200919151 九、發明說明： 【發明所屬之技術領域】 本發明係涉及散熱裝置的技術領域，尤其指一種製 作、組裝簡單及散熱效果佳之記憶體模組及其之散熱裝置。 【先前技術】 請參閱台灣專利公告第1273688號所示係為一種記憶 體模組整合結構。其主要係藉由導熱片將記憶體所產生的 熱量傳導至一第二板體’以利用該較大面積的第二板體夾 達到散熱之目的。然而，該第二板體上的熱量係利用自動 散發來產生散熱效果。所以其散熱效率較低，而且該第二 板體亦很容易產生積熱。尤其是記憶體所產生的熱量大於 該第二板體的散熱效率時，則便會大幅影響其之散熱的效 果。 請參閱台灣專利公告第534373號所示係為一種記憶 體之包爽式散熱裝置。其主要係具有兩散熱夾板供夾設於 一記憶體的兩侧面，且於其中一散熱夾板上侧一體垂直延 伸一風扇座供一風扇組裝，使該風扇可對下方之複數記憶 體吹送冷卻軋流以達降溫之目的。然而，於該散熱板上一 體折設出一風扇座的製作係較為麻煩。而且該風扇座的面 積係較該散熱片小，所以該散熱板傳導至該風扇座的熱量 非常有限，因此該記憶體所產生的熱量仍大部份積於該散 熱板上，而如此則記憶體亦仍會受到該散熱板上高溫的影 響，而使散熱效果不佳。而且該風扇座僅靠一側邊與該散 200919151 甚d該風扇高速運轉時係會產生震動，而易 本日甚錢私憶料到損傷。 體之灣專利公告第敗娜號所示係為-種記憶 非常大，而且結構體嵌槽座上。所以整體的體積 兩側面夾雜。再者，其記龍又僅利用 積熱，因此該記憶導出’而該散熱片係易產生 % -乃易又到該散熱片上高溫的影響。 【發明内容】 組裝簡單及散熱 本發明之主要目的係如共一種製作 效果佳之記憶體模組及其散熱裝置者。 該記憶體模組包括複數記憶體及一散熱裳置。每一記 =具有至少一個熱源。該散熱裝置包括一麵、複 數導熱部及至少-風扇。如輕熱部係 與每一記憶體的熱源，供將該熱源的熱量傳導至 片。該風扇餘於該散熱片上可供肢降低該些記 溫度。 如此，由於本發明之結構簡單所以製作、組裝上 簡單方便。而且該散熱裝置之導熱部係可將該記憶體之執 源的熱量傳導至該較大_的散熱片，所以紅散熱效^ 較佳。而且該風扇又可供降低該記憶體的溫度，以增加其 之散熱效果。 ' 6 200919151 【實施方式】 第一、二圖係顯示本發明所述之記憶體模組的第一實 施例，其結構係包括複數記憶體2及一散熱裝置4。 每一記憶體2各具有複複記憶體顆粒6、一晶片8及 兩導熱片10。該晶片8係設於其中一記憶體顆粒6上。該 兩導熱片10係設於兩側面，且貼靠於該晶片8上供將晶片 8之熱量導出。 該散熱裝置4,係包括一散熱片12、複數導熱部14、 兩個風扇16及複數個固定螺絲18。 該散熱片12係設於該些記憶體2的上方，且具有複數 個插槽20、兩個散熱孔22及複數個固定柱24。於該固定 柱24上設有貫穿之固定孔26。 每一個導熱部14具有一基片28及兩連接片30。該兩 連接片30係延伸自該基片28的兩侧邊，且該兩連接片30 並分別插入該散熱片12的插槽20中、並以一扣合結構將 使兩者緊密結合，該兩連接片30並夾設於該記憶體2之兩 導熱片10的外側面。 該兩個風扇16係分別設於該散熱片12的兩個散熱孔 22上方，使該風扇16所產生的氣流可經該些散熱孔22吹 向該些記憶體2,且於該兩風扇16上各設有複數個穿孔32。 該些固定螺絲18係分別係分別穿過該兩風扇18的穿 孔32而螺鎖於該固定孔26。 第三圖係顯示該風扇18之穿孔32係套設於該散熱片 12之固定柱24上，然後該固定螺絲18係穿過該風扇18 200919151 的穿孔32而螺鎖於該固定孔26。 在上述實施例中該導熱片10係貼靠於該晶片8上供將 晶片8之熱量導出，所以該導熱片10係為該記憶體2之熱 源。該導熱部14便連接該導熱片10與該散熱片12，以供 將該導熱片10之熱量傳導至散熱片10。而當該記憶體2 未設有導熱片10時，則該晶片8便為該記憶體2之熱源。 該導熱部14便直接連接該晶片8與該散熱片12，以供將 該導熱片10之熱量傳導至散熱片12。 第四圖係為本發明之第二實施例，其結構係大致與第 一實施例相同，雨差別在於該第二實施例更包括一散熱鰭 片34設於該散熱片12與該兩風扇16之間。其中該兩風扇 16係設於該散熱鰭片34的頂部，且設於該散熱鰭片34中。 第五圖係為本發明之第三實施例，其結構係大致與第 二實施例相同，而差別在於該第三實施例的兩個兩風扇16 係設於該散熱鰭片34的頂部，且凸出於該散熱鰭片34外。 第六圖係為本發明之第四實施例，其結構係大致與第 三實施例相同，而差別在於該第四實施例的兩個兩風扇16 係分別設於該散熱鰭片34的兩側邊，該兩風扇16 —者為 吹風，一者為吸風。 第七圖係為本發明之第五實施例，其結構係大致與第 一實施例相同。而差別在於該第五實施例之散熱片12包括 一座片36及一侧片38。該座片36係位於該些記憶體2的 上方。該側片38係垂直延伸至該些記憶體2之一側，且與 該些記憶體2呈垂直狀。該側片38上具有一散熱孔22。 該風扇16係結合於該側片38上，使其所產生之氣流可經 8 200919151 該散熱孔22吹向該記憶體2。 第八圖係為本發明之第六實施例，其結構係大致與第 五實施例相同。而差別在於該第六實施例之座片36的兩相 對侧皆設有一侧片38,且於該兩側月38上各設有一風扇 16，該兩風扇16者者為吹，一者為吸。 第九圖係為本發明之第七實施例，其結構係大致與第 五實施例相同。而差別在於該第七實施例更包括一散熱轉 片34設於該座片36上。 第十圖係為本發明之第八實施例，其結構係大致與第 七實施例相同’而差別在於該第八實施例更包括有兩個風 扇16設於該散熱鰭片34的頂部，且並凸出於該散熱鰭片 34外部。 第十一圖係為本發明之第九實施例，其結構係大致與 第八實施例相同，而差別在於該第九實施例設於該散熱簿 片34頂部的兩個風扇16係設於該散熱鰭片34中。 由於本發明之係利用導熱部14將記憶體2所產生的埶 =傳導至該面積較大的散熱片12，然後再藉由該風扇16 二拂該散熱片12或直接吹拂該記憶體2,以使其快速降 机所以係可具有非常良好的散熱效果。而且該散熱裝置 於製作、組裝上亦較為簡單方便。 無論如何，任何人都可以從上述例子的說明獲得足夠 導，並據而了解本發明確實有產業上之利用性。又，未 ^與本發__技術’所以本發财新娜。又，未見 '、本發明類似的技術，所以本發明有進步性。於是，本發 明確已符合發明專利要件，爰依法提出申請。 Χ 9 200919151 【圖式簡單說明】 第圖係本發明第一實施例之立體分解圖。 第二圖係本發明第—實施例之立體組合圖。 第三圖係本發料—實施例之局部剖面放大示意圖 第四圖係本發明第二實施例之立體組合圖。 第五圖係本發明第三實施例之立體組合圖。 第六圖係本發明第四實施例之立體分解圖。 第七圖係本發明第五實施例之立體分解圖。 第八圖係本發明第六實施例之立體分解圖。 第九圖係本發明第七實施例之立體分解圖。 第十圖係本發明第八實施例之立體分解圖。 第十一圖係本發明第九實施例之立體分解圖。 【主要元件符號說明】 2記憶體 4散熱裝置 6記憶體顆粒 8晶片 10導熱片 12散熱片 14導熱部 16風扇 18固定螺絲 20插槽 22散熱孔 24固定桎 200919151 26固定孔 30連接片 34散熱鰭片 38側片 28基片 32穿孔 36座片 11200919151 IX. Description of the Invention: [Technical Field] The present invention relates to the technical field of heat dissipating devices, and more particularly to a memory module and a heat dissipating device which are easy to manufacture, assemble, and have good heat dissipation effects. [Prior Art] Please refer to Taiwan Patent Publication No. 1273688 for a memory module integration structure. The heat generated by the memory is mainly transmitted to the second board