TW200903939A - Chip protecting system and electronic device and chip protecting method using the same - Google Patents

Abstract

A chip protecting system and an electronic device and a chip protecting method using the same are provided. The chip protecting system is disposed at the electronic device comprising a circuit board, a north bridge chip and a south bridge chip. The circuit board has a top surface and a bottom surface which are opposite to each other. The north bridge chip and the south bridge chip are both disposed at the top surface. The chip protecting system comprises a first temperature sensing element, a determining unit and a protecting circuit. The first temperature sensing element is disposed at the bottom surface of the circuit board and under one of the north bridge chip and the south bridge chip for sensing the temperature of one of the north bridge chip and the south bridge chip. The determining unit is for producing a temperature value according to the state of the first temperature sensing element and for comparing the temperature value with a predetermined value. When the temperature value is larger than the predetermined value, the determining unit outputs an enabling signal to the protecting circuit, so that the electronic device is shut down.

Description

200903939 二连缅航·丄νν:>δ07ΡΑ * IX. Description of the Invention: [Technical Field] The present invention relates to a wafer protection system and an electronic device and wafer protection method therefor, and in particular A wafer protection system for protecting at least one of a North Bridge wafer and a South Bridge wafer, and an electronic device and wafer protection method using the same. [Prior Art] 'Generally, a central processing unit (CPU), a north bridge chip, and a south bridge chip are provided on a computer motherboard. The central processor communicates with the surrounding components using the Northbridge and Southbridge wafers. Therefore, the North Bridge chip and the South Bridge chip are important components in the operation of the central processing unit. With the implementation of heavy-duty programs and the speed of data processing, the load on the central processor has increased relatively. In addition, some users will use, overclock or improve the operating voltage of the Northbridge and Southbridge wafers \ .· - Improve the efficiency of the central processing unit. As a result, when the load on the central processing unit is increased, the load on the north bridge chip and the south bridge wafer is correspondingly increased. At this time, the temperature of the north bridge wafer and the south bridge wafer will increase as the load increases. If the temperature of the Northbridge and Southbridge wafers cannot be properly reduced, the Northbridge and Southbridge wafers may burn out, making the computer system unable to continue to operate normally. 200903939

The invention relates to a wafer protection system and an electronic device and a wafer protection method thereof, which provide a north bridge wafer and a south bridge wafer to a protection mechanism to avoid the north bridge wafer and the south bridge wafer The temperature is too high and damaged. In this way, the present invention can effectively protect the north bridge wafer or the south bridge wafer even if the user operates the north bridge wafer and the south bridge wafer in an overclocked operation mode or at a higher operating voltage. According to a first aspect of the invention, a wafer protection system is presented. The wafer is kept in an electronic device. The electronic device includes a circuit board, a north bridge chip, and a south bridge chip. The board has an upper surface and a lower surface. The upper surface is opposite the lower surface. Both the North Bridge and the South Bridge are placed on the upper surface. The wafer protection system includes a first temperature sensing component, a determination unit, and a protection circuit. The first temperature sensing element is disposed on the lower surface of the circuit board and the first temperature sensing element is disposed under one of the north bridge wafer and the south bridge wafer to sense the temperature of one of the north bridge wafer and the south bridge wafer. The f-breaking unit is electrically connected to the first temperature sensing element. The determining unit is configured to generate a temperature value according to the state of the " first temperature sensing element and compare it with a predetermined value. When the temperature value is greater than the predetermined value, the judging unit outputs a uniform energy signal. The protection circuit is electrically connected to the determination unit. When the protection circuit receives the enable signal, the protection circuit turns off the electronic device. According to a first aspect of the invention, an electronic device is proposed. The electronic device includes a circuit board, a north bridge wafer, a south bridge wafer, and a wafer protection system. The circuit board has an upper surface and a lower surface. The upper surface is opposite to the lower surface. Both the north bridge and the south bridge wafers are placed on the upper surface of the board. Jing 200903939

