TWI451084B - Sensor for position and gap measurement - Google Patents
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Description
本發明涉及一種位置感測器,特別是關於一種用以探測物體在多維度位置內的位置感測器。The present invention relates to a position sensor, and more particularly to a position sensor for detecting an object in a multi-dimensional position.
目前有多種用於測定移動物體位置的方法。例如,有一種車輛導航系統,其使用與路面條紋交互的雷達信號來測定汽車的位置。另一種定位系統使用無線電通信。但是這兩種系統都需有能在移動物體上使用的動力源。無線電波也同樣會受介入結構和電信號的影響而減弱。There are currently a number of methods for determining the position of a moving object. For example, there is a vehicle navigation system that uses radar signals that interact with road streaks to determine the position of the car. Another positioning system uses radio communication. But both systems require a power source that can be used on moving objects. Radio waves are also attenuated by the effects of intervening structures and electrical signals.
位置亦可由諸如線性差動變壓器(LVDT)來測定。線性差動變壓器為位移感測器,該位移感測器使用纏繞圓柱型筒管的一個初級繞組和兩個次級繞組。可動鎳鐵芯或電樞位於繞組裏面,通過測量該鐵芯的運動來獲得活動物體的位置。霍爾效應感測器可以同樣的方式用來測量位移。通常線性差動變壓器和霍爾效應感測器係用來測量,如線性制動器和活塞的位移有限位移等。The position can also be determined by, for example, a linear differential transformer (LVDT). The linear differential transformer is a displacement sensor that uses one primary winding and two secondary windings wound around a cylindrical bobbin. The movable nickel core or armature is located inside the winding, and the position of the movable object is obtained by measuring the movement of the core. Hall effect sensors can be used to measure displacement in the same way. Linear differential transformers and Hall effect sensors are commonly used to measure, such as linear brakes and displacement displacement of pistons.
對於諸如步進電機,懸浮和/或掃描平臺等高精度定位系統,位置測量的習知方法係使用電容感測器、電感感測器、光學感測器和鐳射感測器。這些感測器通常提供高解析度和低定位干擾。但是,總體成本、行程範圍限制和所需自由度縮小了它們的應用領域。For high precision positioning systems such as stepper motors, suspension and/or scanning platforms, conventional methods of position measurement use capacitive sensors, inductive sensors, optical sensors, and laser sensors. These sensors typically provide high resolution and low positioning interference. However, overall cost, range limitations and required degrees of freedom have narrowed their application areas.
如果能夠同時沿多個軸測量移動物體的位置的話將很有益。如果能夠測量延長行程上的物體的多維位置的話也將十 分有益。It would be beneficial if the position of the moving object could be measured along multiple axes at the same time. If you can measure the multi-dimensional position of the object on the extended stroke, you will also It is beneficial.
本發明提供一種裝置,包括:控制器;輸送工具,其與所述控制器進行通信,並具有活動部分和輸送通道;和多維位置測量裝置,其與所述控制器通信,所述多維位置測量裝置包括多個變壓器和至少一個與所述活動部分附接的元件;其中,設置所述多維位置測量裝置,以便在上述至少一個元件經過鄰近至少一個所述多個變壓器的位置時,接通至少一個所述多個變壓器的回路;控制器設置為基於至少一個所述多個變壓器的輸出來同時計算所述活動物體的多維位置,其中所述多維位置包括所述活動部分和所述多個變壓器間的至少一個間隙。The present invention provides an apparatus comprising: a controller; a transport tool in communication with the controller and having a movable portion and a transport channel; and a multi-dimensional position measuring device in communication with the controller, the multi-dimensional position measurement The apparatus includes a plurality of transformers and at least one component attached to the movable portion; wherein the multi-dimensional position measuring device is disposed to turn on at least when the at least one component passes through a position adjacent to the at least one of the plurality of transformers a loop of the plurality of transformers; the controller being configured to simultaneously calculate a multi-dimensional position of the moving object based on an output of the at least one of the plurality of transformers, wherein the multi-dimensional position comprises the active portion and the plurality of transformers At least one gap between.
圖1A-1C示出根據本示範性實施例沿多個軸同時測量的感測器的示範性結構。儘管將參照附圖對實施例進行描述,但需要瞭解的是本實施例可以以多種變化的實施例實施。另外,可以使用任何合適的部件尺寸、形狀或類型,或材料。1A-1C illustrate an exemplary structure of a sensor that is simultaneously measured along multiple axes in accordance with the present exemplary embodiment. Although the embodiments will be described with reference to the drawings, it is to be understood that this embodiment can be embodied in various modified embodiments. In addition, any suitable component size, shape or type, or material may be used.
本實施例提供一種感測器100,其配置用來在使用相同的感測器進行每次多維測量時,提供沿第一軸的無限長度的位置測量,同時提供沿第二軸的位置測量和平面中的位置測量。作為非限制性示例,感測器100可用於磁懸浮輸送工具或壓板(如美國專利公開號2004/0151562和2008年6月27日申請的、題目為「具有磁浮主軸軸承的自動機械驅動器」),以便測量輸送工具沿任意適合距離的行程的方向上的位置, 壓板與固定表面間的間隙,和壓板的平面位置或方位。需要理解的是,此實施例能用來感應任意適合的活動物體的位置。該適合的活動物體包括但不局限於在一維或多維中可移動的物體,同時包括並不局限於輸送工具和致動器。同樣需要理解的是,儘管本實施例是關於線性傳動系統進行描述,但本實施例能夠以大體與下述方式相同的方式應用於旋轉驅動系統。The present embodiment provides a sensor 100 configured to provide an infinite length position measurement along a first axis while each multi-dimensional measurement is performed using the same sensor, while providing position measurement along the second axis and Position measurement in the plane. As a non-limiting example, the sensor 100 can be used with a magnetic levitation transport tool or a pressure plate (such as U.S. Patent Publication No. 2004/0151562 and entitled "Automatic Mechanical Drive with Maglev Spindle Bearing", filed on June 27, 2008). In order to measure the position of the conveying tool in the direction of the stroke of any suitable distance, The gap between the platen and the fixed surface, and the planar position or orientation of the platen. It will be appreciated that this embodiment can be used to sense the position of any suitable moving object. Suitable moving objects include, but are not limited to, objects that are movable in one or more dimensions, and are not limited to delivery tools and actuators. It should also be understood that although the present embodiment is described in relation to a linear transmission system, the present embodiment can be applied to a rotary drive system in substantially the same manner as described below.
如圖1A所示,其示出了感測器100的截面圖。在一個示範性實施例中,感測器100包括一組沿活動物體104的運動C(見圖1B)方向或平面分佈的固定變壓器109。感測器100還包括與移動物體104附接的元件105,所以在該元件105接近一個相應的變壓器109時,該元件105閉合該變壓器的回路。僅出於示範的目的,在此將變壓器109的回路描述為磁路,同時將元件105描述為鐵元件。但需要理解的是,在備選實施例中,該回路可為任意適合回路,該元件可為由能夠閉合變壓器109回路的材料製成的任意適合元件。As shown in FIG. 1A, a cross-sectional view of the sensor 100 is shown. In an exemplary embodiment, sensor 100 includes a set of stationary transformers 109 that are distributed in the direction or plane of motion C (see FIG. 1B) of moving object 104. The sensor 100 also includes an element 105 attached to the moving object 104 such that when the element 105 approaches a respective transformer 109, the element 105 closes the circuit of the transformer. For exemplary purposes only, the loop of transformer 109 is described herein as a magnetic circuit while element 105 is depicted as an iron component. It should be understood, however, that in alternative embodiments, the circuit can be any suitable circuit that can be any suitable component made of a material capable of closing the circuit of the transformer 109.
每一固定變壓器109包括纏繞公共鐵芯103的一組初級繞組101和一組次級繞組102(即一套繞組)。該鐵芯103可為開口鐵芯。在備選實施例中,該鐵芯可為任意適合結構,並可由任意適合材料製作而成。在其他備選實施例中,可具有多於一組的各初級繞組和次級繞組101、102。在本示範性實施例中,初級繞組101位於次級繞組102上方,但在備選實施例中,次級繞組102可位於初級繞組上方或任意其他相對於初級繞組的合適位置。初級繞組和次級繞組可由任意適 合的導電材料製成,這些材料包括但不局限於鐵和銅。初級繞組和次級繞組101、102可以任意適合距離R彼此間隔。Each of the fixed transformers 109 includes a set of primary windings 101 and a set of secondary windings 102 (i.e., a set of windings) wound around a common core 103. The core 103 can be an open core. In alternative embodiments, the core can be of any suitable construction and can be fabricated from any suitable material. In other alternative embodiments, there may be more than one set of primary and secondary windings 101, 102. In the present exemplary embodiment, primary winding 101 is located above secondary winding 102, but in alternative embodiments, secondary winding 102 may be located above the primary winding or any other suitable location relative to the primary winding. The primary winding and the secondary winding can be any suitable Made of a conductive material, including but not limited to iron and copper. The primary and secondary windings 101, 102 can be spaced apart from one another by any suitable distance R.
與活動物體104附接的鐵元件105可具有任意適合形狀和大小,所以當鐵元件105通過初級繞組和次級繞組101、102附近時,初級繞組和次級繞組101、102之間的回路被閉合。例如,如圖1A所示,鐵元件105可具有橫跨初級繞組和次級繞組101、102的長度。在本示範性實施例中,鐵元件105橋接初級繞組和次級繞組101、102間的間距R,以便使回路閉合。在備選實施例中,該元件可配置以任意適合方式閉合初級繞組和次級繞組之間的回路。該鐵元件105還表現為超過各繞組101、102的高度H。但在備選實施例中,鐵元件可超過或不超過各繞組101、102的高度。在一示範性實施例中,如圖1B所見,鐵元件105可具有大體與繞組101、102相同的寬度。在備選實施例中,該元件105可具有大於或小於繞組101、102的寬度。應注意到任意適合數量的鐵元件105都可固定到活動物體104上。還需注意的是一個或多個鐵元件105可位於位置和間隙待測的活動物體104上的任意適合位置。例如,鐵元件105可沿物體104側邊任意適合長度放置,可放置於物體104各個角上,可放置在物體的頂部或底部或任意其他適合位置,這取決於物體大小和形狀、將追蹤物體哪一部分的位置等。由於在移動物體104上的固定點上測量位置和間隙,所以能夠優化物體104的運動控制。The iron element 105 attached to the movable object 104 can have any suitable shape and size so that when the iron element 105 passes near the primary and secondary windings 101, 102, the loop between the primary and secondary windings 101, 102 is closure. For example, as shown in FIG. 1A, the iron element 105 can have a length that spans the primary and secondary windings 101, 102. In the present exemplary embodiment, the iron element 105 bridges the spacing R between the primary winding and the secondary windings 101, 102 to close the loop. In an alternative embodiment, the element can be configured to close the loop between the primary winding and the secondary winding in any suitable manner. The iron element 105 also exhibits a height H that exceeds each of the windings 101, 102. However, in alternative embodiments, the iron elements may or may not exceed the height of each of the windings 101,102. In an exemplary embodiment, as seen in FIG. 1B, the iron element 105 can have substantially the same width as the windings 101, 102. In alternative embodiments, the element 105 can have a width that is greater or less than the windings 101, 102. It should be noted that any suitable number of iron elements 105 can be secured to the moving object 104. It is also noted that one or more of the iron elements 105 can be located at any suitable location on the moving object 104 where the position and gap are to be measured. For example, the iron elements 105 can be placed along any suitable length of the sides of the object 104, can be placed at various corners of the object 104, can be placed at the top or bottom of the object, or at any other suitable location, depending on the size and shape of the object, the object will be tracked Which part of the location is waiting. Since the position and the gap are measured at fixed points on the moving object 104, the motion control of the object 104 can be optimized.
