200844455 九、發明說明： 【發明所屬之技術領域】 本發明係提供一種可有效縮短各裝置之 加記憶體I c之檢着量，啸歧収 ，而大幅增200844455 IX. Description of the Invention: [Technical Field] The present invention provides an effective reduction in the amount of memory Ic of each device, which is greatly increased
檢測分類機。 手及產此之記憶體IC 【先前技術】 邮ΐ?ί，半導體元件之1 C概分為邏輯1 C、兮己情!# i c 頜比I C及微元件I C等不同類型，以邏 。L體I C、 主機板上之中央處理哭，俾以g主由也老 為例，係應用於 訊號轉換或傳遞周邊元件之 再裝配於主機板上，其功能性較為單純，f模組電路板 ’於製作完成後，均須經過一檢二4類型之I C 保產品品質。 、’、/匈/太出不良品’而確 功能處理器係直接裝設於主機板，且 订檢測，以提升檢測作業之準確性，遂 進 使用之實體板（即主機板）作 麦曲I c貫際裝配 板上進行檢測作業，基路板’使邏輯I C於實體 ，故該實體板常僅設有二測作業較為複雜及多樣化 分賴，包之於檢測邏輯ί c之I c檢測 =料m :mmi 1係可承置制之邏輯I c以 -3裝盒可承置完測之邏輯1。用以收料，而第 則設有複數個測試裝t 輯1 c，而機台之後端 1 4係設有具單7 2置1 5，各測試裝置 供置入單—待測之邏輯f :中，該測試套座14 2可 铒^17，而弟二移料裝置1 5則用以移 200844455 载待/完測之邏輯i c，躲有-可於勤前、後端往復位移之 轉運I置16，該轉運裝置16係用以載送待/完測之邏輯I匸 if第Γ移料裝置13可於供料£ 11處取出待測之邏輯 Ic17，亚置放於轉運裝置16上，由轉運装置丄6載送至機 二移料裝置1 5即將轉運裝置1 6上待測之邏輯 ϋ 7取出’並移載至測試裝置χ 4處，且置人於其實體 ^2中，以執行檢測作業’於檢測完畢後， 2即將完測之邏輯1 c 17取出，並置放於轉Detect the sorter. Hand and memory IC [Prior Art] Mail ΐ? ί, semiconductor component 1 C is divided into logic 1 C, 兮 情! # i c jaw ratio I C and micro-component I C and other different types, to logic. The L-body IC and the central processing on the motherboard are crying, and the main method is also used as an example. It is applied to the signal conversion or transmission of peripheral components and then assembled on the motherboard. The function is relatively simple, the f-module circuit board 'After the production is completed, it is necessary to pass the inspection of the 2nd type of IC to ensure product quality. , ', / Hungarian / too bad products' and the functional processor is directly installed on the motherboard, and set the detection, in order to improve the accuracy of the detection operation, into the physical board (ie motherboard) for the Maiqu The Ic is mounted on the assembly board, and the base board 'makes the logic IC in the entity. Therefore, the physical board often only has two complex operations, which are more complicated and diverse, and are included in the detection logic. Detection = material m: mmi 1 system can be installed logic I c to -3 box can be placed to complete the logic 1 of the test. It is used for receiving materials, while the first is equipped with a plurality of test sets t 1c, and the rear end of the machine is equipped with a single 7 2 set 1 5, each test device is used for placing a single - the logic f to be tested In the middle, the test socket 14 2 can be 铒^17, and the second shifting device 15 is used to move the 200844455 logic ic to be carried/completed, hiding - transportable before and after the reciprocating displacement I set 16, the transfer device 16 is used to carry the logic to be tested/completed. The second transfer device 13 can take out the logic Ic17 to be tested at the supply of the material 11 and place it on the transfer device 16. , carried by the transfer device 丄 6 to the second transfer device 1 5, the logical ϋ 7 to be tested on the transfer device 16 is taken out and transferred to the test device χ 4, and placed in its entity ^ 2, To perform the test operation' After the test is completed, 2 the logic 1 c 17 to be completed is taken out and placed in the turn.
