200919240 •.九、發明說明： .【發明所屬之技術領域】 本發明涉及模擬技術，尤其涉及一種電路板製作模擬 系統及方法。 【先前技術】 資訊、通訊及消費性電子產業中，電路板為所有電子 貢訊產品不可或缺之基本構成要件。電路板可實現各種電 子零元件之電氣連接，使得各電子零元件可協同處理傳輸 訊號。 電路板之製作工藝通常包括下料、鑽孔、孔内鍍銅、 導電線路製作、光學檢測、覆蓋層貼覆、文字印刷、檢驗 包裝等步驟。下料係指將原材料如覆銅層壓板裁切成便於 生產之適當尺寸之基板。鑽孔及孔内鍍銅之目的為實現層 間導通。導電線路製作係指將基板上之銅箱製成設計之導 電圖形，一般藉由壓膜、曝光、顯影、钱刻、剝膜等製程 形成。光學檢測係指以自動光學檢測機對電路板之導電線 路進行檢查，以確定是否具有短路、斷路等導電線路不良 之情形（請參閱Acciani，G.等2006年8月發表於IEEE Transactions on Industrial Informatics 第 2 卷第 3 期之文獻 “Application of neural networks in optical inspection and classification of solder joints in surface mount technology ”）。覆蓋層貼覆係指於導電線路外表面貼覆一 層覆盡層以保護導電線路5避免導電線路氧化。文字印刷 係指將相應文字、商標或零件標號以網版印刷之方式印刷 7 200919240 上’以指示產品之型號或各種零件組裝或換修之 •位置。取後還需對電路板做最後之電性導通、 =性、熱衝擊耐受性試驗，檢驗合格後即可將產品包： 出> 〇 —^路板製作工藝較為複雜，涉及之工藝參數亦較多， 了一 1 固工藝參數均可能影響製造之電路板產品品質。因 t當開發電路板新產品或進行電路板現有產品改進時， =投：大量電路板樣品，經過大量實驗才能獲得-較佳 衣工^。如此不但浪費大量電路板製作之原材料、較多 =資源，且需要一段較長實驗時間，從而對開發電路 =新產品或改進電路板現有產品之成本、速度造成極大影 快速相:擬電路板製作結 以利於開發電路板新產 有鏗於此，提供一種可準確、 果之電路板製作模擬系統及方法， 品或改進電路板現有產品實屬必要 【發明内容】 以下’將以貫施例說日月—種可準確、快速模擬電路; 衣作結果之電路板製作模擬系統及方法。 ， 一種電路板製作模㈣統，包括至少—電路板製作模 ，子线’該電路板製作模擬子系統包括數據獲取模組、、 子儲核組、處理減及輪出模組’該數祕取模組用於誇 ^寺試驗之電路板製作工序之工藝參數，該存儲模組用ς 子儲與獲取之工藝參數相對應之模擬函數，該處理模組用 於獲取該;^擬函數’並根據該模擬函㈣獲取之卫藝參數 8 200919240 •進行運算，得出電路板經過該製作工序之性能參數模擬結 •果，該輸出模組用於輸出該模擬結果。 一種電路板製作模擬方法，包括以下步驟：利用數據 獲取模組獲取待試驗之電路板製作工序之工藝參數；從存 儲模組獲取模擬函數，該模擬函數與獲取之工藝參數相對 應；處理模組利用該模擬函數對獲取之工藝參數進行運 算，得出電路板經過該製作工序之性能參數模擬結果；利 用輸出模組輸出該模擬結果。 本技術方案之電路板製作模擬系統及方法可根據模擬 函數對待試驗之電路板工藝參數進行電路板製作流程之模 擬。因此，開發電路板新產品或改進電路板現有產品時， 不需要實際進行大量投料、實驗，即可準確、快速地獲得 電路板經過該製作工序之性能參數。如此不但可節省大量 原材料及大量人力資源，降低電路板新產品開發或現有產 品改進之成本，亦可提高電路板開發或改進之速度。 【實施方式】 下面將結合附圖及複數實施例，對本技術方案之電路 板製作模擬系統及方法作進一步之詳細說明。 如圖1所示，為本技術方案第一實施例提供之電路板 製作模擬系統10之功能模組圖。該電路板製作模擬系統10 可建構於一個或複數電腦中，其包括一電路板製作模擬子 系統11。該電路板製作模擬子系統11包括一數據獲取模組 111、一存儲模組112、一處理模組113及一輸出模組114。 該電路板製作模擬子系統11可對電路板製造中之一個製作 9 200919240 ，工序如孔内鍍銅工序進行模擬，亦可 .數製作工序如壓膜、曝光、顯影、蝕刻、：二製造中之複 以下僅以壓膜工序為例’對本實施例之電行模擬。 統10之功能模組進行說明。 反衣作杈擬系 該數據獲取模組ηι用於獲取待處理 數據可由工作人員從一輸入介面輸入，處理 J作模擬子系統輸出模組輸出之模擬 二：電路板 !組合。該待處理數據為電路板製上： 設備性能參數以及加工環境 七生此參數、加工 電路板尺寸、铜^ “板性質參數可包括 距等。加:材==銅荡厚度、導電線路之線寬、線 寸、成分、= =:視:材料而定，可包括原材料尺 密切相關，可為加工設備之= 嫩能參數與加工設備 境參數包括加工溫度、加週期等。加工環 等。 &力加工時間以及加工速度 於只際模擬過程令，待虛 工 序相關之所有，數，=:===之 例如，電路板進行壓二為參數。 膜熱輪溫度η，膜厂…：膜$=之=參數包括壓 該存儲模組112存儲右金垂、,ν以及板面溫度丁2。 處理數據相對庫之模擬Β 〃據獲取模組111獲取之待 〜之接擬函數。該存儲 記憶體或磁性記憶體，例如，硬碟。〜 可為半導體 本技術方案中，访π & ’、 函數係指製作電路板之工藝參 10 200919240 數與衣作出之電路板具體性能參， -電路板某—具體製作工 1日之函數關係，其可為 板性能參數間之闕係， =數與經過該工序之電路 該複數工序之電路板致=之工藝參數與經過 根據數學、物理相料^間之關係。該模擬函數可為 次試驗得出之出之柄闕係，亦可為根據多 析或統計分析對複冑&回歸分 數。 ^數4驗數據進行曲線擬合得出之類比函 優選地，電路板製作模擬系統 組及模擬函數嬅疋'J匕括數據分析模 員於1=拉組。該數據分析模組用於根據工作人 ::或仗數據庫獲取之多次試驗結果以函數類比法自動 i成拉擬函數。該模擬函數獲取模組用於從數據分析模組 又取生成之模擬函數。該存儲额112可與模擬函數獲取 模組:數據分析模组具有數據連接關係，以可從模擬^數 獲取模組、數據分析模組獲取生成之模擬函數。 壓膜工序中，當壓膜熱輪溫度T1於100〜14〇攝氏度之 間、板面溫度T2於35〜65攝氏度之間、壓膜速度乂於15〜2 5 米/分之間、壓膜壓力P於1〇〇〜300千帕之間時，以F表 示幹膜之附著力’以N表示幹膜之填充性，則有如下模擬 函數（1)、（ 2): F=alTl + a2T2 +a3P+a4V ( 1 ) N=blTl+b2T2 +b3P+b4V (2) 其中，al、a2、a3、a4、bl、b2、b3、b4 均為常數， 且 al、a2、a3、bl、b2、b3 為正數，a4、b4 為負數。 11 200919240 …該處理模組113用於獲取該與待處理數據相對應之模 -擬函數，並根據該模擬函數對獲取之數據進行運算「以得 出模擬結果。該數據處理模組113可為cpu。 “本實施例中，處理模組113首先從存儲模組ιΐ2獲取 杈擬函數⑴、（2)，然後根據模擬函數⑴、⑴以及 據獲取模組ill獲取之待處理數據T1、T2、v、p 從而獲得幹膜之附著力F、幹膜之填充性 丁异’ 即，獲得模擬結果。 <、體數值’ 並將用於從處理模組113獲取模擬結果， 外界介面’使得工作人員可獲知該工 ^ 之电路板性能參數。本實施例中，輸出桓 組m可將模擬結果F、N輸出至一顯示器。輪出拉 請參閱圖2 ’本技術方宰第一择 模擬方法包括以下步驟： AM供之電路板製作 步驟S1 .數據獲取模組111從外界之數撼私 一電路板製作模擬季移夕私山4 1之數據輪入端或另 、破系、，先之輸出模組獲取待虛 處理數據為製作電路柘 处里數據。該待 藝參數。 路板之某—工序或複數4之待試驗工 步驟S2··從軸存㈣ 對應之模擬函數。搜取與該待處理數據相 „ 筑該拉擬函數係指製作雷 與製作出之電路板1體 <作电路板之工藝參數 u 犯參數間之關係。 y驟S3 ·數據處理模组 取模組111獲取之1考 利用杈擬函數對從數 知取之待處理數撻 双錄筏 該模擬結果係模擬 弄，並得出模擬結果。 電條過某-袋作工序或複數裳作工 200919240 •序後之電路板具體性能參數。 社果少驟S4 ·輪出模組II4從數據處理模知 可V得Γ將該模礙結果輪出至外界介面。::：13獲取模擬 件輿待試祭工 囬处而，工作人昌 系統2〇包衽笛本技術方案第二實施例之 数 作模禊子手^電路叛袅作模擬子系統2i反袋作模擬 路板製作镇以三電路板製作模擬‘ M ’第二電路㈣、^ 21用於對電路板切光 電 行模銕，第-ί作模擬子系統22可對工序進行模 之模擬系统：，反製作模擬子系統23為：：顯影工序進 暮金ta 攸而，蕾_L 4 ^笔路板银刻工岸 電圖形製作流程、隹路板製作模擬系统20可對電心 謗第〜:進行模擬。 