TW200914800A - Multiple dimension position sensor - Google Patents
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Abstract
Description
200914800 九、發明說明: 【發明所屬之技術領域】 本發明涉及位置感測器,特別是一種用於多維度探測物體 位置的位置感測器。 【先前技術】 相關進展的簡述移動物體的定位方法有很多,比如利用雷 達信號與道路斑馬線相結合以確定汽車位置的交通指揮系統, 及其他利用無線電通信的定位系統。但是,這兩種系統需要在 移動物體上安裝動力源,無線電波也容易受到建築物干涉和電 信號干擾。 位置也可以通過如線性差動變壓器(LVDT)來確定,LVDT 是一種位移功能變換器,它利用一個初級繞組和兩個二次繞組 纏繞在一個圓柱形線軸上,一個可動鎳-鐵合金芯或電枢被固定 在繞組中,通過測定合金芯的移動來確定移動物體的位置。霍 爾效應感測器也是利用相似的理論方法來測定位移。LVDTs和 霍爾效應創感器通常用於測定有限位移,如直線驅動器和活塞 的位移。 對於高精度定位系統,如步進、懸浮和/或掃描台等等,傳 統的位置測定方法利用捕捉、誘導、光學和鐳射感測器。這些 感測器一般具有高解析度和低定位雜訊等特點,但是,總成本 高、移動範圍有限和自由度要求縮小了它們的應用範圍。 通常在多數位置回饋裝置中,如正弦信號和餘弦信號等都 是通過感測器產生,信號發送到例如電動機控制器中類似於數 位轉換器的裝置中,信號在數位域中進行處理,確定物體的位 5 200914800 置。但是,正弦/餘弦週期和ADC解析度有可能不足以生成所 需要的位置解析度,從而必須重新設計電動機控制器或者更換 更昂貴的解碼器。 ' 這對於利用相同的感測器和磁體測量確定二維位置和間隙 寬度是有利的,也利於使用成本經濟、高解析度的解碼器。同 時,這更利於在不使用諸如電動機控制器和/或解碼器等進行修 正的條件下,在類比域中增加回饋裝置的解析度。 【發明内容及實施方式】 。圖1所示為示範儀器中用於同時沿多個方向軸測距的感測 器100的示意圖。儘管我們會圖解示範儀器,但我們應該清楚 的女裝示範儀器方式有报多,另外,任何合適的尺寸、形狀、 任何類型的元素或材料都可以應用。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a position sensor, and more particularly to a position sensor for multi-dimensionally detecting the position of an object. [Prior Art] Brief Description of Related Development There are many methods for locating moving objects, such as a traffic command system that uses a radar signal in combination with a road zebra to determine the position of the vehicle, and other positioning systems that utilize radio communication. However, these two systems require a power source to be mounted on a moving object, and the radio waves are also susceptible to interference from buildings and electrical signals. The position can also be determined by, for example, a linear differential transformer (LVDT), which is a displacement function converter that is wound on a cylindrical bobbin with a primary winding and two secondary windings, a movable nickel-iron alloy core or electric The pivot is fixed in the winding and the position of the moving object is determined by measuring the movement of the alloy core. The Hall effect sensor also uses a similar theoretical approach to determine displacement. LVDTs and Hall effect sensors are commonly used to measure finite displacements, such as linear actuator and piston displacement. For high-precision positioning systems, such as stepping, floating, and/or scanning stations, traditional position measurement methods utilize capture, induction, optics, and laser sensors. These sensors typically feature high resolution and low positioning noise, but the high total cost, limited range of motion, and freedom requirements reduce their range of applications. Usually in most position feedback devices, such as sinusoidal signals and cosine signals, etc. are generated by sensors, the signals are sent to devices such as digital converters in the motor controller, and the signals are processed in the digital domain to determine the object. Bit 5 200914800 set. However, the sine/cosine period and ADC resolution may not be sufficient to generate the required position resolution, necessitating a redesign of the motor controller or replacement of a more expensive decoder. This is advantageous for determining the two-dimensional position and gap width using the same sensor and magnet measurements, and also facilitates the use of cost-effective, high-resolution decoders. At the same time, it is advantageous to increase the resolution of the feedback device in the analog domain without using corrections such as motor controllers and/or decoders. SUMMARY OF THE INVENTION AND EMBODIMENT Figure 1 is a schematic illustration of a sensor 100 for use in ranging along a plurality of directional axes in an exemplary instrument. Although we will illustrate the demonstration of the instrument, we should be aware of the number of women's demonstration instruments, and any suitable size, shape, any type of element or material can be applied.
::::弟::二任意適!位移的運行方向(如⑷測量 盘"fe 6 *4· _:::: Brother:: Any two! The direction of travel of the displacement (eg (4) measuring disk "fe 6 *4· _
傳送位置,同時測量如磁性壓板170 Y軸)的間距寬度 能用於示範分析, 200914800 軸線上,包括但是不局限於轉動軸。我們也應該清楚,示範感 測器能夠感應任何合適的移動物體,包括但不局限於單向或多 向移動的物體,如傳輸機、執行器以及其他驅動系統構件。位 置測量感測器產生的信號用於電機換向以驅動諸如傳輸機或其 他任意移動物體從第一個位置移動到第二個位置。需要認清的 是,這裏所講的示範性實施例並不局限於與電動機聯合應用, 它與任何需要單一或多向位置資訊的裝置都可以連用。 如圖1所示,在一個示範性實施例中,感測器100包括一 個磁性壓板170和一個或多個感測器組130a-130n。感測器組包 括一個或多個感測器,在下面加以介紹。磁性壓板170包括一 個或多個磁體140,150,磁體排成一列或一個網格,磁體的極 性互動式排列(如北一南一北一南等),見圖1。磁體140,150 的交互極性排列會產生波160,例如當磁體經過感測器130會 產生正弦或餘弦波,這在下面進一步進行講解。磁體140和150 可以是任意具有合適場強的磁體。示範性實施例中的磁體可以 是永磁體,磁性壓板170不需要任何動力源就可以被轉變成壓 板170,預備體中的磁體則可以是電磁體。其他備選實施例中 的壓板170包含有任意合適的能被感測器130a-130n感應到的 磁場產生裝置。壓板170也可以是包含有任意適當數量的具有 合適構造的磁體。例如上面所提到的磁體可以排列成直線,可 能多排和/或排成柱形,磁體也可以交叉排列,壓板170固定於 待測物體120上。備選實施例中的壓板170和物體120可能是 同一個。物體120可以是任意物體,包括但不局限於如運輸車、 活塞/活塞桿、執行器、自動機械末端執行器、傳動軸、電動機 200914800 轉子或其他任意需要位置測量的物體體。 感測器13Ga-13()n可以是任意適當的感測器,而不局限於 —耳效應感測器、感應感測器和/或電容感測器。感測器⑽ 幾^^物體運行了方向佈置,需要注意的是運行方向可能有 =二=卡爾坐標系中的χ、γ、ζ方向(或者其中幾個方 ^ )或極坐標系中的R,e方向(或任意合向)。借選實 ί ί. '的行方向可與任何適當坐標系相聯繫。任意適當數量 ,則盗可以沿運行方向佈置,感測器ΐ3〇“3〇η佈置在沿物 體^丁方向的預定距離内,由此物體12〇的位置就能被確定, 细細的描述。感測器咖视連接在控制 督物體120 : ^用於接收感測器的輸出並基於感測器輸出計 ^體尸沿運行方向的二維位置和感測器ma_i3 Ϊ控例中 算間距寬以根據諸如磁場強度(如通量密度)等資訊計 的振場強度由諸如壓板m和/或感卿輸出信號 的電腦程ί:==ΐ軟體和嵌入了處理程式和說明書 意適合的電腦可讀介質)實施文中所述的計tr 位移=====精確定位-個物體體的短距 =二=,其他示範性實施例中,位置測量系 材料處理系傳送U部件中,物體在設備中通過適當的自動 '見圖2Α中不範性實施例中感測器1GG,的示範構造這_ 200914800 示la性實施例中的一對感測器沿物體運行T的12 〇方向佈置, 感測器200Α-200η有可能呈直線排列或與運行方向共線排列。 例如,磁感測器200Α、200Β形成第一對感剥對,2〇〇c和200D 形成第二對,以此類推。在備選實施例中,感測器2〇〇Α·2〇〇η 沿運行方向交錯排列,一些感測器會排列在其他感測器的上方 或下方。在其他示範性實施例中,感測器2〇〇Α_2〇〇η可能具有 其他合適的結構。感測器200Α-200η可以是任意適當的感測 器,包括但不局限於上述的霍耳效應感測器、感應感測器和電 容感測器。 在示範性實施例中’每一對感測器或感測器對被預定間距 或頂點Ρ間隔開,每一個感測器對都被隔開一段距離,距離大 概是頂點Ρ或4Ρ的4倍。在備選實施例中,感測器2〇〇Α-200η 具有適當的間隔。感測器200Α-200η中的感測器對由於固定在 感測器上的磁極片或磁體210A-210D,220A-220D的作用帶上 不同磁性’或由移動物體120的其他部分作用帶不同磁性。需 要認清的是任意適當的磁場生成器都可用,並且磁體不必一定 具有南北極。在這一示例中,對應於感測器200Α-200η的磁體 210A-10D,220A-220D的磁極被排列在交互結構中。例如,磁 體210A-210D的北極對應感測器200Α-200η,磁體220A-220D 的南極則對應感測器200Α-200η當磁體210A-210D,220A-220D 在感測器200A-200n作用下發生移動時,磁極片210A-210D, 220A-220D的交互磁極產生正弦曲線型感測器輸出。在備選實 施例中,磁體可能會任意適當結構排列。在這一示範性實施例 中,磁體210A-210D,220A-220D被分開一定距離,距離大概 200914800 是點P或2P的兩倍。在備選實施例中,磁極片210A-210D, 220A-220D可以有任意適當的間距。 上述感測器 200A-200n 和磁體 210A-210D,220A-220D 的 間距可以在構成每一個感測器對兩個感測器輸出信號中生成正 弦/餘弦關係,由圖2B和2C可見。作為非極限示例,感測器 200A生成如2B中的正弦波,而感測器200A則產生圖2C所示 的餘弦波,反之亦然。感測器輸出信號可根據感測器200A-200n 插入物體200的位置。例如,當兩個信號的比值的反正切角度 確定後’物體120的插值位置就邛以確定,該值與4p和感測器 對的距離部分成正比。由於每個感測器對按預定間距安裝,插 值位置能夠從預設間距中減去或加上’從而得到了物體1200 的位置。例如,如果感測器對200A和200B的間距為C,感測 器對200A、200B和感測器對200C、200D之間的插值距離是 螺距的2倍,則物體120的位置可能是間距c與2倍螺距的和 (即 C + 2P ) 〇 感測器 200A-200n 與磁極片 210A-210D,220A-220D (由 (j 此物體120)的間距寬度G可以通過計算每個感測器對的兩個 感測信號輸出值的平方和的平方根確定,並獲得間距中感測器 的磁通密度。在備選實施例中,任意適當的計算都可用來計算 - 間距磁通密度可用於確定感測器200A-200n與磁極片 210A-210D,220A-220D的間隙g。在備選實施例中,間隙寬 . 度G可以用任意其他方法計算確定。例如,磁間隙G的寬度範 圍能夠通過幾種方法獲得,這些方法包括(但不局限於):查找 表法,包括由間距測仔的通量值和感測器對磁體運行點在去磁 10 200914800 的介 曲線上波動的敏感度。間隙G的計算將在下面進行更詳 紹。 = 根 由感測器200A-200n的數量和感測器丨〇〇,的解折 、 據下面的N位元感測器計算公式計算: °以 resolutionThe transfer position, while measuring the pitch width such as the Y-axis of the magnetic platen 170, can be used for demonstration analysis, on the 200914800 axis, including but not limited to the axis of rotation. It should also be clear that the demonstration sensor can sense any suitable moving object, including but not limited to one-way or multi-directional moving objects such as conveyors, actuators, and other drive system components. The position measurement sensor produces a signal for motor commutation to drive, for example, a conveyor or any other moving object to move from the first position to the second position. It is to be understood that the exemplary embodiments described herein are not limited to use in conjunction with an electric motor and can be used with any device that requires single or multi-directional position information. As shown in FIG. 1, in one exemplary embodiment, sensor 100 includes a magnetic platen 170 and one or more sensor groups 130a-130n. The sensor group includes one or more sensors, which are described below. The magnetic platen 170 includes one or more magnets 140, 150, the magnets are arranged in a row or a grid, and the magnets are arranged in a polar interaction (e.g., north, south, north, south, etc.), as shown in FIG. The alternating polarity arrangement of the magnets 140, 150 produces a wave 160, such as when the magnet passes through the sensor 130 to produce a sine or cosine wave, as explained further below. Magnets 140 and 150 can be any magnet having a suitable field strength. The magnets in the exemplary embodiment may be permanent magnets, the magnetic platen 170 may be converted to the platen 170 without any source of power, and the magnets in the preparation may be electromagnets. The platen 170 in other alternative embodiments includes any suitable magnetic field generating device that can be sensed by the sensors 130a-130n. Platen 170 can also be comprised of any suitable number of magnets having suitable configurations. For example, the magnets mentioned above may be arranged in a straight line, and may be arranged in a plurality of rows and/or in a column shape, and the magnets may be arranged in a crosswise manner, and the platen 170 may be fixed to the object to be tested 120. The platen 170 and the object 120 in alternative embodiments may be the same. Object 120 can be any object including, but not limited to, a transport vehicle, a piston/piston rod, an actuator, an automated mechanical end effector, a drive shaft, a motor 200914800 rotor, or any other object body that requires position measurement. The sensor 13Ga-13()n can be any suitable sensor and is not limited to - an ear effect sensor, an inductive sensor, and/or a capacitive sensor. The sensor (10) several ^^ objects run in the direction of the arrangement, it should be noted that the running direction may have = two = χ, γ, ζ direction in the Karl coordinate system (or several of them ^) or R in the polar coordinate system , e direction (or any orientation). Borrowing ί ί. 'The row direction can be associated with any suitable coordinate system. Any suitable number, the thief can be arranged in the running direction, and the sensor ΐ3 〇 "3 〇 n is arranged within a predetermined distance along the direction of the object, whereby the position of the object 12 就能 can be determined and described in detail. The sensor is connected to the control object 120: ^ for receiving the output of the sensor and based on the sensor output, the two-dimensional position of the body in the running direction and the sensor ma_i3 A computer program that outputs signals based on information such as magnetic field strength (such as flux density), such as a platen m and/or a sensory signal, and a computer embedded with a processing program and instructions. Reading medium) implementation of the meter tr displacement ===== precise positioning - short distance of an object body = two =, in other exemplary embodiments, the position measurement system material processing system transmits U components, the object is in the device An exemplary configuration of the sensor 1GG in the exemplary embodiment of the present invention is shown in FIG. 2, which is a schematic configuration of the pair of sensors in the embodiment of the present invention. The detector 200Α-200η may be arranged in a straight line or The running directions are collinearly arranged. For example, the magnetic sensors 200Α, 200Β form a first pair of stripping pairs, 2〇〇c and 200D form a second pair, and so on. In an alternative embodiment, the sensor 2〇 〇Α·2〇〇η are staggered along the running direction, some sensors will be arranged above or below other sensors. In other exemplary embodiments, the sensor 2〇〇Α_2〇〇η may have other Suitable structures. The sensor 200A-200n can be any suitable sensor including, but not limited to, the Hall effect sensor, the inductive sensor, and the capacitive sensor described above. In an exemplary embodiment Each pair of sensors or sensors is spaced apart by a predetermined spacing or apex, each sensor pair being separated by a distance that is approximately four times the vertex Ρ or 4 。. In an alternative embodiment The sensors 2〇〇Α-200η have appropriate spacing. The sensor pairs in the sensors 200Α-200η are carried by the pole pieces or magnets 210A-210D, 220A-220D fixed on the sensor. Different magnetic ' or different parts of the moving object 120 with different magnetic properties. It is recognized that any suitable magnetic field generator is available, and the magnet does not have to have north and south poles. In this example, the magnetic poles of the magnets 210A-10D, 220A-220D corresponding to the sensors 200Α-200n are arranged in interaction. In the structure, for example, the north pole of the magnets 210A-210D corresponds to the sensor 200Α-200η, and the south pole of the magnets 220A-220D corresponds to the sensor 200Α-200η when the magnets 210A-210D, 220A-220D act on the sensor 200A-200n When the movement