JP2007090508A - Dividing memory card board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dividing method for a memory card substrate, which manufactures a memory card substrate whose corners are cut away, inexpensively and efficiently. <P>SOLUTION: In technology for picking a substrate for a memory card, which has the corner parts of a mother board 301 obliquely cut off, longitudinal and lateral scheduled cutting lines 302, 304 are cut by cutting using a cutting blade, and the corner parts are cut using a jet stream of high pressure water or a laser beam. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technique for obtaining a memory card substrate used as a base material of a memory card, and more particularly to an improvement of a technique for cutting off a corner portion of a memory card substrate.

  Memory cards such as SD cards have a basic structure in which a semiconductor chip, wiring, electrodes, etc. are arranged on the front and back surfaces of a memory card substrate made of a material such as glass epoxy resin, and a resin mold is applied for protection It has a structure. The memory card has a shape in which one of the corners is cut obliquely so that the card insertion direction can be specified. For this reason, one of the corners of the memory card substrate, which is the base material of the memory card, is similarly cut obliquely.

  In manufacturing a memory card, first, a plurality of memory card structures are arranged on a board called a mother board, and then the mother board is cut vertically and horizontally to obtain each memory card board in which a memory function is built. In this cutting, a method using a dicing apparatus or the like is advantageous in terms of cost and work efficiency. On the other hand, a technique for processing various substrates by a method using high-pressure water flow or laser light is also known. A cutting technique using a high-pressure water stream is described in Patent Document 1, for example.

JP-A-2005-161460

However, since the vertical and horizontal dimensions of the memory card are as small as several centimeters, it is difficult to perform the oblique cutting of the corners of the substrate described above with a cutting device using a rotating blade such as a dicing device. On the other hand, the method using high-pressure water flow or laser light allows fine processing as compared with the case of using a dicing apparatus, and can perform oblique cutting of corners on the memory card substrate described above. is there. However, the method using a high-pressure water stream or laser light has a drawback that the processing cost is high and the processing efficiency is inferior.
Accordingly, an object of the present invention is to provide a method of dividing a memory card substrate that can reduce the manufacturing cost and improve the productivity in the technology for obtaining a memory card substrate having a shape with corners cut off. .

  The first memory card substrate dividing method according to the present invention is provided in a memory card area defined by a first scheduled dividing line and a second scheduled dividing line orthogonal thereto, and provided outside the memory card area. A method of dividing a memory card substrate in which a mother board composed of surplus areas is divided into individual memory card areas, and a first division line is cut with a cutting blade to form a row of strip-shaped memory card areas In addition, a first cutting process for leaving an excess area without cutting on one side of the row of the memory card area, and a thread-like shape along a cutting line formed by the cutting in the first cutting process. A corner cutting step of spraying high-pressure water, tracing a cutting line, and forming an oblique cutting line at a predetermined corner of each memory card area, and a second division Is characterized in that a second cutting step of dividing the rows of strip-shaped memory card area into individual memory card area by cutting a constant line cutting blade.

  According to the first memory card substrate dividing method, cutting of the first and second divided lines, which constitute most of the memory card substrate dividing process, is performed by cutting using a cutting blade. Only cutting is performed by injection of high pressure water. In other words, most of the processing is performed using a low-cost, high-efficiency cutting blade, and the remaining portion is processed using high-cost high-pressure water jet, minimizing an increase in manufacturing costs and a reduction in processing efficiency. It is possible to divide a memory card substrate having a shape in which corners are cut out while limiting to the limit.

  More specifically, in the first cutting process, the mother board is cut along the first division line by using a cutting blade, and is cut into a comb shape whose ends are connected by the surplus region. . Then, only the corner portion of the memory card area is cut while moving the jet flow of high-pressure water while tracing the cutting line cut in the first cutting step. In this case, in the corner cutting step, after forming the oblique cutting line, the jet stream of high pressure water is moved so as to trace the oblique cutting line in the reverse direction, and the cutting line cut by the cutting in the first cutting step. It is desirable to include a step of returning to step (b). As another aspect, when the corner cutting process is completed, the injection of high-pressure water can be stopped and the corner cutting process can be started from the cutting line of the next memory card area. Decreases. As another aspect, when the corner cutting process is completed, there is a method of returning the jet flow of high-pressure water to the cutting line cut in the first cutting process while cutting the second scheduled line. However, in this method, since the portion that is later cut in the second cutting step is cut with the jet flow of high-pressure water, the disadvantage that there is a lot of waste cannot be denied.

