TWI400203B - Cutting device and substrate cutting device and method using the same - Google Patents

Description

Cutting device and substrate cutting device and method using the same

The present invention relates to a device and method for use in the manufacture of a flat panel display panel, and more particularly to a cutting device for forming a cutting line of a mother board having formed a plurality of unit substrates, and using the same Apparatus and method for cutting a motherboard.

Recently, information processors are rapidly developing in order to have various forms of functions and faster information processing speeds. Such information processors are displays that display operational information. In the past, displays mainly used Braun tubes ( Cathode ray tube (Cathode Ray Tube) monitor, however, recently, the light and small space is like a Thin Film Transistor-Liquid Crystal Display Panel or an organic light-emitting diode display (Organic Light) The use of flat-panel displays like Emitting Diodes display is gradually increasing.

Generally, a panel used in a flat panel display or the like is usually fabricated using a brittle substrate, and the panel can be roughly divided into a single-board substrate composed of one sheet and a bonded substrate in which two substrates are bonded.

From a small panel for a liquid crystal display such as a mobile phone to a large panel such as a TV or monitor, due to Since the bonded substrate is processed into various sizes and used, the large-sized mother board is cut into a unit substrate of a predetermined size, and each panel is used.

The method of cutting the mother board includes: a method of cutting with a laser beam; or a method of cutting using a Scribe Wheel embedded with a fine diamond.

The method of cutting a mother board by using a laser beam is constituted by a process of dicing a cutting laser beam along a cutting line of a mother board to form a cutting line, and heating the cutting line. The line quencher; and the disconnection procedure is to cut off the laser beam along the cutting line and cut the mother board into a unit substrate.

The method of cutting the mother board by using the cutting wheel is constituted by a cutting program for forming a cutting line of a predetermined depth along the line to cut after the cutting wheel is brought into contact with the cutting line of the mother board ( Scribe Line); and the disconnection procedure is to apply a physical impact on the motherboard to propagate a crack along the cutting line, thereby cutting the motherboard into a unit substrate.

An object of the present invention is to provide a cutting apparatus and a substrate cutting apparatus and method using the same, which can maintain either one of the upper and lower surfaces of the mother board in a state of maintaining the directivity of the upper surface and the lower surface of the mother board. A cutting line is formed, and a cutting line is formed sequentially on the other side.

The object of the present invention is not limited thereto, and those having ordinary knowledge in the art should clearly understand other objects not mentioned from the following disclosure.

In order to achieve the above object, the cutting apparatus of the present invention performs a cutting process for separating a mother board having formed a plurality of unit substrates into a unit substrate, comprising: a first cutting portion, which is attached to the upper surface and the lower surface of the mother board And the second cutting portion is formed by cutting the other side of the mother board transferred from the first cutting portion while maintaining the directivity of the upper surface and the lower surface of the mother board. .

In the cutting device of the present invention having the above configuration, the first cutting portion may include: a first supporting member supporting the lower side of the mother board; and a first cutting unit forming a cut on the mother board Further, the second cutting portion may include: a second supporting member that supports the upper surface of the mother board; and a second cutting unit that forms a cutting line under the mother board.

The first cutting portion may include: a first supporting member supporting the upper surface of the motherboard; and a first cutting unit for forming a cutting line under the mother board, wherein the second cutting portion may include The second supporting member supports the lower side of the mother board; and the second cutting unit is formed on the upper surface of the mother board to form a cutting line.

The aforementioned mother board may be a flat display substrate.

The flat display substrate may be a thin film transistor-liquid crystal display (TFT-LCD) panel in which a color filter and a thin film transistor are laminated in the vertical direction.

In order to achieve the above object, the substrate cutting apparatus of the present invention comprises: a load portion which has formed a plurality of unit substrates. a first cutting portion for forming a cutting line on either one of an upper surface and a lower surface of the mother board that is conveyed from the load portion; the second cutting portion is for maintaining the direction of the upper surface and the lower surface of the mother board a state in which a cutting line is formed on the other surface of the mother board transferred from the first cutting portion; the breaking portion separates the mother board into a unit substrate along a cutting line generated on the mother board And the unloading department is the unloading unit substrate that has been separated.

In the substrate cutting device of the present invention having the above configuration, the first cutting portion may include: a first supporting member supporting the lower surface of the motherboard; and a first cutting unit attached to the front surface of the motherboard The second cutting portion may include a second supporting member that supports the upper surface of the mother board, and a second cutting unit that forms a cutting line under the mother board.

The first cutting portion may include: a first supporting member supporting the upper surface of the motherboard; and a first cutting unit for forming a cutting line under the mother board, wherein the second cutting portion may include The second supporting member supports the lower side of the mother board; and the second cutting unit is formed on the upper surface of the mother board to form a cutting line.

In order to achieve the above object, the substrate cutting method of the present invention separates a mother substrate on which a unit substrate has been formed into a unit substrate, and forms a cutting line on either one of the upper surface and the lower surface of the mother substrate, and maintains the mother A cutting line is formed on the other surface of the mother board in a state in which the upper surface of the board is oriented downward.

According to the present invention, the cutting line can be formed on either one of the upper and lower surfaces of the mother board while maintaining the directivity of the upper surface and the lower surface of the mother board, and the cutting line can be formed on the other side in sequence.

Moreover, according to the present invention, the cutting process can be performed without reversing the substrate, so that the program time can be shortened and the productivity of the entire program can be improved.

Further, according to the present invention, it is possible to omit the equipment related to the reversal of the substrate, thereby simplifying the arrangement of the equipment and reducing the equipment cost.