以乍i依檢測結果而分類收置，以完成邏輯ictS J觀參閱第3圖，由於記憶體！ c係純粹用 ，並衣配於模組電路板上，故常以測試電 、厂 f 1_試電路板1 4 4上係晴复數烟試套^ ^檢= 次執行數十個記憶體IC之檢測作業。 便 惟，請參閱第1、3圖，當業者以上述丨 記憶體I C之檢測作業時，由於各 ^ j測分類機執行 I C之測試電路板i 44，係配置 j1 4應用檢測記憶體 可承置數十個待測之4 5 ’而 16因-次僅載送單-待測之記憶體，&》雜運褒置 裝置13、15必須往復執行數十次=该弟―、二移料 測試套座1 4 5之測試電路板！ 4 4 =#動作’以配置3 2個 -、二移料裝置i 3、i 5 ，運裝置1 6及第 而測試裝置14相對地亦必須办等至J久載送及移料動作， 置待測之記憶體ί 〇：後，方可個娜試套座1 4 5均承 裝置之大型ί C檢測機，則各裝置業：若為具複數個测試 及耗時，亦大幅降低記憶體了 C之产、、丨，等待時間將更為繁瑣 類機不適用於執行記憶體J C之檢能，故此一I C檢測分 200844455 求快速之檢測使用效率及提升產能之需求下，如 C，而Α幅提升檢·能之記憶 體I C檢測刀類械，即為業者設計之標的。 【發明内容】 Μ …係提供—種記憶體1匚檢測分類機，包含 设於機口刖编之t、料匣、至少一個收料匣及第一移料裝置，設於 機台後端之至少-個戦I置及第二移料裝置，以及 料ΐ及測試之轉運裝置；該供、收料匠係分別用以承置待 /元測之恤體I C，第-移料裝践可於供、賊&及轉運裝 置間-次移載複數個待/完測之記紐〗C，而轉運裝置則於供 、收料If及測試裝置間載送待/完測之記憶則c，第二移料裝 置則於轉運4置及’貞彳4裝置間移載複數個待/完測之記憶體I c ，各測試5置係設有具複數個測試套座之測試電路板，以及於上 方設有具概棘朗之壓接麟，肋—次制概個待測之 記憶體I C ;藉此，可有效縮短各裝置之作動時間，而大幅增加 f己憶體I C之制數量，制更加提升制效率及產能之使用效 益0 -本發明之目的二，係提供一種記憶體丨C檢測分類機，更包 含於機台後端設有熱測室裝置，該熱測室裝置係罩覆於各測試裝 置之外部’用以使各測試裝置可於高溫環境巾執行檢測作業，利 ，熱測至裝置而可使各測試裝置於模擬實際使用之高溫環境下執 行檢測作業，達到有效提升檢測準確率之使用效益。 本發明之目的三，係提供一種記憶體I c檢測分類機，其中， 設於供、收料匣及測試裝置間之轉運裝置，係以循環交替的、機構 载送複數個待/完測之記憶體〗C，其於機台下方之兩端位置分 別，有第一、二升降機構，以及於兩端位置間設有位於不同高度 t第一、二平移機構，使得於前端交換端完成供料之料盤可利用 第一升降機構移載至下層之第二平移機構，再由第二平移機構移 运至後端測試端之第二升降機構處，第二升降機構上升將具待測 200844455 記憶體i^之料盤頂升至測試端，供第二移料裝置移送至測試裘 置、i而i凡測記憶體1 C之料盤則於後端測試端以第一平移機構 換巧’以供第一移料裝置進行待/完測記憶體1 c 待預…、之日寸間，進而有效提升測試之產能。 【實施方式] 杆=ί審查委員對本發明作更進一步之瞭解，兹舉一較德 只施例並配合圖式，詳述如后： 前端，本發明之記憶體1 €檢測分類機係於機台之 1、複數個收料®22A、MB、及 室梦’設於機台後端之複數個測試裝置2 4、熱測 ==二9移9料裝置25，以及設於供鲁^ 乙 228、22(:及測試裝置2 4間之轉運梦署97.該 供料E 2 1係用以承置待測之記情# 27 \ ^0 同等級記憶體I C，第-移鮮置用以儲放完測之不 憶體I c之第一取放器2 3 i ί 寺/完測； 後端之夂測n要數待’元測記憶體1C，而機台 傻2之j、M裝置2 4係設有連結_試機 ’該測試電路板2 4 ^系配置有數十^路板2 4 1 試機並將測試結果傳輸至檢測分賴2， 器控制各裂置配合作動，第二移料益，由中央處理 至各測試裝置2 4之載台25 1係具有一可左右橫移 置有待/完測記憶體I c之料盤，载台2 5 1移載放 時，供測試裝置2 4進行交簡倾^，至賴裝置2 4 用於高溫之環境中，為使複數個測^裝置讀體1 C會應 飞衣置24可於模擬實際使用 200844455 :同：裒i兄下執行檢測作業，而於複 覆一熱測室裝置2 6，該熱測室裝置 之外部罩 測試装置2 4之外部’使得内部可形成—具高溫複數個 參閱第4、5 ϋ，本發明設於供、收料E 之至。 2 2丑、2 2(：及測試裝置24間之轉運_置27 /2八、 替的機構載送複數個待/完測之記憶體J置g端$循環交 於供、收料E2 1、22A、22b、McG 係位 降機構2 7 !，後端測試端則位於設有第-升 二升降機構2 7 2，另於前、德“=2 2 6内’並設有第 -、二平移機構2 7 3、』7 ==设有=同高度之第 以係分別具有可移動於前、後端位置::巧〜%7?: 同，以載送放置有待/完測記憶體Ic之料盤；參閱第β 圖，二前端交換端第-升降機構2 7 i上 5二 記憶體I C之置料後，第一升降機盖 2 7 5凡成待測 降，並將料盤2 了 -工# I7▼動料盤2 7 5下 上，而第 記憶體I C之料盤2 7 6至前^拖#1職达放置有完測 ? 7 9目丨I册私P箱挪” 4 而又換&處’另第二升降機構 2 7 2,動已預熱亚放置有待測記憶體 閱=第盤 2 ” ϋI 7 R牛“構2 71上升並抵接放置有完測記憶 =士== ;Γ行待，完測記憶體1。的咖^ 7 3 1則向後端移動；另後According to the detection results, 分类i is classified and collected to complete the logical ictS J view. See Figure 3, due to the memory! c is purely used, and the clothing is matched on the module circuit board. Therefore, it is often used to test the electric power, the factory f 1_ test circuit board 1 4 4, the upper and the plurality of smoke test sets ^ ^ check = the execution of dozens of memory ICs Test the job. However, please refer to the first and third figures. When the manufacturer uses the above-mentioned test of the memory IC, the test circuit board i 44 of the IC is executed by each test machine, and the configuration test memory can be configured. Set up dozens of 4 5 ' to be tested and 16 to - only carry-only memory to be tested, & "Miscellaneous device 13, 15 must reciprocally execute dozens of times = the brother - two shift Test the test socket 1 4 5 test circuit board! 