  By repeating the above steps, the corner cutting step for all the memory card areas is executed. When the corner cutting step is completed, a second cutting step is performed in which cutting is performed along a second division line that is orthogonal to the cutting direction in the first cutting step. Thereby, a plurality of memory card areas connected in a row in a strip shape are divided into respective memory card substrates. Also, since the remaining one side of the corner portion forming a right triangle is cut, the corner portion is separated from the memory card substrate.

  The motherboard to which the present invention is applied can be cut at any stage where the function as a memory card is built. For example, the semiconductor memory placement completion stage, the formation of wiring and electrodes, the intermediate stage where some electrodes are not formed, the stage before resin molding, the stage after resin molding, the final process are completed The present invention can be applied at any stage such as the above stage. Further, the material of the motherboard is not particularly limited as long as it is a material that can be used as a memory card substrate. For example, examples of the mother board include a glass epoxy substrate and a fluororesin substrate. Further, the motherboard is not limited to a single layer structure, and may have a multilayer structure.

  Before performing the second cutting step, the mother board can be fixed on the protective member. A dicing tape is suitable as the protective member, and has a function of fixing the whole motherboard with an adhesive force. In the second cutting process, cutting is performed along the second division line orthogonal to the first division line on the motherboard in which the cut is made in the first division line, and each memory card is cut. In this process, the memory card substrate is obtained by dividing the area. In addition, after the second cutting step, each divided memory card substrate is sent to the next step. Therefore, even if it is removed from the cutting device, it is easier to handle if each memory card substrate is in a state of being stuck on the dicing tape. Such advantages can also be obtained with other features of the present invention described below.

  Next, according to the second method of dividing the memory card substrate of the present invention, there is provided a memory card area defined by the first scheduled dividing line and a second scheduled dividing line orthogonal thereto, and outside the memory card area. A memory card substrate dividing method for dividing a mother board composed of a surplus area provided into individual memory card areas, wherein a first dividing line is cut with a cutting blade to form a strip-shaped memory card area. A first cutting step of forming a row and leaving a surplus region on one side of the row of the memory card region without cutting, and a laser from above the cutting line cut by the cutting in the first cutting step A corner cutting process in which light is transmitted obliquely to form an oblique cutting line at a predetermined corner of each memory card area, and the second division planned line is cut into a cutting block. Is characterized in that a second cutting step of dividing the rows of strip-shaped memory card area into individual memory card area by cutting in over de.

  According to the second aspect of the invention, it is only necessary to irradiate the laser beam only when the oblique cutting line is cut, so that it is possible to increase the energy utilization efficiency and reduce the manufacturing cost. Since it is not necessary to trace the cutting line with thread-like high-pressure water as in the first invention, the processing efficiency is improved.

  In the second memory card substrate dividing method of the present invention, it is preferable that the mother board is fixed on the protective member described above in the first cutting process to the second cutting process. According to this aspect, the first cutting step, the corner cutting step, and the second cutting step can be performed in a state where the mother board is fixed on a protective member such as a dicing tape. For this reason, handling between each process is easy and workability | operativity can be improved. In addition, since the entire mother board is fixed on the protective member, there is no need for an extra area that connects the rows of strip-shaped memory card areas. For this reason, the material yield of a motherboard can be improved. In this case, the protection member is preferably made of a material that does not absorb laser light, and thus the protection member can be made less likely to be damaged by laser light irradiation. The material that does not absorb the laser beam is preferably one that transmits the laser beam to be used by 80% or more, preferably 90% or more, and more preferably 95% or more. Examples of a material that can be used as a protective member and easily transmit laser light include polyolefin (PO).

  According to the present invention, the cutting of the first and second lines to be divided, which constitute most of the dividing process of the memory card substrate, is performed by cutting using the cutting blade, and only the corners are cut off by the injection of high-pressure water. Alternatively, since it is performed by laser light irradiation, it is possible to divide the memory card substrate having a shape in which the corners are cut away while minimizing the sacrifice of cost and processing efficiency.

