201001142 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別係指一種用於 對電子元件散熱之散熱裝置。 【先前技術】 隨著電子產業之迅速發展，如電腦中電子元件 之運算速度大幅度提高’其產生之熱量也隨之劇 增，如何將電子元件之熱量散發出去，以保證其正 常運行，一直係業者必需解決之問題。隨著近年來 兩頻圖像處理、無線通訊等技術不斷發展，包括顯 卡、視頻圖像卡（VGA卡）在内之附加卡上電子元j牛 之發熱量越來越大。例如圖像卡，一般包括—單獨 之處理器，稱作圖像處理器（Gpu)，其發熱量也相 當大’如不能有效散熱將會影響其正常運行。因 此，通常在GPU之表面安裝一散熱裝置進行散熱。 所述散熱裝置一般包括與GPU接觸之散熱器及設 於政熱器頂部之風扇，該散熱器包括一基座及設於 f基座上之一散熱片組。風扇運轉時其產生之氣流 人過政熱器之散熱片並與散熱片進行熱交換，從而 將散熱器從GPU吸收之熱量散發。該散熱片組往 在^由貼設在底座上之複數單個之散熱片組成，此 2員政熱片直接焊接到底座上固定或者相互扣合成 …、片組後在一起焊接到底座上。然而，這樣接焊 接到底座上之散熱片很容易因為單個散熱片與底 6 稷敢熱衮 201001142 座之焊接面積小而不牢固發生脫落；先由散熱 合而成再焊接到底座上之散熱片組容易在風 作時產生之高頻振動之作用下發生共振現象， 散熱片組尤其係其扣合結構發出較大之噪音t 【發明内容】 有鑒於此，有必要提供一種結構牢固且有 除噪音之散熱裝置。 _八一〜_ 進行散熱，其包括一基座、排列在該基座上二 熱體、安襞在該基座上並位於該散熱體一側二 扇和覆蓋在風扇及散熱體上之一蓋體，該基2 置有一完全覆蓋於該電子元件頂部之均; 熱體包括夾置在蓋體頂部與均熱板之間之_ 和形成於盒體内之蜂窩結槿 氣流通道之_端開口朝j/蜂寓結構内； 體之外之環境連通。風屬，其另-端開〗 上述散熱體盒體内形成 具有牢固之結構不會在風戶有蜂窩結構，使, 振而發出噪音，且散熱體之羽之间頻振動下』 基座相接，可使散熱裝置上下兩面分別與j 散熱體内之蜂窩結構形内部結構更緊湊 免氣流通過時產生之紊流=、氣流通道能有交 利於風扇產生之氣流從^二滯留等現象，從 【實施方式】 片扣 扇工 而使 效消 元件 一散 一風 内嵌 該散 盒體 成之 與殼 熱體 生共 體及 固， 之避 更有 7 201001142 圖1至圖2揭示本發明一實施例中之散熱裝 置，該散熱裝置用於對電路板上60之電子元件 64進行散熱。該電路板60可以係顯卡、視頻圖像 卡或主機板等’其上安裝之電子元件可以係圖片處 理晶片等高功率電子元件，該等電子元件在運行時 會釋放出大量之熱’需被及時冷卻以確保其正常運 行。 上述散熱裝置包括一基座10、安裝於該基座 10 —端之一風扇3〇、排列於該基座1〇上之一散熱 體2〇和罩設於該厩屬30及散熱體20上之一蓋體 40 〇 上述基座10包括一基板11及嵌置在該基板 11内之均熱板13。該基板u由導熱性能良好且 密度^較小之金屬材料如鋁形成，其一端形成一風扇 3〇安裝之平滑面’該平滑面上開設有與固定件（圖 未示）配合之複數安裴孔110，以將風扇30固定 八上。5亥基座10中間偏向另一端處設置一供該均 熱板13敗入之缺口 112，該缺口 112之大小形狀 與均熱板13相適配，該缺口 112邊緣之下半部分 形成向缺口 119 νΚ ^ 丄2中心内凸伸之凸簷1120，且該凸 1 1120在#近该缺〇 Μ〗之各個角落處向該缺口 12中心内凸伸之長度比其他地方之長，以保證穩 固地支樓該均熱板13。該基板11在靠近該平滑面 之側向上延伸有複數與基板11長度方向平行之 8 201001142 散熱鰭片 114，所述散熱鰭片114垂直於該基板 11，且沿著並平行於基板11 一侧邊排列。 上述均熱板13為一平板形熱管，其内封裝有 工作介質，故相對實體金屬板體來說具有導熱性能 好及品質小之優點。該均熱板13大體呈矩形，其 形狀大小與該基板11之缺口 11 2相匹配，以容置 於該缺口 112内。該均熱板13之上表面為一平面， 其底面中間部分向下浮凸，而其底面靠近各邊緣部 分向上凹陷形成環繞該中間部分之凹陷部（未標 號），該凹陷部之形狀與基板11 2之凸簷11 20互 補，正好承接在該凸簷1120上使該均熱板13之上 下表面分別與該基板11之上下表面在同一面上。 請一併參閱圖3，上述散熱體20由導熱性能 良好之金屬材料如鋁、銅等製成，其大致呈長方體 形，該散熱體 20包括二相互平行間隔之水平板 22、分別垂直連接二水平板22兩側端緣之二豎直 板24和形成水平板22與豎直板24圍成之空間内 之蜂窩結構26。該散熱體20之下水平板22可通 過焊接或粘貼等方式貼設在基座10之均熱板1 3頂 面上，且散熱體20之蜂窩結構26正對安裝在基座 10 —端之風扇30。該蜂窩結構26可以係由複數圓 形、三邊形、四邊形等多邊形組成，該蜂窩結構 26也可以係由不規則之多邊形狀拼湊在一起而 成。在本實施例中，該蜂窩結構26由複數個六邊 9 201001142 形孔組成’且每一六邊形均為一正對風扇30並供 風扇30產生之氣流通過之氣流通道28。 上述風扇30為一軸流式風扇，其通過一固定 架（未標號）安裝在該基板之一端之平滑面上。 上述蓋體40可由鋁、銅等導熱材料製成，以 便將散熱體20上之熱量散發出去，蓋體4〇包括一 頂板42及從該頂板42邊緣垂直向下延伸之側板 44。該頂板42之形狀和該基板11之形狀相對應， 其覆蓋除該基板11 一側之散熱鰭片i i 4以外之其 他部分。該頂板4 2之一端對應該風扇3 〇處開設有 一圓形氣流入口 420’以供该風扇3〇在運轉時將 周圍之空氣從中吸入。該頂板42沿側板44垂直向 下延伸形成有複數螺筒，以與穿過基座1 〇之螺釘 (圖未示）螺合從而將蓋體40固定到基座1〇上。 該侧板44之高度與散熱體20之高度大致相等，以 使頂板42之底面與散熱體20底面緊密接觸，所述 側板44在遠離該氣流入口之另一端形成有一氣流 出口 440，以供該風扇30產生之氣流與該散熱體 20進行熱交換後被從中排出。 上述散熱裝置還包括一位於電路板60下方之 背板50 ’該背板60與自上向下依次穿過基座1〇 與電路板60之固定件配合，而將散熱裝置固定到 電子元件64上。 上述散熱裝置在組裝狀態時，該散熱熱體2〇 10 201001142 之底面通過焊接或粘貼等方式固定在該基座1〇岣 熱板13上面，該風屬30安裝在該基座10之〜端 之平滑面上，該蓋體40覆蓋該散熱體20及風戶 30上面。 ％ 上述散熱裝置在工作時，通過固定件向下穿過 該基座10與電路板60而與位於電路板60下方= 一背板5 0配合而將散熱裝置固定到電路板6 〇上， 該基座10均熱板13之底面可以與一個或多個電子 元件64接觸，可以在該均熱板13底面與電子元 64頂面之間塗抹導熱膠以增強導熱效果，選可γ 在該散熱裝置與電路板之間墊設絕緣膠片以起至I 絕緣及緩衝作用。由於該均熱板13為一高玫導= 之板开> 熱管，故該電子元件64產生之熱量能被= 均熱板13吸收並迅速均勻地分佈在整個均熱該 在傳導到整個散熱體20上，最後通過該風扇產 生之氣流經過散熱體20内之氣流通道而快速將熱 量帶走，從而達到快速冷卻電子元件之效果。此 外，该散熱體20具有一長方體形盒體及盒體内形 成蜂窩結構26 ’因而該散熱體2〇具有牢固之結構 不會在風扇30之高頻振動下產生共振而發出噪 音，且散熱體20之上下兩面分別與蓋體4〇及基座 10相接，可使散熱裝置之内部結構更緊凑牢固， 散熱體20内之蜂窩結構26形成之氣流通道28能 有效之避免氣流通過時產生之紊流和滯留等現 11 201001142 象，從而更有利於風屬30產生之氣流從中流過。 