對電路板之 組211、第〜路板製作模擬子系统21勹h 模級存儲模緩2!2、第、、声匕括第一數據獲取模 工序J。”-數據獲取處理模1 且213及第-輪出 7工%袅叙 又取故組211用仇松 設定。讀第—二該待試驗之工藝參數可：取待試驗之曝光 相對應 存儲模纟且2U用认― 工作人員輸入或 曝光光模擬函數。今第儲與待試驗之卫藝參數 藝表數^數’並根據节曝^ 模叙213用於獲取該 ιϊ，行運算，得= 數對獲取之待試驗工 結果。4用於輪出電路板經過：:::结：。該第 铸第 艰九工序之曝光模擬. 級22:、：電路板製作模挺子系缔 4二存儲模細222、m 技第二數據獲取模 4二處理模挺223及第二輪出 200919240 模組224。該第二數據獲取模組221用於獲取待試驗之顯影 •工序工藝參數，該待試驗之顯影工序工藝參數可包括工作 人員輸入之工藝參數及第一輸出模組214輸出之電路板曝 光模擬結果。該第二存儲模組222用於存儲顯影模擬函數。 該第二處理模組223用於得出電路板顯影性能之模擬結 果。該第二輸出模組224用於輸出電路板經過顯影工序之 顯影性能模擬結果。 相類地，該第三電路板製作模擬子系統23包括第三數 據獲取模組231、第三存儲模組232、第三處理模組233及 第三輸出模組234，其可獲得蝕刻工序之模擬運算結果。 當然，該第一存儲模組212、第二存儲模組222、第三 存儲模組232可為同一存儲模組，即，存儲模組可存儲有 複數模擬函數，僅需複數模擬函數之存取路徑不同即可。 第一處理模組213、第二處理模組223、第三處理模組233 亦可為同一處理模組，即，處理模組可處理複數待處理流 程，僅需各個待處理之流程之處理順序不同即可。 電路板製作模擬系統20可根據工作人員輸入之工藝參 數快速獲得較為準確之電路板導電圖形製作之性能模擬結 果。 請參閱圖4,本技術方案第二實施例提供之電路板製作 模擬方法包括以下步驟： 步驟S10:第一數據獲取模組211從外界之數據輸入端 獲取待試驗之曝光工序工藝參數。 步驟S11:從第一存儲模組212獲取與曝光工序之工藝 14 200919240 參數相對應之曝光模擬函數。 • 步驟S12:第—處理 一數據獲取模組211 #、且213利用曝光模擬函數對從第 模擬結果。 &之工藝參數進行運算，得出曝光 步驟S13:第一輪出 曝光模擬結果，並 Ά 214從第—處理模組213獲取 步驟咖：第^ 及第—輸出模組214獲^^且221從外界之數據輸入端 步驟S15:從第二存^ ^之㈣工序工藝參數。 數相對應之顯影模擬函數。"、，且222獲取與顯影工序工藝參 -數2 Μ6,第一處理模組223湘顯影模擬函數對從第 據獲取模組221獲取之工藝參數進行運算，3 = 衫模擬結果。 並仔出顯 步驟S17:第二輸出模組224從第二處理·奶獲取 々衫擬結果，並將該顯影模擬結果輸出。 I +步驟S18:第三數據獲取模組231從外界之數據輸入端 及第二輸出模組224獲取蝕刻工序之工藝參數。 步驟S19:從第三存儲模組232獲取與蝕刻工序之工蓺 參數相對應之蝕刻模擬函數。 ^ 步驟S20:第三處理模組233利用蝕刻模擬函數對從第 二數據獲取模組231獲取之工藝參數進行運算，並得出钮 刻模擬結果。 步驟S21:第三輸出模組234從第三處理模組233赛取 钱刻模擬結果，並將該#刻模擬結果輸出至顯示幕。 15 200919240 • 經過以上步驟，電路板製作模擬系統及方法可獲得並 -輸出電路板經壓膜、顯影、蝕刻工序後之性能參數模擬結 果，即，可獲得並輸出電路板導電圖形之性能參數模擬結 果。 本技術方案之電路板製作模擬系統及方法可根據模擬 函數對待試驗之電路板工藝參數進行電路板製作流程之模 擬。因此，開發電路板新產品或改進電路板現有產品時， 不需要實際進行大量投料、實驗，即可準確、快速地獲得 電路板經過該製作工序之性能參數。如此不但可節省大量 原材料及大量人力資源，降低電路板新產品開發或現有產 品改進之成本，亦可提高電路板開發或改進之速度。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 £ 應涵蓋於以下申請專利範圍内。 I, 【圖式簡單說明】 圖1係本技術方案第一實施例提供之電路板製作模擬 系統之功能模組圖。 圖2係本技術方案第一實施例提供之電路板製作模擬 方法之流程圖。 圖3係本技術方案第二實施例提供之電路板製作模擬 系統之功能模組圖。 圖4係本技術方案第二實施例提供之電路板製作模擬 16 200919240 •方法之流程圖。 •【主要元件符號說明】 電路板製作模擬系統 10，20 電路板製作模擬子系統 11 ， 21 ， 22 ， 23 數據獲取模組 111 存儲模組 112 處理模組 113 輸出模組 114 第一數據獲取模組 211 第一存儲模組 212 第一處理模組 213 第一輸出模組 214 第二數據獲取模組 221 第二存儲模組 222 第二處理模組 223 第二輸出模組 224 第三數據獲取模組 231 第三存儲模組 232 第三處理模組 233 第三輸出模組 234 17200919240 • Nine, invention description: . [Technical field to which the invention pertains] The present invention relates to analog technology, and more particularly to a circuit board production simulation system and method. [Prior Art] In the information, communication and consumer electronics industries, circuit boards are an essential component of all electronic tribute products. The board enables electrical connection of various electronic components so that each electronic component can cooperatively process the transmitted signal. The manufacturing process of the circuit board usually includes steps of blanking, drilling, copper plating in holes, fabrication of conductive lines, optical inspection, overlay coating, text printing, inspection and packaging, and the like. The blanking refers to cutting a raw material such as a copper clad laminate into a substrate of an appropriate size for ease of production. The purpose of copper plating in the holes and holes is to achieve interlayer conduction. Conductive circuit fabrication refers to the formation of a conductive pattern on a copper box on a substrate, usually by lamination, exposure, development, engraving, stripping, and the like. Optical inspection refers to the inspection of the conductive circuit of the circuit board by an automatic optical detector to determine whether there is a short circuit or open circuit, etc. (see Acciana, G. et al., August 2006, IEEE Transactions on Industrial Informatics). "Application of neural networks in optical inspection and classification of solder joints in surface mount technology", Volume 2, Issue 3. Overlay overlay refers to