1. First Embodiment (A) Configuration of Mother Board FIG. 7 is a plan view of a mother board 301 to be divided and processed in this embodiment. The mother board 301 is formed by molding glass epoxy resin into a rectangular plate. In FIG. 7, reference numeral 302 denotes a first scheduled cutting line cut in the first cutting process, and reference numeral 304 denotes a second scheduled cutting line cut in the second cutting process. A rectangular area denoted by reference numeral 305 is a memory card area defined by these first and second scheduled cutting lines 302 and 304. Reference numeral 303 denotes a diagonal cut scheduled line 303 for cutting off a corner of the memory card area 305.

(B) Jig Configuration FIG. 3 is a perspective view (A), a top view (B), and a side view (C) of the jig 20 for attracting the mother board 301 to the chuck table 125 shown in FIG. A groove 201 extending in the X-axis direction and a groove 202 extending in the Y direction are formed on the upper surface of the jig 20. The mother board 301 is positioned and placed on the surface on which the grooves 201 and 202 are formed. The groove 201 functions as a relief groove of the cutting blade 142 when cutting in the X-axis direction in the drawing using the cutting device 10 shown in FIG. 1 is performed in a state where the mother board 301 is placed. Further, the groove 202 functions as a relief groove of the cutting blade 142 when cutting in the Y-axis direction in the figure in a similar state.

  On the upper surface of the jig 20, a plurality of memory card corresponding regions 203 are partitioned by grooves 201 and 202. In each memory card corresponding area 203, a plurality of holes 204 communicating with the upper and lower surfaces of the jig 20 are formed. By this hole 204, suction by the vacuum chuck function provided in the chuck table 125 acts on the mother board 301 placed on the jig 20, and the mother board 301 can be adsorbed to the chuck table 125 via the jig 20. .

(C) Configuration of Cutting Device FIG. 1 is a perspective view showing the cutting device 10. A cutting apparatus 10 shown in FIG. 1 includes a base 100, and a chuck table mechanism 120, a cutting unit 140, and a cutting unit support mechanism 160 are provided on the base 100. The chuck table mechanism 120 holds the jig 20 (see FIG. 3) or the dicing tape 401 (see FIG. 4) horizontally and moves it in the cutting feed direction (X direction in FIG. 1). The cutting unit 140 cuts and cuts the mother board 301 (see FIG. 7) fixed on the cutting jig 20 or the dicing tape 401 along a predetermined cutting line. The cutting unit support mechanism 160 supports the cutting unit 140 and moves it in the Y direction in FIG. The cutting unit 140 is attached to the cutting unit support mechanism 160 so as to be movable in the cutting direction (Z direction in FIG. 1).

  The chuck table mechanism 120 is disposed on one end side in the Y direction on the base 100, and is attached to the guide rail 121 slidably on a pair of guide rails 121 extending in the X direction fixed to the base 100. A movable plate 122, a stage 124 supported on the movable plate 122 via a cylindrical post 123, a disk-shaped chuck table 125 rotatably mounted on the stage 124, and a movable plate 122. And a slide mechanism 130 that moves the guide along the guide rail 121.

  The chuck table 125 has a horizontal upper surface and is rotated clockwise or counterclockwise by a rotation driving mechanism (not shown) housed in the post 123 with the Z direction as a rotation axis. The chuck system of the chuck table 125 is a well-known vacuum chuck. The chuck table 125 is formed with suction holes that communicate with the front and back surfaces, and an air suction port of a vacuum device (not shown) is connected to the back surface side. When the vacuum device is operated, the cutting jig 20 or the dicing tape 401 is sucked and held on the chuck table 125.

  The slide mechanism 130 includes a screw rod 131 disposed between the base 100 and the moving plate 122 and extending in the X direction, and a pulse motor 132 that rotationally drives the screw rod 131. The screw rod 131 is threadedly engaged with a bracket (not shown) formed to protrude from the lower surface of the moving plate 122, and is rotatably supported in an axially immovable state. According to the slide mechanism 130, when the screw rod 131 is rotated by the pulse motor 132, the moving plate 122 is moved along the guide rail 121 in the X direction corresponding to the rotation direction.

  The cutting unit support mechanism 160 includes a pair of guide rails 161 extending in the Y direction and arranged on the base 100 so as to form a T shape together with the guide rails 121 of the chuck table mechanism 120, and these guide rails. A movable table 162 slidably mounted on 161 and a slide mechanism 170 for moving the movable table 162 along the guide rail are provided.