綜上所述’本發明符合發明專利要件，爰依法 知：出專利申明准，以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，右奚&丄 甘戋依本發明 精神所作之等效修飾或變化，皆應涵蓋 门 請專利範圍内。 ；以下之申 【圖式簡單說明】 圖1係本發明散熱裝置之一實余 合圖。 列之立體組 圖2係圖1中散 圖3係圖2中散 f t要元件符號說明】 基座 10 安裝孔 110 凸簷 1120 均熱板 13 水平板 22 缘窩結構 26 風屬 30 頂板 42 側板 44 背板 50 熱裝置之立體分解圖。 熱體之立體組合圖。 基板 缺口 散熱鰭片 散熱體 賢直板 氣流通道 蓋體 氣流入t? 氣流出Q 電路板 11 112 114 20 24 28 40 420 440 12 60201001142 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from electronic components. [Prior Art] With the rapid development of the electronics industry, such as the speed of computing electronic components in computers has increased dramatically, the heat generated by them has also increased dramatically. How to dissipate the heat of electronic components to ensure their normal operation. The system must solve the problem. With the continuous development of two-frequency image processing, wireless communication and other technologies in recent years, the electronic card j cattle on the add-on card including the video card and the video image card (VGA card) is getting more and more heat. For example, an image card generally includes a separate processor, called an image processor (Gpu), which generates a relatively large amount of heat. If it cannot be effectively dissipated, it will affect its normal operation. Therefore, a heat sink is usually mounted on the surface of the GPU for heat dissipation. The heat sink generally includes a heat sink in contact with the GPU and a fan disposed on the top of the economizer. The heat sink includes a base and a heat sink set disposed on the f base. When the fan is running, the airflow generated by the fan passes through the heat sink of the heat exchanger and exchanges heat with the heat sink, thereby dissipating the heat absorbed by the heat sink from the GPU. The heat sink group is composed of a plurality of single heat sinks attached to the base, and the two members of the heat sheet are directly welded to the base to be fixed or interlocked with each other, and the sheet group is welded to the base together. However, the heat sink that is soldered to the base is easy to fall off because the single heat sink and the bottom 6 稷 衮 衮 201001142 seat has a small welding area; the heat sink that is first heat-dissipated and then welded to the base The group is prone to resonance under the action of high-frequency vibration generated during wind production, and the heat sink group, in particular, has a large noise due to its fastening structure. [Inventive content] In view of this, it is necessary to provide a firm structure and a removal. Noise sink. _ 八一 _ for heat dissipation, comprising a pedestal, two hot bodies arranged on the pedestal, two ampoules mounted on the pedestal and located on one side of the heat sink, and one of the fan and the heat sink a cover body, the base 2 is provided with a cover completely covering the top of the electronic component; the heat body comprises a _ end disposed between the top of the cover body and the heat equalization plate and the honeycomb air flow passage formed in the casing body The opening faces the j/bee structure; the environment outside the body is connected. The wind belongs to the other, and the other end-opening 