occurs, the alternating magnetic poles of the pole pieces 210A-210D, 220A-220D produce a sinusoidal sensor output. In alternative embodiments, the magnets may be arranged in any suitable configuration. In this exemplary embodiment, the magnets 210A-210D, 220A-220D are separated by a distance that is approximately twice the point P or 2P from approximately 200914800. In alternative embodiments, the pole pieces 210A-210D, 220A-220D can have any suitable spacing. The spacing of the above-described sensors 200A-200n and magnets 210A-210D, 220A-220D can produce a sine/cosine relationship in the two sensor output signals that make up each sensor, as seen in Figures 2B and 2C. As a non-limiting example, sensor 200A generates a sine wave as in 2B, while sensor 200A produces a cosine wave as shown in Figure 2C, and vice versa. The sensor output signal can be inserted into the position of the object 200 according to the sensors 200A-200n. For example, when the arc tangent angle of the ratio of the two signals is determined, the interpolation position of the object 120 is determined to be proportional to the distance between 4p and the sensor pair. Since each sensor pair is mounted at a predetermined pitch, the interpolation position can be subtracted or added from the preset pitch to obtain the position of the object 1200. For example, if the spacing of the sensor pairs 200A and 200B is C, the interpolation distance between the sensor pair 200A, 200B and the sensor pair 200C, 200D is twice the pitch, then the position of the object 120 may be the spacing c The sum of the gaps G with the 2 times pitch (ie C + 2P ) 〇 sensors 200A-200n and the pole pieces 210A-210D, 220A-220D (by (j this object 120) can be calculated by calculating each sensor pair The square root of the sum of the squares of the two sensed signal output values is determined and the magnetic flux density of the sensor in the spacing is obtained. In an alternative embodiment, any suitable calculation can be used to calculate - the pitch flux density can be used to determine The gap g between the sensors 200A-200n and the pole pieces 210A-210D, 220A-220D. In an alternative embodiment, the gap width G can be calculated and determined by any other method. For example, the width of the magnetic gap G can pass Several methods are available, including (but not limited to): look-up table method, including the flux value measured by the spacing and the sensitivity of the sensor to the fluctuation of the magnet operating point on the demagnetization 10 200914800. The calculation of the gap G will be described in more detail below. = Root Calculated by the number of sensors 200A-200n and the sensor 丨〇〇, according to the following N-bit sensor calculation formula: ° to resolution
4P W Π] f 其中’ N代表位數文中所述的位置測量系統的解析度 於由環境類似噪音和系統輸出的比魏(類比/數位 ^ 的不確定性測量。感測器雇_2_間距或螺 每= 器對的間距P和對與對之間的間距4p)以及磁體2二^ =20^ 22GD之間的間距會按比例增加或減少,從 感測器100,的解析度。 代门次降低 續掃=過第:二,-2’排列線被控制器19。連 —, 個感測器也被掃描,如感測器200A,& =/口_1、測窃掃插線的基礎間距感 〇A_ 程可得出物體i2n s 士一 A w评r田過 結果。 具有南解析度或最大解析度的絕對位置剩量 參考圖1和jgj 2 —, — 刚,,的示意圖。所示為1示範性實施例的感測器 把性實施例中的感測器300A-300n沿物體的 盥方向佈置,感測器300A_300n有可能呈直線排列或 二:方=共線排列。在備選實施例中,感測器3〇〇A_3〇〇n沿 使仙供向交錯排列’一些感測器會位於其他感測器的上方。在 其他備選實施例中 „ r ’感測器300A-300n可能會以任意適當結構 11 200914800 排列。感測器300A-300n可以是任意適當的感測器,包括但不 局限於上述的霍耳效應感測器、感應感測器和電容感測器。 如圖3所示,感測器300A-300n沿運行方向被隔開預定間 距或螺距P,在備選實施例中的感測器可以具有任意適當的間 距。感測器300A,300B,300E是第一種類型的感測.器,成本 較低。在較長時間段内跟蹤的物體位置取決於構成另一部分系 統的感測器100”的幾何分佈特性,第二種感測器300C和300D (即一個感測器對)在感測器分佈線上,在第一種感測器的位 置上(見圖3 ),相比於第一種感測器類型300A、300B、300E, 它具有如成本較高和高靈敏度等特性。在備選實施例中,第二 種感測器的使用數量大於或小於兩個。在其他備選實施例中, 所有感測器(包括感測器和感測器對)全部是低成本感測器或 高成本感測器。同時,感測器可以以任意適當方式固定在低成 本和高成本感測器之間。低成本感測器與一個或多個感測器對 結合利用構成一個低成本位置測量精確系統,通過單一感測器 或感測器單線,該系統可以跟蹤到物體的一個粗略位置(如準 確度低於利用感測器對測量的位置),在位置的高度關注區域 内,感測器對用來精確測量物體的位置。通過利用單一感測器 跟蹤物體,感測器對也可用來校準物體位置,但第一感測器可 能會產生物體測量的偏差和變化。高成本感測器300C和300D 被隔開預定間距,該間距距離約為螺距或1/4螺距的1-4倍, 因此感測器300C和300D會生成具有正弦/餘弦關係輸出信 號,基本與上述圖2B和2C所示方式相似。 感測器300A-300I1因連接在移動物體120上或者是其組成 12 200914800 部分磁極片或磁體320A-320n的作用帶相反磁性。需要認清的 是,任意適當的磁場生成器都可用,並且磁體不必一定具有南 北極。對應於感測器300Α-300η的磁極排列成交互結構,磁體 320Α ’ 320C ’ 320Ε ’ 320G 的北極與感測器 300Α-300η 接觸, 磁體320Β,320D ’ 320F的南極則與感測器300Α-300η接觸當 感測器300Α·300η驅動磁體320Α_320η,磁極片320Α-320η的 交互磁極生成正弦曲線圖,見圖3Β。在交替體中,磁體可以以 任意適當結構排列。在這個實例中,當磁體經過單個感測器 300Α,300Β,300Ε,將產生正弦曲線感測輸出SW。當磁體經過 感測器對300C,300D時,感測器300C將生成正弦曲線輸出 SW,而感測器300D將生成餘弦輸出CW,這與感測器300C 的輸出或間距Ρ有關(即正弦/餘弦關係)。在這個示範性實施 例中,磁體320Α-320η彼此分開有一定間隔,間距大約是螺距 Ρ或2Ρ的兩倍。在交替體中,磁體320Α-320η之間的距離或大 或小於2Ρ。 感測器300Α-300η的輸出信號通過數學運算可確定在一個 基圓齒距内(本例中的Ρ)物體的位置。如上所述,由於 感測器300Α-300η中每個感測器的位置都是已知的,在基圓齒 距Ρ中,物體的確切位置玎以通過感測器300Α-300η中的兩個 感測器的已知位置做加減運算,由此得到物體120的位置。間 隙G可以利用上述相似的方法計算得出,我們會結合圖7以及 平行場方法在下面進行更詳細的論述。在備選實施例中’間隙 G可以通過其他方法求得,包括但不限於這裏所講的方法。感 測器300Α-300Ι1的輸出信號用於感測器之間的物體間距插值測 13 200914800 量。 在操作過程中,感測器300A-300n被控制器190連續掃描 輸出,同時第一個感測器也被掃描,如感測器300A,從而確定 沿感測器掃描線的基距。感測器300A-300n的掃描結果可得出 物體120具有高解析度或最大解析度的絕對位置測量結果 在一個示範性實施例中,圖3A所示的示範感測器構造可 用於低成本準確定位長距離運動物體,比如製造單元或FABS 等,這將在下面詳細介紹。圖3A所示另一示範性實施例的感 測器構造可用於任意適宜設備中發生物體傳輸的部件中進行測 距。類似的設備包括半導體加工設備,機動產品生產設備,或 其他任何設備,如機械化材料處理設備等。 參考圖4中磁性壓板400的示意圖,可見感測器S1-S4。 示範性實施例中,磁性壓板400包含4排磁極片,磁極片沿Z 方向堆疊,並沿X方向排列成7列。注意··圖4中顯示的磁極 片只是壓板400中磁體的一部分,在交替體中,壓板400則可 能包含適當數量的磁極片排和/或列。本例中,磁極片行具有交 互磁極,交錯排列或彼此分隔開約P/2距離,見圖4。同樣的, 磁極片列也具有交互磁極,交錯排列或彼此分隔開約P/2距 離。任一排或列中兩個磁體之間的螺距是P。在交替體中,磁 極片的排列和間距則是任意的。4P W Π] f where 'N represents the resolution of the position measurement system described in the number of bits in the ambient-like noise and system output ratio Wei (analog/digit^ uncertainty measurement. Sensor hired_2_ The spacing between the spacing P or the pitch of the pair of pairs and the spacing between the pair and the pair 4p) and the spacing between the magnets 2 and 2^20^22GD will increase or decrease proportionally from the resolution of the sensor 100. The generation gate is reduced. The continuous sweep = over the second: second, the -2' arrangement line is controlled by the controller 19. Even--, the sensors are also scanned, such as the sensor 200A, & = / port_1, the basic spacing of the sneak sweep line 〇 A_ Cheng can get the object i2n s Shi Yi A w evaluation r Tian The result. Absolute position residual with south resolution or maximum resolution Refer to the schematic diagram of Figure 1 and jgj 2 —, — just, . Sensors shown as an exemplary embodiment The sensors 300A-300n in the embodiment are arranged in the 盥 direction of the object, and the sensors 300A-300n are likely to be arranged in a straight line or two: square = collinear arrangement. In an alternative embodiment, the sensors 3 〇〇 A_3 〇〇 n are staggered along the direction of the supply. Some sensors may be located above the other sensors. In other alternative embodiments, the 'r' sensors 300A-300n may be arranged in any suitable configuration 11 200914800. The sensors 300A-300n may be any suitable sensors including, but not limited to, the above-described Hall Effect sensor, inductive sensor, and capacitive sensor. As shown in FIG. 3, the sensors 300A-300n are spaced apart by a predetermined pitch or pitch P in the direction of travel, and the sensor in an alternative embodiment may Having any suitable spacing. The sensors 300A, 300B, 300E are the first type of sensor, which is less expensive. The position of the object being tracked over a longer period of time depends on the sensor 100 that forms the other part of the system. Geometric distribution characteristics, the second sensors 300C and 300D (ie a pair of sensors) on the sensor distribution line, at the position of the first sensor (see Figure 3), compared to the first A sensor type 300A, 300B, 300E has characteristics such as high cost and high sensitivity. In an alternative embodiment, the second sensor is used in an amount greater or less than two. In other alternative embodiments, all of the sensors (including the sensor and sensor pairs) are all low cost sensors or high cost sensors. At the same time, the sensor can be secured between the low cost and high cost sensors in any suitable manner. A low-cost sensor in combination with one or more sensor pairs forms a low-cost position measurement accuracy system that can track a rough position of an object (such as accuracy) through a single sensor or sensor single line Below the position measured with the sensor pair, the sensor pair is used to accurately measure the position of the object in the highly focused area of the position. By tracking the object with a single sensor, the sensor pair can also be used to calibrate the position of the object, but the first sensor may produce deviations and changes in the measurement of the object. The high cost sensors 300C and 300D are spaced apart by a predetermined pitch which is about 1-4 times the pitch or 1/4 pitch, so the sensors 300C and 300D generate a sine/cosine relationship output signal, substantially The manners shown in Figures 2B and 2C above are similar. The sensors 300A-300I1 are oppositely magnetic due to their attachment to the moving object 120 or their composition 12 200914800 partial pole piece or magnet 320A-320n. It is important to recognize that any suitable magnetic field generator is available and that the magnet does not have to have a north and south pole. The magnetic poles corresponding to the sensors 300Α-300η are arranged in an alternating structure, the north pole of the magnet 320Α '320C '320Ε '320G is in contact with the sensor 300Α-300η, the south pole of the magnet 320Β, 320D '320F and the sensor 300Α-300η Contact When the sensor 300Α·300η drives the magnet 320Α_320η, the alternating magnetic poles of the pole piece 320Α-320η generate a sinogram, as shown in FIG. In the alternating body, the magnets may be arranged in any suitable configuration. In this example, when the magnet passes through a single sensor 300 Α, 300 Β, 300 Ε, a sinusoidal sense output SW will be produced. When the magnet passes the sensor pair 300C, 300D, the sensor 300C will generate a sinusoidal output SW, and the sensor 300D will generate a cosine output CW, which is related to the output or spacing 感 of the sensor 300C (ie sine / Cosine relationship). In this exemplary embodiment, the magnets 320Α-320η are spaced apart from one another by a spacing of approximately twice the pitch Ρ or 2Ρ. In the alternating body, the distance between the magnets 320Α-320η is either greater or less than 2Ρ. The output signal of the sensor 300Α-300η can be mathematically determined to determine the position of the object within a base circular pitch (Ρ in this example). As described above, since the position of each of the sensors 300A-300n is known, in the base pitch Ρ, the exact position of the object 玎 passes through two of the sensors 300Α-300η The known position of the sensor is added and subtracted, thereby obtaining the position of the object 120. The gap G can be calculated using a similar method as described above, which we will discuss in more detail below in conjunction with Figure 7 and the parallel field method. In an alternative embodiment, the gap G can be determined by other methods including, but not limited to, the methods described herein. The output signal of the sensor 300Α-300Ι1 is used for the inter-object distance interpolation between the sensors 13 200914800. During operation, sensors 300A-300n are continuously scanned for output by controller 190 while the first sensor is also scanned, such as sensor 300A, to determine the base distance along the sensor scan line. The scan results of the sensors 300A-300n may result in absolute position measurements of the object 120 having a high resolution or maximum resolution. In one exemplary embodiment, the exemplary sensor configuration shown in FIG. 3A may be used for low cost accuracy Position long-distance moving objects, such as manufacturing units or FABS, as described in more detail below. The sensor configuration of another exemplary embodiment shown in Fig. 3A can be used for ranging in components where object transfer occurs in any suitable device. Similar equipment includes semiconductor processing equipment, motorized product production equipment, or any other equipment, such as mechanized material processing equipment. Referring to the schematic view of the magnetic platen 400 of Figure 4, the sensors S1-S4 are visible. In the exemplary embodiment, the magnetic platen 400 includes four rows of pole pieces stacked in the Z direction and arranged in 7 rows in the X direction. Note that the pole piece shown in Figure 4 is only a portion of the magnet in the platen 400. In the alternating body, the platen 400 may contain an appropriate number of pole pieces and/or columns. In this example, the rows of pole pieces have alternating magnetic poles that are staggered or spaced apart from each other by a distance of about P/2, see Figure 4. Similarly, the pole pieces also have alternating magnetic poles that are staggered or spaced apart from each other by about P/2. The pitch between the two magnets in either row or column is P. In the alternating body, the arrangement and spacing of the pole pieces are arbitrary.