Hereinafter, a cutting device according to a preferred embodiment of the present invention and a substrate cutting device and method using the same will be described in detail with reference to the accompanying drawings. First, when the reference symbols are attached to the constituent elements of the respective drawings, it should be noted that the same constituent elements are attached with the same symbols as much as possible, and when the present invention is described, Detailed descriptions of well-known structures or functions are omitted when the detailed description of the present invention is omitted.

The first figure shows a diagram of an example of a motherboard.

As shown in the first figure, the mother board 1 is a panel for a TFT-LCD (Thin Film Transistor-Liquid Crystal Display). The mother board 1 is composed of a first mother board 2 and a second mother board 3 having a substantially square plate shape, and the first mother board 2 and the second mother board 3 are stacked one on another. A plurality of unit substrates 2a and 3a are formed on the first and second mother boards 2 and 3, and the unit substrates 2a and 3a are arranged in a lattice shape on the planes of the first and second mother boards 2 and 3. First mother board 2 is formed The substrate having the thin film transistor substrate, the second mother board 3 is a substrate on which the color filter is formed, and the mother board 1 is an organic light emitting diode (OLED: Organic Light Emitting Diodes). ) Panels for displays, etc.

The second drawing schematically shows the structural drawing of the substrate cutting device 10 of the present invention.

As shown in the second figure, the substrate cutting device 10 is for cutting a mother board (reference numeral 1 in the first drawing) into a plurality of unit substrates, and includes a load portion 11 and a first cutting portion 12, The second cutting portion 13, the breaking portion 14, and the unloading portion 15. The load portion 11, the first cutting portion 12, the second cutting portion 13, the breaking portion 14, and the unloading portion 15 may be arranged in a row. However, the arrangement structure of the substrate cutting device 10 of the present invention is not limited thereto. Others may have various arrangement structures such as an arranging structure.

The mother board 1 is carried into the substrate cutting device 10 through the load portion 11, the first cutting portion 12 is formed on the first mother board 2 to form a cutting line, and the second cutting portion 13 is formed on the second mother board 3 to form a cutting line. The disconnecting portion 14 uses a break bar (not shown) to apply a force to the cutting line portion formed on the mother board 1 to separate the unit substrate from the mother board 1, and the separated substrate is transmitted through the unloading portion 15 It is carried out to the outside of the substrate cutting device 10.

The third figure schematically shows the configuration of the first and second cutting portions of the second drawing.

As shown in the third figure, the first cutting portion 12 includes: support The member 100 supports the mother board 1 and the cutting unit 200, forms a cutting line, and moves the unit 300 to move the cutting unit 200. The mother board 1 is supported in a state where the second mother board 3 of the lower layer has been placed on the support member 100, and the cutting unit 200 is attached to the upper layer of the mother board 1 which has been placed on the support member 100, that is, the first mother board A cutting line is formed on 2. The moving unit 300 is in the middle of the cutting process, and the cutting unit 200 is linearly moved along the line to cut on the first mother board 2.

The second cutting portion 13 includes a substrate transfer member 100', a cutting unit 200', and a moving unit 300. The substrate transfer member 100' is transferred from the first cutting portion 12 to the second cutting portion 13 in a state where the second mother substrate 3 is turned downward, and is supported during the cutting process by the second cutting portion 13. Mother board 1. The substrate transfer member 100' adsorbs the first mother substrate 2, which is the upper layer of the mother substrate 1, and supports the mother substrate 1. The cutting unit 200' and the moving unit 300 are disposed below the substrate transfer member 100', and the cutting unit 200' is formed on the lower layer of the mother board 1 supported by the substrate transfer member 100', that is, formed on the second mother board 3. The cutting line is cut, and the moving unit 300 is in the middle of the cutting process, and the cutting unit 200' is linearly moved along the line to cut on the second mother board 3.

With such a configuration, the substrate cutting device 10 of the present invention can form a cutting line on the upper layer of the mother board 1, that is, the first mother board 2, and does not need to invert the mother board 1 to maintain the upper surface of the mother board 1 and In the following directional state, a cutting line is formed sequentially on the lower layer of the mother board 1, that is, on the second mother board 3.

The conventional substrate cutting device is formed by cutting a line on one side of the mother board, inverting the substrate, and forming a cutting line on the other side of the mother board. Therefore, the reverse of the substrate is involved, and the arrangement of the device becomes complicated. There is a problem that the equipment cost increases and the program time increases. However, since the present invention can sequentially perform the cutting process on both sides of the mother board without reversing the mother board, there is an advantage that the structure of the apparatus can be simplified and the program time can be shortened.

Hereinafter, the configuration of the first and second cutting portions 12, 13 will be described in more detail. First, the first cutting portion 12 will be described, and then the second cutting portion 13 will be described.

The fourth drawing is a perspective view of the first cutting portion of the third drawing, the fifth drawing is a plan view of the first cutting portion of the fourth drawing, and the sixth drawing is a side view of the supporting member of the fourth drawing, and the seventh drawing is The enlarged view of the "A" portion of the fourth figure, the eighth A and the eighth B shows the sectional relationship between the bracket and the lead screw of the seventh figure.

Hereinafter, the first direction I is a linear movement direction of the support member 100 to be described later, and the second direction II is a direction perpendicular to the first direction I in the plane arrangement structure of the first cutting portion 12, and the third direction III is the first direction I. And the second direction II is perpendicular to the direction, and the first direction I and the second direction II correspond to any one of the arrangement directions of the unit substrates 2a and 3a arranged in a lattice shape on the mother board 1.