〗 The above-mentioned heat sink body is formed with a firm structure, which does not have a honeycomb structure in the wind, so that the vibration is generated and the frequency of the heat sink is vibrated. The connection can make the upper and lower sides of the heat dissipating device and the honeycomb structure-shaped internal structure of the j heat dissipating body are more compact, and the turbulence generated when the airflow passes can be arbitrarily=, the airflow channel can cope with the phenomenon that the airflow generated by the fan is retained from the second, and the like. [Embodiment] The film and the fan are arranged to disperse the air-dissipating component into the air, and the body of the shell is formed into a solid body and a solid body. The avoidance is further improved. 7 201001142 FIG. 1 to FIG. 2 discloses a first embodiment of the present invention. In the embodiment, the heat sink is used to dissipate heat from the electronic component 64 on the circuit board 60. The circuit board 60 can be a video card, a video image card or a motherboard, etc. The electronic components mounted thereon can be high-power electronic components such as picture processing chips, which release a large amount of heat during operation. Cool down in time to ensure proper operation. The heat dissipating device includes a base 10, a fan 3〇 mounted on the end of the base 10, a heat dissipating body 2 disposed on the base 1 and the cover 30 and the heat sink 20 The cover body 40 includes a substrate 11 and a heat equalizing plate 13 embedded in the substrate 11. The substrate u is formed of a metal material having good thermal conductivity and a small density, such as aluminum, and one end thereof forms a smooth surface of a fan 3〇. The smooth surface is provided with a plurality of ampoules that are matched with a fixing member (not shown). Holes 110 are used to secure the fan 30 eight. 5 recessed 112 is disposed at the other end of the bottom of the base 10, and the gap 112 is sized to match the heat equalizing plate 13. The lower half of the edge of the notch 112 forms a gap. 119 Κ Κ ^ 丄 2 in the center of the convex protrusion 1120, and the convex 1 1120 at the corners of the near-negative defect to the center of the gap 12 is longer than other places to ensure a stable branch The heat equalizing plate 13. The substrate 11 extends upward from the side close to the smooth surface with a plurality of 201001142 heat dissipation fins 114 parallel to the longitudinal direction of the substrate 11. The heat dissipation fins 114 are perpendicular to the substrate 11 and are parallel to and parallel to the substrate 11 side. Arranged side by side. The heat equalizing plate 13 is a flat-plate heat pipe which is filled with a working medium, so that it has the advantages of good thermal conductivity and small quality with respect to the solid metal plate body. The heat equalizing plate 13 has a substantially rectangular shape and is matched in shape to the notch 11 2 of the substrate 11 to be received in the notch 112. The upper surface of the heat equalizing plate 13 is a flat surface, the bottom portion of the bottom surface is downwardly convex, and the bottom surface thereof is recessed