  The movable table 162 includes a horizontal plate portion 163 and one end portion in the X direction of the horizontal plate portion 163 (in this case, the direction of the cutting unit 140 is observed along the Y direction from the end portion of the base 100 on the chuck table mechanism 120 side). 1 is an L-shaped base having a vertical plate portion 164 rising from the right end portion in the direction of arrow F in FIG. 1, and the lower surface of the horizontal plate portion 163 is slidably attached to the guide rail 161. .

  The slide mechanism 170 has the same configuration as that of the slide mechanism 130 of the chuck table mechanism 120, and includes a screw rod 171 disposed between the base 100 and the horizontal plate portion 163 and extending in the Y direction, and the screw rod 171. And a pulse motor 172 that rotates. The screw rod 171 is threadedly engaged with a bracket (not shown) protruding from the lower surface of the horizontal plate portion 163, and is rotatably supported in a state in which it cannot move in the axial direction. According to the slide mechanism 170, when the screw rod 171 is rotated by the pulse motor 172, the moving table 162 is moved along the guide rail 161 in the Y direction corresponding to the rotation direction.

  The cutting unit 140 reads a cylindrical housing 141 extending in the Y direction, a disk-shaped cutting blade 142 attached to the tip of the housing 141 on the chuck table mechanism 120 side, and a cutting line cut by the cutting blade 142. Alignment means 150. The cutting unit 140 is attached to the left surface of the vertical plate portion 164 of the movable table 162 as viewed in the direction of arrow F via a housing holder 165.

  The housing holder 165 is slidably attached to a vertically extending guide rail 166 formed on the left side surface of the vertical plate portion 164, and a pulse motor 180 fixed on the vertical plate portion 164 is a driving source. Is lifted and lowered along the guide rail 166 by the lifting mechanism. The housing 141 is passed through and fixed to the housing holder 165, so that the cutting unit 140 can be moved up and down together with the housing holder 165.

  FIG. 2 is a side cross-sectional view showing a mounting structure of a cutting blade provided in the cutting device. As shown in FIG. 2, the cutting blade 142 is a so-called hub blade fixed to the periphery of the umbrella-shaped hub 143. The hub 143 is fixed to a tip end of a spindle 144 that is rotationally driven by a motor (not shown) housed in the housing 141 of FIG. The axial direction of the spindle 144 is parallel to the Y direction in FIG. 1, and the exposed lower portion of the cutting blade 142 that rotates integrally with the spindle 144 contacts the motherboard 301 (see FIG. 7). Cutting is performed.

  As shown in FIG. 1, the alignment unit 150 includes a microscope, a CCD camera, and the like, and has an imaging unit 151 that images a subject at the tip. The alignment unit 150 is attached to the tip of the housing 141 such that the imaging unit 151 is adjacent to the cutting feed direction (Y direction) of the cutting blade 142. By using this alignment means 150, the cutting blade 142 is aligned (positioned) with respect to the cutting place.

(D) Water Jet Cutting Device FIG. 5 is a conceptual diagram showing an outline of the water jet cutting device 50. The water jet cutting device 50 sprays a thread-like high-pressure water jet mixed with abrasive grains onto the workpiece and cuts the workpiece using the jet containing the abrasive grains. Since the water jet cutting device 50 can be handled like a yarn saw, it is suitable for performing partial cutting, curved cutting, and bent cutting.

In the water jet cutting device 50, the high-pressure water generator 501 pressurizes the supplied water such as tap water or pure water and supplies it to the abrasive mixing device 502. The pressurizing pressure is appropriately set according to the material and thickness of the workpiece, and for example, 600 to 700 (kg / cm ² ) is used. The abrasive grain mixing device 502 mixes abrasive grains with high-pressure water, and sends the mixture to the water flow control device 504. Abrasive grains are supplied from the abrasive grain collection device 503 to the abrasive grain mixing device 502. As the abrasive grains, granular materials having a diameter of several tens of μm such as garnet, diamond, and alumina are used. The water flow control device 504 controls ON / OFF of the injection of the high-pressure water flow to the workpiece and the injection flow rate.