As shown in FIGS. 4 to 8B, the first cutting portion 12 includes a support member 100, a cutting unit 200 (200a-1, 200a-2, 200b), and a moving unit 300 (300a, 300b). Support member 100 Holding the motherboard 1 and moving the motherboard 1 linearly along the first direction I, the cutting unit 200 is in contact with the first motherboard 2 that has been placed on the motherboard 1 of the support member 100, and forms a first direction I cut The line and the second direction II cutting line, the moving unit 300 linearly moves the cutting unit 200 in the second direction II.

The moving unit 300a moves the cutting units 200a-1, 200a-2 in the second direction II to adjust the interval between the cutting units 200a-1, 200a-2 by adjusting the interval between the cutting units 200a-1, 200a-2. , the interval of the first direction I cutting line can be adjusted. When the first direction I cut line is formed, the cutting units 200a-1, 200a-2 are fixed, and the mother board 1 is moved in the first direction I.

The moving unit 300b linearly moves the cutting unit 200b in the second direction II. When the second direction II is formed, the mother board 1 is fixed, and the cutting unit 200b is linearly moved in the second direction II by the moving unit 300b. The interval of the second direction II cutting line is adjusted by the first direction I movement of the mother board 1.

The support member 100 includes an organic stage 120 and a driving unit 140. The mother board 1 is placed on the machine table 120, and the driving unit 140 linearly moves the machine table 120 in the first direction I.

The machine 120 has an upper plate 122 and a lower plate 124. The upper plate 122 and the lower plate 124 are slightly rectangular, and the upper plate 122 is located above the lower plate 124. The motherboard 1 is placed on the upper panel 122, and the upper panel 122 has the same or larger area than the motherboard 1. On the upper plate 1 A plurality of holes (not shown) connected to a vacuum line (not shown) are formed on the upper surface of the second surface, and the mother board 1 is fixed to the upper plate 122 by vacuum pressure, and is additionally provided on the upper plate 122 or the lower plate 124. There is a jig (not shown) for fixing the mother board 1 to the upper board 122.

The driving unit 140 linearly moves the machine table 120 in the first direction I, and the driving unit 140 has a guide 142, a bracket 144, and a driver (not shown). The guiding member 142 is provided with a long shape along the first direction I and is disposed at the center of the base B. Further, the guiding member 142 has the same width along the length direction, and the upper surface of the guiding member 142 is provided flat. The shape and the groove 141 formed to have a long shape along the longitudinal direction are respectively provided on both sides of the guide 142.

The machine table 120 is coupled to the guide 142 by a bracket 144, and the bracket 144 has a bottom plate 145, a support plate 147, and a coupling plate 149. The bottom plate 145 has a flat rectangular shape and is located on the guide 142. The support plate 147 is vertically fixed on the bottom plate 145 and fixedly coupled with the lower plate 124 of the machine table 120 to support the machine table 120. The support plates 147 are provided in two, and are arranged side by side on the upper sides of the bottom plate 145. The coupling plate 149 includes a side plate 149a that is vertically joined to the bottom surface of the bottom plate 145, and an insertion plate 149b that extends perpendicularly from the lower end of the side plate 149a to the inner side. The insertion plate 149b is inserted into the groove 141 which has been formed on the side of the guide 142, and the bonding plate 149 is provided to face two faces.

The driving mechanism provides a driving force to guide the machine table 120 by the guide member 142 and linearly move in the first direction I. The drive machine uses an assembly including a motor and a screw, and optionally uses a component composed of a combination of a motor, a belt, and a pulley, or a component including a linear motor as a drive. Since the specific configurations of the various components described above are well known to those of ordinary skill in the art, a detailed description thereof will be omitted.

The cutting unit 200 includes: first cutting units 200a-1, 200a-2; and a second cutting unit 200b. The first cutting unit 200a-1, 200a-2 is provided in parallel with the second direction II to the path in which the support member 100 moves, and the second cutting unit 200b is provided along the first direction I to the first cutting unit 200a- 1, one side of 200a-2. The first cutting unit 200a-1, 200a-2 is formed on the mother board 1 to form a cutting line in the first direction I, and the second cutting unit 200b is attached to the mother board 1 to form a cutting line in the second direction II. In the series of the present embodiment, two cutting units 200a-1 and 200a-2 are provided as the first cutting units 200a-1 and 200a-2. However, of course, two or more cutting units may be disposed. The first cutting units 200a-1 and 200a-2 are moved in the second direction II by the first moving unit 300a described later to adjust the interval.

As shown in the seventh figure, the first cutting unit 200a-1 has two scribing pins 220a-1, 240a-1 arranged in parallel in the second direction II, and the first cutting unit 200a -2 has two scribing pins 220a-2 and 240a-2 arranged in parallel in the second direction II, and the second cutting unit 200b has two scribing pins 220b arranged in parallel in the second direction II 240b. Since the scribe needles 220a-1, 240a-1, 220a-2, 240a-2, 220b, and 240b have the same structure, the scribe needle 220a-1 of one of the above will be described below. Description of the scribe needles 240a-1, 220a-2, 240a-2, 220b, and 240b will be omitted.

The ninth drawing is a perspective view of the scribe needle of the seventh drawing, the tenth is a partial sectional view of the lower end of the scribe needle of the ninth drawing, and the eleventh drawing is a plan view of the cutting wheel of the tenth drawing.

As shown in the ninth to eleventh drawings, the scribe needle 220a-1 has a cutter wheel 222, a support body 224, a pressing member 226, and a vibrator 228. The cutting wheel 222 is in contact with the mother board 1 during the cutting process, and forms a cutting line on the mother board 1 while rotating. The cutting wheel 222 is a diamond-shaped wheel, and a circular through hole 222a is formed in the center of the cutting wheel 222, and the edge 222b of the cutting wheel 222 is provided with a sharp shape.