attaching a layer of overlayer on the outer surface of the conductive trace to protect the conductive trace 5 from oxidation of the conductive trace. Text printing means printing the corresponding text, trademark or part number in the form of screen printing 7 200919240 to indicate the model of the product or the location or replacement of various parts. After the take-up, it is necessary to make the final electrical conduction, = sex, and thermal shock resistance test on the circuit board. After the inspection is passed, the product package can be packaged: Out > 〇 - ^ Road board manufacturing process is more complicated, involving the process parameters There are also many, one-to-one solid process parameters may affect the quality of the manufactured circuit board products. Because when developing new board products or improving existing products on the board, = cast: a large number of board samples, after a lot of experiments can get - better clothes ^. This not only wastes a lot of raw materials for circuit board production, more = resources, and requires a long experiment time, which makes a huge impact on the cost and speed of developing circuits = new products or improving the existing products of the circuit board: In order to facilitate the development of new circuit boards, it is necessary to provide an accurate and reliable circuit board production simulation system and method. It is necessary to improve the existing products of the circuit board. [Inventive content] The following 'will be used to illustrate Sun and Moon - a circuit board production simulation system and method that can accurately and quickly simulate circuits; , a circuit board manufacturing module (four) system, including at least - a circuit board manufacturing module, a sub-wire 'the circuit board production simulation subsystem includes a data acquisition module, a sub-reservoir group, a processing reduction and a wheel-out module' The module is used for the process parameters of the circuit board manufacturing process of the exaggeration temple test, and the storage module uses the simulation function corresponding to the process parameter of the scorpion storage, and the processing module is used to obtain the; According to the simulation letter (4), the Weiyi parameter 8 200919240 • The calculation is performed to obtain the performance parameter simulation result of the circuit board through the production process, and the output module is used to output the simulation result. A circuit board manufacturing simulation method includes the following steps: obtaining a process parameter of a circuit board manufacturing process to be tested by using a data acquisition module; acquiring a simulation function from the storage module, the simulation function corresponding to the acquired process parameter; and processing module The simulation function is used to calculate the obtained process parameters, and the simulation result of the performance parameters of the circuit board through the manufacturing process is obtained; the simulation result is output by using the output module. The circuit board manufacturing simulation system and method of the present technical solution can simulate the circuit board manufacturing process according to the simulation function of the circuit board process parameters to be tested. Therefore, when developing a new circuit board product or improving the existing product of the circuit board, it is possible to accurately and quickly obtain the performance parameters of the circuit board through the manufacturing process without actually performing a large amount of feeding and experimenting. This not only saves a lot of raw materials and a lot of human resources, but also reduces the cost of