  High-pressure water from the water flow control device 504 is supplied to the injection nozzle 505, and thread-like high-pressure water is injected from the injection nozzle 505. The injection nozzle 505 includes an orifice 511. The orifice 511 is fixed to the injection nozzle 505 by a screwed orifice cover 512. The orifice 511 is a member for reducing the jet diameter of the high-pressure water to be small, and the diameter of the jet port 513 is, for example, 250 μm. For example, when the distance between the injection nozzle 505 and the workpiece is 50 μm to 1 mm and the diameter of the injection port 513 is 250 μm, the cut width (cut width) of the workpiece is about 300 μm.

  The thread-like high-pressure water stream 506 ejected from the ejection nozzle 505 is ejected to a workpiece (not shown) fixed to the moving table 507. The holding table 507 is supported by a table support arm 508. The table support arm 508 is driven by the table moving device 509, thereby moving the holding table 507 in a two-dimensional manner.

  The water used for cutting the workpiece is collected in the catch tank 510. In the catch tank 510, water containing abrasive grains is stored at a predetermined level, and the momentum of the high-pressure water flow is buffered and received. The abrasive grain collection device 503 collects abrasive grains from the water containing the abrasive grains discharged from the catch tank 510, sends it to the abrasive grain mixing device 502, and discharges unnecessary abrasive grains and water. The collection of the abrasive grains is performed by, for example, a filter. Further, the abrasive grains can be replenished by putting the abrasive grains into the catch tank 510.

  FIG. 6 is a perspective view (A) showing an outline of the holding table 507 and a side view (B) seen from the direction of the arrow 601. As shown in FIG. 6A, the holding table 507 is supported by a table support arm 508, and an opening 507a is formed at the center thereof. Since the high-pressure water flow passes through the opening 507a, the holding table 507 is not damaged by the high-pressure water flow. On the upper surface of the holding table 507, a clamper 507b for fixing the workpiece is disposed. FIG. 6B shows a state where the mother board 301 is fixed to the holding table 507 by the clamper 507b.

(E) Cutting step E-1. First Cutting Step Hereinafter, a step of cutting the mother board 301 to obtain a memory card substrate will be described. First, the first cutting process using the cutting apparatus 10 will be described. First, the mother board 301 is placed on the jig 20 shown in FIG. Then, the jig 20 on which the mother board 301 is placed is placed on the chuck table 125 of the cutting apparatus 10 shown in FIG. Next, the vacuum chuck function of the chuck table 125 is operated to suck the jig 20 on the chuck table 125 and suck the mother board 301 to the jig 20. FIG. 8 is a side cross-sectional view showing a state where the mother board 301 is adsorbed to the chuck table 125 via the jig 20. As shown in FIG. 8, when the vacuum chuck function of the chuck table 125 is activated, air is sucked into the chuck table 125 through the plurality of holes 204 provided in the jig 20, and the motherboard 301 is attached to the jig 20. Adsorbed.

  Cutting to the mother board 301 fixed on the chuck table 125 in the state shown in FIG. 8 is performed as follows. First, in the cutting apparatus 10, the rotation angle of the chuck table 125 and the relative position in the Y-axis direction with respect to the cutting blade 142 are finely adjusted, and the cutting blade 142 is aligned with the first scheduled cutting line 302 of the motherboard 301. Next, the position of the chuck table 125 in the X-axis direction is finely adjusted, and the position of the cutting blade 142 is aligned with the cutting start position of the first scheduled cutting line 302. Then, the cutting blade 142 is rotated, the position of the cutting blade in the Z-axis direction is finely adjusted, the cutting blade 142 cuts the mother board 301, and the cutting edge is accommodated in the groove 201 or 202 of the jig 20. And Thereafter, by moving the chuck table 125 in the X-axis direction, the cutting with the cutting blade 142 is performed on the mother board 301, and the mother board 301 is cut.

  Next, the procedure for cutting the motherboard will be described in more detail. FIG. 9 is a conceptual diagram showing the procedure of the first cutting process. In the first cutting process, as shown in FIG. 9, cutting is performed in the order of the first scheduled cutting lines 302a → 302b → 302c →. Cutting starts from the edge 312 in each planned cutting line 302a..., And is performed toward the surplus area 313 where no cutting is performed. That is, first, cutting is started from the edge 312 in the planned cutting line 302a, and at the stage of reaching the surplus region 313, the movement of the chuck table 125 is stopped and the cutting blade 142 is raised at the same time. Then, the chuck table 125 is returned to the original position, and the same operation is performed on the next scheduled cutting line 302b. By repeating this work process, the planned cutting lines 302a to 302i are sequentially cut and cut. By cutting the scheduled cutting lines 302 a to 302 i, a plurality of rows 314 of the strip-shaped memory card area 305 are formed, and a comb-like state is formed in which these are connected by the surplus area 313.