The cutting wheel 222 is supported by a support body 224, and the support body 224 has a body 224a and a shaft pin 224b. Below the body 224a, a groove 225 is formed which penetrates the body 224a in one direction, and the shaft pin 224b has a long rod shape having a circular cross section. The shaft pin 224b is located in the groove 225 in a direction perpendicular to the longitudinal direction of the groove 225, and the shaft pin 2 Both ends of 24b are fixed to the body 224a. The shaft pin 224b passes through the through hole 222a that has been formed in the cutting wheel 222, and when the cutting wheel 222 is supported by the shaft pin 224b, one portion of the cutting wheel 222 is located in the groove 225, and the other portion is below the support body 224. protruding.

The pressing member 226 presses the cutting wheel 222 such that when the cutting wheel 222 comes into contact with the mother board 1, the cutting wheel 222 can press the mother board 1 by a predetermined force. As an example, the pressing member 226 is located above the support body 224 and presses the support body 224 downward with air pressure, thereby pressing the cutting wheel 222.

The vibrator 228 is configured to apply vibration to the cutting wheel 222 when the cutting process is performed. The vibrator 228 is mounted inside the body 224a, and the vibrator 228 is an ultrasonic vibrator.

Further, referring to the fourth to eighth panels, the mobile unit 300 includes a first mobile unit 300a and a second mobile unit 300b. The first moving unit 300a moves the first cutting units 200a-1, 200a-2 toward the second direction II, and arranges the first cutting units 200a-1, 200a-2 in the first direction I on the motherboard 1. Cut off the booking line. The second moving unit 300b moves the second cutting unit 200b along the line to cut in the second direction II on the mother board 1. Further, the linear movement of the first cutting units 200a-1, 200a-2 and the linear movement of the second cutting unit 200b are guided by the guiding member 370.

The first mobile unit 300a includes: a first vertical support station 310a; and a first bracket 330a-1, 330a- 2; and the first driving member 350. The first vertical support table 310a is configured to be spaced apart by a certain distance in the second direction II, and the first vertical support table 310a is configured to move the motherboard 1 through the first vertical direction when the motherboard 1 moves linearly along the first direction I. Support between the stations 310a. A guiding member 370 is fixed on the upper end of the first vertical support table 310a. The length direction of the guiding member 370 is arranged in the second direction II, and has a long shape along the length direction above and below the guiding member 370. Grooves 372, 374 are provided.

The first cutting unit 200a-1 is coupled to the guiding member 370 by the first bracket 330a-1, and the first cutting unit 200a-2 is coupled to the guiding member 370 by the first bracket 330a-2. Since the first brackets 330a-1, 330a-2 have the same structure, only the first bracket 330a-1 will be described below. As shown in the seventh figure, the first bracket 330a-1 has a support plate 332 and a coupling plate 334. The support plate 332 has a flat rectangular plate shape and is located on one side of the guiding member 370. The joint plate 334 includes a side plate 334a which is formed from the upper side and the lower side of the support plate 332, protrudes perpendicularly to the support plate 332, and the insertion plate 334b, and is inserted into the groove 372 which has been formed in the guide member 370.

The first driving member 350 provides a driving force to linearly move the first brackets 330a-1, 330a-2 along the guiding member 370. The first drive member 350 has a first lead screw 352, 3 configured to be parallel with the guide member 370 54. As shown in FIG. 8A, the first bracket 330a-1 is mounted on the first lead screw 352 so as to be linearly movable, and the first bracket 330a-2 is attached to the first lead screw 354. It can move in a straight line. That is, although the first lead screw 330, 354 is inserted into the first bracket 330a-1, the first lead screw 352 is engaged with the female screw portion 335-1 formed in the bracket 330a-1, the first guide The screw 354 penetrates without being in contact with the hole 336-1 formed in the first bracket 330a-1. Similarly, although the first lead screw 352, 354 is inserted into the first bracket 330a-2, the first lead screw 352 is not in contact with the hole 336-2 formed in the first bracket 330a-2. In the state of passing through, the first lead screw 354 is engaged with the female screw portion 335-2 formed in the bracket 330a-1.

When the first lead screw 352 is driven, the first bracket 330a-1 moves linearly, however, the first bracket 330a-2 does not move, and when the first lead screw 354 is driven, the first bracket 330a -1 does not move, however, the first bracket 330a-2 moves linearly. With this driving method, the first cutting unit 200a-1 coupled to the first bracket 330a-1 and the first cutting unit 200a-2 coupled to the first bracket 330a-2 move along the second direction II. And adjusting the interval between the first cutting units 200a-1, 200a-2.

A first driving machine 353 that provides a rotational force is coupled to one end of the first lead screw 352 and provides a first driving force for the rotational force The 355 system is coupled to one end of the first lead screw 354. The first and second driving machines 353 and 355 are driven by a motor or the like. Although the first driving member 350 is described as a series including a motor and a lead screw, other components such as a cylinder may be used. A bracket 330a-1, 330a-2 provides various driving machines for linear driving force.

As shown in the seventh figure, the first cutting unit 200a-1 is mounted on the support plate 332 of the first bracket 330a-1 so as to be movable up and down, and an example is formed on the support plate 332 to form a slit shape in the third direction III. The guide groove 331 is provided, and the scribing pins 220a-1 and 240a-1 of the first cutting unit 200a-1 are respectively coupled to a support shaft (not shown) into which the guide groove 331 has been inserted. The first cutting unit 200a-2 is also coupled to the first bracket 330a-2 so as to be movable up and down, and the connection structure is the same as the connection structure of the first cutting unit 200a-1, and thus the description thereof will be omitted.