現參照圖1B和圖1C。圖1B示出感測器100的俯視圖,圖1C為感測器的原理圖。任意適合數量的繞組101、102和 鐵芯103都可沿諸如活動物體104行程方向C上的固定表面分佈。在本示例中,行程方向是在X方向上,但在備選實施例中,行程方向可沿任意適合的軸或多個軸的組合。任意適合數量的繞組裝置都可沿行程C方向放置,所以感測器100在物體的行程C方向上具有無限的感應範圍。繞組裝置可以間距P彼此隔開。間距P可為任意適合距離,並可與感應器100的分辨度對應。例如,間距越小,感應器的分辨度就越高,反之亦然。Reference is now made to Figures 1B and 1C. FIG. 1B shows a top view of the sensor 100, and FIG. 1C is a schematic diagram of the sensor. Any suitable number of windings 101, 102 and The iron cores 103 are all distributed along a fixed surface such as the traveling direction C of the movable object 104. In this example, the stroke direction is in the X direction, but in alternative embodiments, the stroke direction can be along any suitable axis or combination of multiple axes. Any suitable number of winding arrangements can be placed in the direction of the stroke C, so the sensor 100 has an infinite sensing range in the direction of the stroke C of the object. The winding means can be spaced apart from each other by a pitch P. The pitch P can be any suitable distance and can correspond to the resolution of the sensor 100. For example, the smaller the pitch, the higher the resolution of the sensor and vice versa.
如圖1C所示,初級繞組101a-101n可連接於交流電源,並由該交流電源供電。所以能夠基於變壓器109的次級繞組102上感生的電壓測定元件105的位置和元件105與變壓器109鐵芯103之間的間隙。在備選實施例中,初級繞組101可與能夠通過元件105在次級繞組中感生電壓的任意適合電源相連。次級繞組102a-102n可與交流結構中的電壓匯流排107、108相連,使得次級繞組具有交變極性。例如,電壓匯流排107可具有第一極性,並且電壓匯流排108可具有第二極性(與第一極性不同),這樣使得繞組102a可連接於匯流排108,繞組102b可連接於匯流排107,繞組102c可連接於匯流排108,繞組102d可連接於匯流排107,等。在備選實施例中,次級繞組102可以任意適合的方式和/或結構,連接於任意一條或多條電壓匯流排。穿過匯流排107、108的電壓的帶符號的幅度分別標記為A和B。As shown in FIG. 1C, the primary windings 101a-101n can be connected to an AC power source and powered by the AC power source. Therefore, the position of the element 105 and the gap between the element 105 and the core 109 of the transformer 109 can be determined based on the voltage induced on the secondary winding 102 of the transformer 109. In an alternate embodiment, the primary winding 101 can be coupled to any suitable power source capable of inducing a voltage in the secondary winding through the component 105. The secondary windings 102a-102n can be coupled to voltage busbars 107, 108 in the AC structure such that the secondary windings have alternating polarity. For example, the voltage busbar 107 can have a first polarity, and the voltage busbar 108 can have a second polarity (different from the first polarity) such that the winding 102a can be coupled to the busbar 108 and the winding 102b can be coupled to the busbar 107, The winding 102c can be connected to the bus bar 108, the winding 102d can be connected to the bus bar 107, and the like. In an alternative embodiment, the secondary winding 102 can be coupled to any one or more of the voltage busses in any suitable manner and/or configuration. The signed amplitudes of the voltages across the busbars 107, 108 are labeled A and B, respectively.
在操作中,當元件105不與鐵芯103鄰近時,次級繞組102感生的電壓小且平衡,就導致了穿過匯流排107、108的 電壓A、B基本為零。當鐵元件105在行程C方向上移動時,鐵元件105將與它鄰近的初級和次級繞組對的磁路閉合。例如,參照圖1C,鐵元件位於鄰近繞組對101e-102e和101f-102f的位置上,這樣就至少部分地閉合了繞組對的磁路。在此示例中,如果鐵元件105在方向T上移動,繞組對101e-102e間的回路將會斷開,同時繞組對101f-102f間的回路將會閉合。這時,繞組對101e-102e中感生的電壓將會降低,同時繞組對101f-102f引起的電壓將會升高。由一特定繞組對感生的電壓可與和該特定繞組對相關聯的鐵元件105和鐵芯103間的位置重疊成比例。在此示例中,該位置重疊將在沿X軸的方向T上。在備選實施例中,該重疊可在沿任意適合行程方向的任意適合的軸上。In operation, when the element 105 is not adjacent to the core 103, the voltage induced by the secondary winding 102 is small and balanced, resulting in passage through the busbars 107, 108. The voltages A and B are substantially zero. When the iron element 105 moves in the direction of the stroke C, the iron element 105 closes the magnetic circuit of the pair of primary and secondary windings adjacent thereto. For example, referring to Figure 1C, the iron elements are located adjacent the pairs of windings 101e-102e and 101f-102f such that the magnetic paths of the winding pairs are at least partially closed. In this example, if the iron element 105 is moved in the direction T, the loop between the winding pairs 101e-102e will be broken and the loop between the winding pairs 101f-102f will be closed. At this time, the voltage induced in the winding pair 101e-102e will decrease, and the voltage caused by the winding pair 101f-102f will rise. The voltage induced by a particular winding pair can be proportional to the positional overlap between the iron element 105 and the core 103 associated with that particular winding pair. In this example, the position overlap will be in the direction T along the X axis. In alternative embodiments, the overlap can be on any suitable axis along any suitable stroke direction.
現參照圖2A,其示出了次級繞組的輸出或感應電壓A、B的示範性圖表。如該圖所示,沿縱軸繪製了電壓A、B的幅度,同時沿圖中的橫軸繪製了沿X軸(第一軸)的行程距離。當鐵元件105通過靠近各繞組對的位置時,感應電壓產生具有基本為鋸齒狀曲線分佈的輸出信號。圖2A中可以看出,兩個輸出信號A、B基本具有正弦/餘弦關係,其相位移動了繞組對間距P的距離。在備選實施例中,兩個輸出信號的相位可移動任意適合的量。由於各繞組對的次級繞組102具有交變極性,兩個信號A、B中每個的週期為間距的4倍或4P。在備選實施例中,信號A、B的週期可具有任意適合的長度,該長度可大於或小於4P。Referring now to Figure 2A, an exemplary graph of the output or induced voltages A, B of the secondary windings is shown. As shown in the figure, the amplitudes of the voltages A, B are plotted along the vertical axis, while the travel distance along the X-axis (first axis) is plotted along the horizontal axis in the figure. When the iron element 105 passes the position close to each winding pair, the induced voltage produces an output signal having a substantially zigzag curve distribution. As can be seen in Figure 2A, the two output signals A, B have substantially a sine/cosine relationship, the phase of which shifts the distance of the windings to the pitch P. In an alternative embodiment, the phase of the two output signals can be moved by any suitable amount. Since the secondary winding 102 of each winding pair has an alternating polarity, the period of each of the two signals A, B is 4 times or 4P of the pitch. In an alternative embodiment, the periods of signals A, B may have any suitable length, which may be greater or less than 4P.
鐵元件150沿運動方向(此示例中為沿X軸)的位置可
借助諸如下列公式,從兩個電壓信號A、B中得到:
其中x為鐵元件105沿x軸測量的位置,A和B是由感測器100產生的兩個感應電壓信號,x0 和KX 為在x方向上行程的校準常數,|A|和|B|分別為信號A和B的絕對值。Where x is the position measured by the iron element 105 along the x-axis, A and B are the two induced voltage signals generated by the sensor 100, x 0 and K X are the calibration constants for the stroke in the x direction, |A| and | B| is the absolute value of signals A and B, respectively.
需要注意到公式[1]可在一個週期n或間距的4倍4P內提供連續的位置資訊。在一個實施例中,感測器100可用作增量式編碼器,其中,在x方向上沿無限的行程長度,能夠基於週期性信號A、B的跳變次數得到鐵元件105的絕對位置。在備選實施例中,感測器100可用作絕對式編碼器。在其他實施例中,各繞組對在每一週期n之初的位置可在諸如控制器1090(圖10)的任意適合控制器的記憶體中得到和儲存。在一個示範性實施例中,控制器1090可為如2005年7月11日提交的美國專利申請號11/178,615所述的集群控制結構的一部分,該申請的公開內容通過引用而整體結合到本文中。為了得到鐵元件105的位置,該控制器可測定哪些繞組對回路閉合或部分閉合,哪些繞組對回路使用閉合繞組對的已記錄位置作為基線測量,哪些繞組對增加或減少在由公式[1]測定的週期n中與已記錄位置之間的距離。在備選實施例中,從感應器處得到的資訊可以任意適合方式用於測量鐵元件105的位置。應注意到這裏所描述的與一個或多個示範性感應器相連的控制器可包括包含在電腦可讀介質中的電腦可讀代 碼,以便進行本文所描述的計算和控制。It should be noted that the formula [1] can provide continuous position information within one cycle n or 4 times 4P of the pitch. In one embodiment, the sensor 100 can be used as an incremental encoder in which the absolute position of the iron element 105 can be derived based on the number of transitions of the periodic signals A, B along an infinite stroke length in the x direction. . In an alternative embodiment, the sensor 100 can be used as an absolute encoder. In other embodiments, the position of each winding pair at the beginning of each cycle n can be obtained and stored in a memory of any suitable controller, such as controller 1090 (Fig. 10). In an exemplary embodiment, the controller 1090 can be part of a cluster control structure as described in U.S. Patent Application Serial No. 11/178,615, filed on Jul. <RTIgt; in. In order to obtain the position of the iron element 105, the controller can determine which windings are closed or partially closed, which windings use the recorded position of the closed winding pair as a baseline measurement, and which winding pairs are increased or decreased by the formula [1] The distance between the measured period n and the recorded position. In an alternative embodiment, the information obtained from the sensor can be used to measure the position of the iron element 105 in any suitable manner. It should be noted that the controller described herein coupled to one or more exemplary sensors can include a computer readable generation embodied in a computer readable medium. Codes for the calculations and controls described herein.
在一個示範性實施例中,鐵芯的位置可通過諸如計算週期性信號A、B的跳變次數而測量到;感測器100可結合電動機使用,其中感測器100的週期n與電動機的電週期匹配,所以電動機可在上電情況下無需知道絕對位置而整流。電動機的示例包括但不局限於無刷或有刷直流電動機,和無刷或有刷交流電動機。In an exemplary embodiment, the position of the core may be measured by, for example, calculating the number of transitions of the periodic signals A, B; the sensor 100 may be used in conjunction with an electric motor, wherein the period n of the sensor 100 is related to the motor The electrical cycle is matched so that the motor can be rectified without knowing the absolute position at power-on. Examples of electric motors include, but are not limited to, brushless or brushed DC motors, and brushless or brushed AC motors.
現參照圖1A、1B和2B,感應電壓信號A、B的幅度取決於沿諸如Y軸(第二軸)測量到的鐵元件105和鐵芯的間隙G(見圖1A和1B)。圖2B中能夠看出,該圖示出了信號A、B的絕對值|A|、|B|各自的幅度與沿Y軸的間隙G之間的關係。在此示例中,沿縱坐標軸繪製出了A、B絕對值之和,同時沿圖表的橫坐標軸繪製出了沿Y軸的距離或間隙G。絕對值|A|或|B|的幅度越大或絕對值|A|和|B|的和越大,間隙G就越小。1A, 1B and 2B, the magnitudes of the induced voltage signals A, B are dependent on the gap G (see Figs. 1A and 1B) of the iron member 105 and the core measured along, for example, the Y-axis (second axis). As can be seen in Fig. 2B, the figure shows the relationship between the respective amplitudes of the absolute values |A|, |B| of the signals A, B and the gap G along the Y-axis. In this example, the sum of the absolute values of A and B is plotted along the ordinate axis, and the distance or gap G along the Y axis is plotted along the abscissa axis of the graph. The larger the amplitude of the absolute value |A| or |B| or the larger the sum of the absolute values |A| and |B|, the smaller the gap G.