by the heat conducting sheet to utilize the second board clamp of the larger area to achieve heat dissipation. However, the heat on the second plate is automatically dissipated to generate a heat dissipation effect. Therefore, the heat dissipation efficiency is low, and the second plate body is also prone to generate heat. In particular, when the heat generated by the memory is greater than the heat dissipation efficiency of the second plate, the heat dissipation effect is greatly affected. Please refer to Taiwan Patent Publication No. 534373 for a memory-cooled heat sink. The utility model mainly has two heat dissipating clips for clamping on two sides of a memory body, and a fan seat is vertically extended on one of the heat dissipating clip plates for assembly by a fan, so that the fan can blow cooling and rolling the plurality of memory materials below. Flow to cool down. However, it is troublesome to fold a fan holder on the heat sink. Moreover, the area of the fan holder is smaller than that of the heat sink. Therefore, the heat transferred from the heat dissipation plate to the fan holder is very limited, so that the heat generated by the memory is still mostly accumulated on the heat dissipation plate, and thus the memory is remembered. The body is still affected by the high temperature on the heat sink, which makes the heat dissipation effect poor. Moreover, the fan seat is only on one side and the side of the 200919151. When the fan is running at a high speed, vibration will occur, and it is easy to privately recall the damage. The body of the Bay of the Patent Announcement is the type of memory that is very large, and the structure is embedded in the seat. So the overall volume is mixed on both sides. Furthermore, the recording dragon uses only the accumulated heat, so the memory is derived and the heat sink is prone to generate a high temperature effect on the heat sink. SUMMARY OF THE INVENTION Simple assembly and heat dissipation The main object of the present invention is to collectively produce a memory module and a heat sink thereof. The memory module includes a plurality of memories and a heat sink. Each record = has at least one heat source. The heat sink includes a side, a plurality of heat conducting portions, and at least a fan. For example, the heat source and the heat source of each memory are used to conduct heat from the heat source to the sheet. The fan is disposed on the heat sink to allow the limb to lower the temperature. Thus, since the structure of the present invention is simple, it is simple and convenient to manufacture and assemble. Moreover, the heat conducting portion of the heat dissipating device can conduct the heat of the source of the memory to the larger heat sink, so the red heat dissipating effect is better. Moreover, the fan can be used to lower the temperature of the memory to increase its heat dissipation. [Embodiment] The first and second figures show a first embodiment of the memory module of the present invention, the structure of which includes a plurality of memories 2 and a heat sink 4. Each of the memories 2 has a complex memory particle 6, a wafer 8, and two thermally conductive sheets 10. The wafer 8 is attached to one of the memory particles 6. The two thermally conductive sheets 10 are disposed on both sides and abut against the wafer 8 for guiding the heat of the wafer 8. The heat sink 4 includes a heat sink 12, a plurality of heat conducting portions 14, two fans 16, and a plurality of fixing screws 18. The heat sink 12 is disposed above the memory 2 and