The second moving unit 300b includes a second vertical support table 310b, a second bracket 330b, and a second driving member 350'. The second vertical support table 310b is configured to be spaced apart by a certain distance in the second direction II, and the second vertical support table 310b is configured to move the motherboard 1 through the second vertical when the motherboard 1 moves linearly along the first direction I. Support station 310b. Further, the second vertical support table 310b is disposed such that its upper end is fixedly coupled to the guide member 370 which has been fixed to the upper end of the first vertical support table 310a.

The second cutting unit 200b is by the second bracket 330 b is coupled to the guiding member 370, and since the second bracket 330b has the same structure as the first bracket 330a-1 described above, the description thereof will be omitted.

The second drive member 350' provides a driving force to linearly move the second bracket 330b along the guide member 370. The second driving member 350' has a second lead screw 352' disposed in parallel with the guiding member 370. As shown in the eighth B, the second bracket 330b is attached to the second lead screw 352' to be mounted. The linear movement, that is, the female screw portion 335' formed in the second bracket 330b is engaged with the second lead screw 352'. With this driving method, the second cutting unit 200b coupled to the second bracket 330b moves in the second direction II.

The second driving machine 353' that provides the rotational force is coupled to one end of the second lead screw 352', and the second driving machine 353' uses a driving machine such as a motor, although the second driving member 350' series includes a motor and a guide The components of the screw are explained. However, other types of driving machines that can provide a linear driving force to the second bracket 330b such as a cylinder can be used.

The second cutting unit 200b is coupled to the second bracket 330b so as to be movable up and down, and the connection structure is the same as the connection structure of the first cutting unit 200a-1, and thus the description thereof will be omitted.

The operations of the first and second mobile units 300a, 300b are controlled by the control unit 400, and the control unit 400 controls the first drivers 353, 355 of the first mobile unit 300a and the second of the second mobile unit 300b. Drive machine The action of 353'. By the control of the first driving machines 353, 355, the first cutting units 200a-1, 200a-2 move toward the second direction II, and adjust the interval between the first cutting units 200a-1, 200a-2, again, The second cutting unit 200b is movable in the second direction II by the control of the second driver 353'.

The process of forming a cutting line on the first mother board 2 of the mother board 1 using the first cutting portion 12 of the present invention having the aforementioned configuration will be described below.

The twelfth to the twelfth Kth drawings show a process of forming a cutting line on the mother board by using the first cutting portion of the present invention.

In order to turn the first motherboard 2 to the upper side, the motherboard 1 is placed on the upper plate 122 of the machine table 120. The machine 120 is linearly moved in the first direction I by a driving machine (not shown) (Twelfth A picture), and when the machine 120 moves to a predetermined position (ie, the first cutting schedule of the first motherboard 2) When the line a is arranged at the position of the second cutting unit 200b, the movement of the machine 120 is stopped (Twelfth B).

Thereafter, in a state where the second cutting unit 200b is arranged along the second direction II in the first cutting planned line a of the first mother board 2, the second driving machine 353' of the second moving unit 300b is driven, and The second cutting unit 200b moves in the one side direction of the first motherboard 2, and at this time, the scribing pins 220b and 240b of one of the scribing pins 220b and 240b of the second cutting unit 200b are moved downward to be located. The height in contact with the first mother board 2 (Fig. 12C).

In this state, the second driving machine 353' of the second moving unit 300b is driven, and the second cutting unit 200b is moved across the first motherboard 2 along the second direction II. At this time, the second cutting Among the scribe needles 220b and 240b of the unit 200b, a scribe needle that is in contact with the first mother board 2 is attached to the first mother board 2 to form a crack. A cut line is formed on the first mother board 2 by continuously forming a crack along the line to cut a, and after the formation of the cut line, the scribe needles 220b, 240b of the second cutting unit 200b move upward ( Twelfth D)).

The machine table 120 is linearly moved in the first direction I by a driving machine (not shown), and when the machine table 120 is moved to a predetermined position (that is, the second cutting planned line b of the first mother board 2 is arranged in the second cutting) The position of the unit 200b stops the movement of the machine 120. Further, the scribing pins 220b and 240b of one of the scribing pins 220b and 240b of the second cutting unit 200b are moved downward to be at a height that can be in contact with the first mother board 2 (twelfth E-picture).

Thereafter, the second driving unit 353' of the second moving unit 300b is driven, and the second cutting unit 200b is moved across the first motherboard 2 along the second direction II. At this time, the second cutting unit 200b is drawn. The scribe needles of the wire pins 220b and 240b that are in contact with the first mother board 2 are formed on the first mother board 2 to form cracks. A cutting line is formed on the first mother board 2 by continuously forming a crack along the line to cut b, and after the formation of the cutting line, the scribe needles 220b, 240b of the second cutting unit 200b move upward ( Twelfth F)).

By repeating the above-described process, a cutting line is formed on the first mother board 2 along the remaining cutting lines c and d, and thereafter, the machine 120 is driven first by a driving machine (not shown). The direction I moves linearly, and when the machine 120 moves to a predetermined position, the movement of the machine 120 is stopped (Twelfth G-picture).