4 4 = # action 'to configure 3 2 -, 2 transfer devices i 3, i 5, transport device 16 and the first test device 14 must also wait until J long-term carrying and moving action, set Memory to be tested ί 〇: After that, you can use the large ίC detector for the 1 4 5 uniform housing. The equipment industry: if there are multiple tests and time-consuming, it will also greatly reduce the memory. After the production and production of C, the waiting time will be more complicated and the machine is not suitable for the execution of the memory JC. Therefore, the IC test is divided into 200844455 to find the rapid use efficiency and the need to increase the production capacity, such as C. The 提升 提升 · 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆[Description of the Invention] Μ 系 系 系 种 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆 记忆At least one 置I and second transfer device, and a transfer device for the material and test; the supply and collection smith are respectively used to hold the body IC to be tested/conducted, and the first-shifting device can be Between the supply, the thief & and the transfer device - the transfer of a plurality of pending/completed test notes C, and the transfer device carries the memory to be/completed between the supply and receipt If and the test device. The second transfer device transfers a plurality of memory Ic to be tested/completed between the transfer device and the '贞彳4 device, and each test 5 device is provided with a test circuit board having a plurality of test sockets. And at the top, there is a memory IC with a sturdy crimping rib and a rib-second system to be tested; thereby, the operation time of each device can be effectively shortened, and the number of the system of the IC is greatly increased. The system improves the efficiency of the system and the use efficiency of the production capacity. 0 - The object of the present invention is to provide a memory 丨C detection sorting machine, which is further included in The back end of the station is provided with a thermal chamber device, and the thermal chamber device is covered on the outside of each test device to enable each test device to perform a test operation in a high temperature environment towel, and the heat test device can be used for each The test device performs the test operation under the high temperature environment in which the actual use is simulated, thereby achieving the use efficiency of effectively improving the detection accuracy. A third object of the present invention is to provide a memory Ic detection sorting machine, wherein the transfer device provided between the supply and the receiving device and the testing device is arranged in a cyclical manner, and the mechanism carries a plurality of pending/completed tests. Memory C, which has first and second lifting mechanisms at the two ends of the lower part of the machine, and first and second translation mechanisms at different heights t between the two ends, so that the front end exchange end is completed. The material tray can be transferred to the second translation mechanism of the lower layer by the first lifting mechanism, and then moved to the second lifting mechanism of the rear end testing end by the second translation mechanism, and the second lifting mechanism is raised to be tested 200844455 The top of the memory i^ is raised to the test end, and the second transfer device is transferred to the test device, and the tray of the memory 1 C is replaced by the first translation mechanism at the back end test end. 