同樣,鐵元件150和鐵芯103沿諸如Y軸的間隙可通過諸如下列方程式從兩個電壓信號A、B中得出。Also, the gap between the iron member 150 and the iron core 103 along, for example, the Y-axis can be derived from the two voltage signals A, B by, for example, the following equation.
其中y為鐵元件105和鐵芯103之間沿y軸測量到的間隙,A和B是由感測器100產生的兩個感應電壓信號,y0 和KX 為在y方向上行程的校準常數,|A|和|B|分別為信號A和B的絕對值。需注意到,關於計算間隙G的示範性方程式[2]可在預期的工作點周圍線性化。在備選實施例中,可利用任意適合的方程式和/或值計算鐵元件105的位置和間隙G。Where y is the gap measured between the iron element 105 and the core 103 along the y-axis, A and B are the two induced voltage signals generated by the sensor 100, and y 0 and K X are the calibrations of the stroke in the y direction The constants, |A| and |B| are the absolute values of signals A and B, respectively. It is noted that the exemplary equation [2] for calculating the gap G can be linearized around the expected operating point. In alternative embodiments, the position and gap G of the iron element 105 can be calculated using any suitable equation and/or value.
至此,示範性實施例已就有關活動物體104在二維度內(即沿x軸和物體104與芯103之間的空氣間隙)的位置測量做出了描述。但在另一示範性實施例中,感測器100可用於獲得活動物體在大於兩個維度中的位置測量。例如,參照圖3,繞組裝置可沿任意適合數量的軸分佈。在此示例中,繞組裝置300-311沿x軸和z軸(第三軸)分佈。應當認識到,使用x軸和z軸實際上僅作為示範,而且任意適合的軸都可使用。在此示範性實施例中,x軸和z軸彼此正交,但在備選實施例中,軸之間可具有任意適合的角度關係。例如,軸之間可具有大於或小於90度的角度關係。在圖3所示的示範性實施例中,示出了繞組裝置300-311是以網格圖形排布,但在備選實施例中,繞組裝置300-311可以任意適合圖形排布,這些型式包括但不局限於「L」型圖形,「T」型圖形或十字型圖形。在此示範性實施例中,正如下文將要描述的那樣,各繞組裝置的初級繞組和次級繞組和鐵元件可具有適合的大小和形狀,繞組裝置相對於彼此之間可具有適合的間距,以便相對於x軸和z軸產生了大體上為鋸齒狀的輸出分佈曲線。To this end, the exemplary embodiment has described the positional measurement of the movable object 104 within two dimensions (i.e., along the x-axis and the air gap between the object 104 and the core 103). However, in another exemplary embodiment, the sensor 100 can be used to obtain a position measurement of a moving object in more than two dimensions. For example, referring to Figure 3, the winding arrangement can be distributed along any suitable number of axes. In this example, winding devices 300-311 are distributed along the x-axis and the z-axis (third axis). It will be appreciated that the use of the x-axis and the z-axis is practically exemplary only, and any suitable shaft may be used. In this exemplary embodiment, the x-axis and the z-axis are orthogonal to each other, but in alternative embodiments, there may be any suitable angular relationship between the axes. For example, the shafts may have an angular relationship greater than or less than 90 degrees. In the exemplary embodiment shown in FIG. 3, winding arrangements 300-311 are shown in a grid pattern, but in alternative embodiments, winding devices 300-311 can be arranged in any suitable pattern, these patterns Including but not limited to "L" type graphics, "T" type graphics or cross graphics. In this exemplary embodiment, as will be described below, the primary and secondary windings and the iron elements of each winding arrangement can have a suitable size and shape, and the winding means can have a suitable spacing relative to each other so that A substantially zigzag output profile is produced relative to the x-axis and the z-axis.
在此示例中,諸如裝置300-303的繞組裝置通過基本與上文所述關於圖1A和1B的方式相同的方式沿x軸設置。例如,繞組裝置300-303分別具有的初級繞組300P-303P和次級繞組300S-303S。次級繞組300S可與匯流排107連接並產生電壓信號A,次級繞組301S可與匯流排108連接並產生電壓信號B,次級繞組302S可與匯流排107連接並產生電壓信號A,等。圖4中能夠看到,如下文所述,次級繞組同樣可與匯 流排407、408連接以便測量沿Z軸的距離。In this example, winding devices such as devices 300-303 are disposed along the x-axis in substantially the same manner as described above with respect to Figures 1A and 1B. For example, winding devices 300-303 have primary windings 300P-303P and secondary windings 300S-303S, respectively. The secondary winding 300S can be coupled to the bus bar 107 and produce a voltage signal A, the secondary winding 301S can be coupled to the bus bar 108 and produce a voltage signal B, the secondary winding 302S can be coupled to the bus bar 107 and produce a voltage signal A, and the like. As can be seen in Figure 4, as described below, the secondary windings can also be combined with sinks. Rows 407, 408 are connected to measure the distance along the Z axis.
諸如繞組裝置300、304、308的繞組裝置以相似的方式沿Z軸設置。例如,繞組裝置300、304、308同樣具有初級繞組300P、304P、308P和次級繞組300S、304S、308S,這樣使得次級繞組300S、304S、308S與匯流排107相連以便產生電壓信號A。但如圖4所示,次級繞組300S、304S、308S同樣可與電壓匯流排407和408相連以便分別產生電壓信號C和D。諸如繞組300S、304S、308S的次級繞組可通過交流方式與匯流排407、408相連,這樣使得繞組300S可與匯流排407相連以便產生電壓信號C,繞組304S可與匯流排408相連以便產生電壓信號D,繞組308S可與匯流排407相連以便產生電壓信號D,等。需注意到,如上文所述,電壓信號A和B可用於測量沿X軸的距離,而如下文將要描述的那樣,電壓信號C和D可用於測量沿Z軸的距離。應注意到,圖3示出的次級繞組中,只有一些具有為清楚起見的附圖標記,但所有次級繞組都以各次級繞組分別產生的電壓信號A、B、C、D標記。Winding devices such as winding devices 300, 304, 308 are arranged along the Z-axis in a similar manner. For example, the winding arrangements 300, 304, 308 also have primary windings 300P, 304P, 308P and secondary windings 300S, 304S, 308S such that the secondary windings 300S, 304S, 308S are connected to the busbar 107 to produce a voltage signal A. However, as shown in FIG. 4, secondary windings 300S, 304S, 308S can also be coupled to voltage busses 407 and 408 to generate voltage signals C and D, respectively. Secondary windings such as windings 300S, 304S, 308S may be coupled to busbars 407, 408 by means of an alternating current such that winding 300S may be coupled to busbar 407 for generating a voltage signal C, which may be coupled to busbar 408 for voltage generation. Signal D, winding 308S can be coupled to bus bar 407 to generate voltage signal D, and the like. It is noted that as described above, voltage signals A and B can be used to measure the distance along the X-axis, and as will be described below, voltage signals C and D can be used to measure the distance along the Z-axis. It should be noted that only some of the secondary windings shown in Figure 3 have reference numerals for clarity, but all secondary windings are labeled with voltage signals A, B, C, D respectively generated by the respective secondary windings. .
當鐵元件105在繞組裝置300-311附近移動時,與圖2A中所示的相似的大體為鋸齒形的信號可在X軸上產生。在X軸上,信號A和B的幅度取決於鐵元件105與各繞組裝置300-311的鐵芯103之間的間隙。在備選實施例中,鐵元件和繞組裝置可配置為生成任意適合形狀的信號。同樣,如上文所述,鐵元件沿X軸的位置可關於方程式[1]計算,並且間隙可關於方程式[2]計算。在備選實施例中,位置和間隙可通過 任意適合方式計算。When the iron element 105 is moved around the winding arrangement 300-311, a substantially zigzag-like signal similar to that shown in Figure 2A can be produced on the X-axis. On the X-axis, the magnitude of the signals A and B depends on the gap between the iron element 105 and the core 103 of each winding arrangement 300-311. In an alternative embodiment, the iron element and winding arrangement can be configured to generate a signal of any suitable shape. Also, as described above, the position of the iron element along the X axis can be calculated with respect to equation [1], and the gap can be calculated with respect to equation [2]. In an alternative embodiment, the position and clearance can be passed Calculate in any suitable way.
同樣,如圖5A所示的大體為鋸齒狀的信號可在Z軸上產生。在Z軸上,信號C和D的幅度取決於鐵元件105與各個繞組裝置300-311的鐵芯103之間的間隙G。圖5A能夠看出,該圖示出了次級繞組中輸出或感應電壓C、D的示範性圖表。沿縱坐標軸繪製了電壓C、D的幅度,同時沿圖中的橫坐標軸繪製了沿Z軸的行程距離。當鐵元件105沿Z軸通過靠近各繞組對的位置時,感應電壓產生具有基本為鋸齒狀分佈曲線的輸出信號。如上文所述,在備選實施例中,鐵元件和繞組裝置可配置為產生任意適合形狀的信號。從圖5A中可以看出,兩個輸出信號C、D基本具有正弦/余弦關係,其相位移動了繞組對間距的距離。由於各繞組對的次級繞組102沿Z軸具有交變極性,兩信號C、D中每一個週期n為間距的4倍或4P’。在備選實施例中,各信號C、D的週期n可大於或小於4P’。可實現沿Z軸的間距P’基本於沿X軸的間距P相等。在備選實施例中,間距P’可大於或小於間距P,所以各軸可具有不同的感測器解析度。Similarly, a substantially jagged signal as shown in Figure 5A can be produced on the Z-axis. On the Z-axis, the magnitude of the signals C and D depends on the gap G between the iron element 105 and the core 103 of each winding arrangement 300-311. As can be seen in Figure 5A, this figure shows an exemplary graph of the output or induced voltages C, D in the secondary winding. The amplitudes of the voltages C and D are plotted along the ordinate axis, and the travel distance along the Z axis is plotted along the abscissa axis in the figure. When the iron element 105 passes the position near the pair of windings along the Z axis, the induced voltage produces an output signal having a substantially zigzag distribution curve. As described above, in alternative embodiments, the iron element and winding arrangement can be configured to generate a signal of any suitable shape. As can be seen from Figure 5A, the two output signals C, D have substantially a sine/cosine relationship, the phase of which shifts the distance of the windings to the pitch. Since the secondary winding 102 of each winding pair has an alternating polarity along the Z-axis, each of the two periods C, D is 4 times or 4P' of the pitch. In an alternative embodiment, the period n of each of the signals C, D may be greater than or less than 4P'. It is achieved that the pitch P' along the Z axis is substantially equal to the pitch P along the X axis. In alternative embodiments, the pitch P' may be greater or less than the pitch P, so each axis may have a different sensor resolution.
鐵元件150沿Z軸運動的位置可通過諸如下列方程式,從電壓信號C、D中得出。The position at which the iron member 150 moves along the Z axis can be derived from the voltage signals C, D by equations such as the following.
其中z為鐵元件105沿z軸所測量到的位置,C和D是由感測器100產生的兩個感應電壓信號,z0 和Kz 為在z方向 上行程的校準常數,|C|和|D|分別為信號C和D的絕對值。Where z is the position measured by the iron element 105 along the z-axis, C and D are the two induced voltage signals generated by the sensor 100, z 0 and K z are the calibration constants for the stroke in the z direction, |C| And |D| are the absolute values of signals C and D, respectively.