Sanda number: TW3807PA The chip protection system includes a first temperature sensing component, a judging unit and a guarantor house road. First, the sensing element is disposed on the lower surface of the circuit board, and the first temperature sensing element is disposed under the north bridge wafer and the south bridge wafer to sense the temperature of one of the north bridge wafer and the south bridge wafer. The simple element is electrically connected to the first temperature sensing element. The judging unit is configured to generate a temperature value ' according to the state of the first temperature sensing 7G member and compare it with a predetermined value. When the temperature value is greater than the predetermined value, the judging unit outputs a uniform energy signal. Protection; the road is electrically connected to the judgment unit. When the protection circuit receives the enable signal, the protection circuit turns off the electronic device. According to a second aspect of the invention, a wafer protection method is presented. The wafer protection method is applied to an electronic device. The electronic device includes a circuit board, a north bridge chip, and a south bridge chip. The board has an upper surface and a lower surface. The upper surface is opposite the lower surface. Both the north bridge wafer and the south bridge wafer are disposed on the upper surface. The wafer protection method includes the following steps. First, the temperature of one of the north bridge wafer and the south bridge wafer is sensed using a first temperature sensing element. The first temperature sensing element is disposed on a lower surface of the circuit board, and the first temperature sensing element is disposed under one of the north bridge wafer and the south bridge wafer. Next, a determination unit is utilized to generate a first temperature value based on the state of the first temperature sensing element. Then, the judgment unit compares whether the first temperature value is greater than a predetermined value. Then, when the first temperature value is greater than the predetermined value, the determining unit outputs a first enable signal to the one-of-a-kind circuit. Then, when the protection circuit receives the first enable signal, the electronic device is turned off. In order to make the above description of the present invention more comprehensible, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows: 200903939

达达编肮:丄WM07PA [Embodiment] The present invention provides a wafer protection system and an electronic device and wafer protection method therefor, which are sensed by a temperature sensing element disposed under a north bridge wafer or a south bridge wafer. Or the temperature of the south bridge wafer, and a judgment unit is used to generate a temperature value based on the state of the temperature sensing element and compare it with a predetermined value. When the temperature value is greater than the predetermined value, the electronic device is turned off to prevent the north bridge wafer or the south bridge wafer from being damaged due to excessive temperature. 4' First Embodiment Referring to Figure 1A, there is shown a top view of an electronic device in accordance with a first embodiment of the present invention. In this embodiment, the electronic device 200 is taken as an example, and the electronic device 200 is, for example, a computer host. The electronic device 200 includes a circuit board 210, a north bridge wafer 220, a south bridge wafer 230, and a wafer protection system 240. The wafer protection system 240 includes a first temperature sensing element 241, a determining unit 245, and a protection circuit 247. The determining unit 245 is electrically connected to the first temperature sensing element 241 and the protection circuit 247. The components in the embodiments are omitted, and the components are shown in a more exaggerated manner to clearly show the technical features of the present invention. The arrangement of the circuit board 210, the north bridge wafer 220, the south bridge wafer 230, and the first temperature sensing element 241 described above will be further described with reference to FIG. 1B. FIG. 1B is a side view of the electronic device of FIG. 1A. In order to clearly show the relative positions between the elements, Fig. 1B shows only a part of the elements. The circuit board 210 of the electronic device 200 has an upper surface 211 and a lower surface 212. The upper surface 211 of the circuit board 210 is opposite to the lower surface 212. 9 200903939