示範性實施例中的4個感測器S1-S4定位於磁性壓板400 產生的對稱磁場中,在交替體中,可以應用4個以上或以下的 感測器。感測器S1-S4與圖2A和3A中所描述的感測器特性相 似。如圖4所示,感測器S1和S2是第一對感測器,它們在X 14 200914800 方向共線排列,彼此之間預置有約P/2或一半螺距左右的間 距。感測器S3和S4構成第二對感測器,它們實質上也在X方 向共線排列’彼此之間預置有約P/2左右的間距。S3和S4感 測器對在X方向偏移出S1和S2感測器對一定距離,約p/4 , 感測器對S3和S4在X方向偏移出S1和S2感測器對约p/4距 離。在備選實施例中,感測器對中的感測器分佈則具有任意適 當的間距。在其他交替體中,感測器對之間也具有任意適當的 間距。 在這一示範性實施例中,感測器S1_S4回應磁場組成,這 對磁極片平面很正常(即測量位置的正常場法)感測器對S1, S2和S3,S4提供輸出信號,信號呈正弦/餘弦關係,實際上與 圖2B和2C所述類似。例如,在這一示範性實施例中,感測器 S2的彳s號減去感測器S2的信號所得的信號結果與沿X軸產生 的位移的正弦值呈正比。與沿X軸向上的間距的正弦成正比的 信號’按等同於磁體螺距P的空間週期重複出現,用感測器S3 的信號減去感測器S4的信號,所得信號結果與χ軸向上的間 距的餘弦成正比。與沿X軸向上的間距的餘弦成正比的信號, 按等同於磁體螺距P的空間週期重複出現。 除了沿X軸向測量位置外,感測器S1 —S4和壓板4〇〇也 可用於z軸向的位置測量。例如,如果感測器S2的信號加上 ^的信號,所得信號結果與Z軸向上的間距的正弦成正比。與 Z軸向上的間距的正弦成正比的信號,按等同於磁體螺距p ,工間週期重複出現’用感測器S3的信號加上感測器S4的信 號所得彳5號結果與z軸向上的間距的餘弦成正比。與沿z軸 15 200914800 向上的間距的餘弦成正比的信號,按等同於磁體螺距p的空間 週期重複出現。 正弦和餘弦信號可在一個間距内生成〇度到360度不等的 角度,該間距等同於磁螺距,可確定感測器陣列相對於磁體陣 列的準確位置,反之亦然。 參見圖5,圖4中的位置測量系統將在下文中加以詳細論 述。感測器對SI ’ S2,S3 ’ S4的位置彼此各不相同。例如, 圖5中的感測器對S3,S4位於感測器對si,S2的下方,而在 圖4中,感測器對S3 ’ S4則位於感測器對si,S2的上方。在 備選實施例中,感測器對具有適當構造,並/或彼此隔開,因此 感測器對之間存在正弦/餘弦關係。由圖5可見,感測器組53〇 由感測器S1-S4構成,與包含磁極單元51〇和52〇的磁性壓板 540相鄰或距離最近。如圖5所示,磁極單元以某種交互結構 排列,其中磁極單元510的北極與感測器組53〇相接觸,磁極 早元520的南極與感測态組53〇相接觸,磁極單元的距離與上 面圖4中所示相似。在備選實施例中,磁極單元51〇和52〇具 有適當的間距。 在本示範性實施例中,四個感測器S1_S4生成兩組信號, 兩組中的#號成正弦/餘弦關係(即感測器S 1,的輸出信號 成正弦/餘弦關係,感測器S3,S4的輸出信號成正弦/餘弦關 係)。如上所述,圖5所示的感測器s 1-S4的結構是感測器能夠 感應到與磁性壓板54〇垂直的磁場,如對示範坐標系統5〇〇的 解釋所示。圖6A和9A表示磁性壓板540生成的一個磁場的三 、准圖,其中,所繪製的Y軸向上的磁場強度與沿X軸和Z軸向 16 200914800 的位置相反。圖6B和9B分別表示根據圖6A和9A中的磁場 '強度圖繪製的感測器輸出的二維圖。 在圖4和5所示的位置測量正常場法中,兩個感測器對 SI、S2和S3、S4的正弦和餘弦關係用來計算固定於磁性壓板 540上的物體120的位置。例如,沿X軸向的感測信號的正弦 值可用如下公式計算: sin, S1-S2 [2] 沿X軸向的感測信號的餘弦值可用如下公式計算 cos, S3-S4 [3] 螺距P内,物體120在Z軸向的位置可以通過sinz和cosz 計算得到,如下式: X = arctan —— [4] COS/ 其中,X與沿磁螺距的部分間距成正比,由於感測器組530 中的每個感測器之間都有一定的預設距離,用預設距離減去或 加上對應於X的插值位置Dx就可以獲得物體120的位置。例 如,假設530感測器組沿X軸線的預設距離為C,插值位置Dx 等於P/3,則物體120在X軸線的位置可能是間距C加上Dx (gp C+P/3 )。 17 200914800 類似z軸向的位置可以通過計算z軸向的感測信號的正弦 和餘弦值確定,如下: [5] 51 + 52 ~2~~ cos, S3 + S4 [6] 螺距P内,物體120在Z轴向的位置可以通過sinz和cosz 計算得到,如下式: m Z = arctan S1-z cos, 其中,Z與沿磁螺距的部分間距成正比,感測器組530中 的每個感測器沿Z軸都有一定的預設距離,因此,用預設距離 減去或加上對應於Z的間距Dz就可以獲得物體120的位置。 例如,假設530感測器組沿Z軸線的預設距離為B,插值位置 Dz等於P/3,則物體120在Z轴線的位置可能是間距B加上 Dz (即 B+ P/3 )。 計算得到正弦和餘弦平方和的平方根,磁通密度就可以確 定。磁通密度與磁體整理或壓板540與感測器530之間的間距 G成正比,這樣,感測器組530與磁性壓板540 (即Y軸向的 位置)之間的間隙G就可以通過下式確定:The four sensors S1-S4 in the exemplary embodiment are positioned in a symmetrical magnetic field generated by the magnetic platen 400, and in the alternating body, four or more sensors can be applied. Sensors S1-S4 are similar to the sensor characteristics described in Figures 2A and 3A. As shown in Fig. 4, the sensors S1 and S2 are first pair of sensors which are arranged in line in the direction of X 14 200914800 with a pitch of about P/2 or a half pitch between them. The sensors S3 and S4 constitute a second pair of sensors which are also substantially collinearly arranged in the X direction with a pitch of about P/2 pre-positioned therebetween. The S3 and S4 sensor pairs are offset in the X direction by a distance from the S1 and S2 sensors, about p/4, and the sensor pairs S3 and S4 are offset in the X direction by the S1 and S2 sensor pairs. /4 distance. In an alternative embodiment, the sensor distribution in the sensor pair has any suitable spacing. In other alternating bodies, there is also any suitable spacing between pairs of sensors. In this exemplary embodiment, the sensor S1_S4 responds to the magnetic field composition, which is normal for the plane of the pole piece (ie, the normal field method of measuring position). The sensor provides output signals to S1, S2 and S3, S4, and the signal is presented. The sine/cosine relationship is actually similar to that described in Figures 2B and 2C. For example, in this exemplary embodiment, the signal obtained by subtracting the signal of sensor S2 from the ss of sensor S2 is proportional to the sine of the displacement produced along the X axis. The signal ' proportional to the sine of the pitch along the X-axis is repeated in a spatial period equivalent to the pitch P of the magnet, and the signal of the sensor S4 is subtracted from the signal of the sensor S3, and the resulting signal is obtained in the axial direction. The cosine of the spacing is proportional. A signal proportional to the cosine of the pitch along the X-axis is repeated in a spatial period equivalent to the pitch P of the magnet. In addition to measuring the position along the X-axis, the sensors S1-S4 and the platen 4〇〇 can also be used for position measurement in the z-axis. For example, if the signal of sensor S2 is plus the signal of ^, the resulting signal result is proportional to the sine of the spacing in the Z-axis. The signal proportional to the sinusoidal spacing of the Z-axis is equivalent to the pitch of the magnet p, and the inter-process cycle is repeated. 'The signal of the sensor S3 plus the signal of the sensor S4 is obtained. The cosine of the spacing is proportional. The signal proportional to the cosine of the pitch along the z-axis 15 200914800 is repeated in a spatial period equivalent to the pitch p of the magnet. The sine and cosine signals can generate angles ranging from twentieth to 360 degrees in a pitch equal to the magnetic pitch, which determines the exact position of the sensor array relative to the array of magnets, and vice versa. Referring to Figure 5, the position measuring system of Figure 4 will be discussed in detail below. The positions of the sensor pairs SI ’ S2, S3 ′ S4 are different from each other. For example, the sensor pairs S3, S4 in Figure 5 are located below the sensor pair si, S2, while in Figure 4, the sensor pair S3'S4 is located above the sensor pair si, S2. In an alternative embodiment, the pairs of sensors have an appropriate configuration and/or are spaced apart from one another such that there is a sine/cosine relationship between the pairs of sensors. As seen in Fig. 5, the sensor group 53A is constituted by the sensors S1-S4 adjacent to or closest to the magnetic platen 540 including the magnetic pole units 51A and 52A. As shown in FIG. 5, the magnetic pole units are arranged in an interactive structure in which the north pole of the magnetic pole unit 510 is in contact with the sensor group 53 ,, and the south pole of the magnetic pole early element 520 is in contact with the sensing state group 53 ,, the magnetic pole unit The distance is similar to that shown in Figure 4 above. In an alternative embodiment, the pole units 51A and 52A have appropriate spacing. In the present exemplary embodiment, the four sensors S1_S4 generate two sets of signals, and the # of the two groups is in a sine/cosine relationship (ie, the output signal of the sensor S1 is in a sine/cosine relationship, the sensor The output signals of S3 and S4 are in sine/cosine relationship). As described above, the structure of the sensors s 1-S4 shown in Fig. 5 is such that the sensor can sense a magnetic field perpendicular to the magnetic platen 54A as shown in the explanation of the exemplary coordinate system 5A. Figures 6A and 9A show a three-dimensional map of a magnetic field generated by the magnetic platen 540, wherein the intensity of the magnetic field in the drawn Y-axis is opposite to the position along the X-axis and the Z-axis 16 200914800. Figures 6B and 9B show two-dimensional views of sensor outputs plotted according to the magnetic field 'intensity plots of Figures 6A and 9A, respectively. In the position measurement normal field method shown in Figs. 4 and 5, the sine and cosine relations of the two sensor pairs SI, S2 and S3, S4 are used to calculate the position of the object 120 fixed to the magnetic platen 540. For example, the sine value of the sensed signal along the X-axis can be calculated by the following formula: sin, S1-S2 [2] The cosine of the sensed signal along the X-axis can be calculated by the following formula: S3-S4 [3] pitch In P, the position of the object 120 in the Z-axis can be calculated by sinz and cosz, as follows: X = arctan - [4] COS / where X is proportional to the spacing along the magnetic pitch, due to the sensor group There is a certain preset distance between each sensor in 530, and the position of the object 120 can be obtained by subtracting or adding the interpolation position Dx corresponding to X by the preset distance. For example, assuming that the preset distance of the 530 sensor group along the X axis is C and the interpolation position Dx is equal to P/3, the position of the object 120 on the X axis may be the spacing C plus Dx (gp C+P/3 ). 17 200914800 The position similar to the z-axis can be determined by calculating the sine and cosine values of the z-axis sensing signal as follows: [5] 51 + 52 ~2~~ cos, S3 + S4 [6] Pitch P, object The position of 120 in the Z-axis can be calculated by sinz and cosz as follows: m Z = arctan S1-z cos, where Z is proportional to the partial spacing along the magnetic pitch, and each sense in sensor group 530 The detector has a certain preset distance along the Z axis. Therefore, the position of the object 120 can be obtained by subtracting or adding the spacing Dz corresponding to Z by the preset distance. For example, assuming that the preset distance of the 530 sensor group along the Z axis is B and the interpolation position Dz is equal to P/3, the position of the object 120 on the Z axis may be the spacing B plus Dz (ie, B+P/3). Calculate the square root of the sum of the squares of the sine and cosine, and the flux density can be determined. The magnetic flux density is proportional to the spacing G between the magnet assembly or platen 540 and the sensor 530, such that the gap G between the sensor group 530 and the magnetic platen 540 (i.e., the position in the Y-axis) can pass through Determine:
Gap = t*ln A ) [8]Gap = t*ln A ) [8]
vVsin H-cos J 18 200914800 其中,t和A是由磁體分佈確定的常量。 如圖7所示,位置測量系統由感測器組73〇和磁性塵板74〇 組成。磁性壓板740與圖5所述的壓板基本相同,它包括有磁 極單元710 (北極單元)’720 (南極單元),71〇和720以對 話模式排列,見圖7。該示範性實施例中的感測器組73〇含有4 個感測器S1-S4。在備選實施例中,感測器組73〇可以由任意 適量的感測器組成,S1-S4可以是任意合適類型的感測器,包 括但不限於霍耳效應感測器、感應感測器或電容感測器。感測 器SI ’ S2構成第一個感測器對,S3和以構成第二對。感測器 S1和S2在Z軸基本呈共線排列(從代表7〇〇的示範座標體系 '^見),並彼此分隔開相當於磁體螺距1/4左右的距離。感測 器S3和S4在X軸基本呈共線排列,也彼此分隔開相當於磁體 螺T171左右的距離。在•選實施例中,感測器之間的間距可 以疋任思的。如圖7所示,在χ軸向,感測器S1、S2位於 和S4之間,而在z軸向,感測器S3、S4則位於S1和S2之間。 在備選實施例中,感測器S1、S2與S3'S4之問的空匕具vVsin H-cos J 18 200914800 where t and A are constants determined by the distribution of the magnets. As shown in Fig. 7, the position measuring system is composed of a sensor group 73A and a magnetic dust plate 74A. The magnetic platen 740 is substantially identical to the platen described in Fig. 5 and includes a magnetic pole unit 710 (North Pole unit) '720 (South Pole unit), 71 〇 and 720 arranged in a dialogue mode, see Fig. 7. The sensor group 73 in the exemplary embodiment contains four sensors S1-S4. In an alternative embodiment, sensor group 73A may be comprised of any suitable amount of sensors, S1-S4 may be any suitable type of sensor including, but not limited to, Hall effect sensors, inductive sensing Or capacitive sensor. The sensor SI ’ S2 constitutes the first sensor pair, S3 and constituting the second pair. The sensors S1 and S2 are arranged substantially collinearly on the Z-axis (see from the exemplary coordinate system representing 7〇〇) and are spaced apart from each other by a distance corresponding to about 1/4 of the pitch of the magnet. The sensors S3 and S4 are substantially collinearly arranged on the X-axis, and are also spaced apart from each other by a distance corresponding to the magnet screw T171. In the alternative embodiment, the spacing between the sensors can be considered. As shown in Fig. 7, in the x-axis, the sensors S1, S2 are located between and S4, and in the z-axis, the sensors S3, S4 are located between S1 and S2. In an alternative embodiment, the empty cookers of the sensors S1, S2 and S3'S4
可見’感測益S3與S4以及si與S2 感測輸出的二維圖。由圖8B S2均成正弦/餘弦關係。 19 200914800 這些正/餘弦關係式能夠確定磁性壓板74 0相對於感測器組 73 0沿X軸和Ζ轴的位置。感測器輸出之間的正弦/餘弦關係也 可用來計算壓板740和感測器組730之間的在Υ軸向的間隙 G。例如,壓板740沿X軸的位置可按下式計算: Z = arctan— [9]A two-dimensional map of the sensory outputs of senses S3 and S4 and si and S2 can be seen. S2 is a sine/cosine relationship from Fig. 8B. 19 200914800 These positive/cosine relations can determine the position of the magnetic platen 74 0 relative to the sensor group 73 0 along the X and Ζ axes. The sine/cosine relationship between the sensor outputs can also be used to calculate the gap G in the x-axis between the platen 740 and the sensor group 730. For example, the position of the platen 740 along the X-axis can be calculated as follows: Z = arctan - [9]
S4 L J 其中,X與沿磁螺距的部分間距成正比。由於每個感測器 組730之間都有一定的預設距離,用預設距離減去或加上對應 於X的插值位置Dx就可以獲得壓板740相對於感測器730的 位置(以及固定於壓板740的物體120的位置)。例如,假設 730感測器組沿X軸線的預設距離為C,插值位置Dx等於P/3, 則物體120在X軸線的位置可能是間距C加上Dx(即C+ P/3 )。 壓板740沿Z軸的位置可按下式計算: Z = arctan— [10] 52 其中,Z與沿磁螺距的部分間距成正比,由於每個感測器 組730之間都有一定的預設距離,用預設距離減去或加上對應 於Z的插值位置Dz就可以獲得壓板740相對於感測器730的 位置(以及壓板740連接的物體120的位置)。例如,假設730 感測器組沿X軸線的預設距離為B,插值位置Dz等於P/3,則 物體120在X轴線的位置可能是間距B加上Dz (即B+P/3)。 感測器組730與磁性壓板740之間的間隙(即Y轴向的位 置)可以按下式計算: 20 200914800S4 L J where X is proportional to the spacing along the magnetic pitch. Since there is a certain preset distance between each sensor group 730, the position of the pressure plate 740 relative to the sensor 730 can be obtained by subtracting or adding the interpolation position Dx corresponding to X by the preset distance (and fixing) The position of the object 120 on the platen 740). For example, assuming that the preset distance of the 730 sensor group along the X axis is C and the interpolation position Dx is equal to P/3, the position of the object 120 on the X axis may be the spacing C plus Dx (ie, C+P/3). The position of the platen 740 along the Z-axis can be calculated as follows: Z = arctan - [10] 52 where Z is proportional to the spacing along the magnetic pitch, since each sensor group 730 has a certain preset The position of the platen 740 relative to the sensor 730 (and the position of the object 120 to which the platen 740 is attached) can be obtained by subtracting or adding the interpolation position Dz corresponding to Z by the preset distance. For example, assuming that the preset distance of the 730 sensor group along the X axis is B and the interpolation position Dz is equal to P/3, the position of the object 120 on the X axis may be the spacing B plus Dz (ie, B+P/3). . The gap between the sensor group 730 and the magnetic platen 740 (i.e., the position in the Y-axis) can be calculated as follows: 20 200914800
Gap = / * InGap = / * In