需要注意到公式[3]可在一個週期n或間距的4倍4P’內沿Z軸提供連續的位置資訊。在一個實施例中,感應器100可用作增量式編碼器,其中,在Z方向上沿無限的行程長度,能夠基於週期性信號C、D的跳變次數得到鐵元件105的絕對位置。在其他實施例中,各繞組對在每一週期n之初的位置可在任意適合控制器的記憶體中得到和儲存。為了得到鐵元件105的位置,該控制器可測定哪些繞組對回路閉合或部分閉合,哪些繞組對回路使用閉合的繞組對的已記錄位置作為基線測量,哪些繞組對增加或減少在由諸如公式[3]測定的週期n中與繞組對的已記錄位置之間的距離。在備選實施例中,從感測器處得到的資訊可以任意適合的方式用於測量鐵元件105沿Z軸的位置。It should be noted that equation [3] provides continuous positional information along the Z-axis within a period n or 4 times 4P' of the pitch. In one embodiment, the inductor 100 can be used as an incremental encoder in which the absolute position of the iron element 105 can be derived based on the number of transitions of the periodic signals C, D along an infinite stroke length in the Z direction. In other embodiments, the position of each winding pair at the beginning of each cycle n can be obtained and stored in the memory of any suitable controller. In order to obtain the position of the iron element 105, the controller can determine which windings are closed or partially closed to the loop, which windings use the recorded position of the closed pair of windings as a baseline measurement, and which winding pairs are increased or decreased in a formula such as [ 3] The distance between the measured period n and the recorded position of the winding pair. In an alternative embodiment, the information obtained from the sensor can be used to measure the position of the iron element 105 along the Z-axis in any suitable manner.
圖5B中能夠看出,該圖示出了信號C、D的絕對值|C|、|D|分別沿Z軸的幅度與沿Y軸的間隙G之間的關係。在此示例中,沿縱坐標軸繪製出了C、D絕對值的和,同時沿圖表的橫坐標軸繪製出了沿Y軸的距離或間隙G。絕對值|C|或|D|的幅度越大或絕對值|C|和|D|的和越大,間隙G就越小。同樣,可利用諸如方程式[2]或諸如下列方程式計算間隙。As can be seen in Fig. 5B, the graph shows the relationship between the amplitudes of the absolute values |C|, |D| of the signals C, D along the Z-axis and the gap G along the Y-axis, respectively. In this example, the sum of the absolute values of C and D is plotted along the ordinate axis, while the distance or gap G along the Y axis is plotted along the abscissa axis of the graph. The larger the amplitude of the absolute value |C| or |D| or the larger the sum of the absolute values |C| and |D|, the smaller the gap G. Also, the gap can be calculated using, for example, equation [2] or such as the following equation.
其中y為鐵元件105和鐵芯103之間沿y軸測量到的間隙,C和D是由感測器100產生的兩個感應電壓信號,y0 和Ky 為在y方向上行程的校準常數,|C|和|D|分別為信號C和D 的絕對值。需注意到,關於計算間隙G的示範性方程式[3]可在預期的工作點周圍線性化。如上文提到的,在備選實施例中,可利用任意適合的方程式和/或值計算鐵元件105的位置和間隙G。Where y is the gap measured between the iron element 105 and the core 103 along the y-axis, C and D are the two induced voltage signals generated by the sensor 100, and y 0 and K y are the calibrations of the stroke in the y direction The constants, |C| and |D| are the absolute values of signals C and D, respectively. It is noted that the exemplary equation [3] for calculating the gap G can be linearized around the expected operating point. As mentioned above, in alternative embodiments, the position and gap G of the iron element 105 can be calculated using any suitable equation and/or value.
在另一示範性實施例中,參照圖6,感測器600可利用霍爾效應感測器進行多維位置測量。該霍爾效應感測器可為任意適合的霍爾效應感測器。霍爾效應感測器610a-610n可沿活動物體604的行程方向C’以相等間隔分佈。例如,霍爾效應感測器610a-610n可間隔間距P",其中間距P"可為取決於感應器600解析度的任意適合距離。In another exemplary embodiment, referring to FIG. 6, the sensor 600 can perform multi-dimensional position measurement using a Hall effect sensor. The Hall effect sensor can be any suitable Hall effect sensor. Hall effect sensors 610a-610n may be distributed at equal intervals along the travel direction C' of the moving object 604. For example, Hall effect sensors 610a-610n may be spaced apart by a pitch P", where pitch P" may be any suitable distance that depends on the resolution of inductor 600.
在此示例中,具有適合形狀和大小的磁鐵可附接於活動物體604。但在備選實施例中,能夠產生能被霍爾效應感測器感應的場的任意適合場發生的物體可附接於活動物體604。在活動物體沿通道C’移動時,在諸如X方向上,當磁鐵經過相應的一個感測器610a-610n附近時,霍爾效應感測器610a-610n探測磁鐵620的磁場密度,當磁鐵620經過霍爾效應感測器610a-610n時,感測器610a-610n產生如圖8A所示的大體上為正弦曲線型的輸出信號E。能夠通過計算信號E的週期測定沿X軸的距離,信號E的週期可通過霍爾效應感測器輸出的極大值和/或極小值測定。在備選實施例中,輸出E的週期可以任意方式計算。在其他的備選實施例中,各個霍爾效應感測器沿諸如X軸或任意其他適合的軸的位置可在諸如與感測器600連接的控制器的記憶體中得到和記錄。活動物體604的大概位置可通過測定哪一霍爾效應感測器正在 輸出信號而測定。活動物體位於霍爾效應感測器之間時,能通過將活動物體距離進行插值操作而得到更精確的沿X軸的距離(即活動物體在間距P"內的位置)。此插值替換的或改進的距離可通過利用任意適合的插值技術得到。在該技術中,週期數或有源霍爾效應感測器的位置與插值結果相加或相減,以便精確測定活動物體沿諸如X軸的位置。In this example, a magnet having a suitable shape and size can be attached to the movable object 604. In an alternative embodiment, however, an object capable of generating any suitable field that can be induced by the Hall effect sensor can be attached to the moving object 604. As the moving object moves along the channel C', the Hall effect sensors 610a-610n detect the magnetic field density of the magnet 620 as the magnet 620, such as in the X direction, as the magnet passes near a respective one of the sensors 610a-610n. Upon passing through the Hall effect sensors 610a-610n, the sensors 610a-610n produce a substantially sinusoidal output signal E as shown in Figure 8A. The distance along the X-axis can be determined by calculating the period of the signal E, which can be determined by the maximum and/or minimum values output by the Hall effect sensor. In an alternative embodiment, the period of output E can be calculated in any manner. In other alternative embodiments, the position of each Hall effect sensor along a device such as the X-axis or any other suitable axis may be obtained and recorded in a memory such as a controller coupled to sensor 600. The approximate location of the active object 604 can be determined by determining which Hall effect sensor is It is measured by outputting a signal. When the moving object is located between the Hall effect sensors, the more accurate distance along the X axis (ie, the position of the moving object within the distance P" can be obtained by interpolating the distance of the moving object. This interpolation replaces or The improved distance can be obtained by using any suitable interpolation technique. In this technique, the number of cycles or the position of the active Hall effect sensor is added or subtracted from the interpolation result to accurately measure the moving object along the X-axis, for example. position.
參照圖8B,信號E的幅度取決於活動物體604、與活動物體附接的磁鐵620和霍爾效應感測器610a-610n之間的間隙G。例如,信號E的幅度越大,活動物體604就越接近霍爾效應感測器610a-610n,反之亦然。在此示例中的間隙G為沿Y軸,但需再次注意,用於描述示範性實施例的軸實際上僅具有示範作用,而且能由任意適合的軸或坐標系代替。在一個示範性實施例中,間隙G和活動物體604的距離可借助諸如與霍爾效應感測器610a-610b感應到的磁通密度大小相關的查找表計算。在其他示範性實施例中,可利用大體上與上述方式相同且與方程式[2]和[4]相關的方式計算該間隙。在其他的備選實施例中,可利用任意適合的方程式或表格計算該間隙。Referring to Figure 8B, the magnitude of the signal E depends on the active object 604, the magnet 620 attached to the moving object, and the gap G between the Hall effect sensors 610a-610n. For example, the greater the amplitude of the signal E, the closer the active object 604 is to the Hall effect sensors 610a-610n and vice versa. The gap G in this example is along the Y-axis, but it is again noted that the axes used to describe the exemplary embodiments have virtually only exemplary functions and can be replaced by any suitable axis or coordinate system. In an exemplary embodiment, the distance of the gap G from the moving object 604 can be calculated by a lookup table such as the magnitude of the magnetic flux density sensed by the Hall effect sensors 610a-610b. In other exemplary embodiments, the gap may be calculated in a manner substantially the same as described above and associated with equations [2] and [4]. In other alternative embodiments, the gap can be calculated using any suitable equation or table.
參照圖7,霍爾效應感測器700-715同樣可沿兩條正交的軸設置,以便進行平面運動測量和活動物體604與霍爾效應感測器間空氣間隙的測量。在備選實施例中,軸彼此間可具有任意適合關係,比如軸之間的角度可大於或小於九十度。在此示例中,為了測量諸如平面X-Z上的平面運動,諸如感測器700-703的霍爾效應感測器可以間距P"'通過基本與上述 關於圖6的方式相似的方式沿X軸設置。諸如感測器700、704、708、712的霍爾效應感測器同樣可以間距P"'沿Z軸設置。儘管此示例中將沿X軸和Z軸的間距描述是相同的,但在備選實施例中,沿不同軸的間距可不相同,以便提供關於不同軸的不同感測器解析度(如精確度)。Referring to Figure 7, Hall effect sensors 700-715 can also be placed along two orthogonal axes for planar motion measurement and measurement of air gaps between moving object 604 and Hall effect sensors. In alternative embodiments, the shafts may have any suitable relationship to each other, such as an angle between the shafts that may be greater or less than ninety degrees. In this example, to measure planar motion such as on plane X-Z, Hall effect sensors such as sensors 700-703 may pass pitch P"' substantially as described above A similar manner to the manner of Figure 6 is provided along the X axis. Hall effect sensors such as sensors 700, 704, 708, 712 can also be placed along the Z axis at a pitch P"'. Although the spacing along the X and Z axes is described in this example to be the same, In alternative embodiments, the spacing along different axes may be different to provide different sensor resolution (e.g., accuracy) with respect to different axes.
當磁鐵620經過霍爾效應感應器700-703附近時,產生了基本與圖8A所示的波形相似的輸出波形。沿X軸的位置能夠通過基本與上述關於8A的方式相似的方式測定。同樣,當磁鐵620經過諸如霍爾效應感測器700、704、708、712附近時,產生了如圖9A所示正弦曲線型輸出F。能夠通過計算信號F的週期測定沿Z軸的距離,信號F的週期可通過諸如霍爾效應感測器輸出的極大值和/或極小值測定。在備選實施例中,輸出E的週期可以任意方式計算。在其他的備選實施例中,各個霍爾效應感測器沿Z軸或任意其他適合的軸的位置可在諸如與感測器600連接的控制器的記憶體中得到和記錄。活動物體604的大概位置可通過測定哪一霍爾效應感測器正在輸出信號而測定。活動物體位於霍爾效應感測器之間時,能通過將活動物體距離進行插值操作而得到更精確的沿Z軸的距離(即活動物體在間距P"'內的位置)。此插值替換的或改進的距離可通過利用任意適合的插值技術得到。在該技術中,週期數或有源霍爾效應感測器的位置與插值結果相加或相減,以便精確地測定活動物體沿諸如Z軸的位置。When the magnet 620 passes near the Hall effect sensors 700-703, an output waveform substantially similar to the waveform shown in Fig. 8A is produced. The position along the X axis can be determined in a manner substantially similar to that described above with respect to 8A. Likewise, when magnet 620 passes near, for example, Hall effect sensors 700, 704, 708, 712, a sinusoidal output F as shown in Figure 9A is produced. The distance along the Z-axis can be determined by calculating the period of the signal F, which can be determined by a maximum value and/or a minimum value such as a Hall effect sensor output. In an alternative embodiment, the period of output E can be calculated in any manner. In other alternative embodiments, the position of each Hall effect sensor along the Z-axis or any other suitable axis may be obtained and recorded in a memory such as a controller coupled to sensor 600. The approximate location of the moving object 604 can be determined by determining which Hall effect sensor is outputting the signal. When the moving object is located between the Hall effect sensors, the more accurate distance along the Z axis (ie, the position of the moving object within the distance P"' can be obtained by interpolating the distance of the moving object. This interpolation is replaced by Or the improved distance can be obtained by using any suitable interpolation technique. In this technique, the number of cycles or the position of the active Hall effect sensor is added or subtracted from the interpolation result in order to accurately measure the moving object along the Z, such as Z The position of the axis.