upwardly adjacent to the edge portions to form a recessed portion (not labeled) surrounding the intermediate portion, the shape of the recessed portion and the substrate 11 The two protrusions 11 20 are complementary to each other, and the upper surface of the heat equalizing plate 13 is respectively disposed on the same surface as the upper surface of the upper surface of the substrate 11. Referring to FIG. 3 together, the heat dissipating body 20 is made of a metal material having good thermal conductivity, such as aluminum or copper, and has a substantially rectangular parallelepiped shape. The heat dissipating body 20 includes two horizontal plates 22 spaced apart from each other and vertically connected to each other. Two vertical plates 24 on both sides of the horizontal plate 22 and a honeycomb structure 26 forming a space enclosed by the horizontal plate 22 and the vertical plate 24. The horizontal plate 22 of the heat sink 20 can be attached to the top surface of the heat equalizing plate 13 of the base 10 by welding or pasting, and the honeycomb structure 26 of the heat sink 20 faces the fan mounted at the end of the base 10. 30. The honeycomb structure 26 may be composed of a plurality of polygons such as a plurality of circles, a triangle, a quadrangle, etc., and the honeycomb structure 26 may be formed by arranging irregular polygon shapes. In the present embodiment, the honeycomb structure 26 is composed of a plurality of hexagonal 9 201001142 shaped holes and each hexagon is a gas flow passage 28 that faces the fan 30 and passes through the airflow generated by the fan 30. The fan 30 is an axial fan which is mounted on a smooth surface of one end of the substrate via a holder (not numbered). The cover 40 may be made of a heat conductive material such as aluminum or copper to dissipate heat from the heat sink 20. The cover 4 includes a top plate 42 and side plates 44 extending vertically downward from the edge of the top plate 42. The top plate 42 has a shape corresponding to the shape of the substrate 11, and covers other portions than the heat radiating fins i i 4 on the side of the substrate 11. One end of the top plate 42 is provided with a circular airflow inlet 420' corresponding to the fan 3 以 for the air to be sucked from the surrounding air when the fan 3 is in operation. The top plate 42 extends vertically downward along the side plates 44 to form a plurality of barrels for screwing with screws (not shown) passing through the base 1 to secure the cover 40 to the base 1 . The height of the side plate 44 is substantially equal to the height of the heat sink 20 such that the bottom surface of the top plate 42 is in close contact with the bottom surface of the heat sink 20. The side plate 44 defines an air flow outlet 440 at the other end away from the air flow inlet for the The airflow generated by the fan 30 is exchanged by heat exchange with the heat sink 20. The heat dissipating device further includes a backing plate 50 ′ located under the circuit board 60. The backing plate 60 cooperates with the fixing member of the circuit board 60 through the pedestal 1 依次 from the top to the bottom, and fixes the heat dissipating device to the electronic component 64. on. When