Thereafter, the drivers 353, 355 of the first moving unit 300a are driven, and the interval between the first cutting units 200a-1, 200a-2 is adjusted. By the first moving unit 300a, the first cutting unit 200a-1 is moved to a predetermined position (that is, the first cutting unit 200a-1 is arranged at a position of the cutting planned line e of the first motherboard 2), and the first The cutting unit 200a-2 is moved to a predetermined position (that is, the first cutting unit 200a-2 is arranged at a position of the cutting planned line f of the first mother board 2). At this time, the scribing pins 220a-1, 240a-1 of one of the scribing pins 220a-1, 240a-1 of the first cutting unit 200a-1 are moved downward to be in contact with the first motherboard 2 The height, and the scribe needles 220a-2, 240a-2 of one of the scribe needles 220a-2, 240a-2 of the first cutting unit 200a-2 are moved downward to be located with the first motherboard 2 The height of the contact (Twelfth H picture).

In a state in which the first cutting units 200a-1 and 200a-2 are arranged along the first direction I in the cutting planned lines e and f of the first mother board 2, the machine 120 is driven by a driving machine (not shown). Moving linearly in the first direction I, when the machine table 120 is moved to a predetermined position (ie, along the cutting line e of the first motherboard 2, f is the position where the cutting line is formed on the first mother board 2), and the movement of the machine table 120 is stopped (the twelfth I picture).

Thereafter, the driving machines 353, 355 of the first moving unit 300a are driven, and the first cutting units 200a-1, 200a-2 are moved to arrange the first cutting units 200a-1, 200a-2 on the cutting planned line. g, h. By the first moving unit 300a, the first cutting unit 200a-1 is moved to a predetermined position (that is, the first cutting unit 200a-1 is arranged at a position of the cutting planned line g of the first motherboard 2), and the first The cutting unit 200a-2 is moved to a predetermined position (that is, the first cutting unit 200a-2 is arranged at a position of the cutting planned line h of the first mother board 2). At this time, the scribing pins 220a-1, 240a-1 of one of the scribing pins 220a-1, 240a-1 of the first cutting unit 200a-1 are moved downward to be in contact with the first motherboard 2 The height, and the scribe needles 220a-2, 240a-2 of one of the scribe needles 220a-2, 240a-2 of the first cutting unit 200a-2 are moved downward to be located with the first motherboard 2 The height of contact (12th J).

In a state where the first cutting units 200a-1 and 200a-2 are arranged along the first direction I in the cutting planned lines g and h of the first mother board 2, the machine 120 is driven by a drive (not shown). Moving linearly in the first direction I, and stopping when the machine table 120 is moved to a predetermined position (that is, a position along the cutting line g, h of the first mother board 2 forming a cutting line on the first mother board 2) The movement of the machine 120 (Twelfth K picture).

Next, the structure and operation of the second cutting portion 13 will be described.

The thirteenth drawing is a perspective view of the second cutting portion 13 of the third drawing, and the fourteenth drawing is an enlarged view of the "C" portion of the thirteenth drawing. Here, elements having the same configurations as those of the fourth and seventh drawings are denoted by the same reference numerals.

The second cutting portion 13 includes a substrate transfer member 100', a cutting unit 200', and a moving unit 300.

The substrate transfer member 100' is transferred from the first cutting portion 12 to the second cutting portion 13 in a state where the second mother substrate 3 is turned downward, and is supported during the cutting process by the second cutting portion 13. Mother board 1.

The substrate transfer member 100' is a mother board 1 in a state in which the first mother board 2 forms a cutting line and the second mother board 3 is turned downward, and is transferred from the first cutting portion 12 to the second cutting portion 13, and the substrate transfer member 100 The first mother board 2 is adsorbed and supported during the cutting process of the second mother board 3 of the mother board 1 by the second cutting portion 13.

The substrate transfer member 100' includes a transfer body 110' and an adsorption plate 120'. The transfer body 110' includes a plate-shaped support plate 112' and a plurality of support tables 114' extending downward from the lower surface of the support plate 112'. The adsorption plate 120' is coupled to the end of the support table 114', and the adsorption plate 120' is used for adsorbing and supporting the mother board 1 and forming a plurality of adsorption holes under the adsorption plate 120' that the mother board 1 contacts (not shown). A vacuum line (not shown) that communicates with an adsorption hole (not shown) is formed inside the adsorption plate 120'. Also, the substrate transfer member 100' can be linearly moved in the first direction I or the third direction III by a driving device (not shown).

The support mother board 1 is adsorbed on the adsorption plate 120' of the substrate transfer member 100'. At this time, the mother board 1 is supported in a state where the first mother board 2 is in surface contact with the adsorption sheet 120' and the mother board 3 is turned downward. .

A cutting unit 200' and a moving unit 300 are provided below the substrate transfer member 100', and the cutting unit 200' is attached to the lower layer of the mother board 1 supported by the substrate transfer member 100', that is, the second mother board 3 is cut. The line, and the moving unit 300 is in the middle of the cutting process, and the cutting unit 200' is linearly moved along the line to cut on the second mother board 3.

Since the cutting unit 200' and the moving unit 300 have the same configuration as the cutting unit 200 and the moving unit 300 of the first cutting portion 12, detailed description thereof is omitted, however, the cutting unit 200': 200' of the second cutting portion 13 A-1, 200'a-2, 200'b are arranged to form an inverted image of the cutting unit 200 of the first cutting portion 12: 200a-1, 200a-2, 200b, that is, the cutting unit 200': 200'a- 1. 200'a-2, 200'b are arranged such that the cutting wheel 222' is turned to the mother board 1 located above the cutting unit 200': 200'a-1, 200'a-2, 200'b.

The cutting process in the second cutting portion 13 having the aforementioned configuration is performed in the same order as the cutting process in the first cutting portion 12, and since its detailed description is in the technical field Those who have ordinary knowledge can easily infer, and thus detailed descriptions thereof are omitted herein.