參照圖9B,如上文所述,信號F的幅度取決於活動物體604、與活動物體附接的磁鐵620和霍爾效應感測器610a-610n 之間的間隙G。在此示例中,間隙G和活動物體604的距離可借助諸如與霍爾效應感測器610a-610b感應到的磁通密度大小相關的查找表計算。在其他備選實施例中,可用大體上與上述方式相似且與方程式[2]和[4]相關的方式計算該間隙。在備選實施例中,可利用任意適合的方程式或表格計算該間隙。Referring to Figure 9B, as described above, the magnitude of the signal F depends on the active object 604, the magnet 620 attached to the moving object, and the Hall effect sensors 610a-610n. The gap between G. In this example, the distance of the gap G from the moving object 604 can be calculated by a lookup table such as the magnitude of the magnetic flux density sensed by the Hall effect sensors 610a-610b. In other alternative embodiments, the gap can be calculated in a manner substantially similar to that described above and associated with equations [2] and [4]. In alternative embodiments, the gap can be calculated using any suitable equation or table.
在其他備選實施例中,感測器600可包括磁壓板以取代磁鐵620。如2008年6月27日申請、標題為多維感測器的美國專利申請所述,該磁壓板可具有多個設置有交變磁極的磁鐵。該專利申請所公開的內容在通過引用整體併入本文。In other alternative embodiments, the sensor 600 can include a magnetic pressure plate in place of the magnet 620. The magnetic pressure plate may have a plurality of magnets provided with alternating magnetic poles, as described in U.S. Patent Application Serial No. 27, filed on Jun. 27, 2008. The disclosure of this patent application is hereby incorporated by reference in its entirety.
在操作中,如上文所述,本文描述的示範性位置測量系統可用在具有機械化輸送工具的設備上,以便諸如將產品從一個位置輸送到另一個位置上。出於示範目的,僅將示範性位置測量系統的操作相對於半導體處理設備進行描述,但需認識到,如上文所述,示範性位置測量系統能夠用於任意適合的設備和/或處理器材。In operation, as described above, the exemplary position measuring system described herein can be used on a device having a mechanized delivery tool, such as to transport a product from one location to another. For exemplary purposes, only the operation of the exemplary position measuring system is described with respect to a semiconductor processing apparatus, but it will be appreciated that the exemplary position measuring system can be used with any suitable device and/or processing equipment as described above.
現參照圖10,其示出了示範性半導體基板處理裝置1010,在該裝置中,使用了所公開的實施例的多個方面。示出了處理裝置1010與具有多個裝載1012的環境前端模組(EFEM)1014。裝載口1012能夠支撐多個基板儲存罐,例如普通FOUP罐;但也可提供任意其他適合類型的罐。EFEM 1014通過負載鎖裝置1016與處理裝置連通。該負載鎖裝置與該處理裝置相連。EFEM 1014(其可與大氣相通)具有能夠將基板從裝載口1012輸送到負載鎖裝置1016的基板輸送裝置(未 示出)。EFEM 1014可還包括基板對準能力,批運送能力,基板和承載器識別能力等。在備選實施例中,負載鎖裝置1016可與裝載口1012對接,比如在負載鎖裝置具有批次處理能力的情形下,或具負載鎖裝置有直接將晶片從FOUP轉移到負載鎖裝置上的能力的情形下。在以下美國專利公開這類裝置的一些實例:6,071,059,6,375,403,6,461,094,5,588,789,5,613,821,5,607,276,5,644,925,5,954,472,6,120,229和2002年7月22日申請的序列號為10/200,818的美國專利申請,上述專利和申請公開內容通過引用整體結合到本文中。在備選實施例中,還可選用其他負載鎖裝置。Referring now to Figure 10, an exemplary semiconductor substrate processing apparatus 1010 is illustrated in which aspects of the disclosed embodiments are utilized. A processing device 1010 is shown with an environmental front end module (EFEM) 1014 having a plurality of loads 1012. The load port 1012 can support a plurality of substrate storage tanks, such as conventional FOUP tanks; however, any other suitable type of tank can be provided. The EFEM 1014 is in communication with the processing device via a load lock device 1016. The load lock device is coupled to the processing device. EFEM 1014 (which can be connected to the atmosphere) has a substrate transport device capable of transporting the substrate from the load port 1012 to the load lock device 1016 (not show). The EFEM 1014 may also include substrate alignment capabilities, batch transfer capabilities, substrate and carrier identification capabilities, and the like. In an alternative embodiment, the load lock device 1016 can interface with the load port 1012, such as where the load lock device has batch processing capabilities, or where the load lock device directly transfers the wafer from the FOUP to the load lock device. In the case of ability. U.S. Patent Application Serial No. 10/200,818, the entire disclosure of which is incorporated herein by reference in its entirety in the U.S.S.S.S.S.S.S.S.S.S.S.S.S.S.S.S.S.S.S.S.S.S. The patent and application disclosures are hereby incorporated by reference in their entirety. In alternative embodiments, other load lock devices may also be used.
仍參照圖10,前面已指出,處理裝置1010可用於處理半導體基板(如200/300mm的晶片或其他大於或小於200/300mm且具有適合大小的晶片),平板顯示器的面板,或任意其他所需類型的基板,處理裝置通常包括輸送室1018,處理模組1020,和至少一個基板輸送裝置1022。示出的實施例中,基板輸送裝置1022與室1018一體設置。在此實施例中,處理模組安裝於室1018的兩邊。在其他實施例中,如圖12所示出的示例,處理模組可安裝於室的一側。圖10示出的實施例中,各處理模組1020彼此相對地安裝於Y1、Y2列或垂直平面內。在其他備選實施例中,處理模組可彼此交錯地排列在輸送室的相反兩側上,或彼此在垂直方向堆疊。輸送裝置1022具有小車1022C,其在室1018內移動,以便將基板在負載鎖裝置1016和處理室1020之間輸送的。在此示出的實施例中,僅設置了一個小車1022C,但在其他備選實施 例中,可設置更多的小車。如圖10所示,輸送室1018(其內部處在真空或惰性氣氛中、或簡單的乾淨環境或這些組合之中)具有一種結構,並且使用基板輸送裝置1022,該基板輸送裝置允許將處理模組以笛卡爾座標設置安裝於室1018內,使得模組基本平行於垂直平面或列。這就導致處理裝置1010具有比同類型傳統處理裝置(即,具有同樣數量處理模組的傳統處理裝置)更緊湊的基底面(如見圖16)。此外,為了提高產能,輸送室1018可以設置任意所需的長度,以便增加任意所需數量的處理模組,這在下面將更詳細講到。輸送室1018還可以支撐在輸送室中所需任意數量的輸送裝置,並允許輸送裝置1022在不相互干擾的情況下到達輸送室1018上的任意所需的處理室1020。這實際上就把處理裝置的產能與輸送裝置的輸送能力分離,因此處理裝置的產能只受處理能力的限制而不受輸送能力的限制。所以,只要在同一平臺上增加處理模組和相應的輸送能力,就可根據需要提高生產率。Still referring to Figure 10, it has been previously noted that the processing device 1010 can be used to process semiconductor substrates (e.g., 200/300 mm wafers or other wafers of suitable size or larger than 200/300 mm), flat panel displays, or any other desired A type of substrate, processing device typically includes a transfer chamber 1018, a processing module 1020, and at least one substrate transport device 1022. In the illustrated embodiment, the substrate transport device 1022 is integrally disposed with the chamber 1018. In this embodiment, the processing modules are mounted on both sides of the chamber 1018. In other embodiments, as illustrated in Figure 12, the processing module can be mounted to one side of the chamber. In the embodiment illustrated in Figure 10, each processing module 1020 is mounted opposite the other in the Y1, Y2 column or vertical plane. In other alternative embodiments, the processing modules may be staggered on opposite sides of the transport chamber, or stacked in a vertical direction from one another. The delivery device 1022 has a cart 1022C that moves within the chamber 1018 to transport the substrate between the load lock device 1016 and the processing chamber 1020. In the embodiment shown here, only one cart 1022C is provided, but in other alternative implementations In this case, more cars can be set. As shown in Figure 10, the transfer chamber 1018 (with its interior in a vacuum or inert atmosphere, or a simple clean environment or combinations thereof) has a structure and uses a substrate transport device 1022 that allows processing of the mold The set is mounted in chamber 1018 in a Cartesian coordinate arrangement such that the modules are substantially parallel to a vertical plane or column. This results in the processing device 1010 having a more compact footprint than conventional processing devices of the same type (i.e., conventional processing devices having the same number of processing modules) (see Figure 16). Additionally, to increase throughput, the transfer chamber 1018 can be set to any desired length to add any desired number of processing modules, as will be described in more detail below. The delivery chamber 1018 can also support any number of delivery devices required in the delivery chamber and allow the delivery device 1022 to reach any desired processing chamber 1020 on the delivery chamber 1018 without interfering with each other. This actually separates the capacity of the processing device from the delivery capacity of the delivery device, so the throughput of the processing device is limited only by the processing capacity and not by the delivery capacity. Therefore, as long as the processing modules and corresponding transport capabilities are added to the same platform, productivity can be increased as needed.
仍參照圖10,在此實施例中,輸送室1018大體為矩形,但備選實施例中,輸運室可為任意其他適合的形狀。室1018具有細長的形狀(即長度遠遠大於寬度),並為輸送裝置在室中界定了一條總體上為直線的輸送通道。室1018具有縱向側壁1018S。側壁1018S上具有在其上穿過而形成的輸送開口或埠1018O。該輸送埠1018O具有足夠的大小,以允許基板穿過埠(可以通過閥門)而進出該輸送室。圖10中可以看出,此實施例的處理模組1020安裝在側壁1018S的外面,並且各處理模組在輸送室中與對應的輸送埠對準。可實現各處理模 組1020圍繞對應的輸送口的週邊並緊靠室1018的側邊1018S而密封,以便保持輸送室內的真空。各處理模組可具有閥門,該閥門可通過任意適合方式控制以便在需要時關閉輸送埠。輸送埠1018O可位於同一水平面內。因此,室上的處理模組同樣與同一水平面對準。在備選實施例中,輸運埠可設置在不同的水平面內。圖10能夠看出,在此實施例中,負載鎖裝置1016安裝于室側邊1018S上兩個最前端的輸送埠上。這就允許了負載鎖裝置在處理裝置前端靠近EFEM1014。在備選實施例中,負載鎖裝置可位於如圖12所示的輸送室的任意其他輸送埠上。六面體形狀的輸送室使得可以按需要選擇室的長度,以便安裝所需列數的處理模組(如:見圖11、13-15中示出的其他實施例,其中輸送室的長度可以容納任意數量的處理模組)。Still referring to Fig. 10, in this embodiment, the delivery chamber 1018 is generally rectangular, but in alternative embodiments, the delivery chamber can be any other suitable shape. The chamber 1018 has an elongated shape (i.e., a length that is much greater than the width) and defines a generally linear delivery passageway in the chamber for the delivery device. The chamber 1018 has a longitudinal side wall 1018S. The side wall 1018S has a delivery opening or weir 1018O formed therethrough. The transfer port 1018O is of sufficient size to allow the substrate to pass into and out of the transfer chamber through the weir (which may be through a valve). As can be seen in Figure 10, the processing module 1020 of this embodiment is mounted outside of the side wall 1018S, and each processing module is aligned with the corresponding transport port in the transfer chamber. Can realize each processing mode The set 1020 is sealed around the perimeter of the corresponding delivery port and against the side 1018S of the chamber 1018 to maintain a vacuum within the delivery chamber. Each processing module can have a valve that can be controlled by any suitable means to close the delivery weir as needed. The transport crucible 1018O can be located in the same horizontal plane. Therefore, the processing modules on the chamber are also aligned with the same horizontal plane. In an alternative embodiment, the transport crucibles can be placed in different horizontal planes. As can be seen in Figure 10, in this embodiment, the load lock device 1016 is mounted to the two forwardmost transport ports on the side 1018S of the chamber. This allows the load lock device to be located near the EFEM 1014 at the front end of the processing device. In an alternative embodiment, the load lock device can be located on any other transport port of the delivery chamber as shown in FIG. The hexahedral shaped transfer chamber allows the length of the chamber to be selected as needed to accommodate the desired number of rows of processing modules (eg, as shown in other embodiments shown in Figures 11 and 13-15, wherein the length of the transfer chamber can be Accommodate any number of processing modules).