Sanda number: TW3807PA 'The north bridge wafer 220 and the south bridge wafer 230 are both disposed on the upper surface 211 of the circuit board 210. The first temperature sensing component 241 is disposed on the lower surface 212 of the circuit board 210. In this embodiment, the first temperature sensing component 241 is disposed under the north bridge wafer 220 to sense the temperature of the north bridge wafer 220. In addition, the determining unit 245 of FIG. 1A is configured to generate a temperature value according to the state of the first temperature sensing element 241 and compare it with a predetermined value. When the temperature value is greater than the predetermined value, the judging unit 245 outputs the coincidence signal to the protection circuit 247. When the protection circuit 247 receives the enable signal, the protection circuit 247 causes the electronic device 200 to be turned off to protect the north bridge wafer 220 from damage due to excessive temperature. The wafer protection system of this embodiment will be further described as follows. Please refer to FIG. 2, which is a circuit block diagram of the electronic device of FIG. 1A. The first temperature sensing element 241 is, for example, a negative temperature coefficient thermistor, and the resistance value of the negative temperature coefficient thermistor decreases as the temperature rises. The wafer protection system 240 of the present embodiment further includes a resistor R 〇 in series with the first temperature sensing element 241. The determining unit 245 is coupled to one of the nodes p electrically connected to the first temperature sensing element 241. Since the first temperature sensing element 241 of the embodiment is for sensing the temperature of the north bridge wafer 22 (as shown in FIG. 1A), the first temperature sensing element is when the temperature of the north bridge wafer 220 is raised. The resistance of 241 (negative temperature coefficient thermistor) will decrease. In other words, the partial pressure of the voltage v 得到 obtained by the judging unit 245 at the node P is correspondingly lowered, and the judging unit 245 calculates the temperature value based on the partial pressure to compare with the predetermined value. When the temperature value is greater than the predetermined value, judge 200903939 Sanda number: TW3807PA early '245 output enable signal Es to protection circuit μ?. The enable signal & for example is a low voltage signal. * As shown in FIG. 2, the protection circuit 247 includes a -th resistor R1, a second resistor R2, a first transistor T1, and a second transistor τ2. In the present example, in the example, the first electro-optic crystal T1 and the second electro-optical transistor 2 are, for example, the gate of the N-type metal Oxide semiconductor (NMOS) transistor T1. R1 receives a first-supply electrical VI and is electrically connected to the judging unit 245. The source of the first transistor T1 receives - the second supply voltage V2, the second supply voltage, the ground voltage. The gate of the second transistor D2 receives the second through the second resistor R2, and the voltage V3 is electrically connected to the sum of the first transistor τι. The source of the second body T2 receives - the fourth supply voltage %, and the fourth supply voltage: the column is a ground voltage. The drain of the second transistor τ 2 is electrically connected to the south bridge wafer 230.

Therefore, when the protection circuit 247 receives the output of the determination unit 245, the first transistor T1 is turned off, the second transistor τ2 is turned on, and the fourth supply voltage V4 is input to the south bridge via the second transistor T2. 23〇' to control the south bridge chip 23〇 control electronics 200 is turned off. In addition, as shown in FIG. 2, the south bridge wafer 23 of the present embodiment has: an overheat protection pin 23 and the electronic device 2 (10) further includes a central processing two 250 central processing unit 250 and a protection circuit 247. The overheat protection pin 231 is connected to the south bridge wafer 230. In other words, the south bridge chip 230 of the embodiment can be shared with the central processing unit 25 of the electronic device 2 200903939

Erda: i W_jmj7PA has the same pin (overheat protection pin 231) without the need to additionally add the pin of the south bridge wafer 230. Furthermore, the electronic device 200 of the present embodiment further includes a Basic Input/Output System (BIOS) 260. The predetermined value is set in the basic output input system 260. In this embodiment, the setting of the predetermined value is, for example, set by the user to meet the needs of the user. After the electronic device 2 is turned off because the north bridge wafer 220 is overheated, the basic output input system mo will display a warning message when the electronic device 200 is turned on again. In this way, the user can understand the reason why the electronic device 200 is turned off before, so as to appropriately adjust the operation of the electronic device 200. For example, the user can reduce the operating frequency of the computer system, or reduce the operating voltage of the north bridge chip to reduce the probability of overheating of the north 曰 film. The wafer protection method according to the first embodiment of the present invention will be described below using the wafer protection system 240 mentioned above and the electronic device 200 using the same. Please refer to FIG. 2 and FIG. 3'. FIG. 3 is a flow chart showing the wafer protection method according to the first embodiment of the present invention. The chip protection method of this embodiment includes the following steps. First, since the first temperature sensing element 241 of the present embodiment is disposed under the north bridge wafer 220 (as shown in FIG. 1B), in step 701, the north bridge wafer 220 is sensed by the first temperature sensing element 241. temperature. Next, in step 703, the determining unit 245 is utilized to generate a temperature value according to the state of the first temperature sensing element 241. Since the first temperature sensing element 241 of the embodiment is a negative temperature coefficient thermistor, it is judged 12 200903939