TsfTs? [11] 其中,t和A是由磁體分佈確定的常量。 r\ 參見圖2 6 - 3 4 ’示範性實施例中的位置測量系統由磁陣列m (包含磁極單元2601,2602) ’第一感測器組ai_a5,第二感 測器組B1-B5,類比電子263〇和模數轉換器264〇,2645組成。 注意.類比電子2630和模數轉換器264〇,2645是控制器⑽ 的部件。在備選實施例中,類比電子廳和模數轉換器测, 2645是相互獨立的,但都與控制器携相連接。在其他備選實 施=中’感測器A1-A5,B1-B5用來提供數位輸出。在本示範 性實施例中,每-個感測器組中的兩個感測器都具有一定間 距,其間距等於磁陣列中磁體的磁螺距?與每組中感測器的個 =η )的比值或P / n,其中p表示磁螺距,n表示每個感測器 对感測器的個數。在傭選實施例中,每—個感測器組中的感 測器之間的間距不一定等於ρ/η,兩個感測器組 Π D/2左右的偏移。每組中感測器的間距以及兩個感測 、,且之間的偏移是任意的。如上所述,#磁性陣列Μ沿某一方 向,、如Χ軸向移動經過感測器時,感測器組Α1-Α5, Β1-Β5會 生成週期信號。在該示紐實施财,感測器AM, 十分接近磁轉列Μ,因此每個感測詩達到飽 Γ:Α5生成的示範信號見圖27-31,正弦曲線信號测,、 達到飽^侧’遞的敎或水準部分表明每個感測器都 達到飽和極限。與圖27·31所示類似,感測器m_B5均達到其 21 200914800 飽和極限。(儘管輸出沿x軸和其他軸線發生了改變)類比電 子2630加和感測器A1-A5的輸出信號而生成信號A,見圖32。 類比電子加和感測器B1-B5的輸出信號而生成信號B,見圖 . 33。在備選實施例中,感測器生成數位輸出,則類比電子可以 用數位電子替換。注意··當對感測器信號求和時,一些諸如從 — 感測器A2和A4 (如每兩個間隔感測信號)生成的信號可以是 相反的。在備選實施例中,任意感測器的感測信號都可能是相 〃 反的。在其他備選實施例中,信號則不能顛倒。如圖32和33 所示,對每一個感測器組A1-A5和B1-B5,飽和信號的總和生 • 成周相移動的鋸齒信號3200,3300。信號A3200,B3300用於 確定磁性陣列或壓板Μ相對於感測器A1-A5和B1-B5的位置, 以下詳細論述。我們進一步注意到,與圖34所示的一對非飽和 正弦/餘弦波相比,飽和信號生成的波形週期較短,這決定了感 測器對磁性陣列Μ的回應變化率較高,並提高了感測器解析 度。 我們已經認識到,測量過程都會存在一定的誤差,其原因 ί; 有很多,包括不均勻磁場等。正常場測量方法所產生的誤差可 能是由於電動機線圈生成了磁場而引起的。也可能是由磁性壓 板本身引起的。由不均勻磁場等產生的位置測量誤差可以用多 • 種方法加以修正,包括但不限於增加感測器、查詢表和/或磁體 優化等方法。 . 附加感測器添加到位置測量系統中,感測器之間的螺距就 會減小以增加感測器解析度和抗擾度。以平常場測量方法為 例,添加兩個感測器後,就可以計算出角度或正切的4個組合。 22 200914800 在一個螺距内,這3個角度會產生正切的4個週期,見圖12A。 類似的,如果附加的4個感測器安裝進感測器組530和730中, 一個磁螺距就會產生正切的8個週期。 修正因數也用來提供增高的抗擾度,並提高感測器的準確 度。例如,在平行場法中,參見圖12C,感測器SI —S4顯示出 資料(圖12C,元件1200),初始位置測量方法利用如下公式 計算(圖12C,元件1200):TsfTs? [11] where t and A are constants determined by the distribution of the magnets. r\ see Fig. 2 6 - 3 4 'The position measuring system in the exemplary embodiment consists of a magnetic array m (including magnetic pole units 2601, 2602) 'first sensor group ai_a5, second sensor group B1-B5, Analog electronics 263〇 and analog-to-digital converter 264〇, 2645. Note that analog electronics 2630 and analog to digital converters 264, 2645 are components of controller (10). In an alternative embodiment, the analog electronic hall and analog to digital converter measurements, 2645 are independent of each other, but are connected to the controller. In other alternative implementations, the sensors A1-A5, B1-B5 are used to provide a digital output. In the present exemplary embodiment, each of the two sensors in each of the sensor groups has a pitch equal to the magnetic pitch of the magnets in the magnetic array. The ratio to the =η of each sensor in the set or P / n, where p is the magnetic pitch and n is the number of sensors per sensor. In the commissioning embodiment, the spacing between the sensors in each sensor group is not necessarily equal to ρ/η, and the two sensor groups are offset by about D/2. The spacing of the sensors in each group, as well as the two senses, and the offset between them are arbitrary. As described above, when the magnetic array turns in a direction, such as when the axis moves axially through the sensor, the sensor groups Α1-Α5, Β1-Β5 generate periodic signals. In the implementation of the show, the sensor AM is very close to the magnetic transfer train, so each sensed poem reaches fullness: the exemplary signal generated by Α5 is shown in Figure 27-31, the sinusoidal signal is measured, and the saturation side is reached. 'The 敎 or level of the hand indicates that each sensor has reached the saturation limit. Similar to Figure 27·31, the sensor m_B5 reaches its 21 200914800 saturation limit. (Although the output changes along the x-axis and other axes) analog electronics 2630 sums the output signals of sensors A1-A5 to generate signal A, see Figure 32. Analogy electrons sum the output signals of sensors B1-B5 to generate signal B, see Fig. 33. In an alternative embodiment, the sensor generates a digital output, and the analog electrons can be replaced with digital electrons. Note · When summing the sensor signals, some signals such as those generated from the sensors A2 and A4 (such as every two interval sensing signals) can be reversed. In an alternative embodiment, the sensing signals of any of the sensors may be opposite. In other alternative embodiments, the signal cannot be reversed. As shown in Figures 32 and 33, for each of the sensor groups A1-A5 and B1-B5, the sum of the saturation signals produces a sawtooth signal 3200, 3300 that moves in a phase. Signals A3200, B3300 are used to determine the position of the magnetic array or platen Μ relative to sensors A1-A5 and B1-B5, as discussed in detail below. We further note that compared to the pair of unsaturated sine/cosine waves shown in Figure 34, the waveform generated by the saturation signal has a shorter period, which determines the response rate of the sensor to the magnetic array 较高 is higher and improves. Sensor resolution. We have realized that there are certain errors in the measurement process for a number of reasons, including uneven magnetic fields. The error produced by the normal field measurement method may be caused by the magnetic field generated by the motor coil. It may also be caused by the magnetic plate itself. Position measurement errors due to inhomogeneous magnetic fields, etc., can be corrected in a number of ways, including but not limited to methods such as adding sensors, look-up tables, and/or magnet optimization. Additional sensors are added to the position measurement system and the pitch between the sensors is reduced to increase sensor resolution and immunity. Taking the normal field measurement method as an example, after adding two sensors, you can calculate the four combinations of angles or tangent. 22 200914800 Within a pitch, these three angles produce four cycles of tangent, see Figure 12A. Similarly, if four additional sensors are installed into the sensor groups 530 and 730, one magnetic pitch will produce a tangent of eight cycles. The correction factor is also used to provide increased immunity and improve sensor accuracy. For example, in the parallel field method, referring to Fig. 12C, the sensors SI_S4 display data (Fig. 12C, element 1200), and the initial position measurement method is calculated using the following formula (Fig. 12C, element 1200):
+ SJ a = arctan— [12] [13] 51 =arctan— 52 其中,α表示X軸向的未修正位置,β表示Z軸向的未修 正位置。修正因數δΐ,δ2,δ3,δ4..·δη由查詢表(圖12C,元 件1200)獲得。修正因數δΐ-δη可以是任意通過試驗、感測器 靈敏度資訊、去磁曲線上的磁體工作點和/或其他資訊等得到的 修正因數。修正因數δΐ-δη用來計算修正的感測器輸出值 Sl’-S4’(見圖12C,組件1230)計算,如下所示:+ SJ a = arctan— [12] [13] 51 = arctan — 52 where α represents the uncorrected position of the X-axis and β represents the uncorrected position of the Z-axis. The correction factors δ ΐ, δ2, δ3, δ4.··δη are obtained from the lookup table (Fig. 12C, element 1200). The correction factor δ ΐ - δ η can be any correction factor obtained by experiment, sensor sensitivity information, magnet operating point on the demagnetization curve, and/or other information. The correction factor δ ΐ - δ η is used to calculate the corrected sensor output value Sl'-S4' (see Figure 12C, component 1230) as follows:
Sr=dl*Sl [14] S2'=a2*S2 [15] S3'=33* S3 [16] S4,=d4*S4 [17] 沿X軸、Z軸的修正位置和感測器組73 0與磁性壓板740 之間的修正間隙可以利用下面的公式計算:(圖12C,組件1240) 23 200914800 X = arct3xi— S4f [18] sv Z = arctan— [19] f dnn 一 f * In —----— A u㈣ + (S2,)2 > 其中,t和A是由磁體分佈確定的常量。圖13和14所示 為應用修正因數後,間隙測量和Ζ軸向測量的示範曲線圖。儘 管修正因數的應用是以平行場法為例進行論述的,修正因數也 可以應用於正常場法中,其應用方法與上述方法基本相同。 如上所述,磁體優化後可以提高位置測量系統的準確度。 在圖中所示的示範性實施例中,磁性壓板上的磁體呈圓形或菱 形。但是,磁體可以成任意合適的形狀,包括但不限於正方形、 菱形、橢圓形、矩形、梯形、圓形和三角形等。 將由不均勻磁場引起的最小誤差應用到測量過程,則磁性 壓板上的磁體形狀優化後可以生成正弦曲線波等。磁體的最優 化將根據菱形和圓形磁體在下面做以講述,這裏所講的最優化 方法可以應用到任意適當形狀的磁體中。 圖15A-15C所示為示範磁性壓板。由圖15Α可見,非優化 磁性壓板包含有圓形陣列或圓柱形磁體。圖15]3和15C所示為 圓柱形磁體的最優化形式,此磁體陣列中的每個磁體都呈(具 有一個平頂的)圓錐形。圖15B表示具有50度邊或平衡角的 磁體,而圖15C表示具有60度邊或縱傾角的磁體。圖16A表 示非優化結構中的菱形磁體,圖16B表示具有5〇度邊或縱傾 24 200914800 角的優化菱形磁體備選實施例中的磁體可以具有任意適當的邊 角。在其他備選實施例中的磁體可以是任意合適形狀,而非圓 錐形。 圖17表示當壓板經過感測器時,諸如圖15A所示的非優 化圓柱形磁體生成的正弦曲線波。由圖17可見,正弦波並不平 滑,沿所有軸向(X,Z和磁場強度軸線)的波形都存在波動。 對於菱形磁體,圖19A — 19C表示非優化磁性壓板1900生成的 信號(同時見圖16A),這進一步闡釋了平行場法。由圖19A 中的1910和1920可見,X軸向和Z軸向的磁場強度是沿X軸 和Z轴的相反位置繪製的,具有不均勻的波峰和波谷。二維圖 1930中也存在這些不均勻波峰和波谷,其中的磁場強度根據X 軸向和Z軸向的位置繪製。當沿X軸或Z軸的位置確定後,由 位置結果繪製的圖表如圖19B所示,由正弦曲線波的角度所得 的位置資料點分佈在最佳擬合線1950的兩邊。類似的,繪製出 的磁性壓板和感測器之間的間隙距離圖並不是如圖19C所示的 具有相同的間距測量。 圖18表明當壓板經過感測器時,諸如圖15B,15C和16B 所示的優化磁體生成的正弦曲線波。由圖18可見,正弦波平 滑,因此從優化正弦波中獲得的位置測量的準確度比從非優化 正弦波中的高。圖20A表示一個示範優化磁性壓板2000,磁性 壓板2000的結構與圖4中所描述的結構基本相同。由圖20A 可見,當磁場強度沿X軸、Z軸或者X軸和Z軸的反方向繪製 時,所得正弦曲線波2010,2020,2030較平滑,因此測量誤差 最小。由圖20B可見,由正弦曲線波得到的位置資料點基本沿 25 200914800 線2050刀佈。類似的,繪製出的磁性壓板和感測器之間的間隙 距離圖,不是如圖2GC所示的具有相同的間距測量。 磁场優化可以通過諸如修飾磁性壓板的單個磁體的邊緣來 . #現。縱傾角度的值可以利用標準偏差σ確定,σ表示在感測 區域的磁场變形。例如,見圖22,當菱形磁體的邊緣角為% 度左右(見,點J」)或圓錐形磁體的邊緣角約為度(見點 「Κ」)時,標準^接近於〇。由圖21可見,當菱形磁體的 〇 縱傾角約為50度或圓錐形磁體的縱傾角為60度左右時,磁場 強度的標準化功率最大,其中標準化功率定義為: ne=¥^§^ [21] 衣不铩平差,weight代表磁性壓板的重量,RMS 代表磁場強度的均方根(圖5中的應值)。圖23進一步表明 了磁場強度與磁性Μ板的磁體間距之間的關係,而圖24表明了 一個非優化㈣磁體與優化的菱形和圓錐形磁體的磁場效應。 在備選實施财’简優化可叫職㈣#的料來實現。 在另-個示範性實施例中,位置感測解析度增強器(psRE) =夠增加位置回饋裝置的解析度,比如在這裏所述的類比區域Sr=dl*Sl [14] S2'=a2*S2 [15] S3'=33* S3 [16] S4,=d4*S4 [17] Correction position along the X and Z axes and sensor group 73 The correction gap between 0 and the magnetic platen 740 can be calculated using the following formula: (Fig. 12C, component 1240) 23 200914800 X = arct3xi - S4f [18] sv Z = arctan_ [19] f dnn a f * In —- ---— A u(四) + (S2,)2 > where t and A are constants determined by the distribution of the magnets. Figures 13 and 14 show exemplary plots of gap measurement and Ζ axial measurement after applying the correction factor. Although the application of the correction factor is discussed by taking the parallel field method as an example, the correction factor can also be applied to the normal field method, and the application method is basically the same as the above method. As described above, the accuracy of the position measurement system can be improved after the magnet is optimized. In the exemplary embodiment shown in the figures, the magnets on the magnetic platen are circular or diamond shaped. However, the magnets can be in any suitable shape including, but not limited to, squares, diamonds, ellipses, rectangles, trapezoids, circles, triangles, and the like. Applying the minimum error caused by the uneven magnetic field to the measurement process, the shape of the magnet on the magnetic platen can be optimized to generate a sinusoidal wave or the like. The optimization of the magnet will be described below in terms of diamond and circular magnets, and the optimization method described herein can be applied to magnets of any suitable shape. An exemplary magnetic platen is shown in Figures 15A-15C. As can be seen from Figure 15, the non-optimized magnetic platen comprises a circular array or a cylindrical magnet. Fig. 15] 3 and 15C show an optimized form of a cylindrical magnet in which each of the magnets has a conical shape (having a flat top). Fig. 15B shows a magnet having a 50 degree side or a balance angle, and Fig. 15C shows a magnet having a 60 degree side or a pitch angle. Figure 16A shows a diamond magnet in a non-optimized structure, and Figure 16B shows an optimized diamond shaped magnet having a 5 degree edge or a pitch 24 200914800 angle. The magnet in an alternate embodiment may have any suitable angle. The magnets in other alternative embodiments may be of any suitable shape, rather than a circular cone. Figure 17 shows a sinusoidal wave generated by a non-optimized cylindrical magnet such as that shown in Figure 15A as the platen passes the sensor. As can be seen from Figure 17, the sine wave is not smooth and the waveforms along all axial directions (X, Z and magnetic field strength axes) fluctuate. For diamond magnets, Figures 19A-19C show the signals generated by the non-optimized magnetic platen 1900 (see also Figure 16A), which further illustrates the parallel field method. As can be seen from 1910 and 1920 in Fig. 19A, the magnetic field strengths of the X-axis and the Z-axis are plotted along the opposite positions of the X-axis and the Z-axis, with uneven peaks and troughs. These non-uniform peaks and troughs are also present in the two-dimensional map 1930, where the magnetic field strength is plotted based on the X-axis and Z-axis positions. When the position along the X-axis or the Z-axis is determined, the graph drawn from the position result is as shown in Fig. 19B, and the position data points obtained from the angle of the sinusoidal wave are distributed on both sides of the best fit line 1950. Similarly, the gap distance map between the drawn magnetic platen and the sensor is not the same pitch measurement as shown in Fig. 19C. Figure 18 illustrates the sinusoidal waves generated by the optimized magnets as shown in Figures 15B, 15C and 16B as the platen passes the sensor. As can be seen from Figure 18, the sine wave is smooth, so the accuracy of the position measurement obtained from the optimized sine wave is higher than that from the non-optimized sine wave. Fig. 20A shows an exemplary optimized magnetic platen 2000 having a structure substantially the same as that described in Fig. 4. As can be seen from Fig. 20A, when the magnetic field strength is plotted along the X-axis, the Z-axis, or the opposite directions of the X-axis and the Z-axis, the resulting sinusoidal waves 2010, 2020, 2030 are smoother, so the measurement error is minimized. As can be seen from Fig. 20B, the position data points obtained from the sinusoidal waves are substantially along the 25 200914800 line 2050. Similarly, the gap distance map between the magnetic platen and the sensor is plotted, not the same pitch measurement as shown in Figure 2GC. Magnetic field optimization can be achieved by the edges of a single magnet such as a modified magnetic platen. The value of the pitch angle can be determined using the standard deviation σ, which represents the magnetic field deformation in the sensing region. For example, see Figure 22. When the edge angle of the diamond magnet is around % (see point J) or the edge angle of the conical magnet is about degrees (see point "Κ"), the standard ^ is close to 〇. As can be seen from Fig. 21, when the rake angle of the rhombic magnet is about 50 degrees or the pitch angle of the conical magnet is about 60 degrees, the normalized power of the magnetic field strength is the largest, wherein the normalized power is defined as: ne=¥^§^ [21 The clothing is not adjusted, the weight represents the weight of the magnetic platen, and the RMS represents the root mean square of the magnetic field strength (the value in Figure 5). Figure 23 further shows the relationship between the magnetic field strength and the magnet spacing of the magnetic raft, while Figure 24 shows the magnetic field effect of a non-optimized (four) magnet with optimized diamond and conical magnets. In the alternative implementation of the financial "simplified optimization can be called (four) # material to achieve. In another exemplary embodiment, the position sensing resolution enhancer (psRE) = is sufficient to increase the resolution of the position feedback device, such as the analogy region described herein.