'For the first transfer device to wait for / complete the test memory 1 c to be ..., the day between the inch, and thus effectively improve the test capacity. [Embodiment] The member of the present invention is further understood by the member of the present invention. The following is a detailed description of the following: The front end, the memory of the present invention 1 The detection class is attached to the machine. Taiwan 1, a plurality of receipts ® 22A, MB, and room dream 'multiple test devices set at the back end of the machine 2 4, thermal test == 2 9 shift 9 device 25, and set in Lu ^ B 228, 22 (: and the test device 24 between the transfer of the dream department 97. The feed E 2 1 is used to hold the test to be tested # 27 \ ^0 the same level of memory IC, the first - shifting fresh The first pick-and-place device 2 3 i ί 寺 / 完 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一The M device 2 4 is provided with a connection_testing machine'. The test circuit board 2 4 is equipped with dozens of circuit boards 2 4 1 test machine and transmits the test result to the detection branch 2, and the device controls each split configuration cooperation. The second transfer material benefit, the central processing unit 14 to the test unit 24 has a tray which can be traversed to the left/right to be tested/tested memory Ic, and when the stage is moved. For the test device 2 4 to carry on the exchange ^, depending on the device 2 4 used in high temperature environment, in order to make a plurality of test devices read body 1 C will be flying clothes set 24 can be simulated in the actual use of 200844455: the same: 裒 i brother to perform testing operations, and Overlaying a thermal chamber device 2, the external cover of the thermal chamber device is externally 'so that the interior can be formed - having a high temperature and a plurality of reference to the fourth, fifth, the present invention is provided in the supply and receiving E 2 2 ugly, 2 2 (: and the transfer device between the test device 24 _ 27 /2 eight, the replacement mechanism carries a number of pending / completed memory J set g end $ cycle to supply and receive Material E2 1, 22A, 22b, McG system lowering mechanism 2 7 !, the rear end test end is located with a first-liter two lifting mechanism 2 7 2, and in front, Germany "= 2 2 6" The first and second translation mechanisms 2 7 3, 』7 == are provided = the same height has the same position that can be moved to the front and rear positions: 巧~%7?: same, to carry the pending/end Measuring the tray of the memory Ic; referring to the β-th diagram, after the loading of the 5th memory IC on the front-end switching end of the first-lifting mechanism 