E-2. Corner Cutting Process After the cutting of the first scheduled cutting lines 302a shown in FIG. 9 is completed, a corner cutting process for cutting the corner of the memory card area 305 is performed. The corner cutting step is performed using a water jet cutting device 50 shown in FIG. For this purpose, first, the vacuum chuck function of the chuck table 125 is stopped, the mother board 301 is removed from the jig 20 and mounted on the holding table 507 of the water jet cutting device 50. FIG. 10 is a conceptual diagram showing the procedure of the corner cutting step. In FIG. 10, lines 315a to 315c are cutting lines after cutting the first scheduled cutting lines 302a to 302c shown in FIG. Hereinafter, an example of the corner cutting step will be described in detail with reference to FIG.

  In the cutting process using the water jet cutting device of FIG. 5, first, high-pressure water in the form of yarn is jetted to stabilize the jet flow. Then, as shown in FIG. 10A, the jet flow is moved to the end of the corner cutting scheduled line 303 by tracing the cutting line 315b indicated by the arrow 316a. At this stage, since only the linear gap that has already been cut is traced, the mother board 301 is not cut by the jet flow.

  Next, the high-pressure water stream is moved to the planned corner cutting line 303 along the path indicated by the arrow 316b in FIG. This cutting is performed under the condition that the cutting is completely performed in the thickness direction of the mother board 301. When the cutting of the corner cutting scheduled line 303 is completed, as shown by the arrow 316c in FIG. 10C, the cutting flow is traced in the reverse direction to move the jet flow, and the cutting line 315b is returned. Then, as indicated by an arrow 316d in FIG. 10D, the cutting trace 315b is traced with the high-pressure water flow again, and the high-pressure water flow is moved to the end of the next scheduled cutting line 303. Then, the above operation is repeated, and the corner cutting scheduled lines 303 are sequentially cut.

  FIG. 11 is a conceptual diagram showing a state in which the corner cutting step is completed. In FIG. 11, the cutting lines 315a to 315i cut in the first cutting process, the oblique cutting lines 317 cut in the corner cutting process, and the second scheduled cutting line 304a cut in the next second cutting process. ~ 304f are shown.

E-3. Second Cutting Step Next, a procedure for performing the second cutting step will be described with reference to FIG. Since the second cutting process is performed by the cutting device 10, first, the mother board 301 is removed from the holding table 507 of the water jet cutting device 50 and placed on the jig 20 on the chuck table 125 for positioning. Next, the vacuum chuck function of the chuck table 125 is operated, and the chuck table 125 is rotated by 90 ° to be in a state where cutting is possible.

  FIG. 13 shows a state in which the lowermost second scheduled cutting line 304a among the second scheduled cutting lines 304a to 304f in the second cutting process is cut. The cutting in the second cutting step is performed in the order of the second scheduled cutting line 304a → 304b → 304c →... 304f. As a result, each memory card area 305 is divided from the mother board 301. At this time, when the cutting blade 142 reaches the end of the oblique cutting line 317 cut in the corner cutting step, the corner is separated from the memory card region 305, and the memory card substrate 320 shown in FIG. 14 can be obtained. it can. Thereafter, the vacuum chuck function of the chuck table 125 is stopped, and the jig 20 on which the memory card substrate 320 is placed is transported to the next step.

  In the above embodiment, the first and second scheduled dividing lines 302 and 304 that make up most of the dividing process of the memory card substrate 320 are performed by cutting using the cutting blade 142, and only the corners are cut. This is performed by the water jet cutting device 50. That is, most of the processing is performed using the cutting blade 142 with low cost and high work efficiency, and the remaining portion is processed using the high-cost water jet cutting device 50, which increases the manufacturing cost and increases the processing efficiency. It is possible to divide the memory card substrate having a shape in which the corners are removed while minimizing the decrease.

2. Modified Example FIG. 15 shows a modified example of the cutting path by the water jet cutting device 50 shown in FIG. 10 in the first embodiment. In this example, in cutting the corner cutting scheduled line 303, the thread-like high-pressure water flow is advanced in the direction of arrow 318a → arrow 318b → arrow 318c → arrow 318d, and at this time, the jet flow of high-pressure water at the portions of the arrows 318b and 318c The motherboard 301 is cut using Note that the path shown in FIG. 10 is more advantageous from the viewpoint of minimizing cutting using the jet flow of high-pressure water.