如之前所提到的,在圖10中示出的該實施例中,輸送室1018設置了一個具有單個小車1022C的基板輸送裝置1022。輸送裝置1022與該室形成一體,以便使小車1022C在室的前端1018F和後端1018B間前後平移。輸送裝置1022配置了具有末端執行器的小車1022C,以便夾持一個或多個基板。輸送裝置1022的小車1022C同樣具有鉸接臂或活動輸送機構1022A,用於伸縮末端執行器,以便拾取或釋放處理模組或負載鎖裝置上的基板。為了在處理模組/裝載口上拾取或釋放基板,輸送裝置1022可與所需的模組/埠對齊,並且該臂通過對應的埠1018O伸長/縮回,以便為了基板的拾取/釋放而將末端執行器定位與該模組/埠內As previously mentioned, in the embodiment illustrated in Figure 10, the transfer chamber 1018 is provided with a substrate transport device 1022 having a single cart 1022C. The delivery device 1022 is integral with the chamber to cause the carriage 1022C to translate back and forth between the forward end 1018F and the rear end 1018B of the chamber. The delivery device 1022 is configured with a cart 1022C having an end effector to hold one or more substrates. The cart 1022C of the transport device 1022 also has an articulated arm or movable transport mechanism 1022A for telescoping the end effector to pick up or release the substrate on the processing module or load lock device. To pick up or release the substrate on the processing module/loading port, the delivery device 1022 can be aligned with the desired module/埠 and the arm is extended/retracted by the corresponding 埠1018O to end the substrate for picking/releasing. Actuator positioning and the module/埠
圖10所示的輸送裝置1022為典型的輸送裝置,包括由線性支架/驅動導軌支撐的小車1022C。該輸送裝置可與美國專利公開號2004/0151562(先前已通過引用併入)中描述的磁懸浮輸送裝置基本相似,但也可使用任意適合的線性或旋轉輸送裝置。該線性支架/驅動導軌可安裝在輸送室的側壁1018S、底面或頂部,並且可擴展室的長度。這就允許了小車1022C,因而也允許該裝置在室的長度上來回移動。該小車具有框架,且該框架支撐該臂。該框架同樣支撐與框架一起或相對於框架移動的腳輪托板或壓板1022B。任意適合的電動機,比如順序同步線性電動機,可沿導軌驅動壓板從而驅動小車。在此示範性實施例中,臂通過適合的連桿機構/傳動機構可操作地連接於壓板1022B,所以當壓板通過驅動電動機以彼此間的相對運動進行移動時,該臂就伸長或收縮。例如,設置傳動結構,以便使壓板沿導軌移開時,臂向左邊延伸,而壓板移回靠在一起時,臂從左邊縮回。壓板還可適合由線性電動機操作,以便使臂1022A向右邊延伸/從右邊縮回。The delivery device 1022 shown in Figure 10 is a typical delivery device that includes a cart 1022C supported by a linear bracket/drive rail. The delivery device can be substantially similar to the magnetic levitation delivery device described in U.S. Patent Publication No. 2004/0151562, which is incorporated herein by reference in its entirety, but any suitable linear or rotary delivery device can be used. The linear bracket/drive rail can be mounted to the side wall 1018S, bottom or top of the transfer chamber and can extend the length of the chamber. This allows the cart 1022C to also allow the device to move back and forth over the length of the chamber. The cart has a frame and the frame supports the arm. The frame also supports a caster plate or platen 1022B that moves with or relative to the frame. Any suitable motor, such as a sequential synchronous linear motor, can drive the platen along the rail to drive the cart. In this exemplary embodiment, the arms are operatively coupled to the platen 1022B by a suitable linkage/transmission mechanism such that the arms elongate or contract as the platen moves by relative motion with respect to each other by the drive motor. For example, the transmission structure is arranged such that when the pressure plate is moved along the guide rail, the arms extend to the left, and when the pressure plates are moved back together, the arms are retracted from the left side. The platen may also be adapted to be operated by a linear motor to extend the arm 1022A to the right/retract from the right.
通過上述的位置測量系統可完成壓板和線性電動機在滑軌上的位置控制,和壓板、小車、臂的伸縮位置的位置感應。例如,場發生元件或壓板MP可與上述的鐵元件105或磁鐵相似,可固定於輸送壓板1022A、1022B或為輸送壓板的一部分,以便使得壓板MP產生的場集中於室1018的側邊1018S。感測器S,例如變壓器109或霍爾效應感測器610a-610n或圖3和圖7中分別示出的它們的平面等效物,可通過上述方式沿室1018的側邊上的小車1022C和輸送壓板 1022A、1022B的通路佈置。需注意到,只有少數感測器組S在圖中為了清晰起見而示出。還需注意的是,任意不同的上述位置感應系統可單獨或以任意組合的方式使用,從而能夠精確地測定小車的位置。Through the above position measuring system, the position control of the pressure plate and the linear motor on the slide rail and the position sensing of the telescopic position of the pressure plate, the trolley and the arm can be completed. For example, the field generating element or platen MP can be similar to the iron element 105 or magnet described above, can be secured to the delivery platens 1022A, 1022B, or be part of the delivery platen such that the field created by the platen MP is concentrated at the sides 1018S of the chamber 1018. Sensors S, such as transformer 109 or Hall effect sensors 610a-610n or their planar equivalents shown in Figures 3 and 7, respectively, can be placed along the side of chamber 1018 in the manner described above. 1022C and conveying platen Path arrangement of 1022A, 1022B. It should be noted that only a few sensor groups S are shown in the figures for clarity. It should also be noted that any of the above-described position sensing systems can be used alone or in any combination, so that the position of the cart can be accurately determined.
控制器1090可配置為按順序地掃描感測器S以便進行輸出,同時位於點1080上的感測器配置為第一個被掃描的感測器,從而將小車1022C的位置定位回點1080上以便提供絕對位置測量。如上文所述,各感測器S可與室1018內的任意適合基準點間隔預定距離而定位,所以當場發生器MP經過任意給定的感測器時,場發生器MP的位置就能大致地得出。在其他示範性實施例中,如上文所述,場發生器MP的位置可通過計算感測器S產生的輸出的週期而大致地得出。如上文所述,場發生器或壓板MP和小車的更精確的位置測定能夠通過數學方法處理感測器的輸出而得到。由於各個壓板1022A、1022B包括場發生器MP,所以能夠單獨地測定各個壓板1022A、1022B的位置,這就使得壓板1022A、1022B可在一個方向上一起被驅動以便在輸送室的縱向上移動整個小車/裝置,或壓板被單獨地驅動而使小車1022C運載的臂伸長或縮回。還需注意到,如上文所述,能夠測量小車1022C相對於室壁1018S的位置(如牆和小車間的空氣間隙),因而該位置可由控制器1090調整,這就使得小車位於壁之間的預定位置上,以便有助於處理模組1020內基板的精確放置。The controller 1090 can be configured to sequentially scan the sensor S for output while the sensor located at point 1080 is configured as the first scanned sensor, thereby positioning the position of the cart 1022C back to point 1080 Up to provide absolute position measurement. As described above, each sensor S can be positioned a predetermined distance from any suitable reference point within the chamber 1018, so that when the field generator MP passes any given sensor, the position of the field generator MP can be approximated. Draw. In other exemplary embodiments, as described above, the position of the field generator MP can be roughly derived by calculating the period of the output produced by the sensor S. As described above, more accurate position determination of the field generator or platen MP and cart can be obtained by mathematically processing the output of the sensor. Since each of the pressure plates 1022A, 1022B includes the field generator MP, the positions of the respective pressure plates 1022A, 1022B can be individually determined, which allows the pressure plates 1022A, 1022B to be driven together in one direction to move the entire small length in the longitudinal direction of the delivery chamber. The vehicle/device, or platen, is individually driven to elongate or retract the arm carried by the cart 1022C. It should also be noted that, as described above, the position of the cart 1022C relative to the chamber wall 1018S (e.g., the air gap between the wall and the small workshop) can be measured, and thus the position can be adjusted by the controller 1090, which allows the cart to be located at the wall. The predetermined position is to facilitate the precise placement of the substrate within the processing module 1020.
圖11示出了基板處理裝置1010'的另一實施例,其總體上與裝置1010相似。在此實施例中,輸送室1018'具有兩個 輸送裝置1122A、1122B。輸送裝置1122A、1122B基本與上述的關於圖10的裝置1022相同。如先前所述,兩個輸送裝置1122A、1122B都可由共同的一組縱向滑軌支撐。對應於各裝置的小車壓板可由同一線性電動機驅動。線性電動機上的不同驅動區域允許單獨驅動各小車上的單個壓板,因而就允許單獨驅動各單獨的小車1122A、1122B。可以意識到,通過與前述方式相似的方式使用線性電動機單獨地使各裝置的臂伸長/縮回。但是,在這種情況下,如不使用單獨的滑動系統,基板輸送裝置1122A、1122B就不能在輸送室內相互通過。如上文所述,小車的各個壓板可包括與固定在室壁1018S'上的感測器S進行交互的場發生器或壓板MP。在此示範性實施例中,處理模組1020位於沿輸送室長度的位置上,所以基板可按順序輸送到一個或多個處理模組中進行處理,這就避免了輸送裝置彼此間的干擾。例如,用於塗覆的處理模組可設置於加熱模組之前,冷卻模組和蝕刻模組設置在最後。FIG. 11 illustrates another embodiment of a substrate processing apparatus 1010' that is generally similar to apparatus 1010. In this embodiment, the delivery chamber 1018' has two Conveying devices 1122A, 1122B. Conveying devices 1122A, 1122B are substantially identical to device 1022 described above with respect to FIG. As previously described, both conveyors 1122A, 1122B can be supported by a common set of longitudinal rails. The carriage plate corresponding to each device can be driven by the same linear motor. The different drive zones on the linear motor allow for the individual drive of a single platen on each cart, thus allowing the individual carts 1122A, 1122B to be driven separately. It will be appreciated that the arms of the various devices are individually elongated/retracted using a linear motor in a manner similar to that previously described. However, in this case, the substrate transfer devices 1122A, 1122B cannot pass each other in the transfer chamber without using a separate slide system. As described above, each of the platens of the cart may include a field generator or platen MP that interacts with a sensor S that is fixed to the chamber wall 1018S'. In this exemplary embodiment, the processing module 1020 is located along the length of the transfer chamber so that the substrates can be transported sequentially to one or more processing modules for processing, which avoids interference between the transport devices. For example, the processing module for coating can be placed before the heating module, and the cooling module and the etching module are disposed at the end.