The three-numbered _ TW3S07PA break unit 245 calculates the corresponding temperature value using the partial pressure obtained from the point P. Then, in step 705, the determination unit 245 compares whether the temperature value is greater than a predetermined value. In this embodiment, the predetermined value can be set by the user in the basic output input system 260 to meet the needs of the user. Next, in step 707, when the temperature value is greater than the predetermined value, the determining unit 245 outputs the enable signal Es to the protection circuit 247. Then, in step 709, when the protection circuit 247 receives the enable signal Es, the south bridge wafer 230 turns off the electronic device 200. After the enable signal Es is turned off the first transistor T1, the second transistor T2 will be turned on, so that the second transistor T2 is input to the fourth supply voltage V4 to the south bridge wafer 230 to trigger the south bridge wafer 230 to control the electronic device 200 to be turned off. Next, in step 711, when the electronic device 200 is turned back on, a warning message is displayed by the basic output input system 260. Moreover, in the present embodiment, the wafer protection method may optionally include the step of setting a predetermined value in the f basic output input system 260 prior to step 701 to meet the needs of the user. The above is the wafer protection system according to the first embodiment of the present invention and the electronic device and wafer protection method therefor, which provide a mechanism for protecting the north bridge wafer to prevent the north bridge wafer from being burnt due to excessive temperature. In addition, in this embodiment, after the protection circuit is turned off due to overheating of the north bridge chip, when the electronic device is turned on, the basic output input system will display a warning message to let the user know the reason for the previous shutdown of the electronic device. . In this way, even if the user operates in an overclocked manner or at a higher level 13 200903939

Sanda number: TW3807PA voltage to operate the Northbridge wafer and Southbridge wafers. The wafer protection system of this embodiment and the electronic device and wafer protection method therefor still provide a mechanism for protecting the Northbridge wafer. Although the first temperature sensing element of the present embodiment is disposed below the north bridge wafer, it will be apparent to those skilled in the art that the first temperature sensing element can also be disposed beneath the south bridge wafer to provide a mechanism for protecting the south bridge wafer. Tf Second Embodiment The difference between this embodiment and the first embodiment is that the first embodiment senses the temperature of the north bridge wafer only by using the first temperature sensing element, and the first embodiment uses the first temperature sensing element and the first The two temperature sensing elements respectively sense the temperature of the north bridge wafer and the south bridge wafer to prevent the north bridge wafer and the south bridge wafer from being burnt due to excessive temperature. Referring to Figure 4, there is shown a top view of an electronic device in accordance with a second embodiment of the present invention. The wafer protection system 340 of the electronic device 3 includes a first temperature sensing element 341, a second temperature sensing element 342, a determining unit 345, and a protection circuit 347. The first temperature sensing element 341 and the second temperature sensing element 342 are both disposed on the lower surface of the circuit board 310 and the first temperature sensing element 341 and the second temperature sensing element 342 are respectively disposed on the north bridge chip 320 and the south bridge chip. Below 330, the temperature of the north bridge wafer 320 and the south bridge wafer 330 is sensed. In the embodiment, the determining unit 345 is electrically connected to the first temperature sensing element 341, the second temperature sensing element 342, and the protection circuit 347. 14 200903939