I二個不祕實施例中PRSE可料位在—個或多個感測器 輸出與-個電動機控制器的輸人之間。在備選實施例中,PRSE :以定位在任意恰當録,以修正感測㈣生成信號。需要注 思的是,當電動機控制器應用在本例中時,控制器可以是任音 能夠接收位置感測器信號的控制器。示範性實施例中的微E 26 200914800 ' ^久或夕次乘、除和兩倍、四倍放大等運算處理位置感測 =號★諸如位置線號的正弦曲線分佈的頻率能夠分別通過因數In the two non-secret embodiments, the PRSE can be leveled between one or more sensor outputs and the input of one motor controller. In an alternative embodiment, the PRSE: generates a signal by locating at any appropriate recording to correct the sensing (4). It is important to note that when the motor controller is used in this example, the controller can be a controller that can receive position sensor signals. In the exemplary embodiment, the micro E 26 200914800 ' ^ long or octave multiplication, division and double, quadruple amplification, etc. processing position sensing = number ★ the frequency of the sinusoidal distribution such as the position line number can pass the factor
〇等增加位置感測解析度。在其他示範性實施例中,PSRE Ζ於信號振幅的優化監測,這種優化監測是—種轉子—定子 ^里裝置備選貫施例巾的信號振幅優化監測可以用在旋轉或 =應祕式巾的任意作,比如(但料限於)文中所 述的那些應用。 在「個不祕實施例中,對感測器信號的正弦值和餘弦值 二方得?導出域,這些信號也是正弦曲線信號,但週期分 口疋原始^號週期的—半,在本例中,感測器解析度加倍。但 果‘號振^疋隨由諸如變化間隙和/或溫度引起的磁感測 =的j化而變化的’數位轉化器類裝置一般會生成更少量的比 振岐化種比特具有&小的振幅,有效降低了位置解析度。變化 、戀所生成的信號必須用與振幅成正比關係值做補償。為了避 =變化振㈣帶來的問題,示範性實施例將信號振幅分段,這 知Γίΐ求正難號和餘弦信制平方以及對振幅的平方數求 和來確疋,振幅變化可以視過彳士啤、τ 士 除,由此,相相振幅平方的商基本消 賴於疒她… 持在數位轉換器範圍’從而提供不依 置解析度翻倍。 _如前所述,連續信號平方使位 磁間識到’如果感測器的振幅用來處理諸如感應 —靜或 式,振幅信號的平方就可以在類比區域進 處理’以此得到所需範圍内的最優化線性和解析度。 27 200914800 圖35表示上面所述的解析度增強。示例中,感測器感應磁 場所得的信號呈正弦曲線分佈,對信號求平方並做補償,從而 得到直流電的希望值,該值是信號解析度的2倍(4倍等)。 由圖35可見,線50100代表初始感測信號,線50101代表是加 倍後的信號,以下將作介紹。從圖中可見,雙倍信號50101的 週期為初始信號50100的一半,圖35所示為示範處理過程的結 構圖,該處理過程是對一個感測器解析度進行雙倍和4倍增加 處理。在備選實施例中,感測器的解析度可以用任意合適的方 法進行雙倍(4倍等)增加處理。圖36中,S1和S2表示初始 感測信號,如圖3 7所示,其中:〇 etc. increase the position sensing resolution. In other exemplary embodiments, the PSRE is optimized for monitoring the amplitude of the signal. This type of optimization monitoring is a rotor-stabilizer alternative. The signal amplitude optimization monitoring can be used for rotation or = secret. Any use of the towel, such as (but limited to) those applications described herein. In the "unclear embodiment", the sine and cosine values of the sensor signal are derived from the derivation domain. These signals are also sinusoidal signals, but the periodic division is — the half of the original ^ period, in this case. In the middle, the resolution of the sensor is doubled. However, the 'digital converter type device that varies with the magnetic sense caused by varying the gap and/or temperature generally produces a smaller ratio. The vibrating seed bit has & small amplitude, which effectively reduces the position resolution. The signal generated by the change and love must be compensated by the value proportional to the amplitude. In order to avoid the problem caused by the change (four), the demonstration The embodiment segments the signal amplitude, which is known as the sum of the square of the hard and cosine signals and the sum of the squares of the amplitudes. The amplitude variation can be regarded as the division of the gentleman beer, the τ 士, and thus, the phase The square of the amplitude is basically dependent on her... Holding in the range of the digital converter's to provide an unconstrained resolution doubling. _ As mentioned above, the continuous signal squared makes the bit magnetic sense to 'if the amplitude of the sensor is used To deal with things like induction Equation, the square of the amplitude signal can be processed in the analog region to get the optimal linearity and resolution within the desired range. 27 200914800 Figure 35 shows the resolution enhancement described above. In the example, the sensor induces a magnetic field. The resulting signal is distributed in a sinusoidal curve, and the signal is squared and compensated to obtain the desired value of the direct current, which is twice the resolution of the signal (4 times, etc.) As can be seen from Fig. 35, the line 50100 represents the initial sensing signal. Line 50101 represents the doubled signal, which will be described below. As can be seen from the figure, the period of the double signal 50101 is half of the initial signal 50100, and FIG. 35 is a structural diagram of the exemplary processing procedure. A sensor resolution is doubled and quadrupled. In an alternative embodiment, the resolution of the sensor can be doubled (4 times, etc.) increased by any suitable method. In Figure 36, S1 And S2 represents the initial sensing signal, as shown in Figure 37, where:
Sl = A sin(x) [22] 而 S2 = Asin(x + (p) [23] 其中,Φ表示兩個信號之間的固定相位變化,A表示振幅。 在一個示範性實施例中,Φ可能是硬體確定相位變化。在備選 實施例中,Φ的值可通過任意適當方法確定。為了簡化解釋, 與正弦曲線信號分佈相關的位置將以「頻率」這一概念在本文 中加以引用。在一個示範性實施例中,要獲得4倍頻的正弦和 餘弦信號,Φ值約等於22.5。。在備選實施例中,Φ值可以是任 意適合的值以得到所需頻率。如圖36所示,SI2,S22表示補償 和修正平方之後的信號SI,S2。SI2,S22的頻率是雙倍增之後 的值。 28 200914800 注意:在示範性實施例中,偏移可以通過基於初始sin ( x ) 和sin (χ+Φ)信號以構造餘弦信號得以修正,它們之間的數 學關係為: sin(x + Φ) = sin π cos Φ + cos X sin Φ [24] 其中,sinO和cosO是由感測間距確定的已知常量係數。 在備選實施例中,sin<I>和cosO可以是任意值。Sl = A sin(x) [22] and S2 = Asin(x + (p) [23] where Φ represents a fixed phase change between the two signals and A represents the amplitude. In an exemplary embodiment, Φ It is possible that the phase change is determined by hardware. In an alternative embodiment, the value of Φ can be determined by any suitable method. To simplify the explanation, the position associated with the sinusoidal signal distribution will be referenced in this article by the concept of "frequency". In an exemplary embodiment, to obtain a 4x sine and cosine signal, the Φ value is approximately equal to 22.5. In an alternative embodiment, the Φ value can be any suitable value to achieve the desired frequency. 36, SI2, S22 represent the signals SI, S2 after compensation and correction of the square. The frequency of SI2, S22 is the value after double multiplication. 28 200914800 Note: In an exemplary embodiment, the offset can be based on the initial sin ( The x) and sin (χ+Φ) signals are corrected by constructing the cosine signal. The mathematical relationship between them is: sin(x + Φ) = sin π cos Φ + cos X sin Φ [24] where sinO and cosO are Known constant coefficients determined by the sensing pitch. In the embodiment, sin < I > cosO and may be any value.
上面的示範方程[24]的物理意義為: A sin(x + Φ) = sin x cos Φ + cos x sin Φ [25] 其中,A表示電壓晃動信號的振幅。同樣的, A cos(x) A sin(x + Φ) - ^ sin(x) cos(O) $ίη(Φ) [26] sin ( x )和cos ( x )在平方後可計算振幅,如下式: A2 sin2(x) + A2 cos2(x) = A2 [27] 這個振幅用於偏移修正和信號調節,比如把信號都除以 A2,使振幅變成最優水準用於進一步處理。 4sm2(x)=sin2(;c) [28] _42Α,.,= “(Χ + Φ) [29] 從而產生與振幅變化無關的信號。第二次偏移校正以及倍 增兩個正弦/餘弦信號後,四倍頻可以根據初始輸入信號S1, 29 200914800 S2(如圖39所示)獲得。需要注意的是,可以對信號進行多次 重複調整,以獲得要求的準確度,圖36所示,兩倍信號S12, S22再次加倍得到四倍信號(S12)2,(S22)2。在理想信號條件下(如 圖40所示),文中所述的倍頻會引起位置準確度的提高。由圖 40可見,線50200和50201都代表反正切(正弦/餘弦的反函數) 方程用於位置計算。預計線50200是一個頻率為f(或螺距為p) 的信號,而線50201是頻率為4f (螺距為P/4)的信號由圖40 可見,示範性實施例實際上降低了螺距,增加了位置感測器的 解析度,文中所述的感測器也符合這一情況。 解析度增強的穩定性將根據圖41-44進行論述。在下面的 例子中將介紹相關輸入信號的隨意生成干擾在示例中,圖41 表示誤差為5%的輸入信號,圖42表示其對應的輸出信號。如 上所述,如果利用對感測信號頻道求雙倍平方,任何附件雜訊 都成4倍增。動力自動化增益控制匹配單個振幅與數位轉換器 範圍和優化數位化固有誤差,可以減低雜訊放大,雜訊高頻帶 可以在信號處理運行之前被過濾掉,穿越對應頻道(如振幅計 算),從而至少在一定程度上衰減同步殘餘雜訊和相關的非同 步殘餘雜訊,求出四倍位置解析度。在備選實施例中,雜訊放 大可通過任意適當方法降低。要注意,在某些情況下,由感測 電子引入的雜訊可以忽略。 根據示範性實施例,位置回饋系統的位置解析度可以利用 正弦曲線方程來估算。舉例說明:回饋系統使用兩個固定霍耳 效應感測器定位1/4螺距(即90°相位移動),感應由裝有永磁 體的轉軸/壓板生成的正弦曲線磁場。在備選實施例中,系統可 30 200914800 以使用任意適當數量或類型的感測器。需要認清的是,兩個感 測器生成轉軸/壓板依賴正弦曲線的信號(如正弦/餘弦信號)。 計算出這兩個信號的值之比的正切。 a = arctan [30] ^cos ) 電動機的週期位置就可以確定。方程[30]中的正弦和餘弦 表示信號,而不是函數。備選實施例中的回饋系統利用適當數 量的感測器確定在某一測量單元内的電動機位置。為計算位置 解析度誤差εα,由方程[30]求偏導數3/3sin和δ/Scos如下:The physical meaning of the above exemplary equation [24] is: A sin(x + Φ) = sin x cos Φ + cos x sin Φ [25] where A represents the amplitude of the voltage sloshing signal. Similarly, A cos(x) A sin(x + Φ) - ^ sin(x) cos(O) $ίη(Φ) [26] sin ( x ) and cos ( x ) can be calculated after squared, as follows Formula: A2 sin2(x) + A2 cos2(x) = A2 [27] This amplitude is used for offset correction and signal conditioning, such as dividing the signal by A2 to make the amplitude optimal for further processing. 4sm2(x)=sin2(;c) [28] _42Α,.,= “(Χ + Φ) [29] thus producing a signal independent of amplitude variation. Second offset correction and multiplication of two sine/cosine signals After that, the quadruple frequency can be obtained according to the initial input signal S1, 29 200914800 S2 (shown in Figure 39). It should be noted that the signal can be repeatedly adjusted multiple times to obtain the required accuracy, as shown in Fig. 36. The double signal S12, S22 is doubled again to obtain quadruple signal (S12) 2, (S22) 2. Under ideal signal conditions (as shown in Fig. 40), the frequency multiplication described herein causes an increase in positional accuracy. As can be seen in Figure 40, both lines 50200 and 50201 represent arctangent (inverse function of sine/cosine) equations for position calculation. The expected line 50200 is a signal of frequency f (or pitch p), while line 50201 is a frequency of 4f. The signal (pitch P/4) is seen in Figure 40. The exemplary embodiment actually reduces the pitch and increases the resolution of the position sensor, which is also true for the sensors described herein. The stability will be discussed in accordance with Figure 41-44. In the following example Randomly Generated Interference of Correlated Input Signals In the example, Figure 41 shows an input signal with an error of 5%, and Figure 42 shows its corresponding output signal. As described above, if double-squared is used for the channel of the sensing signal, any accessory miscellaneous The signal is multiplied by 4. The power automation gain control matches the single amplitude and digital converter range and optimizes the digital inherent error, which can reduce the noise amplification. The noise high frequency band can be filtered out before the signal processing operation, crossing the corresponding channel (such as Amplitude calculation) to attenuate the synchronization residual noise and associated non-synchronous residual noise, at least to some extent, to find a quadruple position resolution. In an alternative embodiment, the noise amplification can be reduced by any suitable method. Note that in some cases, the noise introduced by the sensing electrons can be ignored. According to an exemplary embodiment, the position resolution of the position feedback system can be estimated using a sinusoidal equation. For example: the feedback system uses two fixed Huo The ear effect sensor locates the 1/4 pitch (ie, 90° phase shift) and senses the shaft with the permanent magnet/ The sinusoidal magnetic field generated by the plate. In an alternative embodiment, the system can use any suitable number or type of sensors, 30 200914800. It is recognized that the two sensors generate a sinusoidal signal for the shaft/platen (eg sine/cosine signal) Calculate the tangent of the ratio of the values of the two signals. a = arctan [30] ^cos ) The periodic position of the motor can be determined. The sine and cosine in equation [30] represent the signal, Instead of a function, the feedback system in an alternative embodiment uses a suitable number of sensors to determine the position of the motor within a certain measurement unit. To calculate the position resolution error εα, the partial derivative 3/3sin is obtained by equation [30]. δ/Scos is as follows:
d δ sin r sin * 5 arctan 、cosJ + ^C0S% 5 cos arctan 、cosJd δ sin r sin * 5 arctan , cosJ + ^C0S% 5 cos arctan , cosJ
[31] 其中,ssin和sC0S分別表示正弦信號和餘弦信號誤差。利用 如下簡化:[31] where ssin and sC0S represent sinusoidal and cosine signal errors, respectively. Use the following simplification:
d_ dx [arctan(i/(x))] = 丄, l + U2 dx [32] d sin d sin cosD_ dx [arctan(i/(x))] = 丄, l + U2 dx [32] d sin d sin cos
cos [33] sin cos2 d sin cos [cos 可以發現εα等於 31 [34] [35] 200914800Cos [33] sin cos2 d sin cos [cos can be found that εα is equal to 31 [34] [35] 200914800
如杲用正弦和餘弦函數[35]替代正弦和餘弦信號,則方程 可寫成:If you use sine and cosine functions [35] instead of sine and cosine signals, the equation can be written as:
*[ A cos a ) 〇 氺 f Asina 彳 V.A^sina2 +A2cosa2 J ^COS lA^sina^ +A2cosa2 J*[ A cos a ) 〇 氺 f Asina 彳 V.A^sina2 +A2cosa2 J ^COS lA^sina^ +A2cosa2 J
A A2(sina^ +cosa2) *[ε sin *cosa-scos *sina]A A2(sina^ +cosa2) *[ε sin *cosa-scos *sina]
*cosa-ffc〇s*sina] [36] 其中,A表示信號的振幅。假設數位轉換器類比量的範圍 相當於2A(伏特)(即利用數位轉換器類比量的全範圍),信 號不確定誤差的主要來較數位轉換轉析度N (比特)= (2xA) /2N (伏特),則線性位置解析度^可如下表示:*cosa-ffc〇s*sina] [36] where A represents the amplitude of the signal. Assuming that the analog converter's analog quantity range is equivalent to 2A (volts) (that is, using the full range of the digital converter analogy), the signal uncertainty error is mainly compared to the digital conversion resolution N (bit) = (2xA) /2N (volts), the linear position resolution ^ can be expressed as follows:
2η 2π A ^2n ±fc〇sa ^ [(± cos a) - (+ sin a)] [37]2η 2π A ^2n ±fc〇sa ^ [(± cos a) - (+ sin a)] [37]
T 私小止琢,餘弦#號週期(如螺距)。由方 、 丁在感測益與數位轉換器類比量通過解析 度倍增器相連接處,如圖47的結構圖所示(注意:圖47表示 32 200914800 不祀。增$ ’備選實施例中的倍增器可以具有適當的結構和構 件^用來實現這裏所說的信號倍增),倍增器產.生的輸出信號 雜訊水準不應該超過數位轉換器類比量的解析度。基於連^信 號倍增值的數目得出的雜訊可以表達成: 只 S = sin2*n =^>T private small stop, cosine # number cycle (such as pitch). The analogy and the digital converter analog quantity are connected by the resolution multiplier, as shown in the structure diagram of Fig. 47 (Note: Fig. 47 shows 32 200914800 does not mean. Increase $' in the alternative embodiment The multiplier can have appropriate structure and components to achieve the signal multiplication described herein. The output signal noise level of the multiplier should not exceed the resolution of the digital converter analog. The noise based on the number of times the signal is multiplied can be expressed as: Only S = sin2*n =^>
