200917009 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別係指一種對電子裝置 散熱之散熱裝置。 【先前技術】 隨著電子技術之不斷發展，顯卡等電子元件集成度較 高之電子裝置在運行時會產生大量之熱量，該等熱量如果 不能被有效地散去，將直接導致溫度急劇上升，而嚴重影 響到電子裝置之工作效率盔卜 π双半為此，通常在電子裝置上安裝 散熱裝置來進行散熱。 中國大陸專利第200620041362.6镜揭示了 一種散 一安裝於顯卡上之散熱器及安裝於該散熱器附 近之風扇。為了提相扇氣流之湘率，還在散敎哭上 ί裝：導風罩，以將風扇所產生之氣流集中地引導至；執 二：Γ:，速與外界換熱，進而使顯卡能獲得較高： :二::;:=存在其他熱源，比如安裝於 行散教^種¥風罩所料之氣流僅能對顯卡進 從而影響4效^至硬碟，使其熱量得不到及時地散發， 【發明内容】 有鑒於此， 熱之散熱裝置。 男有必要提供—能同時對多個電子裝置散 —種散熱裝置 其包括一底部與一電子裝置接觸之散 6 200917009 熱器及一安裝於散熱器上之導風板，該導風板包括—結合 至散熱器頂部之底板及由該底板傾斜延伸之一側板，該= 板用於將氣流傾斜地引導至位於該電子裝置上方一带 子裝置。 i 與習知技術相比，本發明散熱裝置之散熱器可對一電 子裝置進行散熱，導風板則將氣流引導至另一電子裝置而 對其進行政熱，故该散熱裝置可同時冷卻複數電子農置， 使該等電子裝置之熱量得到及時散發，從而確保盆正 作。 八 【實施方式】 如圖1及3所示，本發明之散熱裝置用於同時對多個 電子裝置進行散熱，其包括一與一顯卡（圖未示）接觸之 散熱器10及一安裝於散熱器10上之導風板2〇。一風扇4〇 安裝於靠近散熱器10右側之位置且其出風口朝向散熱器 10。一硬碟30安裝於顯卡上方且與所述散熱器1〇隔開一 段距離。 請參閱圖2，所述散熱器1〇用於固定至所述顯卡上， 其包括一基座12、複數自基座12向上延伸出之相互間隔之 鰭片14、及貫穿該等鰭片14且結合至基座12之二熱管丄卜 所述基座12由熱導性良好之金屬材料製成，其下表面垂直 向下凸出一矩形之吸熱部122,用於與顯卡接觸而將其=產 生之熱量均勻地傳導至基座12上；其上表面之中部開設二 平行之凹槽124,其中每一凹槽124之橫截面均呈半圓形， 200917009 用於嵌入熱管16。四螺絲50分別穿過所述基座12之四角 處而螺鎖於顯卡内，以將散熱器10固定至顯卡上。由於該 等螺絲50佔據了基座12上之不同空間，為避免鳍片14與 螺絲50發生干涉，故而處於基座12不同位置之鰭片14之 構造也有所不同：座落於基座12前部之鰭片14為第一趙 片140,其位於二前方之螺絲50之間，且每一第一鳍片 均具有一三角形之構造；座落於基座12中部之鰭片為 第二鰭片142，其位於二前方之螺絲5〇及二後方之螺絲％ 之，，其中每一第二鰭片142均呈矩形，且其面積大於所 述每一第一鰭片14〇之面積；座落於基座12中後部之鰭片 1—4為第三鰭片144,其夾置於二後方之螺絲％之間，^中 每一第三鰭片144亦均呈矩形，其面積大於所述每一第一 轉片140之面積且小於前述每—第二鰭片142之面積；座 落於基座U後部之鰭片14為第四縛片146，其位於二後方 之螺絲50之後，其中每一第四鰭片146也均呈矩形，i面 積與所述每—第二鰭以2之面積大致相等。每―縛片、Μ Z邊緣水平料出—下折4 141，其中每―下折邊i4i =相鄰之下折邊14"目連接而形成—平整之表面，進而 =至基座12上表面而將鰭片14固^至基座12上；每一 :片W之上邊緣水平f折出二上折邊143，其中每一上折 邊143與相應之上折邊143相 夕έ士人# 4。 攸而共同形成二平坦 、、口 a 4 18，供導風板2〇結合。 鍺1 弟一、弟二、及第四 鰭片142、144、146之底部開設-本 1 士 —. 又—'牛圓形之缺口（圖未標）， 八中母一缺口均與相應之缺口 τ月且與母一凹槽124相對 200917009 應、由此°亥等缺口與二凹槽124 #同圍設出二圓筒形之 通道，供熱管16之相應部分穿設；每-第二、第：、及第 四鰭片142、144、146才及弟 頁4開設二分別位於二上折邊143 之兩側之通孔（圖未標）， 透 間之距離，其中每一通孔：一、間之距離大於二缺口 I 一办I >4 、句與相應一側之通孔對齊，由此， ^ ，、5組成另—通道，供熱管16之相應部分穿 設。所述每一熱管16均呈 相應口h牙 (圖未標）、—平行于 U有—平直之蒸發段 及-隸m 段之平鼓冷凝段（圖未標） 也結合至基座12,其二蒸發段分別穿入 位於放熱裔1 〇下部之—福 ..„ 1η 通遏内，其二冷凝段分別穿入位於 —另一通道内，其二絕熱段則位於第-鍵 片142前方且共同夾置第一ϋ片140。 第一 所述導風板20固定至散埶 狀”、、益頂部，其包括一矩形 之底板22及一自底板22 一 24,其中該側板24_底板2 上延伸之矩形側板 一底板22間形成之内角為一銳角。 所述底板22沿散熱器1〇每一姓 二結合部!8，從而將導風板::：：18之延伸方向固定至 叫將V風板20安裝於散熱器1〇上。一片 體240自侧板24 —端之中邮权古 戶操作該導風板2。““向上延伸而出’以方便用 ^^圖3’使肋散衫料，由於風扇40輪較 回不之動，其附近之空氣被擾動而產生氣流。下 部之氣流直接穿過散熱_鰭片14間之走 10自顯卡所吸收之埶哥，、隹而祖壯上 可定威…益 熱里進而對顯卡進行散熱；上部之氣 200917009 流則被導風板20所牽引，其沿導風板20之側板24之寬度方 向傾斜向上流經硬碟30，進而對硬碟30進行散熱。由此， 本發明之散熱裝置可同時冷卻複數電子裝置，使該等電子 裝置之熱量得到及時散發，從而確保其正常運作。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施例， 自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝 之人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明實施例之散熱裝置之立體組裝圖。 圖2係圖1之立體分解圖。 圖3係圖1之散熱裝置之氣流走向圖，此時一風扇及一 硬碟位於散熱裝置附近。 【主要元件符號說明】 散熱器 10 基座 12 吸熱部 122 凹槽 124 鰭片 14 第一鰭片 140 下折邊 141 第二鰭片 142 上折邊 143 第三鰭片 144 第四鰭片 146 熱管 16 結合部 18 導風板 20 底板 22 側板 24 10 30200917009 片體 風扇 240 硬碟 40 螺絲 50 11BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic device. [Prior Art] With the continuous development of electronic technology, electronic devices with high integration of electronic components such as video cards generate a large amount of heat during operation. If such heat cannot be effectively dissipated, it will directly cause a sharp rise in temperature. The work efficiency of the electronic device is seriously affected. For this reason, a heat sink is usually installed on the electronic device for heat dissipation. The Chinese Patent No. 200620041362.6 mirror discloses a heat sink mounted on a graphics card and a fan mounted near the heat sink. In order to increase the Xiangxiang rate of the fan airflow, it is still smashing and smashing: the air hood is used to guide the airflow generated by the fan to the centralized direction; the second: Γ:, the heat exchange with the outside, so that the graphics card can Get higher: : 2::;:= There are other heat sources, such as installed in the line of scattered teaching ^ kind of windshield, the airflow can only affect the graphics card and thus affect the 4 effect ^ to the hard disk, so that the heat is not available Dissipated in time, [Summary of the Invention] In view of this, a heat dissipating device. It is necessary for a man to provide a heat sink that can simultaneously dissipate a plurality of electronic devices. The heat sink includes a bottom portion and an electronic device. The heat sink and the air deflector mounted on the heat sink, the air deflector includes - A bottom plate coupled to the top of the heat sink and a side panel extending obliquely from the bottom plate for guiding the air flow obliquely to a tape device located above the electronic device. Compared with the prior art, the heat sink of the heat sink of the present invention can dissipate heat to an electronic device, and the air deflector guides the airflow to another electronic device to heat it, so the heat sink can simultaneously cool the plurality of devices. The electronic farms enable the heat of these electronic devices to be dissipated in time to ensure that the pots are working. [Embodiment] As shown in Figures 1 and 3, the heat dissipating device of the present invention is used for simultaneously dissipating heat from a plurality of electronic devices, and includes a heat sink 10 in contact with a graphics card (not shown) and a heat sink. The air deflector 2 on the device 10 is 〇. A fan 4 is mounted near the right side of the heat sink 10 and its air outlet faces the heat sink 10. A hard disk 30 is mounted above the graphics card and spaced apart from the heat sink 1〇. Referring to FIG. 2 , the heat sink 1 is configured to be fixed to the graphics card, and includes a base 12 , a plurality of mutually spaced fins 14 extending upward from the base 12 , and through the fins 14 . And the heat pipe is coupled to the base 12, and the base 12 is made of a metal material having good thermal conductivity, and a lower surface of the lower surface vertically protrudes downwardly from a rectangular heat absorbing portion 122 for contacting the video card to be The generated heat is uniformly conducted to the susceptor 12; two parallel grooves 124 are formed in the upper portion of the upper surface, wherein each of the grooves 124 has a semicircular cross section, and 200917009 is used to embed the heat pipe 16. Four screws 50 are threaded through the four corners of the base 12 to be screwed into the graphics card to secure the heat sink 10 to the graphics card. Since the screws 50 occupy different spaces on the base 12, in order to prevent the fins 14 from interfering with the screws 50, the configuration of the fins 14 at different positions of the base 12 is different: it is located in front of the base 12. The fins 14 of the portion are the first Zhao pieces 140, which are located between the screws 50 at the front side, and each of the first fins has a triangular structure; the fins located in the middle of the base 12 are the second fins. The sheet 142 is located at the front side of the screw 5〇 and the rear side of the screw, wherein each of the second fins 142 has a rectangular shape and an area larger than the area of each of the first fins 14; The fins 1-4 falling in the rear portion of the susceptor 12 are the third fins 144, which are sandwiched between the screws 5% of the rear side, and each of the third fins 144 is also rectangular, and its area is larger than The area of each of the first rotors 140 is smaller than the area of each of the second fins 142; the fins 14 seated at the rear of the base U are the fourth tabs 146, which are located behind the screws 50 at the rear. Each of the fourth fins 146 is also rectangular, and the area of the i is substantially equal to the area of each of the second fins. Each "tab", Μ Z edge horizontal output - lower fold 4 141, wherein each - lower fold i4i = adjacent lower flange 14 " meshing to form - flat surface, and then = to the upper surface of the pedestal 12 The fins 14 are fixed to the pedestal 12; each: the upper edge of the sheet W is horizontally f-folded by two upper hem 143, wherein each upper hem 143 and the corresponding upper hem 143 are gentlemen # 4. Together, they form a two flat, port a 4 18 for the wind deflector 2 〇 to be combined.