3. Second Embodiment (A) Configuration of Dicing Tape This embodiment is an example in which a corner cutting process of the motherboard 301 is performed using laser light. In this embodiment, since the mother board 301 is fixed and divided on a dicing tape, the configuration of the dicing tape will be described first.

  FIG. 4 is a perspective view (A) and a side sectional view (B) showing an outline of a dicing tape (protective member) 401. A dicing tape 401 shown in FIG. 4 is composed of a flexible circular tape 402 having a pressure-sensitive adhesive layer on the surface, and the mother board 301 is attached to the pressure-sensitive adhesive layer and the mother board 301 is peeled off from the pressure-sensitive adhesive layer. You can also. A ring-shaped frame 403 is attached to the edge of the tape 402. The frame 403 is made of a metal plate, and the dicing tape 401 can be handled by the frame 403. When the dicing tape 401 is used, the height of the cutting blade 142 is adjusted so that the cutting blade 142 half-cuts the tape 402 in cutting using the cutting blade 142.

(B) Configuration of Laser Cutting Device Next, FIG. 16 is a conceptual diagram showing the laser cutting device. The laser cutting device 70 includes a laser oscillator 701, a mirror 702, an optical system 703, and an XY stage 704. The laser beam generated in the laser oscillator 701 is guided to the optical system 703 by changing the beam direction by the mirror 702. In the optical system 703, the laser beam is irradiated on the XY table 704 after adjusting the focal position and the beam diameter.

  The XY table 704 is freely movable in the XY plane. A clamper 704b is provided on the XY table 704, and the dicing tape 401 shown in FIG. 4 is attached to the XY table 704 by the clamper 704b. FIG. 16 shows a state where the motherboard 301 is attached to the dicing tape 401. In the present embodiment, a material that does not absorb or hardly absorbs laser light is selected as the tape 402. For example, as the material of the tape 402, a material that transmits 80% or more of the laser beam to be used is selected.

(C) Cutting step C-1. First Cutting Step In the present embodiment, the entire first cutting step → corner section cutting step → second cutting step is performed with the mother board 301 fixed to the dicing tape 401. FIG. 12 is a side view showing a state in which the dicing tape 401 is attracted to the chuck table 125. First, the mother board 301 is adhered to the dicing tape 401. Next, the dicing tape 401 is placed on the chuck table 125 and the vacuum suction function of the chuck table 125 is operated to suck the dicing tape 401 onto the chuck table 125. In this state, the first cutting process is performed as in the first embodiment.

C-2. Corner cutting step When the first cutting step is completed, the dicing tape 401 is removed from the chuck table 125 and attached to the XY table 704 of the laser cutting device 70. In this embodiment using laser light, laser light irradiation can be switched on and off at any time. For example, when cutting is performed along the path shown in FIG. 10, the path indicated by the arrow 316b in FIG. Only the laser beam is irradiated and the mother board 301 is cut. In this case, the laser beam irradiation is started from one point of the cutting trace 315b and moved along the corner cutting planned line 303, and the laser beam is reached when the second cutting scheduled line 304 in the second cutting process is reached. Stop irradiation. Thereby, the diagonal cutting line shown by the arrow 316b is formed.

C-3. Second cutting step After the corner cutting step is finished, the dicing tape 401 is removed from the XY table 704,
Adsorbed to the chuck table 125. Then, the second cutting process is performed in the same manner as in the first embodiment. When the second cutting process is completed, the dicing tape 401 to which the divided memory card substrate 320 is attached is conveyed to the next process.

  In the second embodiment, since the mother board 301 is fixed to the dicing tape 401, the first cutting process to the second cutting process are performed. Therefore, handling and positioning are extremely difficult compared to the first embodiment. There is an advantage that it is easy. Further, since the entire mother board 301 is fixed to the adhesive layer of the dicing tape 401, it is not necessary to provide the surplus area 313 in the mother board 301. For this reason, in the mother board 301, a dead space that is not used as a memory card can be reduced, and a material yield can be improved.