Ss^SsiD *^η*ήη2^ [38] …其中,11表不倍增值的數量。如上所述,正弦曲線函數的 平方生成具有雙倍頻率的正弦曲線函數(例如半週期),由此 線性位置解析度εχ可以寫成: Ρ £χ =^^T(^*[(±c〇sa)-(±sina)] [39] 其中,p表示初始信號的週期每一個附加信號倍增值是回 饋裝置的線性解析度的兩倍。需要認清的是,以上函數表明線 性位置解析度僅僅是一種典型例子,位置解析度可以用任意適 合的函數求得》 不範性實施例的位置解析度增強信號振幅變化,間隙資 矾。例如,當間隙變化、雜訊和不完整磁場(或其他因素)引 起輸入信號變化時,上面所講的解析度增強能夠使信號在其振 幅内正常化,並生成非失真的正弦/餘弦輸出信號。例如,圖43 表不應用與輸入振幅的具有2〇%雜訊的輸入信號圖44表示圖 43中的一個信號輸出經過解析度增強器處理後的圖。間隙尺寸 或其他資訊可以確定計算的信號振幅(如圖44所示),由此解 33 200914800 析度增強器可增加間隙尺寸的解析度。例如,一旦間隙範圍確 定了’數位轉換器的完全類比量則只能用來分析所確定的間隙 範圍。作為非極限示例,如果間隙不小於5ιηπι,並且不大於 8mm則數位轉換器類比量範圍可以用來分析5mm到8mm區 域。 如上所述,正弦曲線信號的振幅決定於間隙值,間隙可定 義為·Ss^SsiD *^η*ήη2^ [38] ... where 11 is not a multiplier. As described above, the square of the sinusoidal function generates a sinusoidal function with double frequency (for example, a half period), whereby the linear position resolution εχ can be written as: Ρ £χ =^^T(^*[(±c〇sa) )-(±sina)] [39] where p represents the period of the initial signal. Each additional signal multiplier is twice the linear resolution of the feedback device. It is important to recognize that the above function indicates that the linear position resolution is only As a typical example, the position resolution can be obtained by any suitable function. The position resolution of the non-standard embodiment enhances the amplitude variation of the signal, such as gap variation, noise, and incomplete magnetic field (or other factors). When the input signal changes, the resolution enhancement described above normalizes the signal within its amplitude and produces a non-distorted sine/cosine output signal. For example, Figure 43 shows the application and input amplitude with 2〇% The input signal of the noise Figure 44 shows the signal output of Figure 43 after being processed by the resolution enhancer. The gap size or other information can determine the calculated signal amplitude (Figure 44). The resolution enhancer can increase the resolution of the gap size. For example, once the gap range determines the full analogy of the 'digital converter, it can only be used to analyze the determined gap range. As a non-limit For example, if the gap is not less than 5 ηηπι and not more than 8 mm, the digital converter analog quantity range can be used to analyze the 5 mm to 8 mm area. As described above, the amplitude of the sinusoidal signal is determined by the gap value, and the gap can be defined as
Gap = t*ln[| \ =t * In B ) ) LVsin2 + cos2 ^ [40] 其中,B和t是硬體依賴常量,sin和⑽表示正弦曲線信 號(非函數),A表示信號的振幅。備選實施例中的^和^可 以是任意適合的常數值。對方程[40]進行偏微分,間隙 解析度sG為: ' 'Gap = t*ln[| \ =t * In B ) ) LVsin2 + cos2 ^ [40] where B and t are hardware-dependent constants, sin and (10) represent sinusoidal signals (non-function), and A represents the amplitude of the signal . ^ and ^ in alternative embodiments may be any suitable constant value. Partial differentiation of equation [40], the gap resolution sG is: ' '
其中 gsi, d 5 sin a 5 cos ( t*lnWhere gsi, d 5 sin a 5 cos ( t*ln
B in VVsin +cos B /sin^ + cos2 [41] 下簡化公式 ’ ε5ίη和sc()S分別表示正弦和餘弦信號的誤差 使用如 d dU(x) 34 [42] [43]200914800 —h{x)n]= n*Un~l *fHi) 办 dx d ,*In "B V 1 5 sin tVsin2+c〇s2 y Vsin2 + cos2 *- 1 L 5 sin _Vsin2+ cos2 ^Vsin +cos 5 sin2 9 sin in + cos [44] -r * sin sin2 + cos2 [45] 間隙尺寸的解析度可用下式表示: _ -/*sin r ^=iTn2+cos2Kn%Sin+^s*cos] 假設數位轉換器類比量的範圍相當於2A(伏特)(例如利用 數位轉換器類比量的全範圍),信號不確定性/誤差的主要來源是 數位轉換器類比量,N(比特)=(2xA)/2N (伏特),函數[45]可^ t sin + cos' 土 2* A ~¥~ cos [46] 如果正弦和餘弦信號用正弦和餘弦函數替代,則有 -t A2 sin2 α + A2 cos2 α [(+ sin a)+(+ cos a)] ’ 土 ^/*Asina) + (±^i*AC〇sa [47] 或 35 200914800 = [(+sin a)+(+ cos α)ί [48] 與於上述的位置解析度類似’方程[48]表明,總間隙的解 析度是45、135、225和315度最大值的一個週期函數。當感測 通過解析度增強專與數位轉換器類比量相連接時,間隙資 訊可以由在類比區域衍生/預處理所得的正弦和餘弦信號的振 幅獲得’如增強的位置解析度。信號放大能夠被轉換為間隙資 訊’被壓縮到感興趣的區域内並被發送到數位轉換器類比中。 在這種情況下,間隙解析度可以近似表示為: 其中AG表示感興趣的區域面積 注意,上面的例子是結合信號的雙倍增(如初始信號的雙 倍或經過倍增的信號)介紹的,示範性實施例也可以用於對初 始#號或因其他倍增因數(如1,2,3,4等)得到的倍增信號 進行倍增程式。 如上所述,示範位置測量系統可以在任意具有機械運輸系 統的適當設備中使用,如將產品從一個位置傳輸到另一個位 置。為舉例說明問題,示範位置測量系統的運行將結合半導體 處理設備做以介紹,但需要注意的是,示範位置測量系統能夠 應用於任意上述的適當設備中。 參考圖48,一個示範半導體基板處理儀器351()應用在所 不的的不範性實施例中。處理設備3510與環境前端模組 (EFEM) 3514相連接,模組3514包含有一定數量的負載埠 36 200914800 3512。負載谭3512能夠支援一定量的基板存儲罐,比如傳統的 FOUP罐,也可使用其他合適類型。EFEM3514通過負載閉鎖 3516與處理設備聯繫,3516與處理設備相聯繫。EFEM3514(對 環境開放)具有一個基板傳輸設備(為表示出),能夠將基板 從負載琿3512傳輸到負載鎖口 3516,EFEM3514也具有基板 校正功能、組處理功能、基板和載體確認功能及其它功能。對 於備選實施例而言’在負載鎖扣具有批次處理功能或直接將晶 片從FOUP傳送到鎖扣的功能的情況下,負載鎖口 3516與負載 埠3512直接接觸。一些類似設備公開在2002年7月22曰申請 的美國專利號 6,071,821,6,071,059,6,375,925 ’ 6,461,094 ’ 5,588,789,5,613,821,5,607,276,5,644,925,5,954,472,6,120,229 以及美國專利申請號10/200,218中,所有這些都作為參考引用 在本文中。備選實施例可以用其他負載鎖口。 還是參考圖48,上文提到處理設備3510用於處理半導體基 板(如200/300mm晶片或其他合適尺寸晶片),平板顯示器基板 或其他類型的基板,構成傳輸室3518,處理模組3520和至少一 個基板傳輸設備3522,基板傳輸設備3522與室3518聯成一體, 在這個示範性實施例中,處理模組安裝在室3518的兩侧,在其他 示範性實施例中,模組3520可以安置在室3518的一側,如圖50 所示。圖48顯示,處理模組3520彼此相對,安置在行列Y卜Y2 或垂直面在其他備選實施例中,處理模組可以彼此交錯排列在傳 輸室的相對兩側,或者沿垂直方向彼此堆疊。傳輸設備3522包含 運輸車3522C,3522C在室3518中移動,可以在負載鎖口與處理 室3520之間傳送基板。所示儀器只安裝有車3522C,而在備選實 37 200914800 «I, w = 35i8 ^ 且有二:㈣:&讀,或者具有清練境,m其内部組合〕 耕歹應用基板傳輸設備3522將處理模組按笛卡爾 使處理;^ π ’驗基相直於基板或行列平行制。這一結果 ==:具傷了比傳統處理設備(即具有相同數量處理模 的更緊凑的足跡,見圖54。另外,傳輸室節 長度,並附加任意數量的處理模組,從而 增加儀态的處理容量,下面聛 接# 曰下面將進—步加以闡釋。傳輸室也能夠支 ΐ=Γ ’並允許傳輸設備在不彼此干擾的情況 處理六旦㈤的處理至。4效地減少了傳輸設備中處理設備的 縱。設備的處理容量變成有限處理,而非悠閒操 通訊處理容量可以通過上述增加處理肋和同-平臺的 开;,AS,該示範性實施例中的傳輸室3518是普通的矩 長,^施例中的傳輸室可以其其他形狀。傳輸室迎呈細 度遠大於寬度),並定義了其中傳輸設備的線形傳輸 t。傳輸室⑽具有徑向的側壁3518S,側壁3518S具有傳輸 口或埠 35180,傳輪·線 3 51RD έΛ p _u l 過造尺寸大小要足以保證基板能夠通 錢過闊門),進出傳輸室。由圖48可見,示範性實施 m里模組彻安裝在側壁3518S的外側,⑽室中 傳輸淳35180排列成直線,個處理模組352。 傳輸埠35㈣的週邊’倚靠傳輸室3518的侧壁3簡密 一個問p/呆持傳輸i 3518的真空轉臺。每個處理模組3520具有 « ’通過-^的方式控制,在需要時關閉傳輸琿Μ·。 38 200914800 傳輸埠35180都位於同一個水平面上。相應的,傳輸室3518中 的處理模組3520也排列在同一個水平面上。備選實施例中的傳輸 崞35180佈置在不同的水平面上。由圖48所示,在這個示範性 實施例中,負載鎖口 3516安裝在兩個位於最前端的傳輸埠35180 的傳輸室側壁3518S上,這就保證負載鎖口 3516與位於處理設備 刖方的EFEM3514相鄰。在備選實施例中,負載鎖口 3516可以安 裝在傳輸室3518的其他35180傳輸口上,見圖5〇。傳輸室3518 的六面體形狀使傳輸室3518的長度可以是所練意長度,從而安 裝所需排數的處理器模組。(例如,圖49,51_53所示為其他示 犯性實施例’傳輸室的長度能夠滿足安裝足夠數量的處理器模 如前面提到的’圖48所示的示範性實施例中的傳輸室.B in VVsin +cos B /sin^ + cos2 [41] The simplified formula 'ε5ίη and sc()S represent the error of the sine and cosine signals, respectively, as d dU(x) 34 [42] [43]200914800 —h{ x)n]= n*Un~l *fHi) do dx d , *In "BV 1 5 sin tVsin2+c〇s2 y Vsin2 + cos2 *- 1 L 5 sin _Vsin2+ cos2 ^Vsin +cos 5 sin2 9 sin In + cos [44] -r * sin sin2 + cos2 [45] The resolution of the gap size can be expressed by the following formula: _ -/*sin r ^=iTn2+cos2Kn%Sin+^s*cos] Assuming the digital converter analogy The range is equivalent to 2A (volts) (for example, using the full range of digital converter analogy), the main source of signal uncertainty / error is the digital converter analog quantity, N (bit) = (2xA) / 2N (volts) , function [45] can ^ t sin + cos' soil 2* A ~¥~ cos [46] If the sine and cosine signals are replaced by sine and cosine functions, then -t A2 sin2 α + A2 cos2 α [(+ sin a)+(+ cos a)] '土^/*Asina) + (±^i*AC〇sa [47] or 35 200914800 = [(+sin a)+(+ cos α)ί [48] The above-mentioned position resolution is similar to 'equation [48], indicating that the resolution of the total gap is 45, 135, 225, and 315 degrees. A periodic function of the value. When the sensing is connected to the digital converter by the resolution enhancement, the gap information can be obtained from the amplitude of the sine and cosine signals derived/preprocessed in the analog region. The signal amplification can be converted to gap information 'compressed into the region of interest and sent to the digital converter analogy. In this case, the gap resolution can be approximated as: where AG represents the region of interest Area Note that the above example is introduced in conjunction with double the signal (such as double or multiplied signal of the initial signal), and the exemplary embodiment can also be used for the initial # number or for other multiplication factors (eg 1, 2) , 3, 4, etc.) The multiplied signal obtained is multiplied. As described above, the exemplary position measuring system can be used in any suitable device with a mechanical transport system, such as transferring products from one location to another. Problem, the operation of the demonstration position measurement system will be combined with the semiconductor processing equipment to introduce, but need to pay attention to , The exemplary position measurement systems described above can be applied to any suitable apparatus. Referring to Fig. 48, an exemplary semiconductor substrate processing apparatus 351() is applied to the non-standard embodiment. The processing device 3510 is coupled to an Environmental Front End Module (EFEM) 3514, which includes a number of loads 2009 36 200914800 3512. The Load Tan 3512 can support a certain amount of substrate storage tanks, such as conventional FOUP tanks, and other suitable types. The EFEM 3514 communicates with the processing device via load lock 3516, which is associated with the processing device. The EFEM3514 (open to the environment) has a substrate transfer device (shown) that transfers the substrate from the load 珲3512 to the load lock 3516. The EFEM3514 also features substrate correction, group processing, substrate and carrier validation, and more. . For alternative embodiments, the load lock 3516 is in direct contact with the load port 3512 in the event that the load lock has a batch processing function or direct transfer of the wafer from the FOUP to the lock. Some of the similar devices are disclosed in U.S. Patent Nos. 6,071,821, 6,071,059, 6, 375, 925, 6, 461, 094, 5, 588, 789, 5, 613, 821, 5, 607, 276, 5, 644, 925, 5, 954, 472, 6, 120, 229, and U.S. Patent Application Serial No. 10/200,218, filed on Jul. 22, 2002. , all of which are incorporated herein by reference. Alternative embodiments may use other load locks. Still referring to FIG. 48, the processing device 3510 is referred to above for processing a semiconductor substrate (eg, a 200/300 mm wafer or other suitable size wafer), a flat panel display substrate or other type of substrate, constituting a transfer chamber 3518, a processing module 3520, and at least A substrate transfer device 3522, the substrate transfer device 3522 is integrated with the chamber 3518. In this exemplary embodiment, the process modules are mounted on both sides of the chamber 3518. In other exemplary embodiments, the module 3520 can be disposed in One side of chamber 3518 is shown in FIG. Figure 48 shows that the processing modules 3520 are opposite each other, placed in the row Yb or vertical. In other alternative embodiments, the processing modules may be staggered on opposite sides of the transfer chamber or stacked one on another in the vertical direction. The transport device 3522 includes a transport vehicle 3522C that is moved in the chamber 3518 to transfer the substrate between the load lock and the processing chamber 3520. The instrument shown is only equipped with the car 3522C, and in the alternative real 37 200914800 «I, w = 35i8 ^ and there are two: (four): & read, or have a clearing environment, m its internal combination] cultivating application substrate transfer equipment 3522 treats the processing module in a Cartesian process; ^ π 'the base is parallel to the substrate or the row and column parallel. This result ==: the injury is more compact than the traditional processing equipment (ie has the same number of processing modes, see Figure 54. In addition, the transmission chamber section length, and any number of processing modules attached, thus increasing the instrument The processing capacity of the state is as follows: 曰 曰 曰 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 传输 传输 传输 传输 传输 传输 传输 传输 传输 传输 传输 传输 传输 传输 传输 传输 传输 传输 传输The processing device's processing capacity becomes a limited processing, and the non-leiched operation communication processing capacity can be increased by the above-described processing ribs and the same-platform opening; AS, the transmission chamber 3518 in the exemplary embodiment is Ordinary moment lengths, the transmission chamber in the embodiment can have other shapes. The transmission chamber is much finer than the width, and defines the linear transmission t of the transmission device. The transfer chamber (10) has a radial side wall 3518S, the side wall 3518S has a transfer port or 埠 35180, and the transfer line 3 51RD έΛ p _u l is sized to ensure that the substrate can pass through the wide door) and enters and exits the transfer chamber. As can be seen from Fig. 48, the exemplary embodiment of the module is mounted on the outside of the side wall 3518S, and the transfer cassette 35180 is arranged in a straight line in the chamber (10). The periphery of the transfer cassette 35(4) is placed against the side wall 3 of the transfer chamber 3518. A vacuum turntable for the transfer of the i 3518 is asked. Each processing module 3520 has a «' control by means of -^, turning off the transmission 珲Μ· when needed. 38 200914800 Transmission 埠 35180 are all on the same level. Correspondingly, the processing modules 3520 in the transfer chamber 3518 are also arranged on the same horizontal plane. The transport ports 35180 in alternative embodiments are arranged on different levels. As shown in Fig. 48, in this exemplary embodiment, the load lock 3516 is mounted on the transfer chamber side walls 3518S of the two forwardmost transfer ports 35180, which ensures that the load lock 3516 is located opposite the processing device. EFEM3514 is adjacent. In an alternate embodiment, the load lock 3516 can be mounted on the other 35180 transfer ports of the transfer chamber 3518, see Figure 5A. The hexahedral shape of the transfer chamber 3518 allows the length of the transfer chamber 3518 to be a desired length to mount the desired number of processor modules. (For example, Figures 49, 51-53 show other exemplary embodiments. The length of the transmission chamber is sufficient to accommodate the installation of a sufficient number of processors, as previously mentioned, in the transmission chamber of the exemplary embodiment shown in Figure 48.