new board development or existing product improvements, and also increases the speed of board development or improvement. [Embodiment] Hereinafter, a circuit board production simulation system and method of the present technical solution will be further described in detail with reference to the accompanying drawings and the embodiments. As shown in FIG. 1, a functional module diagram of a circuit board manufacturing simulation system 10 provided by the first embodiment of the present technical solution is shown. The board fabrication simulation system 10 can be constructed in one or more computers including a board fabrication simulation subsystem 11. The circuit board simulation subsystem 11 includes a data acquisition module 111, a storage module 112, a processing module 113, and an output module 114. The circuit board manufacturing simulation subsystem 11 can manufacture 9 200919240 for one of the circuit board manufacturing processes, such as a copper plating process in a hole, or a number of manufacturing processes such as lamination, exposure, development, etching, and the like. In the following, only the lamination process is taken as an example to simulate the electric line of the present embodiment. The function module of the system 10 is explained. The data acquisition module ηι is used to obtain the data to be processed, which can be input by the staff from an input interface, and the processing J is used as the simulation of the output output module of the analog subsystem. The data to be processed is on the circuit board: equipment performance parameters and processing environment, such parameters, processing board size, copper ^ "plate property parameters can include distance. Add: material = = copper thickness, conductive line width , line inch, composition, = =: depending on the material, may include the raw material ruler closely related, can be the processing equipment = tender energy parameters and processing equipment environment parameters including processing temperature, adding cycle, etc. Processing ring, etc. & The force processing time and the processing speed are only in the simulation process, and all the numbers related to the virtual process are counted, for example, ===== For example, the board is pressed to the second parameter. The film heat wheel temperature η, the film factory...: film $ The = parameter includes pressing the storage module 112 to store the right sag, ν, and the board temperature 2 2. The simulation of the data relative to the library 〃 the acquisition module 111 obtains the corresponding function. Body or magnetic memory, for example, hard disk. ~ Can be used in this technical solution of semiconductor, visit π & ', function refers to the process of making circuit board 10 200919240 number and board made of specific performance parameters, - circuit Board The function relationship of the specific production worker on the 1st, which can be the relationship between the performance parameters of the board, the number of the circuit and the circuit board of the circuit through the process are the process parameters of the circuit and the data according to the mathematics and physical materials. Relationship. The simulation function can be used for the sub-test, or it can be based on the analysis or statistical analysis of the retracement & regression score. Ground, circuit board production simulation system group and simulation function 嬅疋 'J 数据 data analysis model in 1 = pull group. The data analysis module is used to obtain multiple test results according to the worker:: or 仗 database to function The analogy method automatically generates a simulation function, and the simulation function acquisition module is used to obtain the simulation function generated from