2 7 i, the first elevator cover is to be measured and lowered, and Tray 2 -Work # I7▼ moving plate 2 7 5 down, and the first memory IC of the tray 2 7 6 to the front ^ drag #1 job reached the end of the test? 7 9 eyes 丨 I book private P box moved" 4 and then changed & at the other second lifting mechanism 2 7 2, the moving preheating sub-placed memory to be tested = the second plate ” ϋI 7 R cattle “structure 2 71 rises and abuts the placed test memory = 士 = = ; Γ行待,完测记忆1. The coffee ^ 7 3 1 moves to the back;
SitTiili2?：：^ 7 ϊΙΙΙί 二並將料盤2 7 5移載至後端測試端’ 並由弟—升降城才，2 7 2抵接，而於* ^ ，以縮短測試前等待預熱之時間；參閱第8圖|第置 200844455 交換後，料盤2 7 7係承置完測之記憶體IC，並移送回後端測 試端處，並由第二升降機構2 7 2抵接，此時第一平移機構 2 7 3上之载台2 7 3 1亦向後端移動至料盤2 7 7下方位置， 準備載送料盤2 7 7回前端交換端；此時，第二平移機構2 7 4 之載台2 7 4 1則向前移動至前端位置，而第一升降機 上之料盤2 7 6，因已完成待/完測記憶體I C的交換料作辈， 而於盤面上放置有待測之記憶體i C。 、 菜 杯9 ^ 〇圖，本發明之各測試裝置2 4於測試電路 板2 41之上方设有一壓接機構2 4 3，該壓接 複數個取置頭2 4 3丄，當職裝置2 4完成複 =後，取置頭2 4 3 1係將複數個完測之記憶體j二 而=二移料裝置2 5之載台2 5 1#絲_ 於下方時，由於料盤2 7 5 一 ]空己= 位置為承置待測之記憶體j c，因此取置頭2 ^ + 測之記憶體I C可先放置於料盤2 7 5之空位内。3 讀個完 赫ΐί^11、12圖，接著壓接機構24 3上升後，當一 ^ 2衣置2 5之載台2 51再移動位置，使料盤2 7 一 =憶體Ic位於壓接機構243之取置頭24I 上待測之 ^’接著壓接機構2 4 3下降，並利用取iUf閱 樣出複數個待測之記憶體丨c ;請參 、^ 4 31同 ^移料裝置2 5之載台2 51移出料盤2 7 5至轉圖’當第 ，位置後，壓接機構2 4 3即 4 置2 7之 =測之記憶體I C置顧於測試電” 3 i將複 接體1 C可確實與測試套座2 c：：jj 挪室裝置及可先行將複數待測記憶;cU:間j設有熱 退仃預熱’以提升檢测 200844455 ==測試之產能’實為―深具實祕 申同ί產品及刊物公開’從而允符發明專利4要1 ’= 【圖式簡單說明】 第1圖 第2圖 第3圖 第4圖 第5圖 第6圖 第7圖 第8圖 第9圖 習式IC檢測分類機之配置圖。 習式IC檢測分類機之測試裝置示 習式測試電路板之示意圖。 本發明記㈣I c檢齡麵之配置圖。 本發明轉運裝置之示意圖。 口 本發明轉運裝置之動作示意圖（一）。 本發明轉運裝置之動作示意圖（二）。 本發明轉運裝置之動作示意圖（三）。 第^网本，測試裝置壓接機構之動作示意圖（ π ° •置將待測記憶體1 C移載至測試裝SitTiili2?::^ 7 ϊΙΙΙί 2 and transfer the tray 2 7 5 to the back end test end' and by the brother-lifting city, 2 7 2 abut, and * ^ to shorten the test before waiting for warm-up Time; refer to Fig. 8 | The first set of 200844455, after the exchange, the tray 2 7 7 is the memory IC that is tested and transferred back to the back end test end, and is abutted by the second lifting mechanism 272. When the stage 2 7 3 1 on the first translation mechanism 2 7 3 is also moved to the lower end of the tray 2 7 7 , the carrier tray 27 7 is prepared to return to the front end exchange end; at this time, the second translation mechanism 27 4, the stage 2 7 4 1 is moved forward to the front end position, and the tray 2 7 6 on the first elevator is placed on the disk surface because the exchanged material of the memory IC is completed. Memory i to be tested. The test device 24 of the present invention is provided with a crimping mechanism 2 4 3 above the test circuit board 2 41, and the crimping plurality of picking heads 2 4 3丄, the incumbent device 2 4 After completion of the complex =, take the head 2 4 3 1 will be a plurality of completed memory j 2 and = 2 transfer device 2 5 of the stage 2 5 1 # silk _ below, due to the tray 2 7 5 1] Empty = The position is the memory jc to be tested, so the memory IC measured by the head 2 ^ + can be placed in the space of the tray 2 7 5 first. 