但輸送室1018'可具有另外的輸送區域1018A'、1018B',該輸送區域允許兩個輸送裝置1122A、1122B相互經過(與側導軌、旁通導軌或不需要導軌的磁懸浮區域相似)。在這種情況下,其他輸送區域可位於處理模組所在的水準的上方或下方。在這種情況下,各輸送區域1018A'、1018B'可具有各自的一組感測器S,所以當小車在各輸送區域1018A'、1018B'時,能夠單獨地追蹤小車1122A、1122B的位置。在備選實施例中,兩個輸送區域1018A'、1018B'可共同具有一組感測器。在此實施例中,輸送裝置1122A、1122B具有兩個滑軌3501、 3502,其中各個滑軌與各輸送裝置1122A、1122B對應。滑軌3501、3502可通過諸如一個位於另一個之上的方式設置,其中,僅作為示範,一個滑軌可位於輸送室1018'的底面或側壁,另一個滑軌可位於室1018'的頂部。在備選實施例中,可使用同時驅動並使小車懸浮的線性傳動系統,在該系統中,小車可在豎直方向和水準方向上獨立運動,因此就允許了小車彼此獨立地傳遞或移動基板。需注意到,當小車從彼此的上方/下方穿過以便避免可能損壞輸送工具或輸送工具運載的基板的碰撞時,和壓板MP組合在一起的感測器S能夠用於追蹤各個小車1122A、1122B的豎直位置。However, the transfer chamber 1018' can have additional transport regions 1018A', 1018B' that allow the two transport devices 1122A, 1122B to pass each other (similar to the side rails, bypass rails, or magnetic levitation regions that do not require rails). In this case, other delivery areas may be located above or below the level at which the processing module is located. In this case, each of the transport regions 1018A', 1018B' can have a respective set of sensors S, so that when the cart is in each of the transport regions 1018A', 1018B', the carts 1122A, 1122B can be individually tracked. position. In an alternative embodiment, the two delivery regions 1018A', 1018B' may together have a set of sensors. In this embodiment, the delivery devices 1122A, 1122B have two slide rails 3501. 3502, wherein each of the slide rails corresponds to each of the conveying devices 1122A, 1122B. The rails 3501, 3502 can be disposed, such as by one on top of the other, wherein, by way of example only, one rail can be located on the bottom or side wall of the transport chamber 1018' and the other rail can be located on top of the chamber 1018'. In an alternative embodiment, a linear drive system that simultaneously drives and suspends the cart can be used, in which the cart can move independently in the vertical and horizontal directions, thus allowing the carts to pass independently of each other. Or move the substrate. It should be noted that the sensors S combined with the platen MP can be used to track the respective carts 1122A when the carts pass above/below each other in order to avoid collisions that may damage the transport tool or the substrate carried by the transport tool. , 1122B vertical position.
在所有使用電力繞組的實施例中,這些繞組還可用作電阻加熱器,例如在需要給室加熱來排氣的情況下,例如消除水蒸氣的情況下。在這種情況下,各個輸送裝置可由前文所述相似的專用線性驅動電動機或小車所在的專用驅動區域驅動。In all embodiments where power windings are used, these windings can also be used as electrical resistance heaters, for example in the case where it is desired to heat the chamber to vent, for example to eliminate water vapor. In this case, each of the conveying devices can be driven by a dedicated drive motor or a dedicated drive region in which the trolley is located as described above.
現參照圖14和15,這裏根據其他示範性實施例示出了與本文描述的位置測量系統結合的基板處理裝置。如圖14和15所示,延在這些實施例中,延長了輸送室以便容納增加的處理模組。圖14所示的裝置具有十二(12)個與輸送室1018相連的處理模組1220,圖15中的各個裝置1518A、1518B(示出了兩個裝置)具有二十四(24)個與輸送室1018相連的處理模組1501、1502。這些實施例中示出的處理模組的數量僅作為示範,而且如先前所述,該裝置可具有任意其他數量的處理模組。這些實施例中,處理模組沿輸送室的側邊按笛卡爾座 標設置,這和前面討論過的類似。但在這些情形中,處理模組的列數大大增加了(例如圖14中的裝置有六(6)列,圖15中的各個裝置有十二(12)列)。在圖14的實施例中,可去掉EFEM,同時將裝載口直接與負載鎖裝置配合。圖14和15中的裝置的輸送室具有多個輸送裝置(即在圖14中具有三個裝置,圖15中具有六個裝置),以便在負載鎖裝置和處理室間輸送基板。示出的輸送裝置數量僅僅作為示範,所以可使用更多或更少的裝置。這些實施例中的輸送裝置總體上與前述的輸送裝置相似,包括了臂和小車,其中,使用上述的多維位置測量系統追蹤小車和臂伸長/縮回的位置。但在這種情況下,小車由分區的線性電動機驅動器支撐,該電動機驅動位於諸如輸送室的側壁上。在備選實施例中,該驅動可位於輸送室中的任意適合位置。此處的線性電動機驅動提供小車在兩正交的軸上的平移(即:輸送室的縱向和輸送室的垂直方向)。因此,輸送裝置能夠在輸送室中彼此經過地移動。輸送室可在處理模組的一個或多個平面的上方/下方具有「通路」或輸送區域,通過「通路」或輸送區域,使得輸送裝置處在規定路線上,以便避開固定輸送裝置(即從處理模組拾取/釋放的基板)或反向移動的輸送裝置。能夠實現使基板輸送裝置具有用於控制多個基板輸送裝置運動的控制器(如控制器1090)。Referring now to Figures 14 and 15, a substrate processing apparatus in conjunction with the position measuring system described herein is illustrated herein in accordance with other exemplary embodiments. As shown in Figures 14 and 15, in these embodiments, the delivery chamber is extended to accommodate the added processing module. The apparatus shown in Figure 14 has twelve (12) processing modules 1220 coupled to the transport chamber 1018, and each of the devices 1518A, 1518B (showing two devices) of Figure 15 has twenty-four (24) Processing modules 1501, 1502 connected to the transfer chamber 1018. The number of processing modules shown in these embodiments is merely exemplary, and as previously described, the device can have any other number of processing modules. In these embodiments, the processing module is arranged in a Cartesian seat along the side of the transport chamber. The flag settings, which are similar to those discussed earlier. In these cases, however, the number of columns of processing modules is greatly increased (e.g., the device in Figure 14 has six (6) columns and the devices in Figure 15 have twelve (12) columns). In the embodiment of Figure 14, the EFEM can be removed while the load port is directly mated with the load lock device. The delivery chamber of the apparatus of Figures 14 and 15 has a plurality of delivery devices (i.e., three devices in Figure 14 and six devices in Figure 15) for transporting the substrate between the load lock device and the processing chamber. The number of delivery devices shown is merely exemplary, so more or fewer devices may be used. The delivery device of these embodiments is generally similar to the previously described delivery device, including arms and carts, wherein the multi-dimensional position measurement system described above is used to track the position of the cart and arm extension/retraction. In this case, however, the cart is supported by a zoned linear motor drive that is located on a side wall such as a transport chamber. In an alternative embodiment, the drive can be located at any suitable location in the delivery chamber. The linear motor drive here provides translation of the carriage on two orthogonal axes (i.e., the longitudinal direction of the delivery chamber and the vertical direction of the delivery chamber). Therefore, the conveying devices can move relative to each other in the conveying chamber. The transport chamber may have a "passage" or transport area above/below one or more planes of the processing module, through the "passage" or transport area, such that the transport device is on a prescribed route to avoid the fixed transport device (ie, A substrate that is picked up/released from the processing module) or a transport device that moves in the opposite direction. It is possible to have a substrate transport device having a controller (such as controller 1090) for controlling the movement of a plurality of substrate transport devices.
仍參照圖15,此處的基板處理裝置1518A和1518B可直接與工具1500配合。Still referring to FIG. 15, substrate processing devices 1518A and 1518B herein can be directly mated with tool 1500.
從圖10、11和14-15中認識到,可根據需要延伸輸送室 1018以便貫穿處理設備PF。圖15中可以看出,並如下文將更為詳細地描述那樣:輸送室可與處理設備PF中各種部分或分區連接和連通,例如存儲室、光刻工具、金屬沉積工具或任意其他適合的工具區段。通過輸送室1018相互連接的區段同樣可配置為處理區段或工藝1518A、1518B。各個區段具有所需的工具(如光刻、金屬沉積、熱浸、清潔)以便在半導體工件上完成指定的加工過程。在無論哪種情況下,輸送室,通常指的是輸送室1018,其具有處理模組,處理模組與如先前所述與設備區段中的各種工具對應並可相通地連接於該輸送室,以便允許在室和處理模組之間傳遞半導體工件。因此,輸送室可包含不同的環境條件,比如大氣、真空、超高真空、惰性氣體或任意其他的,這些環境條件遍及輸送室上與輸送室連接的各種處理模組的環境對應的長度內。因而,在指定的工藝或區段1018A、1018B,或在一部分區段內的輸送室部分1018P1可具有一種環境條件(如大氣)等,同時室的另一部分1018P2、1018P3可具有不同的環境條件。如前文所提到的,其中具有不同環境的室上的區域1018P1、1018P2、1018P3可位於設備的不同區段,或全部位於設備上的同一區段。圖15出於示範的目的示出了具有三個或至少三個具有不同環境的部分1018P1、1018P2、1018P3。在此實施例中的室1018可配置具有許多部分,其有許多所需的不同環境。區域1518A、1518B、1018P1、1018P2、1018P3中的每一個可具有如上述的沿各傳輸部分側壁配置的感測器。在備選實施例中,本文描述的示範性位置測量系統的任意組合可用於輸送 部分1518A、1518B、1018P1、1018P2、1018P3的任意一個之中。It is recognized from Figures 10, 11 and 14-15 that the delivery chamber can be extended as needed 1018 to penetrate the processing device PF. As can be seen in Figure 15, and as will be described in more detail below: the delivery chamber can be connected and connected to various portions or partitions in the processing device PF, such as a storage chamber, a lithography tool, a metal deposition tool, or any other suitable Tool section. The sections interconnected by the transfer chamber 1018 can also be configured as process sections or processes 1518A, 1518B. Each section has the required tools (eg, photolithography, metal deposition, hot dip, cleaning) to complete the specified process on the semiconductor workpiece. In either case, the transfer chamber, generally referred to as the transfer chamber 1018, has a processing module that is coupled to and communicatively coupled to the various tools in the equipment section as previously described. In order to allow the transfer of semiconductor workpieces between the chamber and the processing module. Thus, the transfer chamber can contain different environmental conditions, such as atmosphere, vacuum, ultra-high vacuum, inert gas, or any other, such ambient conditions throughout the length of the environment of the various processing modules on the transfer chamber that are coupled to the transfer chamber. Thus, the delivery chamber portion 1018P1 within a specified process or section 1018A, 1018B, or within a portion of the section may have an environmental condition (e.g., atmosphere), etc., while another portion of the chamber 1018P2, 1018P3 may have different environmental conditions. As mentioned previously, the on-chamber areas 1018P1, 1018P2, 1018P3 having different environments may be located in different sections of the device, or all located in the same section on the device. Figure 15 shows, for exemplary purposes, three or at least three portions 1018P1, 1018P2, 1018P3 having different environments. The chamber 1018 in this embodiment can be configured with a number of sections that have many different environments as desired. Each of the regions 1518A, 1518B, 1018P1, 1018P2, 1018P3 may have a sensor disposed along the side walls of each of the transmission portions as described above. In alternative embodiments, any combination of the exemplary position measuring systems described herein can be used for delivery Among the parts 1518A, 1518B, 1018P1, 1018P2, 1018P3.
如圖15所示,與裝置1122A相似的輸送裝置(仍見圖11),在室1018中能夠穿過內部具有不同環境的室部分1018P1、1018P2、1018P3。因此,能從圖15中認識到,輸送裝置1122A利用一次拾取就可以將半導體工件從處理設備的一個工藝或區段1518A移動到處理設備具有不同環境的不同的工藝或區段1518B的工具上。例如,輸送裝置1122A可在處理模組1501中拾取基板,該處理模組可為輸送室1018的區段1018P1中的大氣模組、光刻、蝕刻或任意其他適合的處理模組。然後輸送裝置1122A可按圖15中箭頭X3所示方向,從室部分1018P1移動到部分1018P3。在部分1018P3中,輸送裝置1122A將基板放置到處理模組1502中,該處理模組可為任意適合的處理模組。As shown in Figure 15, a delivery device similar to device 1122A (still see Figure 11) is capable of passing through chamber portions 1018P1, 1018P2, 1018P3 having different environments therein. Thus, it can be appreciated from Figure 15 that the transport device 1122A can utilize a single pick to move a semiconductor workpiece from one process or section 1518A of the processing apparatus to a tool having a different process or section 1518B of a different environment. For example, the transport device 1122A can pick up a substrate in the processing module 1501, which can be an atmospheric module, lithography, etching, or any other suitable processing module in the section 1018P1 of the transport chamber 1018. The delivery device 1122A can then be moved from the chamber portion 1018P1 to the portion 1018P3 in the direction indicated by arrow X3 in FIG. In section 1018P3, the transport device 1122A places the substrate into the processing module 1502, which can be any suitable processing module.