the data analysis module. The storage amount 112 can be connected with the simulation function acquisition module: the data analysis module has a data connection relationship. The simulation function can be obtained by acquiring the module and the data analysis module from the analog system. In the laminating process, when the laminating heat wheel temperature T1 is between 100 and 14 degrees Celsius, the plate surface temperature is T2 at 35 to 65 degrees Celsius. between When the laminating speed is between 15 and 25 m/min, and the laminating pressure P is between 1 and 300 kPa, the adhesion of the dry film is indicated by F, and the filling property of the dry film is indicated by N. There are the following simulation functions (1), (2): F=alTl + a2T2 + a3P+a4V ( 1 ) N=blTl+b2T2 +b3P+b4V (2) where al, a2, a3, a4, bl, b2 B3 and b4 are all constants, and al, a2, a3, bl, b2, and b3 are positive numbers, and a4 and b4 are negative numbers. 11 200919240 ... The processing module 113 is configured to acquire the analog-to-be-corresponding data corresponding to the data to be processed. The function calculates the acquired data according to the simulation function to obtain the simulation result. The data processing module 113 can be a CPU. In the present embodiment, the processing module 113 first acquires the simulation functions (1), (2) from the storage module ι2, and then according to the simulation functions (1), (1) and the to-be-processed data T1, T2, v obtained according to the acquisition module ill, Therefore, the adhesion of the dry film F and the filling property of the dry film are obtained, that is, the simulation result is obtained. <, the volume value 'will be used to obtain the simulation result from the processing module 113, and the external interface' enables the staff to The performance parameter of the circuit board of the work is known. In this embodiment, the output group m can output the simulation results F and N to a display. The wheel pull is shown in Fig. 2 'The first method of the simulation method includes the following Step: AM for the circuit board manufacturing step S1. The data acquisition module 111 is made from the outside number of the private circuit board to make the simulation season shifting the private mountain 4 1 data wheel in the end or another, broken system, first output mode The group obtains the data to be virtualized as the data in the circuit of the circuit. The parameter of the process is a certain step of the road plate - the process or the complex number 4 steps to be tested S2 · the slave axis (4) corresponding to the simulation function. Processing data Means the number of mine production and production of the circuit board body 1 < process parameter u for a circuit board made of the relationship between the parameters. y S3 · Data processing module Take the module 111 to obtain the 1 test. Use the analog function to know the number to be processed from the number 挞 Double recording 筏 The simulation result is simulated and the simulation result is obtained. Electric strips over a bag-making process or a plurality of skirts work 200919240 • The specific performance parameters of the circuit board after the sequence. The result is less than S4. The round-out module II4 knows from the data processing mode that the result of the mode can be rotated out to the external interface. :::13 Get the simulation piece 舆The test ritual is going back, the work person Chang system 2 〇 衽 衽 技术 技术 技术 技术 第二 第二 第二 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路For the analog road board production town, the three circuit boards are used to simulate the 'M' second circuit (4), ^ 21 is used to cut the photoelectric circuit module on the circuit board, and the first simulation system subsystem 22 can simulate the operation of the process: , the counter-production simulation subsystem 23 is:: the development process into the ta ta ,, 蕾 _L 4 ^ pen board silver engraving work shore graphics production process, the chopping board production simulation system 20 can be on the electric heart 谤 ~: Perform the simulation. For the circuit board group 211, the first road board, the simulation subsystem 21勹h, the mode storage mode buffer 2! 