具有-個包含-個傳輸車3522C的基板傳輸設備迎,3522。傳 輸裝置3522整合在傳輸室巾,軸傳輸車3522(:在傳輸室内的前 方位置3518F和後方位置3测之間來回移動。傳輸設備迎 的傳輸車3522C具❹個末職行器,能夠帶動—個或多個基板 移動。傳輸車3522C還鉸接臂或可移動傳輸機械迎a,用來擴 2縮小末端執行器實現在處理模組測或負解3516中採集 板要Λ了^處Γ組/負載料採集㈣放基板,傳輸設 在模組/捧内部定位末端執㈣,用來進行基 傳輸設備3522,如圖48 置,它有一個傳輸車3522C, 所示,疋一種具有代表性的傳輸裝 通過線性支撐/驅動桿控制。該傳輸 39 200914800 裝置與美國專利出版物No.2004/151562所述的磁懸浮傳輸設備基 本相同,但也可用其他傳輸裝置。線性支撐/驅動桿安裝在側壁 318S、傳輸室底面或頂面上,並可以延伸傳輸室的長度。這就保 證傳輸車3522C和設備能夠橫穿過傳輸室的長度範圍。傳輸車 3522C具有支撐鉸接臂的框架’該框架也支撐隨框架或相對於框 架移動的角輪底盤或壓板3522B,其他適當的電動機,如連續的 同步線形電動機,驅動壓板3522B,並由此驅動傳輸車3522C。 在該示範性實施例中,鉸接臂通過適當的聯接裝置/傳動裝置與壓 板3522B相聯接,因此當壓板3522B受驅動機產生相應移動時, 鉸接臂即發生延伸或收縮。比如,安裝傳動裝置後,當壓板3522B 沿桿彼此移動分離時,鉸接臂向左延伸,當移動回來時,鉸接臂 從左收縮。壓板3522B也可以用線形電動機操控,使鉸接臂3522A 向/從右側延伸/收縮。 線形電動機作為驅動時,通過滑動桿對壓板3522B的移動控 制、對壓板3522B和傳輸車3522C的位置感應,以及鉸接臂的延 伸/收縮位置,利用上文所述的位置測量系統都可以實現。以磁性 壓板MP為例,比如示範壓板400固定在傳輸壓板3522B上或者 是每個傳輸壓板3522B的部件上,由此,壓板MP產生的磁場指 向傳輸室3518中的側壁3518S (圖55,結構圖4200)。感測器 組群Q(每個感測器組都包含一個感測器組(如圖4, 5, 7所示), 感測器對(如圖2A和3A所示),單個感測器(圖3A所示), 或者它們之間的任意組合)以上述的某種方式沿側壁3518S放 置,傳輪室3518沿傳輸車3522C的運行路徑和傳輸壓板3522A, 3522B佈置。注意:為表達清楚,只有少量感測器組Q在圖中可 40 200914800 同的位置感測系統可單獨或部分組合都可 3522C的位置。 見。還需注意的是,不 以用來準確確定傳輸車There is a substrate transmission device containing a transmission car 3522C, 3522. The transmission device 3522 is integrated in the transmission chamber towel, and the axle transmission vehicle 3522 (: moves back and forth between the front position 3518F and the rear position 3 in the transmission room. The transmission device welcomes the transport vehicle 3522C with a last job, which can drive - One or more substrates move. The transport vehicle 3522C also has an articulated arm or a movable transport mechanism to a, which is used to expand and shrink the end effector to achieve the processing module or the negative solution 3516. The load material is collected (4), the substrate is placed, and the transmission is set in the module/holding internal positioning end (4), which is used to carry out the base transmission device 3522, as shown in Fig. 48, which has a transmission vehicle 3522C, as shown, a representative transmission. The mounting is controlled by a linear support/drive rod. The transmission 39 200914800 device is substantially identical to the magnetic levitation transmission device described in U.S. Patent Publication No. 2004/151562, but other transmission devices can be used. The linear support/drive rod is mounted on the side wall 318S, The bottom or top surface of the transfer chamber can extend the length of the transfer chamber. This ensures that the transport vehicle 3522C and the device can traverse the length of the transfer chamber. The transport vehicle 3522C has support The frame of the arm 'the frame also supports the corner wheel chassis or platen 3522B that moves with the frame or relative to the frame. Other suitable motors, such as a continuous synchronous linear motor, drive the platen 3522B and thereby drive the transport vehicle 3522C. In the exemplary embodiment, the articulated arm is coupled to the pressure plate 3522B by a suitable coupling/transmission, such that when the pressure plate 3522B is moved by the drive, the articulated arm extends or contracts. For example, after installing the transmission, when When the pressure plate 3522B is moved apart from each other along the rod, the hinge arm extends to the left, and when moved back, the hinge arm is contracted from the left. The pressure plate 3522B can also be operated by a linear motor to extend/contract the hinge arm 3522A toward/from the right side. When driving, the movement control of the pressure plate 3522B by the slide bar, the position sensing of the pressure plate 3522B and the transport vehicle 3522C, and the extended/contracted position of the articulated arm can be realized by the position measuring system described above. With the magnetic pressure plate MP For example, for example, the exemplary pressure plate 400 is fixed on the transmission platen 3522B or each transmission platen 3522 The components of B, whereby the magnetic field generated by the platen MP is directed to the side wall 3518S in the transfer chamber 3518 (Fig. 55, block diagram 4200). Sensor group Q (each sensor group contains a sensor group) (as shown in Figures 4, 5, and 7), the sensor pair (as shown in Figures 2A and 3A), a single sensor (shown in Figure 3A), or any combination between them) with one of the above The mode is placed along the side wall 3518S, and the transfer chamber 3518 is arranged along the running path of the transport vehicle 3522C and the transport platens 3522A, 3522B. Note: For clarity of expression, only a small number of sensor groups Q can be used in the same position. The position of the 3522C can be combined individually or in part. see. It should also be noted that it is not used to accurately determine the transmission vehicle.
器359G用於掃描感測器Q組群,點358G處的第一掃描 感測器感,’由此傳輪車3522C的位置被定位回點摘,生成 王位置測里(圖55 ’結構圖421〇)。如上所述,每個感測器組q 的位置與傳輸至35丨8中的參考點有預定間距,當磁性壓板經 過感測器4 ’則可以大致確定磁性壓板的位置。磁性壓板Mp和 傳,車=22C的更精確位置可以通過對上述的感測輸出進行數學 運异確定(圖55,結構圖4220)。在本例中,由於每個壓板3522B 包括個磁性壓板MP,每個壓板3 5 22B的位置可以分別確定, 由此所有壓板3522B可以在同一方向同時啟動,從而使整個傳輸 車/設備在傳輸室3518内沿徑向移動;或者分別驅動壓板,由傳 輸車3522C攜帶的鉸接臂3522A就會被伸長或收縮。需要注意的 是,對應於傳輸室壁的傳輸車3522C的位置(如室壁與車之間的 間隙)可以測量並做相應調整,則車3522C在兩個室壁3518S之 間的位置就確定了,該預定位置可以處理模組3520的基板的準確 佈局。 圖49表示另一個基板處理設備3510’,它與3510大致相同。 在該示範性實施例中,傳輸室3518’具有兩個傳輸裝置3622A和 3622B。傳輸裝置3622A ’ 3622B與上面所講的3522基本相同, 參見圖48。傳輸裝置3622A,3622B都由一組普通的徑向滑動桿 支撐。對應於每個傳輸設備的傳輸車的壓板用同一個線性電動機 驅動。線性電動機的不同驅動區域允許每個傳輸車3622A、3622B 上單個壓板的獨立驅動,因此單個傳輸車3622A、3622B也可以 41 200914800 獨立驅動。需要瞭解的是,用某一(類似於上述的)方式操縱線 性電動機,每個裝置的鉸接臂就可以獨立地延伸/收縮。但是,在 這種情況下,基板傳輸裝置3 622A、3 622B不能在傳輸室中經過 彼此,除非應用獨立滑行系統。如上所述,傳輸成的每個壓板都 包括磁性壓板MP,MP與固定在室壁35 18,上的感測器組Q相聯 繫。在該示範性實施例中,處理模組沿傳輸室3518'長度佈置,所 以基板被傳送到處理模組3518'中進行處理,這可以避免傳輸裝置 3622A、3622B彼此干擾。例如,用於塗層的處理模組在加熱模組 之前已經定位,冷卻模組和蝕刻模組最後定位。 但是,傳輸室3518,含有另外兩個傳輸區域3518A'和3518B,, 它們允許兩個傳輸裝置穿越過彼此(類似於邊桿,分路桿或不需 要支撐桿的磁懸浮區域)^在這種情況下,其他傳輸區域可以定 位在處理模組所在的平板的上方或下方。每個傳輸區域351和 3518B'具有自己的感測器組q,因此,當傳輸車分別在各自的傳 輸區域3518A’和3518B,中時,可以獨立跟蹤傳輸車3622A, 3622B。示範性實施例中的傳輸裝置具有兩個滑動桿,每個傳輸裝 置一個。一個滑動桿定位在傳輸室的底面或侧壁上,另一個滑動 桿定位在傳輸室頂部。在備選實施例中,應用線性驅動系統同時 驅動並懸浮傳輸車,傳輸車將獨立地發生水準移動或垂直運動, 由此彼此獨立地傳遞或傳送基板。需要注意的是,感測器組卩與 磁性壓板MP相結合可用於跟蹤3622A,3622b每個傳輸車的豎 直位置’它們從彼此的上方/下方經過以避免相撞,這種相撞可能 破環運輸車或運輸車所攜帶的基板^在所有應用電動繞組的儀器 中’在傳輸室需要加熱除氣(如去除水蒸氣)時,繞組也可用作 42 200914800 二下,每個傳輸裝置由專用線性驅動電動機驅動或 在傳輸車所在的專用驅動區域被驅動。 盥位=2县和/3所示為其他示範性實施例中,其他基板處理裝置 i置附加^統的整合圖。由圖52和53可見,傳輸室被拉長以 與傳輸:相連::組圖圖52所示的裝置具有12個處理模組,它們 個與傳輸室相連的處Γ模中组的每戶^置(所示為兩個裝置)具有4 為示例,%備所~人#… 範性貫施例的模組數量僅作 盥俞面所十人l處模組數量可以是任意的,如前所述。 面所“的相似,處理模組沿傳輸室的兩側呈笛卡爾排列。 圓=模Γ列的數量都有大幅增加(如圖52中所示的6排, 以知掉排)°圖52所示的示範性實施例中,£丽可 场掉,負載埠可與負載鎖扣直接連接。圖52和圖53中的 =有多個傳輸裝置(即圖52中的3個,圖53中的6個),能 鎖扣和處理室中的基板。所顯示的傳輸裝置的數量僅 僅作為-個例子,實際裝置的數量可或多或少。傳輸裝置盘上面 所逑的大體相同,包括-個鉸接臂和—個傳輸車,其中料位置 和鉸接臂的延伸/收翻多維位置測量系統跟縱。 下,傳輸車由傳輸室側壁上的線性電動機驅動切,線性^動 驅動傳輸車在兩個正交坐標軸(即傳輸室内為徑向和垂 生平移。相應的,傳輸裝置能夠在傳輸室内經過彼此。傳輸室且 有位於處理模⑽在平板的上方和/或下方的「經^ ㈣ 域’傳輸裝置需要設定路線㈣免傳輸裝置相 隹 理模組中的基板)或傳輸裝置沿相反方向運行。基板傳I裝置 一個控制器’可以控制多個基板傳輸裝置的移動。 43 200914800 仍然參見圖53,基板處理裝置3918A和3918B直接與控制器 3900相連接。 從圖49,50,52— 53可以看到,傳輸室3518可以按要求延 伸,橫穿出處理設備PF。由圖53和以下進一步的論述可知,傳 輸室與各種部件或隔間,3918A,1918B處理設備PF,如儲存、 “ 光刻工具、金屬沉積工具或其他適合的工具隔間連接並通訊。未 與傳輸室3518相連接的隔間也可以設置成程式隔間或3918A, f、 3918B程式。每個隔間具有所需工具(如光刻、金屬沉積、熱浸 \ · 潰、清潔)以完成給定的半導體工件製造程式。在每種情況下, 傳輸室3518中的處理模組與設備隔間中的各種工具通訊連接,保 證半導體工件在傳輸室和處理模組之間傳送。因此,傳輸室沿其 長度具有不同的環境條件,如大氣、真空、高真空、注入氣體或 其他條件,該環境與連接到傳輸室的不同處理模組有關。相應的, 一個給定程式的傳輸室部件3518P1,或間隔3518A,3518B,或 者間隔的一部分,可能具有一個環境條件(如大氣),而另一個 部件3518P2,3518P3可能具有一個不同的環境條件。如前面所提 ί> 到的,具有不同環境條件的部件3518Ρ1,3518Ρ2,3518Ρ3位於設 備不同的間隔艙内,或者都在同一個間隔艙。圖53表示具有3個 * 部件3518Ρ1,3518Ρ2,3518Ρ3的傳輸室,其中三個部件環境條件 • 的不同,僅以此舉例說明。示範性實施例中的室3518根據環境的 不同具有不同的部件。部件3918Α,3918Β,3518Ρ1,3518Ρ2,3518Ρ3 . 中的每一個都有感測器組Q,感測器組沿傳輸部件側壁定位。對 於不需要傳輸車3266Α的高精度位置的傳輸部件,如3518Ρ2,可 使用如圖3Α所示的感測器構造,從而使傳輸車3266Α的成本有 44 200914800 效降低,並能夠被準確跟蹤。在備選實施例中,示範位置測量裝 置的任意組合系統可以應用到3918A,3918B,3518P1,3518P2, 3518P3傳輸部件中的任意一個中。 由圖53可見,類似於傳輸艙3518中的3622A (見圖49)的 傳輸設備能夠實現在3518P1,3518P2,3518P3部件之間不同環境 中轉換。因此,從圖53可知,傳輸裝置3622A利用一個採集基 板把一個半導體工件從處理設備的某個程式或間隔3518A中的工 具,移動到另一個具有不同環境的不同程式或間隔3518A中的工 具。例如,傳輸裝置3622A從處理模組3901中採集一個基板, 可以是部件3518P1中的一個大氣模組、光刻模組、刻蝕模組或其 他所需處理模組,傳輸裝置3622A沿箭頭指定方向移動,圖53 所示為從傳輸室的部件3518P1移動到3518P3。在部件3518P1 中,傳輸裝置3622A將基板放置在所要求的處理模組3902中。 由圖53可知,傳輸室可以是模組,它與室模組相連接,構成 傳輸室3518,這種模組包含35181内壁,類似於圖48中的壁 3518F,3518R,用來分離傳輸室中的部件3518P1,3518P2, 3518P3,3518P4内壁35181包括溝槽閥門或其他適當閥門,保證 部件3518P1,3518P4能夠與一個或多個相鄰部件通訊連接。溝槽 閥門3518V的尺寸要保證一個或多個傳輸車能夠通過閥門,從部 件3518P1,3518P4運行到其他部件。用這種方法,車3622A可 以移動到傳輸室3518的任何地方。閥門關閉後,能夠將部件 3518P1,3518P2,3518P3,3518P4隔開,這樣,不同部件就可以 包含不同的環境。進一步的,傳輸室模組的内壁是固定的,以便 形成負載鎖扣3518P4,見圖48。負載鎖扣3518P4 (圖53中只有 45 200914800 一個,以示說明)定位在室3518中,並擁有所需數量的傳輸車。 參考圖54所示為一個示範製造設備圖,它是使用一個自動化 材料運輸系統(AMHS) 4120。在這個示範性實施例中,AMHS 工件從儲料器4130傳送到一個或多個處理工具4110處,AMHS 包含有一個或多個傳輸車4125和一個傳輸執跡4135,傳輸軌跡 4130可以是任意適當路徑。傳輸路徑包括感測器組群Q,Q如上 所述,沿軌跡分佈。傳輸車4125包括一個或多個磁性壓板MP, MP與感測器組群Q相互作用,提供對4125的位置測量值。 待測或所跟蹤的物體120的位置可利用距物體120末端較近 的感測器進行跟蹤,因此控制器可以容許多個物體沿同一傳輸路 徑移動,它跟蹤每一個物體以避免物體之間的接觸。在備選實施 例中,如果物體的長度已知,則使用在物體120末端附近的一個 感測器跟蹤物體120,這裏,控制器使用位置測量所得的物體第 一末端的位置資料加上或者減去物體的長度值,來確定物體沿著 傳輸路徑所產生的空間距離。 需要清楚的是,這裏所論述的示範性實施例是參照線性驅動 系統加以表述的,示範性實施例經改動後也可以應用於旋轉驅動 系統中。例如,所述示範性實施例能夠用於跟蹤圓柱體内一個物 體的旋轉速度和軸向位置,同時測量旋轉物體與圓柱體某個内壁 之間的距離。 這裏所說的示範性實施例裝有位置測量系統,能夠測量沿第 一軸向移動的無限長度,並同時測量沿第二和第三軸向的位置。 位置測量系統可以整合到任意適當傳輸設備中。儘管這裏所講的 示範性實施例能夠同時測量3個軸向的物體位置,但一個測量系 46 200914800 統可以聯合使用’來測量3個以上軸向上的位置。相反的,示範 f生只施例也可以應用於或構造成能夠測量3個以下軸向位置的測 量系統。還需要瞭解的是’示範性實施例可以單個使用,也可以 組合起來使用。示範性實施例所具有的位置測量线,可以不必 賦I可移動物體動力就能獲得物體的位置資訊^但是,儘管示範 性^施例具有固^在可移動物體上的磁性壓板,磁性壓板也可以 固疋在物體傳輸路;^的固定表面上,感測器則固定在可移動物體 上。 還需要瞭解的是’示範性實施例可以單個使用,也可以組合 ^來使用3外’别述内容只是說明示^性實施例卫作流程和性 月b。利用藝術技巧,可以對示範性實施例進行不同的選擇和修改。 相應的’目則的tf範性實施例設計趨向於囊括附注說明範圍内的 所有選擇、修改和差異 【圖式簡單說明】 圖1所示為根據-個示範性實施例的位置測量系統的局部 示意圖; 圖2A所示為-個示範性實施例的位置測量系統的局部示 意圖; 圖2B和2C表示圖2中的位置測量系統的感測器構件 出信號; 圖3A則表示另一個示範性實施例的位置測量系統的局部 示意圖; 圖3B表不圖3A中的位置測量系統的感測器構件的輸出信 號, 47 200914800 圖4表不一個示範性實施例的磁性壓盤和感測器構造圖; 圖5表示另一個示範性實施例的磁性壓盤和感測器構造 圖; 圖6A和6B表示圖5中的感測器感應到的磁性壓盤產生的 磁場強度曲線圖; 圖7則表示另一個示範性實施例繪製的磁性壓盤和感測器 構造圖; 圖8A和8B表示圖7中的感測器感應到的磁性壓盤產生的 磁場強度曲線圖; 圖9A和9B表示示範性實施例的感測器輸出曲線圖; 圖10A-11B表示示範性實施例的感測器輸出曲線圖; 圖12A和12B表示示範性實施例中一個磁螺距内不同數量 的感測器所生成的感測週期; 圖12C表示一個示範性實施例的工作流程圖; 圖13和14表示一個示範性實施例的校正位置測量圖; 圖15A—15C所示為多個示範性實施例的磁性壓板構造; 圖16A和16B所示為其他示範性實施例的磁性壓盤構造; 圖17所示為一個非最優化磁性壓板產生的磁場曲線圖; 圖18表示一個最優化磁性壓板產生的磁場曲線圖; 圖19A-19C表示由示範性實施例的非最優化磁性壓板產生 的磁場幾何圖; 圖20A—20C表示由一個示範性實施例的最優化磁性壓盤 產生的磁場幾何圖; 圖21-25表示一個示範性實施例的磁性壓板優化的圖表和 48 200914800 圖片; 圖26所不為示範性實施例的位置測量系統局部示意圖; 圖圖27di主- 表不示範性實施例感測器的輪出曲線圖; 圖32-33表示示範性實施例附加感測器的輸出曲線圖; 圖34矣 g 衣不另一示範性實施例感測器的輸出曲線圖; 圖35,示一個示範性實施例的示範信號倍增; 圖36是一個示範性實施例的信號倍增結構圖;The 359G is used to scan the sensor Q group, the first scanning sensor at the point 358G, and the position of the wheel carrier 3522C is positioned back to the point to generate the king position measurement (Fig. 55 'Structure diagram 421〇). As described above, the position of each of the sensor groups q is at a predetermined interval from the reference point transmitted to 35丨8, and the position of the magnetic platen can be roughly determined when the magnetic platen passes through the sensor 4'. The more precise position of the magnetic platen Mp and the transmission, car = 22C can be determined mathematically by the above-described sensing output (Fig. 55, block diagram 4220). In this example, since each platen 3522B includes a magnetic platen MP, the position of each platen 3 5 22B can be determined separately, whereby all of the platens 3522B can be simultaneously activated in the same direction, thereby allowing the entire transfer vehicle/equipment to be in the transfer chamber. The inner portion of the 3518 is moved radially; or the pressure plate is driven separately, and the hinged arm 3522A carried by the transport vehicle 3522C is elongated or contracted. It should be noted that the position of the transport vehicle 3522C corresponding to the wall of the transmission chamber (such as the gap between the chamber wall and the vehicle) can be measured and adjusted accordingly, and the position of the vehicle 3522C between the two chamber walls 3518S is determined. The predetermined location can handle the exact layout of the substrate of the module 3520. Fig. 49 shows another substrate processing apparatus 3510' which is substantially the same as 3510. In the exemplary embodiment, transmission chamber 3518' has two transport devices 3622A and 3622B. Transmission device 3622A' 3622B is substantially identical to 3522 described above, see FIG. The transfer devices 3622A, 3622B are all supported by a common set of radial slide bars. The platen of the transfer car corresponding to each transmission device is driven by the same linear motor. The different drive zones of the linear motor allow for independent actuation of a single platen on each of the transport cars 3622A, 3622B, so that a single transport car 3622A, 3622B can also be independently driven by 41 200914800. It will be appreciated that the linear motor can be operated independently (in a manner similar to that described above) and the hinged arms of each device can be independently extended/contracted. However, in this case, the substrate transfer devices 3 622A, 3 622B cannot pass each other in the transfer chamber unless an independent taxi system is applied. As described above, each of the platens that are transported includes a magnetic platen MP that is coupled to a sensor group Q that is fixed to the chamber wall 35 18 . In the exemplary embodiment, the processing modules are arranged along the length of the transfer chamber 3518' such that the substrates are transferred to the processing module 3518' for processing, which prevents the transmission devices 3622A, 3622B from interfering with each other. For example, the processing module for the coating is positioned prior to the heating module, and the cooling module and the etching module are finally positioned. However, the transfer chamber 3518 contains two additional transfer regions 3518A' and 3518B that allow the two transport devices to traverse each other (similar to a side pole, a split rod or a magnetic levitation region that does not require a support rod). Next, other transmission areas can be positioned above or below the panel where the processing module is located. Each of the transmission areas 351 and 3518B' has its own sensor group q, so that the transport cars 3622A, 3622B can be independently tracked when the transport vehicles are in respective transmission areas 3518A' and 3518B, respectively. The transport device in the exemplary embodiment has two slide bars, one for each transfer device. One slide bar is positioned on the bottom or side wall of the transfer chamber and the other slide bar is positioned on top of the transfer chamber. In an alternative embodiment, the linear drive system is used to simultaneously drive and suspend the transport vehicle, and the transport vehicle will independently move horizontally or vertically, thereby transferring or transporting the substrates independently of each other. It should be noted that the sensor group 卩 combined with the magnetic platen MP can be used to track the vertical position of the 3622A, 3622b each transport vehicle 'they pass above/below each other to avoid collision, this collision may break The substrate carried by the ring transport vehicle or transport vehicle ^ In all instruments using electric windings, the windings can also be used as 42 in the case of heating and degassing (such as water vapor removal) in the transmission chamber. A dedicated linear drive motor is driven or driven in the dedicated drive area where the transport vehicle is located. The clamp = 2 counts and / 3 are shown in other exemplary embodiments, and other substrate processing apparatuses are provided with an integrated map of the additional system. As can be seen from Figures 52 and 53, the transmission chamber is elongated to be connected to: transmission: Group diagram The apparatus shown in Figure 52 has 12 processing modules, each of which is connected to the transfer chamber and is in the group of the molds ^ Set (shown as two devices) with 4 as an example, %备所~人#... The number of modules in the general example is only for the ten people in the Yuhan area. The number of modules can be arbitrary, as before Said. The surface is similar, the processing module is arranged in Cartesian along both sides of the transmission chamber. The number of round=module columns is greatly increased (as shown in Figure 52, 6 rows, to know the row). Figure 52 In the exemplary embodiment shown, the 丽 can be detached and the load 直接 can be directly connected to the load lock. In Figures 52 and 53 = there are multiple transmission devices (ie, three in Figure 52, Figure 53 6), can lock and the substrate in the processing chamber. The number of transmission devices shown is only an example, the actual number of devices can be more or less. The transmission device is generally the same on the disk, including - An articulated arm and a transport vehicle, wherein the material position and the extension/retraction multi-dimensional position measuring system of the articulated arm are longitudinal. The transport vehicle is driven by a linear motor on the side wall of the transmission chamber, and the linear motion drive transmission vehicle is in two. Orthogonal coordinate axes (ie, radial and vertical translation in the transmission chamber. Correspondingly, the transmission devices can pass each other in the transmission chamber. The transmission chamber has the "mechanical" (4) located above and/or below the processing module (10). Domain 'transport device needs to set route (4) free transport The substrate in the phase processing module or the transmission device operates in the opposite direction. The substrate transmission device can control the movement of the plurality of substrate transfer devices. 