能從圖15中認識到,輸送裝置可以是模組化的,同時室模組以所需的方式連接來形成室1018。模組可包括與圖10中的側壁1018F、1018R相似的內壁1018I,以便分開室中的區域1018P1、1018P2、1018P3、1018P4。內壁1018I可包括溝槽閥門,或允許一個室部分1018P1、1018P4與一個或多個鄰接區域連通的任意其他適合的閥門。溝槽閥門1018V可具有允許一個或多個小車從一個區域1018P1、1018P4穿過該閥門到另一區域的尺寸。這樣,小車1122A就可移動到全室的任何位置。可關閉閥門來使室部分1018P1、1018P2、1018P3、1018P4隔離,所以可如前文所述的那樣,使不同的 部分包含完全不同的環境。此外,如圖10所示,可設置室模組的內壁以便形成負載鎖裝置1018P4。負載鎖裝置1018P4(圖15中僅示出一個作為示例)可適合設置在室1018內,並可將任意適合數量的小車1122A保持在室內。It can be appreciated from Figure 15 that the delivery device can be modular while the chamber modules are connected in a desired manner to form the chamber 1018. The module may include an inner wall 1018I similar to the side walls 1018F, 1018R of Figure 10 to separate the regions 1018P1, 1018P2, 1018P3, 1018P4 in the chamber. The inner wall 1018I can include a grooved valve or any other suitable valve that allows one chamber portion 1018P1, 1018P4 to communicate with one or more contiguous regions. The grooved valve 1018V can have dimensions that allow one or more trolleys to pass from one zone 1018P1, 1018P4 through the valve to another zone. In this way, the cart 1122A can be moved to any position throughout the room. The valve can be closed to isolate the chamber portions 1018P1, 1018P2, 1018P3, 1018P4, so that different ones can be made as described above Part of it contains a completely different environment. Further, as shown in FIG. 10, the inner wall of the chamber module may be disposed to form the load lock device 1018P4. Load lock device 1018P4 (only one of which is shown in FIG. 15 as an example) may be adapted to be disposed within chamber 1018 and any suitable number of carts 1122A may be held indoors.
現參照圖16,其示出了一種使用自動材料轉運系統(AMHS)的示範性製造設備的佈置圖。在此示範性實施例中,工件通過該AMHS,從儲料器1630輸送到了一個或多個處理工具1610上。該AMHS可與一個或多個輸送小車1625和一個輸送導軌1635結合。該輸送導軌1635可為任意適合的輸送導軌。如上文所述,該輸送導軌可包括沿導軌間隔設置的感測器組S。如上文所述,輸送小車1625可包括一個或多個磁性壓板MP,該磁性壓板MP與感測器組S交互,以便提供小車1625的位置測量。Reference is now made to Fig. 16, which shows an arrangement of an exemplary manufacturing apparatus using an automated material transfer system (AMHS). In this exemplary embodiment, the workpiece is conveyed from the hopper 1630 to one or more processing tools 1610 through the AMHS. The AMHS can be combined with one or more transport carts 1625 and a transport rail 1635. The transport rail 1635 can be any suitable transport rail. As described above, the transport rail can include a sensor group S that is spaced apart along the rail. As described above, the transport carriage 1625 can include one or more magnetic pressure plates MP that interact with the sensor group S to provide position measurement of the trolley 1625.
可認識到,物體(例如其位置將被測量或追蹤的小車1625)的位置可使用與物體1625各端鄰近的感測器追蹤,所以控制器能夠適應沿同一輸送通道的多個物體,這些物體彼此跟隨,以避免物體間的接觸。例如,場發生元件105、620(見圖1A-C和6)可配置在小車的角上。在備選實施例中,可使用位於物體1625一端上的感測器追蹤該物體1625,其中物體的長度是已知的。在其他備選實施例中,場發生元件105、620可配置在任意物體上的任意已知位置,在該物體上,能夠由已知的位置計算出物體的邊界。這裏,控制器可利用由本文所描述的位置測量系統得到的物體第一端的位置,並加上或減去物體的長度來測定物體沿輸送通道所占空間的總 量。在其他實施例中,場發生元件可設置在待追蹤物體的任意適合位置上。It can be appreciated that the position of an object (e.g., cart 1625 whose position is to be measured or tracked) can be tracked using sensors adjacent to each end of object 1625, so the controller can accommodate multiple objects along the same transport path, these Objects follow each other to avoid contact between objects. For example, field generating elements 105, 620 (see Figures 1A-C and 6) may be disposed at the corners of the cart. In an alternative embodiment, the object 1625 can be tracked using a sensor located on one end of the object 1625, where the length of the object is known. In other alternative embodiments, the field generating elements 105, 620 can be configured at any known location on any object on which the boundaries of the object can be calculated from known locations. Here, the controller can utilize the position of the first end of the object obtained by the position measuring system described herein, and add or subtract the length of the object to determine the total space occupied by the object along the conveying path. the amount. In other embodiments, the field generating element can be placed at any suitable location of the object to be tracked.
應當認識到,雖然本文描述的實施例是相對於線性傳動系統進行描述的,但實施例能夠適合用在旋轉傳動中。例如,該公開的實施例能用於追蹤圓筒內物體的旋轉速度和軸向位置,並同時用與本文中相對於線性傳動系統而進行描述的方式相似的方式測量旋轉物體和圓筒壁之間的距離。It will be appreciated that while the embodiments described herein are described with respect to a linear drive system, embodiments can be adapted for use in a rotary drive. For example, the disclosed embodiments can be used to track the rotational speed and axial position of an object within a cylinder while simultaneously measuring the rotating object and the cylindrical wall in a manner similar to that described herein with respect to the linear drive system. The distance between them.
本文描述的示範性實施例提供的位置測量系統能夠沿第一軸測量無限的長度,並同時測量沿第二和第三軸的位置,該系統消除了多個感測器之間的轉換。本文描述的位置測量系統能夠與任意適合的輸送裝置結合。儘管本文描述的公開實施例是同時測量兩個或三個軸,但應當認識到,它能夠合併多個測量系統以便測量三個以上的軸。相反,本文描述的實施例同樣可用於和設置為測量少於兩個或三個的軸。同樣應當認識到,本文公開的實施例可單獨使用或將實施例組合起來使用。示範性實施例同樣提供了位置測量系統,在該系統中,不需將能量傳遞到活動物體上就可獲得物體的位置資訊,該位置資訊使得定位系統能適合在移動物體處於諸如真空的情況下應用。位置和間隙測量同樣從移動物體上的固定位置測定,這樣就便於運動控制。The positional measurement system provided by the exemplary embodiments described herein is capable of measuring an infinite length along a first axis and simultaneously measuring positions along the second and third axes, the system eliminating transitions between the plurality of sensors. The position measuring system described herein can be combined with any suitable delivery device. While the disclosed embodiments described herein measure two or three axes simultaneously, it should be appreciated that it is capable of combining multiple measurement systems to measure more than three axes. Rather, the embodiments described herein are equally applicable and configurable to measure less than two or three axes. It should also be appreciated that the embodiments disclosed herein may be used alone or in combination. The exemplary embodiment also provides a position measurement system in which position information of an object can be obtained without transferring energy to a moving object, the position information making the positioning system suitable for a moving object such as a vacuum application. Position and clearance measurements are also measured from a fixed position on the moving object, which facilitates motion control.
應當理解本文描述的示範性實施例可單獨使用或將實施例進行任意適合的組合而使用。同樣應當理解實施例的以上描述只是說明性的。本領域的技術人員可在不脫離實施例的情況下做出各種備選方案和修改。因此,本實施例旨在包含 所有屬於申請專利範圍內的備選方案、修改和變化。It should be understood that the exemplary embodiments described herein can be used alone or in any suitable combination of embodiments. It should also be understood that the above description of the embodiments is merely illustrative. Various alternatives and modifications can be made by those skilled in the art without departing from the embodiments. Therefore, this embodiment is intended to include All options, modifications and variations within the scope of the patent application.
100‧‧‧感測器100‧‧‧ sensor
101‧‧‧初級繞組101‧‧‧Primary winding
102‧‧‧次級繞組102‧‧‧Secondary winding
103‧‧‧鐵芯103‧‧‧ iron core
104‧‧‧活動物體104‧‧‧Active objects
105‧‧‧元件105‧‧‧ components
107、108‧‧‧電壓匯流排107, 108‧‧‧ voltage busbar
109‧‧‧變壓器109‧‧‧Transformers
150‧‧‧鐵元件150‧‧‧iron components
圖1A示出根據本示範性實施例的感測器的側視圖。FIG. 1A illustrates a side view of a sensor according to the present exemplary embodiment.
圖1B示出圖1A中根據本示範性實施例的感測器的俯視圖。FIG. 1B illustrates a top view of the sensor of FIG. 1A according to the present exemplary embodiment.
圖1C示出根據本示範性實施例的感測器的原理圖。FIG. 1C illustrates a schematic diagram of a sensor according to the present exemplary embodiment.
圖2A示出由根據本示範性實施例的感測器產生的輸出信號的圖表。FIG. 2A shows a graph of an output signal generated by a sensor according to the present exemplary embodiment.
圖2B示出說明根據本示範性實施例的感測器輸出和氣隙之間關係的圖表。FIG. 2B shows a graph illustrating a relationship between a sensor output and an air gap according to the present exemplary embodiment.
圖3示出根據本示範性實施例的感測器的示意圖。FIG. 3 shows a schematic diagram of a sensor according to the present exemplary embodiment.
圖4示出根據本示範性實施例的感測器的原理圖。FIG. 4 shows a schematic diagram of a sensor according to the present exemplary embodiment.
圖5A示出由根據本示範性實施例的感測器產生的輸出信號的圖表。FIG. 5A shows a graph of an output signal generated by a sensor according to the present exemplary embodiment.
圖5B示出說明根據本示範性實施例的感測器輸出和氣隙之間關係的圖表。FIG. 5B shows a graph illustrating a relationship between a sensor output and an air gap according to the present exemplary embodiment.
圖6示出根據本示範性實施例的感測器的簡圖。FIG. 6 shows a simplified diagram of a sensor according to the present exemplary embodiment.
圖7示出根據本示範性實施例的感測器的另一簡圖。FIG. 7 shows another schematic diagram of a sensor according to the present exemplary embodiment.
圖8A示出由根據本示範性實施例的感測器產生的輸出信號的圖表。FIG. 8A shows a graph of an output signal generated by a sensor according to the present exemplary embodiment.
圖8B示出說明根據本示範性實施例的感測器輸出和氣隙之間關係的圖表。FIG. 8B shows a graph illustrating a relationship between a sensor output and an air gap according to the present exemplary embodiment.
圖9A示出由根據本示範性實施例的感測器產生的輸出 信號的圖表。FIG. 9A illustrates an output generated by a sensor according to the present exemplary embodiment Signal chart.
圖9B示出說明根據本示範性實施例的感測器輸出和氣隙之間關係的圖表;和圖10-16示出結合本示範性實施例特徵的處理設備的示意圖。9B shows a diagram illustrating a relationship between a sensor output and an air gap according to the present exemplary embodiment; and FIGS. 10-16 illustrate schematic views of a processing apparatus incorporating features of the present exemplary embodiment.
300-311‧‧‧繞組裝置300-311‧‧‧Winding device
301S、302S‧‧‧次級繞組301S, 302S‧‧‧ secondary winding
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