3 After reading the pictures of Heΐί^11, 12, and then the crimping mechanism 24 3 rises, when the stage 2 51 of the 2 2 clothes is moved to the position, the tray 2 7 = the memory Ic is placed at the pressure The receiving unit 24 of the pick-up mechanism 243 is to be tested, and then the crimping mechanism 2 4 3 is lowered, and a plurality of memory 待c to be tested are read by taking the iUf; please refer to the ^4 31 The stage 2 51 of the device 2 5 removes the tray 2 7 5 to the picture 'When the position is set, the crimping mechanism 2 4 3 is 4 set 2 7 = the measured memory IC is taken care of the test power" 3 i The complex 1 C can be surely tested with the test set 2 c::jj and the device can be tested first; the cU: j is provided with hot back preheating to improve the test 200844455 == test The production capacity is 'real', and the company's products and publications are open', so that the invention patents are required. 1 '= [Simple diagram description] Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 is a configuration diagram of a conventional IC detection classifier. A schematic diagram of a test device for a test device of a conventional IC detection classifier. The present invention records (4) a configuration diagram of the I c ageing surface. The invention turns Schematic diagram of the operation of the device of the present invention (1). Schematic diagram of the operation of the transfer device of the present invention (2). Schematic diagram of the operation of the transfer device of the present invention (3). The net netbook, the action of the crimping mechanism of the test device Schematic ( π ° • Set the memory 1 C to be tested to the test package
Hi明測試裝置壓接機構之動作示意圖（二）。 ^ 冗二置將待測記憶體1。移載至崎 ^ 1 Hi發明測試裝置壓接機構之動作示意 ^圖.本發明測試裝置壓接二 弟1 5圖：本發明麓 (四）。Hi Ming test device crimping mechanism action diagram (2). ^ Two sets of memory will be tested. The operation of the pressure-carrying mechanism of the test device of the invention is shown in Fig. 1. The test device of the present invention is crimped to the second brother 1 5: the invention (4).
\月弟一移抖展置將待測把憶體J r 置之示意圖（三）。 秒戟 【主要元件符號 〔習式〕 供料匣：1丄 苐一移料裂置：1 貫體板：141 壓接機構：14 3 測試套座：14 5 收料匣：12 測試裝置：14 測試套座：14 2 測試電路板·· 1 4 4 第二移料裝置：15 200844455 轉運裝置：16 I c ： 1 7 〔本發明〕 供料匣：21 收料匣 ：2 2 A 2 2 B、2 2 C 第一移料裝置： 2 3 第一取放器： 2 3 1 測試裝置：2 4 測試電路板· 2 4 1 測試套座：2 4 2 壓接機構：2 4 3 取置頭 ：2 4 3 1 第二移料裝置： 2 5 載台： 2 5 1 熱測室裝置：2 6 轉運裝置：2 7 第一升降機構： 2 7 1 第二升降機構 2 7 2 第一平移機構： 2 7 3 載台： 273 1 第二平移機構： 2 74 載台： 274 1 料盤：2 7 5 料盤： 276 料盤：2 7 7 12\月弟一摇摇展 will be tested to the memory of the body J r set (3). Seconds [Main component symbol [Literature] Feeding 匣: 1 丄苐 one moving material splitting: 1 Crossing plate: 141 Crimp mechanism: 14 3 Test socket: 14 5 Receiving 匣: 12 Test device: 14 Test socket: 14 2 Test circuit board · 1 4 4 Second transfer device: 15 200844455 Transfer device: 16 I c : 1 7 [Invention] Feeder: 21 Receipt: 2 2 A 2 2 B 2 2 C First transfer device: 2 3 First pick and place device: 2 3 1 Test device: 2 4 Test circuit board · 2 4 1 Test socket: 2 4 2 Crimp mechanism: 2 4 3 Take-up head :2 4 3 1 Second transfer unit: 2 5 Stage: 2 5 1 Thermal chamber unit: 2 6 Transfer unit: 2 7 First lifting mechanism: 2 7 1 Second lifting mechanism 2 7 2 First translation mechanism : 2 7 3 Stage: 273 1 Second translation mechanism: 2 74 Stage: 274 1 Tray: 2 7 5 Tray: 276 Tray: 2 7 7 12