2, the second, the sound includes the first data acquisition mode process J. ”-Data acquisition processing module 1 and 213 and the first round of the 7%% 又 又 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 2 and 2U use the staff input or exposure light simulation function. The number of the art table parameters of the current storage and test to be tested ^ and according to the section exposure ^ model 213 is used to obtain the ιϊ, row operation, get = The number of pairs to be tested is the result of the test. 4 used to turn out the board after: :::: knot: The exposure simulation of the first hard process of the first casting. Level 22:,: circuit board making molds The storage module 222, the m technology second data acquisition module 4, the second processing module 223, and the second round of the 200919240 module 224. The second data acquisition module 221 is configured to obtain the development and process parameters to be tested. The development process parameter of the test may include a process parameter input by the worker and a circuit board exposure simulation result output by the first output module 214. The second storage module 222 is configured to store a development simulation function. The second processing module 223 Used to derive simulation results for board development performance. The second output module 224 is configured to output a simulation result of the development performance of the circuit board through the developing process. Similarly, the third circuit board manufacturing simulation subsystem 23 includes a third data acquisition module 231 and a third storage module 232. The third processing module 233 and the third output module 234 can obtain the simulation result of the etching process. Of course, the first storage module 212, the second storage module 222, and the third storage module 232 can be the same. The storage module, that is, the storage module can store a plurality of analog functions, and only the access paths of the plurality of analog functions are different. The first processing module 213, the second processing module 223, and the third processing module 233 are also It can be the same processing module, that is, the processing module can process the multiple to-be-processed processes, and only need to process the processes to be processed differently. The circuit board production simulation system 20 can quickly obtain the process parameters according to the input of the staff. The performance simulation result of the circuit board conductive pattern production is accurate. Referring to FIG. 4, the circuit board manufacturing simulation method provided by the second embodiment of the present technical solution includes the following steps: Step S10: The first data acquisition module 211 obtains the exposure process parameter to be tested from the data input end of the external environment. Step S11: Obtain an exposure simulation function corresponding to the process of the process 14 200919240 of the exposure process from the first storage module 212. S12: The first processing-data acquisition module 211 #, and 213 uses the exposure simulation function to calculate the process parameters from the first simulation result, and obtains the exposure step S13: the first round-out exposure simulation