On the other hand, the above series is configured such that the first cutting portion 12 is on the upper surface of the mother board 1, that is, the first mother board 2 forms a cutting line, and the second cutting portion 13 is below the mother board 1, that is, the second mother board 3 Although the substrate cutting device for forming the dicing line is described, the substrate cutting device of the present invention is not limited thereto, and the first cutting portion 12 may be formed below the mother board 1, that is, the second mother. The plate 3 forms a cutting line, and the second cutting portion 13 is on the upper side of the mother board 1, that is, the first mother board 2 forms a cutting line.

The substrate cutting device of the present invention having the above-described configuration can form a cutting line on either one of the upper and lower surfaces of the mother board in a state of maintaining the directivity of the upper surface and the lower surface of the mother board, and sequentially A cutting line is formed on one side.

Moreover, since the substrate cutting apparatus of the present invention can perform the cutting process without reversing the substrate, the program time can be shortened and the productivity of the entire program can be improved.

Further, the substrate cutting device of the present invention can omit the device associated with the inversion of the substrate, thereby simplifying the arrangement of the device and saving equipment costs.

The above description is only illustrative of the technical idea of the present invention, and various modifications and variations can be made without departing from the spirit and scope of the invention. The technical idea of the present invention is limited to be explained, and the scope of the technical idea of the present invention is not limited to such an embodiment. The scope of protection of the present invention should All the technical ideas in the scope of the patent application of the present invention should be included in the scope of the present invention, and are to be combined with Chen Ming.

1‧‧‧ mother board

2‧‧‧First motherboard

2a‧‧‧unit substrate

3‧‧‧Second mother board

3a‧‧‧unit substrate

10‧‧‧Substrate cutting device

11‧‧‧Load Department

12‧‧‧First Cutting Department

13‧‧‧Second cutting department

14‧‧‧Disconnect

15‧‧‧Unloading Department

100‧‧‧Support components

100'‧‧‧Substrate transfer member

110’‧‧‧Transfer

112’‧‧‧ Support Board

114’‧‧‧Support Desk

120‧‧‧ machine

122‧‧‧ upper board

124‧‧‧lower board

120’‧‧‧Adsorption board

140‧‧‧Drive unit

141‧‧‧ditch

142‧‧‧ Guides

144‧‧‧ bracket

145‧‧‧floor

147‧‧‧Support board

149‧‧‧Combination board

149a‧‧‧ side panel

149b‧‧‧ insert board

200‧‧‧Cutting unit

200a-1‧‧‧First cutting unit

200a-2‧‧‧First cutting unit

200b‧‧‧Second cutting unit

200’‧‧‧Cutting unit

200’a-1‧‧‧Cutting unit

200’a-2‧‧‧Cutting unit

200’b‧‧‧ cutting unit

220a-1‧‧‧Drawing needle

220a-2‧‧‧Drawing needle

220b‧‧‧Drawing needle

222‧‧‧ cutting wheel

222a‧‧‧through hole

222b‧‧‧ edge

222’‧‧‧Cutting wheel

224‧‧‧Support

224a‧‧‧ Ontology

224b‧‧‧ axle pin

225‧‧‧ditch

226‧‧‧ Pressing members

228‧‧‧ vibrator

240a-1‧‧‧Draw needle

240a-2‧‧‧Draw needle

240b‧‧‧Draw needle

300‧‧‧Mobile unit

300a‧‧‧First mobile unit

300b‧‧‧Second mobile unit

310a‧‧‧First vertical support desk

310b‧‧‧second vertical support

330a-1‧‧‧First bracket

330a-2‧‧‧First bracket

330b‧‧‧second bracket

331‧‧‧ Guide groove

332‧‧‧Support board

334‧‧‧Combination board

334a‧‧‧ side panels

334b‧‧‧ insert board

335-1‧‧‧ Female thread

335-2‧‧‧ female thread

335'‧‧‧ female thread

336-1‧‧‧ holes

336-2‧‧ hole

350‧‧‧First drive member

352‧‧‧First lead screw

354‧‧‧First lead screw

350'‧‧‧second drive member

352'‧‧‧Second lead screw

353‧‧‧First drive

353’‧‧‧Second drive

355‧‧‧First drive machine

370‧‧‧guide members

372‧‧‧ditch

374‧‧‧ditch

400‧‧‧Control Department

I‧‧‧First direction

II‧‧‧Second direction

III‧‧‧ third direction

A‧‧‧first cut-off line

B‧‧‧Base

b‧‧‧Second cut line

C‧‧‧ cut off the booking line

D‧‧‧ cut off the reservation line

E‧‧‧ cut the booking line

F‧‧‧ cut the booking line

G‧‧‧ cut the booking line

H‧‧‧ cut off the booking line

The first figure shows a schematic diagram of an example of a motherboard.

The second drawing schematically shows the configuration of the substrate cutting device of the present invention.

The third figure schematically shows the configuration of the first and second cutting portions of the second drawing.

The fourth figure is a perspective view of the first cutting portion of the third figure.

The fifth drawing is a plan view of the first cutting portion of the fourth figure.

Figure 6 is a side view of the support member of the fourth figure.

The seventh drawing is an enlarged view of the "A" portion of the fourth figure.

Figs. 8A and 8B are cross-sectional views showing the relationship between the bracket and the lead screw of the seventh figure.

The ninth diagram is a perspective view of the scribe needle of the seventh figure.

The tenth figure is a partial cross-sectional view of the lower end of the scribe needle of the ninth figure.

The eleventh drawing is a plan view of the cutting wheel of the tenth figure.

The twelfth to the twelfth Kth drawings show a process of forming a cutting line on the mother board by using the first cutting portion of the present invention.