the heat dissipating device is in an assembled state, the bottom surface of the heat dissipating heat body 2 〇 10 201001142 is fixed on the susceptor 1 〇岣 hot plate 13 by welding or pasting, and the wind genus 30 is mounted at the end of the pedestal 10 On the smooth surface, the cover 40 covers the heat sink 20 and the upper surface of the wind 30. % When the heat sink is in operation, the heat sink is fixed to the circuit board 6 by the fixing member passing down through the base 10 and the circuit board 60 and being located under the circuit board 60 = a back board 50. The bottom surface of the heating plate 13 of the susceptor 10 may be in contact with one or more electronic components 64. A thermal conductive adhesive may be applied between the bottom surface of the heat equalizing plate 13 and the top surface of the electronic component 64 to enhance the heat conduction effect. Insulating film is placed between the device and the circuit board to provide insulation and buffering. Since the heat equalizing plate 13 is a high heat conducting plate, the heat generated by the electronic component 64 can be absorbed by the heat equalizing plate 13 and quickly and evenly distributed throughout the soaking heat. On the body 20, the airflow generated by the fan finally passes the airflow passage in the heat sink 20 to quickly carry away the heat, thereby achieving the effect of rapidly cooling the electronic components. In addition, the heat dissipating body 20 has a rectangular parallelepiped box body and a honeycomb structure 26' formed in the casing. Therefore, the heat dissipating body 2 has a firm structure, generates no resonance under the high frequency vibration of the fan 30, and emits noise. The upper and lower sides of the 20 are respectively connected to the cover 4 and the base 10, so that the internal structure of the heat sink is more compact and firm, and the airflow passage 28 formed by the honeycomb structure 26 in the heat sink 20 can effectively prevent the airflow from being generated. The turbulence and retention are now 11 201001142, which is more conducive to the flow of air generated by the wind 30. In summary, the present invention complies with the requirements of the invention patent, and is legally known: the patent application is accurate, and the above is only the preferred embodiment of the present invention. For those who are familiar with the skill of the present invention, the right 奚 & Equivalent modifications or variations made by the spirit of the invention are intended to be within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS [Schematic Description of the Drawings] Fig. 1 is a schematic diagram of a heat sink of the present invention. The three-dimensional group of Figure 2 is the scatter diagram of Figure 1 and the symbol of the ft element of Figure 2. The pedestal 10 mounting hole 110 the ridge 1120 the heat slab 13 the horizontal plate 22 the rim structure 26 the wind 30 the top plate 42 the side plate 44 An exploded view of the backplane 50 thermal device. A three-dimensional combination of hot bodies. Substrate notch fins heat sink sturdy plate airflow channel cover gas inflow t? airflow out Q circuit board 11 112 114 20 24 28 40 420 440 12 60