TW200927357A - Lead-free solder - Google Patents
Lead-free solder Download PDFInfo
- Publication number
- TW200927357A TW200927357A TW097139693A TW97139693A TW200927357A TW 200927357 A TW200927357 A TW 200927357A TW 097139693 A TW097139693 A TW 097139693A TW 97139693 A TW97139693 A TW 97139693A TW 200927357 A TW200927357 A TW 200927357A
- Authority
- TW
- Taiwan
- Prior art keywords
- solder
- mass
- lead
- strength
- high temperature
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 121
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229910052789 astatine Inorganic materials 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 12
- 238000011156 evaluation Methods 0.000 abstract description 10
- 229910017518 Cu Zn Inorganic materials 0.000 abstract description 7
- 229910017752 Cu-Zn Inorganic materials 0.000 abstract description 7
- 229910017943 Cu—Zn Inorganic materials 0.000 abstract description 7
- 229910017692 Ag3Sn Inorganic materials 0.000 abstract description 6
- 230000003247 decreasing effect Effects 0.000 abstract description 5
- 238000005219 brazing Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 38
- 239000010949 copper Substances 0.000 description 22
- 239000000203 mixture Substances 0.000 description 21
- 229910045601 alloy Inorganic materials 0.000 description 16
- 239000000956 alloy Substances 0.000 description 16
- 239000000758 substrate Substances 0.000 description 16
- 229910017944 Ag—Cu Inorganic materials 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 230000006378 damage Effects 0.000 description 11
- 238000009864 tensile test Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 238000002844 melting Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 10
- 230000002829 reductive effect Effects 0.000 description 9
- 239000006104 solid solution Substances 0.000 description 9
- 229910000765 intermetallic Inorganic materials 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 239000011148 porous material Substances 0.000 description 8
- 238000011161 development Methods 0.000 description 7
- 238000007689 inspection Methods 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- 229910001018 Cast iron Inorganic materials 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 239000000538 analytical sample Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 238000004448 titration Methods 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910020994 Sn-Zn Inorganic materials 0.000 description 2
- 229910009069 Sn—Zn Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- ZNNZYHKDIALBAK-UHFFFAOYSA-M potassium thiocyanate Chemical compound [K+].[S-]C#N ZNNZYHKDIALBAK-UHFFFAOYSA-M 0.000 description 2
- 229940116357 potassium thiocyanate Drugs 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000012086 standard solution Substances 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- XGGLLRJQCZROSE-UHFFFAOYSA-K ammonium iron(iii) sulfate Chemical compound [NH4+].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O XGGLLRJQCZROSE-UHFFFAOYSA-K 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000001192 hot extrusion Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical group [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- OWMXNNUFZNDDMH-UHFFFAOYSA-M potassium 2-hydroxypropane-1,2,3-tricarboxylic acid thiocyanate Chemical compound C(CC(O)(C(=O)O)CC(=O)O)(=O)O.[S-]C#N.[K+] OWMXNNUFZNDDMH-UHFFFAOYSA-M 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007586 pull-out test Methods 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007270570 | 2007-10-17 | ||
| JP2008243037 | 2008-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200927357A true TW200927357A (en) | 2009-07-01 |
Family
ID=40567501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097139693A TW200927357A (en) | 2007-10-17 | 2008-10-16 | Lead-free solder |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2009051240A1 (fr) |
| TW (1) | TW200927357A (fr) |
| WO (1) | WO2009051240A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106181109A (zh) * | 2016-08-16 | 2016-12-07 | 镇江市锶达合金材料有限公司 | 一种高性能绿色钎焊材料 |
| TWI587964B (zh) * | 2012-10-09 | 2017-06-21 | 阿爾發裝配解決方案公司 | 無鉛、無銻焊接合金、彼之用途、包含彼之焊接點，以及形成焊接點之方法 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101780607B (zh) * | 2010-03-17 | 2012-05-09 | 华南理工大学 | 一种用于电子封装组装钎焊的无铅钎料及其制备方法 |
| WO2012023440A1 (fr) * | 2010-08-18 | 2012-02-23 | 新日鉄マテリアルズ株式会社 | Bille de soudure pour montage de semi-conducteurs, et élément électronique |
| JP5724638B2 (ja) * | 2011-05-30 | 2015-05-27 | 日立金属株式会社 | Ｐｂフリーはんだ及びはんだ被覆導体並びにそれを用いた電気部品 |
| WO2015126403A1 (fr) | 2014-02-20 | 2015-08-27 | Honeywell International Inc | Compositions de soudure exempte de plomb |
| CN104070299A (zh) * | 2013-03-26 | 2014-10-01 | 昆山市天和焊锡制造有限公司 | 一种抗老化光伏焊带之焊锡料 |
| EP2992553A4 (fr) | 2013-05-03 | 2017-03-08 | Honeywell International Inc. | Construction de châssis de brochage pour des connexions de brasage sans plomb |
| JP6240467B2 (ja) | 2013-10-30 | 2017-11-29 | 株式会社タムラ製作所 | ソルダペースト用フラックスおよびソルダペースト |
| CN106624430A (zh) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | 焊锡膏 |
| CN113399859A (zh) * | 2021-05-27 | 2021-09-17 | 西安理工大学 | 一种Sn-Zn-Cu系无铅钎料及其制备方法 |
| CN115383344B (zh) * | 2022-06-06 | 2024-02-06 | 桂林航天工业学院 | In-48Sn-xCuZnAl复合钎料及其制备方法与应用 |
| CN116174993B (zh) * | 2023-02-24 | 2024-10-18 | 东莞市千岛金属锡品有限公司 | 一种纳米二氧化钛掺杂的Sn-Ag-Cu-X四元焊料及其制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4152596B2 (ja) * | 2001-02-09 | 2008-09-17 | 新日鉄マテリアルズ株式会社 | ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
| US20030021718A1 (en) * | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
| JP2003326386A (ja) * | 2002-05-13 | 2003-11-18 | Matsushita Electric Ind Co Ltd | 無鉛はんだ合金 |
| JP4144415B2 (ja) * | 2003-01-07 | 2008-09-03 | 千住金属工業株式会社 | 鉛フリーはんだ |
| JP4391276B2 (ja) * | 2004-03-12 | 2009-12-24 | 新日鉄マテリアルズ株式会社 | 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材 |
| EP1772225A4 (fr) * | 2004-07-29 | 2009-07-29 | Senju Metal Industry Co | Alliage de brasage sans plomb |
| JP5115915B2 (ja) * | 2005-03-17 | 2013-01-09 | 株式会社タムラ製作所 | 鉛フリーはんだ、そのはんだ加工物、ソルダーペースト及び電子部品はんだ付け基板 |
-
2008
- 2008-10-16 TW TW097139693A patent/TW200927357A/zh unknown
- 2008-10-17 WO PCT/JP2008/068895 patent/WO2009051240A1/fr not_active Ceased
- 2008-10-17 JP JP2009538176A patent/JPWO2009051240A1/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI587964B (zh) * | 2012-10-09 | 2017-06-21 | 阿爾發裝配解決方案公司 | 無鉛、無銻焊接合金、彼之用途、包含彼之焊接點，以及形成焊接點之方法 |
| CN106181109A (zh) * | 2016-08-16 | 2016-12-07 | 镇江市锶达合金材料有限公司 | 一种高性能绿色钎焊材料 |
| CN106181109B (zh) * | 2016-08-16 | 2018-12-28 | 镇江市锶达合金材料有限公司 | 一种高性能绿色钎焊材料 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009051240A1 (fr) | 2009-04-23 |
| JPWO2009051240A1 (ja) | 2011-03-03 |
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