The thirteenth diagram is a perspective view of the second cutting portion 13 of the third figure.

Figure 14 is an enlarged view of the "C" portion of the thirteenth figure.

1‧‧‧ mother board

2‧‧‧First motherboard

3‧‧‧Second mother board

12‧‧‧First Cutting Department

13‧‧‧Second cutting department

100‧‧‧Support components

100'‧‧‧Substrate transfer member

200‧‧‧Cutting unit

200’‧‧‧Cutting unit

300‧‧‧Mobile unit

Claims (14)

A cutting device for performing a cutting process for separating a mother board having formed a plurality of unit substrates into a unit substrate, comprising: a first cutting portion, forming a cutting line on one of an upper surface and a lower surface of the mother board And a second cutting portion that forms a cutting line on the other surface of the mother board that is transferred from the first cutting portion while maintaining the directivity of the upper surface and the lower surface of the mother board; wherein the mother board A flat display substrate. The cutting device of claim 1, wherein the first cutting portion comprises: a first supporting member supporting the lower side of the mother board; and a first cutting unit formed on the mother board In the cutting line, the second cutting portion includes: a second supporting member that supports the upper surface of the mother board; and a second cutting unit that forms a cutting line under the mother board. The cutting device of claim 1, wherein the first cutting portion comprises: a first supporting member supporting the upper surface of the mother board; and a first cutting unit formed under the mother board In the cutting line, the second cutting portion includes: a second supporting member supporting the lower side of the motherboard; and a second cutting unit forming a cutting line on the upper surface of the motherboard By. The cutting device according to claim 1, wherein the flat display substrate is a thin film transistor-liquid crystal display (TFT-LCD) panel for stacking color filters in a vertical direction and a thin film transistor substrate. A substrate cutting device includes: a load portion that is a mother board in which a plurality of unit substrates have been formed in a load; and a first cutting portion formed on one of an upper surface and a lower surface of the mother board that is transported from the load portion a second cutting portion that forms a cutting line on the other surface of the mother board that is transferred from the first cutting portion while maintaining the directivity of the upper surface and the lower surface of the mother board; The mother board is separated into a unit substrate along a cutting line generated on the mother board; and the unloading unit is used to unload the unit substrate that has been separated. The substrate cutting device of claim 5, wherein the first cutting portion comprises: a first supporting member supporting the lower side of the motherboard; and a first cutting unit attached to the motherboard The second cutting portion includes a second supporting member that supports the upper surface of the mother board, and a second cutting unit that forms a cutting line under the mother board. The substrate cutting device according to claim 5, The first cutting portion includes: a first supporting member supporting the upper surface of the motherboard; and a first cutting unit for forming a cutting line under the mother board, wherein the second cutting portion includes The second supporting member supports the lower side of the mother board; and the second cutting unit is formed on the upper surface of the mother board to form a cutting line. A substrate cutting method is a method of separating a mother board from which a unit substrate has been formed into a unit substrate, and forming a cutting line on one of an upper surface and a lower surface of the mother board, and maintaining the upper surface and the lower surface of the mother board In a directional state, a dicing line is formed on the other surface of the mother board, wherein the mother board is a flat panel display substrate. The substrate cutting method according to claim 8, wherein the cutting board is formed on the upper surface of the mother board in a state of supporting the lower surface of the mother board, and the mother board in which the cutting line has been formed in the adsorption support is used. In the upper state, a cutting line is formed under the mother board. The substrate cutting method according to claim 8, wherein a cutting line is formed on the lower surface of the mother board in a state in which the upper surface of the mother board is adsorbed and supported, and the mother board in which the cutting line has been formed is supported. In the lower state, a cutting line is formed on the upper surface of the mother board. A cutting device for performing a cutting process for separating a mother board having formed a plurality of unit substrates into a unit substrate, comprising: a first cutting portion, forming a cutting line on one of an upper surface and a lower surface of the mother board The method includes: a first supporting member supporting the underside of the motherboard, and And a first cutting unit is provided to an upper portion of the moving path of the first supporting member, and a cutting line is formed on the upper surface of the motherboard; and the second cutting portion is configured to be The first cutting portion is adjacent to each other and forms a cutting line on a different side of the mother board transferred from the first cutting portion, and includes: a second cutting unit, which is provided to the first cutting unit along the first direction And the second cutting member is linearly movable from the upper portion of the first and second cutting units along the first direction, and moves up and down along a second direction perpendicular to the first direction, and is adsorbed The upper surface of the mother board disposed on the first supporting member includes: an adsorption plate which is formed by forming a plurality of adsorption holes on the surface to adsorb the mother board; and a driving machine for causing the adsorption plate to be in the vertical direction and the foregoing The first direction linearly moves, and the second cutting unit is formed on the underside of the mother board that is adsorbed on the second supporting member to form a cutting line; wherein the mother board is flat Display substrate. The cutting device of claim 11, wherein the cutting wheel of the first cutting unit is arranged downward to face the upper surface of the mother board, and the cutting wheel of the second cutting unit is arranged upwardly facing the foregoing Below the motherboard. A cutting device according to claim 11, wherein The first cutting portion includes: a first supporting member that adsorbs the upper surface of the mother board and is linearly movable in a first direction; and a first cutting unit that is provided to a lower portion of the moving path of the first supporting member And forming a cutting line under the aforementioned mother board. The cutting device of claim 13, wherein the second cutting portion comprises: a second supporting member located behind the first cutting unit, and supporting the mother board from the first supporting member to support The lower surface of the mother board is linearly movable in the first direction; and the second cutting unit is provided to an upper portion of the moving path of the second supporting member, and a cutting line is formed on the upper surface of the mother board.