has a plurality of slots 20, two heat dissipation holes 22, and a plurality of fixing posts 24. A fixing hole 26 is formed in the fixing post 24. Each of the heat conducting portions 14 has a substrate 28 and two connecting sheets 30. The two connecting pieces 30 extend from the two sides of the substrate 28, and the two connecting pieces 30 are respectively inserted into the slots 20 of the heat sink 12, and the two are tightly coupled by a fastening structure. The two connecting pieces 30 are sandwiched on the outer side surfaces of the two heat conducting sheets 10 of the memory 2. The two fans 16 are respectively disposed above the two heat dissipation holes 22 of the heat sink 12, so that the airflow generated by the fan 16 can be blown to the memory bodies 2 through the heat dissipation holes 22, and the two fans 16 are A plurality of perforations 32 are provided on each of the plurality. The fixing screws 18 are screwed into the fixing holes 26 through the through holes 32 of the two fans 18 respectively. The third figure shows that the through hole 32 of the fan 18 is sleeved on the fixing post 24 of the heat sink 12, and then the fixing screw 18 is screwed through the through hole 32 of the fan 18 200919151 to be screwed to the fixing hole 26. In the above embodiment, the thermal conductive sheet 10 is attached to the wafer 8 for guiding the heat of the wafer 8, so that the thermal conductive sheet 10 is a heat source of the memory 2. The heat conducting portion 14 connects the heat conducting sheet 10 and the heat sink 12 for conducting heat of the heat conducting sheet 10 to the heat sink 10. When the memory 2 is not provided with the thermal conductive sheet 10, the wafer 8 is the heat source of the memory 2. The heat conducting portion 14 directly connects the wafer 8 and the heat sink 12 for conducting heat of the heat conducting sheet 10 to the heat sink 12. The fourth embodiment is a second embodiment of the present invention, and the structure is substantially the same as that of the first embodiment. The difference in the rain is that the second embodiment further includes a heat dissipation fin 34 disposed on the heat sink 12 and the two fans 16 . between. The two fans 16 are disposed on the top of the heat dissipation fins 34 and disposed in the heat dissipation fins 34. The fifth embodiment is a third embodiment of the present invention, and the structure is substantially the same as that of the second embodiment, except that the two two fans 16 of the third embodiment are disposed on the top of the heat dissipation fins 34, and Protruding out of the heat dissipation fins 34. The sixth embodiment is a fourth embodiment of the present invention, and the structure is substantially the same as that of the third embodiment, and the difference is that the two two fans 16 of the fourth embodiment are respectively disposed on both sides of the heat dissipation fin 34. On the side, the two fans 16 are blown, and one is suction. The seventh drawing is a fifth embodiment of the present invention, and its structure is substantially the same as that of the first embodiment. The difference is that the heat sink 12 of the fifth embodiment includes a sheet 36 and a sheet 38. The seat piece 36 is located above the memory 2. The side panel 38 extends vertically to one side of the memory 2 and is perpendicular to the memory 2. The side panel 38 has a heat dissipation hole 22 therein. The fan 16 is coupled to the side panel 38 such that the airflow generated by the fan 16 can be blown toward the memory 2 via the