The third level number: TW3807PA determining unit 345 generates a first temperature value and a second temperature value according to the states of the first temperature sensing element 341 and the second temperature sensing element 342, respectively. When the first temperature value is greater than a predetermined value, the determining unit 345 outputs a first enable signal to the protection circuit 347 ′ and when the second temperature value is greater than the predetermined value, the determining unit 345 outputs a second enable signal to Protection circuit 347. When the protection circuit 347 receives the first enable signal or the second enable signal, the protection circuit 347 turns off the electronic device 300 to protect the north bridge wafer 320 and the south bridge wafer 330 from being damaged due to excessive temperature. For the crystal moon protection method of the present embodiment, please refer to FIG. 5 at the same time. FIG. 5 is a flow chart showing a wafer protection method according to a second embodiment of the present invention. Steps 801a to 809a of FIG. 5 are processes for protecting the north bridge wafer 320 by using the first temperature sensing element 341, the determining unit 345, and the protection circuit 347, and the steps 801b to 809b are performed by using the second temperature sensing element 342. Unit 345 and protection circuit 347 protect the flow of south bridge wafer 330. When the electronic splicing 300 is turned on after the north bridge chip 320 or the south bridge chip 33 is turned off, the basic output input system (not shown) will display a warning message to remind the user of the reason for the previous shutdown of the electronic device 300. As a result, when the temperature of the north bridge wafer 32 or the south bridge wafer 33 is too high, the electronic device 300 can be turned off by the protection mechanism of the wafer protection system 340 of the present embodiment to prevent the north bridge wafer 320 and the south bridge wafer from being burned. The wafer protection system and the electronic device and wafer protection method disclosed in the above embodiments of the present invention are provided by a North Bridge wafer or a South Bridge wafer, 15 200903939

The temperature of Erlianmu.1 w j〇07PA' is used as the basis for shutting down the electronic device to protect the North Bridge wafer and the South Bridge wafer. In this way, even if the user operates the north bridge wafer and the south bridge wafer in an overclocked operation mode or at a higher operating voltage, the wafer protection system disclosed in the above embodiments and the electronic device and the wafer protection method using the same can be effectively protected. Northbridge or Southbridge wafers to prevent Northbridge and Southbridge wafers from burning due to excessive temperatures. In the above, the present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. 200903939

2H is a top view of an electronic device according to a first embodiment of the present invention; FIG. 1B is a side view of the electronic device of FIG. 1A; 1 is a circuit block diagram of an electronic device of FIG. 1A; FIG. 3 is a flow chart of a wafer protection method according to a first embodiment of the present invention; and FIG. 4 is a diagram showing an electronic device according to a second embodiment of the present invention. The top view of the device, and FIG. 5 is a flow chart of the wafer protection method according to a second embodiment of the present invention. 17 200903939

Two sarcasm-1 wj〇07PA [Description of main component symbols] 200, 300: electronic device 210, 310: circuit board 211: upper surface 212: lower surface 220, 320: north bridge wafer 230, 330: south bridge wafer 240, 340 : Chip protection system [ R0 : Resistor 241 , 341 : First temperature sensing element 245 , 345 : Judging unit 247 , 347 : Protection circuit T1 : First transistor T2 : Second transistor R1 : First resistor R2 : Two resistors ί 250 : central processing unit 260 : basic output input system 342 : second temperature sensing element Es : enable signal V0 : voltage VI : first supply voltage V2 : second supply voltage V3 : third supply voltage V4 : Fourth supply voltage 18

Claims (1)