result, and Ά 214 Steps from the first processing module 213 are obtained: the ^ and the first output modules 214 are obtained from the external data input step S15: from the second (4) process parameters. The number corresponds to the development simulation function. ", and 222 acquisition and development process process parameters - 2 Μ 6, the first processing module 223 Xiang development simulation function on the process parameters obtained from the data acquisition module 221, 3 = shirt simulation results. Step S17: The second output module 224 obtains the result from the second processing milk and outputs the development simulation result. I + step S18: The third data acquisition module 231 acquires the process parameters of the etching process from the external data input terminal and the second output module 224. Step S19: Obtain an etching simulation function corresponding to the work parameter of the etching process from the third storage module 232. Step S20: The third processing module 233 performs an operation on the process parameters acquired from the second data acquisition module 231 by using an etch simulation function, and obtains a button simulation result. Step S21: The third output module 234 retrieves the simulation result from the third processing module 233, and outputs the #刻 simulation result to the display screen. 15 200919240 • After the above steps, the circuit board production simulation system and method can obtain the performance parameter simulation results of the output-board after the lamination, development and etching processes, that is, the performance parameter simulation of the conductive pattern of the circuit board can be obtained and output. result. The circuit board manufacturing simulation system and method of the present technical solution can simulate the circuit board manufacturing process according to the simulation function of the circuit board process parameters to be tested. Therefore, when developing a new circuit board product or improving the existing product of the circuit board, it is possible to accurately and quickly obtain the performance parameters of the circuit board through the manufacturing process without actually performing a large amount of feeding and experimenting. This not only saves a lot of raw materials and a lot of human resources, but also reduces the cost of new board development or existing product improvements, and also increases the speed of board development or improvement. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. I. [Simple Description of the Drawings] FIG. 1 is a functional block diagram of a circuit board manufacturing simulation system provided by the first embodiment of the present technical solution. FIG. 2 is a flow chart of a circuit board manufacturing simulation method provided by the first embodiment of the present technical solution. 3 is a functional block diagram of a circuit board manufacturing simulation system provided by a second embodiment of the present technical solution. 4 is a circuit board fabrication simulation provided by a second embodiment of the present technical solution. 16 200919240 A flowchart of a method. • [Main component symbol description] Circuit board production simulation system 10, 20 Circuit board production simulation subsystem 11, 21, 22, 23 Data acquisition module 111 Storage module 112 Processing module 113 Output module 114 First data acquisition mode Group 211 first storage module 212 first processing module 213 first output module 214 second data acquisition module 221 second storage module 222 second processing module 223 second output module 224 third data acquisition module Group 231 third storage module 232 third processing module 233 third output module 234 17