锗1 brother 1, brother 2, and the fourth fin 142, 144, 146 at the bottom of the opening - this 1 士 -. and - 'cow round gap (not marked), eight middle mother and one gap are corresponding The gap τ month and the mother-and-groove 124 is opposite to the 200917009, and thus the gap and the two grooves 124 are surrounded by a two-cylindrical channel, and the corresponding portion of the heat pipe 16 is pierced; each-second And the fourth and fourth fins 142, 144, and 146 and the second page of the second page are respectively located at two sides of the two upper flanges 143 (not labeled), the distance between the through holes, wherein each of the through holes: 1. The distance between the two is greater than the two notches I. I > 4, the sentence is aligned with the through hole of the corresponding side, whereby ^, and 5 form another channel, and the corresponding portion of the heat pipe 16 is pierced. Each of the heat pipes 16 is combined with a corresponding port h (not shown), a parallel to the U-bright evaporation section, and a sub-m section of the flat drum condensation section (not shown) are also coupled to the base 12, The two evaporation sections are respectively inserted into the lower part of the exothermic 1 — 福 . . . , , , , , , , , , , , , , , , , , , , , , , , 1 1 且 且 且 且 且 且 且 且 且 且 且 且 且 且The first baffle plate 140 is sandwiched. The first air deflector 20 is fixed to the divergent shape, and the top portion includes a rectangular bottom plate 22 and a self-supporting bottom plate 22-24, wherein the side plate 24_ bottom plate 2 The inner corner formed between the upper rectangular plate and the bottom plate 22 is an acute angle. The bottom plate 22 is fixed along the heat sink 1 with each of the two joints! 8 to fix the extending direction of the wind deflector::::18 to the V wind plate 20 for mounting on the heat sink 1 . The body 240 operates the wind deflector 2 from the end of the side panel 24. ""extends out" to facilitate the use of the ^^Fig. 3' to disperse the ribs. Since the fan 40 is not moving back, the air in the vicinity is disturbed to generate airflow. The lower airflow directly passes through the heat dissipation _ between the fins 14 and 10 from the graphics card, and the ancestors can be determined... The heat is used to heat the graphics card; the upper air 200917009 flow is guided The wind plate 20 is pulled and flows obliquely upward through the hard disk 30 along the width direction of the side plate 24 of the wind deflector 20 to further dissipate heat from the hard disk 30. Therefore, the heat dissipating device of the present invention can simultaneously cool the plurality of electronic devices, so that the heat of the electronic devices can be dissipated in time to ensure normal operation. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the present invention are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective assembled view of a heat sink according to an embodiment of the present invention. 2 is an exploded perspective view of FIG. 1. Figure 3 is a flow diagram of the heat sink of Figure 1 with a fan and a hard disk located adjacent to the heat sink. [Main component symbol description] Heat sink 10 Base 12 Heat sink 122 Groove 124 Fin 14 First fin 140 Lower flange 141 Second fin 142 Upper flange 143 Third fin 144 Fourth fin 146 Heat pipe 16 joint 18 air deflector 20 bottom plate 22 side plate 24 10 30200917009 chip fan 240 hard disk 40 screw 50 11