(D) Modification In the second embodiment, the dicing tape 401 is used in all steps, but the jig 20 can be used only in the first cutting step. In this case, it is necessary to provide a surplus area 313 for handling the motherboard 301.
In the first embodiment, the dicing tape 401 can also be used from the second cutting step.

  INDUSTRIAL APPLICABILITY The present invention can be manufactured inexpensively and efficiently with a memory card with corners cut off, and is extremely promising when applied to the manufacturing technology.

It is a perspective view which shows the cutting device used in the 1st Embodiment of this invention. It is a sectional side view which shows the attachment structure of the cutting blade with which the cutting device is provided in 1st Embodiment. It is the perspective view (A), top view (B), and side view (C) of the jig | tool which fixes a motherboard to a chuck table in 1st Embodiment. It is the perspective view (A) and side sectional view (B) which show the outline | summary of the dicing tape in 1st Embodiment. It is a conceptual diagram which shows the outline | summary of the water jet cutting device used in 1st Embodiment. It is the perspective view (A) and side view which show the outline | summary of the holding table in 1st Embodiment. It is a top view which shows the outline | summary of the motherboard in 1st Embodiment. It is a sectional side view which shows the state which fixed the motherboard to the chuck table via the jig | tool in 1st Embodiment. It is a conceptual diagram which shows the procedure of the 1st cutting process in 1st Embodiment. It is a conceptual diagram which shows the procedure of the corner | angular part cutting process in 1st Embodiment. It is a conceptual diagram which shows the completion | finish stage of the corner | angular part cutting process in 1st Embodiment. It is a side view which shows the state which mounted the dicing tape in the chuck table in 1st Embodiment. It is a conceptual diagram which shows the procedure of the 2nd cutting process in 1st Embodiment. It is a top view which shows the outline | summary of the memory card in 1st Embodiment. It is a conceptual diagram which shows the other procedure of the corner | angular part cutting process in 1st Embodiment. It is a conceptual diagram which shows the outline | summary of the laser cutting device used in 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Cutting device, 20 ... Jig, 50 ... Water jet cutting device,
125 ... chuck table, 142 ... cutting blade, 201 ... groove, 202 ... groove,
203 ... Memory card compatible area, 301 ... Motherboard,
302 (302a-302i) ... 1st cutting plan line,
303 ... Corner cutting scheduled line,
304 (304a-304f) ... 2nd cutting plan line,
305 ... Memory card area, 313 ... Surplus area, 315a to 315i ... Cutting line,
316a to 316d ... cutting path, 317 ... oblique cutting line, 320 ... memory card substrate,
401: Dicing tape (protective member).

Claims (4)

Motherboards each composed of a memory card area defined by a first scheduled dividing line and a second scheduled dividing line orthogonal thereto and an extra area provided outside the memory card area are divided into individual memory card areas. A method of dividing a memory card substrate into
The first dividing line is cut with a cutting blade to form a row of strip-shaped memory card areas, and the surplus area is left on one side of the rows of the memory card areas without cutting. 1 cutting process;
Corner portions that spray thread-like high-pressure water along the cutting lines cut by cutting in the first cutting step, trace the cutting lines, and form oblique cutting lines at predetermined corners of each memory card area Cutting process;
A second cutting step of cutting the second division line with a cutting blade to divide the row of the strip-shaped memory card areas into individual memory card areas. Split method.   In the corner cutting step, after forming the oblique cutting line, the thread-like high-pressure water is moved so as to trace the oblique cutting line, and the step returns to the cutting line cut by the cutting in the first cutting step. The method for dividing a memory card substrate according to claim 1, further comprising: Motherboards each composed of a memory card area defined by a first scheduled dividing line and a second scheduled dividing line orthogonal thereto and an extra area provided outside the memory card area are divided into individual memory card areas. A method of dividing a memory card substrate into
The first dividing line is cut with a cutting blade to form a row of strip-shaped memory card areas, and the surplus area is left on one side of the rows of the memory card areas without cutting. 1 cutting process;
A corner cutting step of forming a diagonal cutting line at a predetermined corner of each memory card region by sending a laser beam obliquely from above the cutting line cut by cutting in the first cutting step;
A second cutting step of cutting the second division line with a cutting blade to divide the row of the strip-shaped memory card areas into individual memory card areas. Split method. The method for dividing a memory card substrate according to claim 1, wherein at least the second cutting step is performed in a state where the mother board is disposed on a protective member having adhesiveness. .

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