200903939 二适肌肌* i vvjd07PA X. Patent Application Range: 1. A wafer protection system is provided in an electronic device, the electronic device comprising a circuit board, a north bridge wafer and a south bridge wafer, the circuit board having an upper surface And the lower surface, the upper surface is opposite to the lower surface, the north bridge wafer and the south bridge wafer are disposed on the upper surface, the wafer protection system comprises: a first temperature sensing component disposed on the lower surface of the circuit board And the first temperature sensing component is disposed under the one of the north bridge wafer and the south bridge wafer to sense a temperature of one of the north bridge wafer and the south bridge wafer; a determining unit, and the first temperature sensing The determining unit is configured to generate a temperature value according to the state of the first temperature sensing component, and compare with a predetermined value. When the temperature value is greater than the predetermined value, the determining unit outputs a consistent energy signal; And a protection circuit electrically connected to the determining unit, when the protection circuit receives the enable signal, the protection circuit causes the electronic device to be mounted shut down. 2. The wafer protection system of claim 1, wherein the protection circuit comprises: a first resistor and a second resistor; a first transistor, the gate of which receives the first resistor through the first resistor a supply voltage is electrically connected to the determining unit, a source of the first transistor receives a second supply voltage, and a second transistor whose gate receives a third supply voltage through the second resistor and is electrically Connected to the drain of the first transistor, the source of the second transistor 19 200903939 · i w_? ov) 7RA receives a fourth supply voltage, and the second transistor is electrically connected to the south bridge a wafer; wherein when the protection circuit receives the enable signal, the first transistor is turned off, the second transistor is turned on, and the fourth supply voltage is input to the south bridge via the second transistor to trigger the The south bridge chip controls the electronic device to turn off. 3. The wafer protection system of claim 2, wherein the first transistor and the second transistor are N-type Metal Oxide Semiconductor (NMOS) transistors, the first The second supply voltage is a ground voltage 'the fourth supply voltage is a ground voltage. 4. The wafer protection system of claim 1, wherein the wafer protection system further comprises: a second temperature sensing component disposed on the lower surface of the circuit board, the first temperature sensing component being Below the other of the north bridge wafer and the south bridge wafer. 5. The wafer protection system of claim 1, wherein the first temperature sensing element is a negative temperature coefficient thermistor. The wafer protection system further includes a resistor, the resistor The first temperature sensing component is connected in series, and the determining unit is connected to a node electrically connected to the first temperature sensing component. 6. If you apply for a patent scope! The chip protection system of the present invention, wherein the south bridge chip has an overheat protection pin, the electronic device further includes a central processing unit (CPU), and the central processor and the protection circuit are electrically connected to the south bridge The overheat protection pin of the wafer is °. 20 200903939 Two violations m. ivvJ〇d7PA 7. — Electronic devices' include: a circuit board 'having an upper surface and a lower surface opposite to the upper surface; a north bridge wafer disposed on the upper surface of the circuit board; a south bridge wafer disposed on the upper surface of the circuit board; a wafer protection The system 'includes: the first temperature offering element' ---- (丨坎's human version of the "noisy .... Jiu Nuo - one of the films" to sense the North Bridge chip and The temperature of the south bar wafer; the surface 'and the first temperature sensing element is disposed under the north bridge chip ... · · · · · · · · · · · · 判断 判断 判断 判断 判断 判断 判断 判断 判断 判断 判断 判断 判断 判断 判断 判断 判断 判断The determining unit is configured to compare a temperature value according to the shape of the first temperature sensing component and compare it with a predetermined value. When the temperature value is greater than __, the determining unit rotates the consistent energy signal; ^ Determine the latter protection circuit, electrically connected to the judgment unit. When the protection circuit receives the enable signal, the protection circuit causes the power to be read and closed. The sub-attack is as follows: The seventh protection circuit of the patent application scope includes: wherein the electronic device is provided with a first resistor and a second resistor; a third to a first transistor, the gate of which passes through the first voltage and is electrically connected to the (4)_ unit, the first receiving a second supply voltage; and a second transistor having a gate through the second 21 200903939 J07PA should be voltage and electrically connected to the first transistor of the first transistor, the source of the second transistor receives - the fourth supply of electric dust, the second transistor is electrically connected to the south bridge chip &amp; wherein, when the protection circuit receives the enable signal, the first transistor is turned off, the second transistor is turned on, and the fourth supply voltage is input to the south bridge via the second transistor. The electronic device of claim 8, wherein the first transistor and the second transistor are Ν-type MOS transistors, The second supply voltage is one The ground voltage, the fourth supply voltage is - the ground voltage. 