43 200914800 Still referring to Fig. 53, the substrate processing devices 3918A and 3918B are directly The controller 3900 is coupled. It can be seen from Figures 49, 50, 52-53 that the transfer chamber 3518 can extend as desired across the processing device PF. As seen in Figure 53 and further discussion below, the transfer chamber is associated with various components or Compartment, 3918A, 1918B processing equipment PF, such as storage, "lithography tools, metal deposition tools or other suitable tool compartments to connect and communicate. The compartments that are not connected to the transfer chamber 3518 can also be configured as a program compartment or a 3918A, f, 3918B program. Each compartment has the required tools (such as photolithography, metal deposition, hot dip, cleaning, cleaning) to complete a given semiconductor workpiece fabrication process. In each case, the processing modules in transfer chamber 3518 are communicatively coupled to various tools in the equipment compartment to ensure that semiconductor workpieces are transferred between the transfer chamber and the processing module. Thus, the transfer chamber has different environmental conditions along its length, such as atmosphere, vacuum, high vacuum, gas injection or other conditions associated with different processing modules connected to the transfer chamber. Accordingly, a given program's transfer chamber component 3518P1, or an interval 3518A, 3518B, or a portion of the interval, may have one environmental condition (e.g., atmosphere), while the other component 3518P2, 3518P3 may have a different environmental condition. As mentioned earlier, the components 3518Ρ1, 3518Ρ2, 3518Ρ3 with different environmental conditions are located in different compartments of the equipment, or both are in the same compartment. Fig. 53 shows a transfer chamber having three * members 3518Ρ1, 3518Ρ2, 3518Ρ3, wherein the three components are different in environmental conditions, and are merely exemplified. The chamber 3518 in the exemplary embodiment has different components depending on the environment. Each of the components 3918A, 3918Β, 3518Ρ1, 3518Ρ2, 3518Ρ3 has a sensor group Q that is positioned along the sidewall of the transmission member. For transmission components that do not require a high-precision position of the transmission 3266Α, such as the 3518Ρ2, the sensor configuration shown in Figure 3Α can be used, so that the cost of the transmission 3266 is reduced and can be accurately tracked. In an alternate embodiment, any combination of exemplary position measuring devices can be applied to any of the 3918A, 3918B, 3518P1, 3518P2, 3518P3 transmission components. As can be seen from Figure 53, a transmission device similar to the 3622A (see Figure 49) in the transmission bay 3518 enables switching between different environments between the 3518P1, 3518P2, 3518P3 components. Thus, as seen in Figure 53, transmission device 3622A utilizes a acquisition substrate to move a semiconductor workpiece from a program in a processing device or a tool in interval 3518A to another tool having a different environment or a tool in interval 3518A. For example, the transmission device 3622A collects a substrate from the processing module 3901, which may be an atmospheric module, a lithography module, an etch module, or other required processing module in the component 3518P1, and the transmission device 3622A is oriented in the direction of the arrow. Moving, Figure 53 shows moving from component 3518P1 of the transfer chamber to 3518P3. In component 3518P1, transport device 3622A places the substrate in the desired processing module 3902. As can be seen from Fig. 53, the transfer chamber may be a module which is connected to the chamber module to form a transfer chamber 3518. The module includes an inner wall of 35181, similar to the walls 3518F, 3518R in Fig. 48, for separating the transfer chamber. The components 3518P1, 3518P2, 3518P3, 3518P4 inner wall 35181 include a grooved valve or other suitable valve to ensure that components 3518P1, 3518P4 can be communicatively coupled to one or more adjacent components. The groove valve 3518V is sized to ensure that one or more transfer vehicles can pass through the valve and run from the components 3518P1, 3518P4 to other components. In this way, the car 3622A can be moved anywhere in the transfer chamber 3518. When the valve is closed, the components 3518P1, 3518P2, 3518P3, and 3518P4 can be separated so that different components can contain different environments. Further, the inner wall of the transfer chamber module is fixed to form a load lock 3518P4, see Fig. 48. The load lock 3518P4 (only one of the 45 200914800 in Figure 53 for illustration) is positioned in the chamber 3518 and has the required number of transport vehicles. Referring to Figure 54, an exemplary manufacturing apparatus diagram is shown using an automated material transport system (AMHS) 4120. In this exemplary embodiment, the AMHS workpiece is transferred from the hopper 4130 to one or more processing tools 4110, the AMHS includes one or more transport vehicles 4125 and a transport trace 4135, and the transport trajectory 4130 can be any suitable path. The transmission path includes sensor groups Q, Q distributed along the trajectory as described above. The transport cart 4125 includes one or more magnetic platens MP that interact with the sensor group Q to provide position measurements for the 4125. The position of the object 120 to be tested or tracked can be tracked using a sensor that is closer to the end of the object 120, so the controller can allow multiple objects to move along the same transmission path, it tracks each object to avoid between objects contact. In an alternative embodiment, if the length of the object is known, the object 120 is tracked using a sensor near the end of the object 120, where the controller uses the positional measurement of the position of the first end of the object plus or minus The length of the object is removed to determine the spatial distance that the object produces along the transmission path. It is to be understood that the exemplary embodiments discussed herein are described with reference to a linear drive system, and the exemplary embodiments can be applied to a rotary drive system as modified. For example, the exemplary embodiment can be used to track the rotational speed and axial position of an object within a cylinder while measuring the distance between the rotating object and an inner wall of the cylinder. The exemplary embodiment described herein is equipped with a position measuring system capable of measuring an infinite length of movement along a first axis and simultaneously measuring positions along the second and third axes. The position measurement system can be integrated into any suitable transmission device. While the exemplary embodiment described herein is capable of simultaneously measuring three axial object positions, one measurement system 46 200914800 can be used in conjunction to measure more than three axial positions. Conversely, the demonstration can also be applied or constructed as a measurement system capable of measuring 3 or less axial positions. It will also be appreciated that the 'exemplary embodiments' can be used individually or in combination. The position measuring line of the exemplary embodiment can obtain the position information of the object without assigning the dynamic force of the movable object. However, although the exemplary embodiment has the magnetic pressure plate fixed on the movable object, the magnetic pressure plate is also It can be fixed on the fixed surface of the object; the sensor is fixed on the movable object. It should also be understood that the 'exemplary embodiments may be used singly or in combination with one another. 'Others' are merely illustrative of the exemplary embodiment process and the nature month b. Different selections and modifications can be made to the exemplary embodiments using art techniques. Correspondingly, the tf exemplary embodiment design tends to encompass all selections, modifications, and differences within the scope of the description. [FIG. 1 illustrates a portion of a position measurement system in accordance with an exemplary embodiment. 2A is a partial schematic view of a position measuring system of an exemplary embodiment; FIGS. 2B and 2C show sensor component signals of the position measuring system of FIG. 2; FIG. 3A shows another exemplary implementation. Figure 3B shows the output signal of the sensor component of the position measuring system of Figure 3A, 47 200914800 Figure 4 shows a magnetic platen and sensor construction diagram of an exemplary embodiment Figure 5 is a view showing a configuration of a magnetic platen and a sensor of another exemplary embodiment; Figures 6A and 6B are graphs showing magnetic field strengths generated by the magnetic platen sensed by the sensor of Figure 5; A magnetic platen and sensor configuration diagram drawn by another exemplary embodiment; FIGS. 8A and 8B are graphs showing magnetic field strengths generated by the magnetic platen sensed by the sensor of FIG. 7; FIGS. 9A and 9B are diagrams. Sensor output graph of an exemplary embodiment; Figures 10A-11B show sensor output plots of an exemplary embodiment; Figures 12A and 12B show different numbers of sensor locations within one magnetic pitch in an exemplary embodiment The resulting sensing period; Figure 12C shows a working flow diagram of an exemplary embodiment; Figures 13 and 14 show a corrected position measurement map of an exemplary embodiment; Figures 15A-15C show magnetics of a plurality of exemplary embodiments Figure 16A and 16B show the magnetic platen configuration of other exemplary embodiments; Figure 17 shows the magnetic field curve produced by a non-optimized magnetic platen; Figure 18 shows the magnetic field curve produced by an optimized magnetic platen. Figures 19A-19C show magnetic field geometry produced by a non-optimized magnetic platen of an exemplary embodiment; Figures 20A-20C show magnetic field geometry produced by an optimized magnetic platen of an exemplary embodiment; Figure 21- 25 shows a magnetic platen optimized chart of an exemplary embodiment and 48 200914800 picture; FIG. 26 is a partial schematic view of a position measuring system which is not an exemplary embodiment; FIG. 27di main - The wheel-out curve of the sensor of the exemplary embodiment is shown; Figures 32-33 show the output graph of the additional sensor of the exemplary embodiment; Figure 34 is not the output of the sensor of another exemplary embodiment FIG. 35 is an exemplary signal multiplication of an exemplary embodiment; FIG. 36 is a signal multiplication block diagram of an exemplary embodiment;
圖37_39表示示範性實施例的信號倍增; 圖40表示一個示範性實施例的倍頻信號; 圖41-44表示—個示範性實施例計信號誤差的輸入和輸出 信號; .圖45和46分別表示示範性實施例的感測和間距解析度函 數’圖47表$個示範性實施例的示^解析度增強器; 圖48-54所tf為具有示範性實施例特性的處理器示意圖; 圖55表示示範性實施例的工作流程圖。 〜, 【主要元件符號說明】 100 感測器 140,150 磁體 180 指定表面 500 坐標系統 120 待測物體 170 磁性壓板 190 控制器 510,520磁極單元 4937-39 show signal multiplication of an exemplary embodiment; Fig. 40 shows a frequency multiplication signal of an exemplary embodiment; and Figs. 41-44 show an input and output signal of an exemplary embodiment signal error; Figs. 45 and 46, respectively </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 55 represents a workflow diagram of an exemplary embodiment. ~, [Key component symbol description] 100 Sensor 140, 150 Magnet 180 Designated surface 500 Coordinate system 120 Object to be tested 170 Magnetic platen 190 Controller 510, 520 magnetic pole unit 49
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US94654207P | 2007-06-27 | 2007-06-27 |
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| TW200914800A true TW200914800A (en) | 2009-04-01 |
| TWI460401B TWI460401B (en) | 2014-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW097124036A TWI460401B (en) | 2007-06-27 | 2008-06-27 | Multiple dimension position sensor |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI489088B (en) * | 2012-06-19 | 2015-06-21 | 利倍庫斯股份有限公司 | Measuring apparatus |
| CN111103559A (en) * | 2018-10-26 | 2020-05-05 | 胜美达集团株式会社 | Magnetic field generation source detection device and magnetic field generation source detection method |
| CN111707182A (en) * | 2020-06-29 | 2020-09-25 | 上海中商网络股份有限公司 | Product spacing detection system, method and device |
| TWI769695B (en) * | 2021-02-08 | 2022-07-01 | 經登企業股份有限公司 | Calibration method of magnetic linear position sensor |
| CN115143870A (en) * | 2021-03-31 | 2022-10-04 | 旭化成微电子株式会社 | Event detection method, event detection system and program |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6876896B1 (en) * | 1999-04-26 | 2005-04-05 | Ab Tetrapak | Variable motion system and method |
| TWI304391B (en) * | 2002-07-22 | 2008-12-21 | Brooks Automation Inc | Substrate processing apparatus |
-
2008
- 2008-06-27 TW TW097124036A patent/TWI460401B/en active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI489088B (en) * | 2012-06-19 | 2015-06-21 | 利倍庫斯股份有限公司 | Measuring apparatus |
| CN111103559A (en) * | 2018-10-26 | 2020-05-05 | 胜美达集团株式会社 | Magnetic field generation source detection device and magnetic field generation source detection method |
| CN111707182A (en) * | 2020-06-29 | 2020-09-25 | 上海中商网络股份有限公司 | Product spacing detection system, method and device |
| CN111707182B (en) * | 2020-06-29 | 2022-06-03 | 上海中商网络股份有限公司 | Product spacing detection system, method and device |
| TWI769695B (en) * | 2021-02-08 | 2022-07-01 | 經登企業股份有限公司 | Calibration method of magnetic linear position sensor |
| CN115143870A (en) * | 2021-03-31 | 2022-10-04 | 旭化成微电子株式会社 | Event detection method, event detection system and program |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI460401B (en) | 2014-11-11 |
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