heat dissipation hole 22 of 200919151. The eighth embodiment is a sixth embodiment of the present invention, and its structure is substantially the same as that of the fifth embodiment. The difference is that the opposite sides of the seat piece 36 of the sixth embodiment are provided with a side piece 38, and a fan 16 is disposed on each of the two sides of the month 38. The two fans 16 are blown, and one is sucked. . The ninth embodiment is a seventh embodiment of the present invention, and its structure is substantially the same as that of the fifth embodiment. The difference is that the seventh embodiment further includes a heat dissipating fin 34 disposed on the seat piece 36. The tenth embodiment is an eighth embodiment of the present invention, and the structure is substantially the same as that of the seventh embodiment. The difference is that the eighth embodiment further includes two fans 16 disposed on the top of the heat dissipation fins 34, and And protruded from the outside of the heat dissipation fin 34. The eleventh embodiment is a ninth embodiment of the present invention, and the structure is substantially the same as that of the eighth embodiment, and the difference is that the two fans 16 provided on the top of the heat dissipation sheet 34 are provided in the ninth embodiment. In the heat sink fins 34. Since the heat conduction portion 14 transmits the 埶= generated by the memory 2 to the heat sink 12 having a larger area, and then the heat sink 12 is blown by the fan 16 or directly blows the memory 2, In order to make it fast down, it can have a very good heat dissipation effect. Moreover, the heat sink is relatively simple and convenient to manufacture and assemble. In any case, anyone can obtain sufficient guidance from the description of the above examples, and it is understood that the present invention does have industrial applicability. Also, this is not the case with the __Technology. Further, the invention is not seen, and the present invention is progressive. Therefore, this issue clearly meets the requirements of the invention patent and submits an application in accordance with the law. Χ 9 200919151 [Simplified illustration of the drawings] The drawings are perspective exploded views of the first embodiment of the present invention. The second drawing is a perspective assembled view of the first embodiment of the present invention. The third drawing is a partial cross-sectional enlarged view of an embodiment of the present invention. The fourth drawing is a three-dimensional combination of the second embodiment of the present invention. The fifth drawing is a perspective assembled view of a third embodiment of the present invention. Figure 6 is a perspective exploded view of a fourth embodiment of the present invention. Figure 7 is a perspective exploded view of a fifth embodiment of the present invention. Figure 8 is a perspective exploded view of a sixth embodiment of the present invention. Figure 9 is a perspective exploded view of a seventh embodiment of the present invention. The tenth drawing is an exploded perspective view of an eighth embodiment of the present invention. Figure 11 is a perspective exploded view of a ninth embodiment of the present invention. [Main component symbol description] 2 memory 4 heat sink 6 memory particles 8 wafer 10 heat transfer sheet 12 heat sink 14 heat transfer part 16 fan 18 fixing screw 20 slot 22 heat sink 24 fixed 桎 200919151 26 fixing hole 30 connecting piece 34 heat dissipation Fin 38 side piece 28 substrate 32 perforation 36 seat piece 11