10. The electronic device of claim 7, wherein the electronic device further comprises: a basic input/output system (BIOS) After the protection circuit causes the electronic device to be turned off, when the electronic device is turned back on, the basic display of the input system is displayed as a warning message. 11. The electronic device according to the above patent scope, the predetermined value is at the basic The output wheel K is set in the system. 12. The electronic device of claim 7, wherein the south bridge chip has an overheat protection pin, and the electronic device further comprises /:, a central processing unit, the central processing And the protection circuit is electrically connected to the overheat protection pin of the south bridge chip. 13. The electronic device according to the seventh aspect of the patent, the chip protection system further comprises: ,, 22 200903939 — il£*5K · i WJ807PA a second temperature sensing component disposed on the lower surface of the circuit board, the second temperature sensing component being on the other of the north bridge wafer and the south bridge wafer 14. The electronic device of claim 7, wherein the first temperature sensing component is a negative temperature coefficient thermistor, the chip securing system further comprising a resistor, the resistor and the first The temperature sensing component is connected in series with the determining unit and coupled to the electrical resistance of the first temperature sensing component. 15. A wafer protection method is applied to an electronic device, the electronic device including a circuit a board, a north bridge chip and a south bridge chip, the circuit board has an upper surface and a lower surface, the upper surface is opposite to the lower surface, and the north bridge B and the hainan bridge wafer are disposed on the upper surface, the wafer protection The method includes: sensing, by a first temperature sensing component, a temperature of the north bridge wafer and the south bridge s chip, wherein the first temperature sensing component is disposed on the lower surface of the circuit board and the first temperature sensing The component is disposed under the one of the north bridge chip and the south bridge chip; and the determining unit is configured to generate a first temperature value according to the state of the first temperature sensing component; The unit compares whether the first temperature value is greater than a predetermined value; when the first temperature value is greater than the predetermined value, the determining unit outputs a first enable signal to a protection circuit; and when the protection circuit receives the first When the signal is enabled, turn off the electronic 23 200903939 - pan-brain 3 i. vy _ni07PA. device. The wafer protection method of claim 15, wherein the protection circuit comprises a first resistor, a second resistor, a first transistor, and a second transistor, the gate of the first transistor Receiving a first supply voltage through the first resistor and electrically connecting to the determining unit, the source of the first transistor receiving a second supply voltage, and the gate of the second transistor is received through the second resistor a third supply voltage is electrically connected to the drain of the first transistor, a source of the second transistor receives a fourth supply voltage, and a drain of the second transistor is electrically connected to the south bridge wafer. When the protection circuit receives the first enable signal, the step of turning off the electronic device includes: when the protection circuit receives the first enable signal, turning off the first transistor, turning on the second transistor 5 via the second transistor 5 The second transistor inputs the fourth supply voltage to the south bridge wafer to trigger the south bridge wafer to control the electronic device to turn off. The wafer protection method according to claim 15, wherein the electronic device further comprises a basic output input system, and after the protection circuit causes the electronic device to be turned off, the wafer protection method further comprises: When the electronic device is turned on, a warning message is displayed by the basic output input system. The wafer protection method of claim 17, wherein before the step of sensing the temperature by using the first temperature sensing element, the wafer protection method further comprises: setting the basic output input system Predetermined value. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; a surface, and the second temperature sensing element is located under the other of the north bridge wafer and the south bridge wafer. The wafer protection method further comprises: sensing the north bridge wafer and the south bridge wafer by using the second temperature sensing component a temperature of the other one, using the determining unit to generate a second temperature value according to the state of the second temperature sensing component; using the determining unit to compare whether the second temperature value is greater than the predetermined value; when the second temperature When the value is greater than the predetermined value, the determining unit outputs a second enable signal to the protection circuit; and when the protection circuit receives the second enable signal, the protection circuit causes the electronic device to be turned off.