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TW200839491A - Heat dissipating device - Google Patents

Heat dissipating device Download PDF

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Publication number
TW200839491A
TW200839491A TW96109283A TW96109283A TW200839491A TW 200839491 A TW200839491 A TW 200839491A TW 96109283 A TW96109283 A TW 96109283A TW 96109283 A TW96109283 A TW 96109283A TW 200839491 A TW200839491 A TW 200839491A
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TW
Taiwan
Prior art keywords
heat
corner
heat sink
fixed side
adjacent
Prior art date
Application number
TW96109283A
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Chinese (zh)
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TWI327270B (en
Inventor
Hui Shen
Gen-Ping Deng
Yi-Qiang Wu
Original Assignee
Foxconn Tech Co Ltd
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Priority to TW96109283A priority Critical patent/TWI327270B/en
Publication of TW200839491A publication Critical patent/TW200839491A/en
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Publication of TWI327270B publication Critical patent/TWI327270B/en

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Abstract

A heat dissipating apparatus is disclosed in the present invention, which includes a heat sink, a thermal interface material disposed on the heat sink and a protective cap engaged on the heat sink. The protective cap includes a body defining a protective space and a first corner portion for covering a corner of said heat sink. The first corner portion has two adjacent sides and one opposite side. Each adjacent side has a first retaining flange for engaging a sidewall of said corner of said heat sink. Said first corner portion is rotatablly connected to said body of said protective cap such that the first corner portion is able to rotate around said opposite side.

Description

200839491 九、發明說明: 【發明所屬之技術領域】 本發明涉及一種散熱裝置,特別涉及一種帶有導熱介 質保護蓋之散熱裝置。 【先前技術】 應用散熱器給電子元件散熱時,爲提高散熱器和電子 元件間之傳熱能力,通常在散熱器底面塗布導熱介質(如 #導熱膠)’但是,由於導熱介質易污染周邊元件及受到灰 塵和其他微粒之污染而不能提前塗布於散熱器上。通常, 在散熱器安裝於中央處理器時,才將導熱介質塗布於散轨 器上。 爲克服上述問題,出現了多種導熱介質保護裝置,如 美國專利第US 6,049,458號即公開了 一種導熱介質保護裝 置,其罩設于塗布有導熱介質之散熱器底面上,避免導熱 _介質在散熱器搬運及安裝過程中污染其他元件及被污染, 通過該V熱介質保護裝置,導熱介質可提前塗布於散熱器 上,簡化散熱器安裝至中央處理器上之步驟,然而,該導 熱介質保護裝置是通過粘膠粘貼於散熱器底面,在散熱器 安裝至中央處理器時需做除膠工作,較爲不便,且粘膠在 多次使用過後容易失去粘性。 【發明内容】 有鑒於此,有必要提供一種散熱裝置,其導熱介質保 護蓋可以被方便地安裝和拆卸。 7 200839491 一種散熱裝置,包括一散熱器、一塗覆於該散熱器上 之導熱介質以及一過盈配合於該散熱器上之導熱介質保護 蓋;該導熱介質保護蓋包括一形成有導熱介質保護空間之 本體及一與該本體相連並包覆於所述散熱器之一角端之第 一角部;該第一角部具有兩鄰邊以及一連接該兩鄰邊之對 邊γ每一鄰邊均延伸出一與所述散熱器一角端之側壁配合 之第一固疋側緣;所述第一角部以其對邊轉動連接於所述 本體上使該苐一角部可相對所述本體翻轉。 上述¥熱介質保護蓋由於通過過盈配合之方式裝配於 散熱器^,與現有粘膠粘合方式相比,操作更加便捷,並 可以重復多次裝配。另外,由於導熱介質保護蓋之第一角 邰活動連接於本體上,使得拆卸過程中很容易去掉導熱介 貝保善蓋與散熱n間之過盈力,使拆卸更加便捷、安全。 【實施方式】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink, and more particularly to a heat sink with a heat shield. [Prior Art] When using a heat sink to dissipate heat from an electronic component, in order to improve the heat transfer capability between the heat sink and the electronic component, a heat transfer medium (such as #thermal adhesive) is usually applied on the bottom surface of the heat sink. However, since the heat conductive medium easily contaminates the peripheral components It is not contaminated by dust and other particles and cannot be applied to the radiator in advance. Typically, the heat transfer medium is applied to the diffuser when the heat sink is mounted to the central processor. In order to overcome the above problems, a variety of heat-conducting medium protection devices have been proposed. For example, U.S. Patent No. 6,049,458 discloses a heat-conducting medium protection device which is disposed on the bottom surface of a heat sink coated with a heat-conducting medium to prevent heat conduction. During the handling and installation process, other components are contaminated and contaminated. Through the V heat medium protection device, the heat transfer medium can be applied to the heat sink in advance, simplifying the step of mounting the heat sink to the central processor. However, the heat medium protection device is Adhesive is attached to the bottom surface of the heat sink. When the heat sink is mounted to the central processing unit, the glue removal work is required, which is inconvenient, and the adhesive easily loses its viscosity after being used for many times. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device whose heat conducting medium protection cover can be conveniently mounted and detached. 7 200839491 A heat dissipating device comprising a heat sink, a heat conductive medium coated on the heat sink, and a heat conductive medium protection cover that is interference fit on the heat sink; the heat medium protection cover includes a heat medium protection a body of the space and a first corner connected to the body and covering a corner end of the heat sink; the first corner has two adjacent sides and a pair of sides γ each adjacent to the two adjacent sides Extending a first solid side edge that cooperates with a side wall of the corner end of the heat sink; the first corner portion is rotatably coupled to the body with opposite sides thereof so that the corner portion of the first corner can be flipped relative to the body . The above-mentioned ¥ heat medium protective cover is assembled to the heat sink by means of an interference fit, and the operation is more convenient than the existing adhesive bonding method, and the assembly can be repeated a plurality of times. In addition, since the first corner of the heat-conducting medium protection cover is movably connected to the body, the interference between the heat-preserving bonnet and the heat-dissipating n is easily removed during the disassembly process, so that the disassembly is more convenient and safe. [Embodiment]

私為ί 1至圖3不出了本發明散熱裝置之-個實施例,該 政=裝置可用於散發電子元件(例如,電⑩cpu)産生之 :置,其包括一散熱器10、一塗覆在散熱器ι〇上之導熱介 貝30以及厂裝配在散熱器1〇上之導熱介質保護蓋加。 放熱咨10採用諸如銅、名望 ,J鋁寺導熱性能良好之材料製 成’其包括一基座及若千4為 眘 &gt;心丄 及右干放熱鰭片13。該基座n在本 實靶例中大體呈一矩形半抬此 ^ +板狀,其具有一用於與電子元件 、&amp;之底面(未標號)及一鱼兮處;4 辟埶鍵H 底面相對之頂面(未標號)。 放…·、、、日片13呈片狀,並平行間 8 1 隔排列於基座11之頂面, 200839491 _ 以增加與空氣之接觸面積。導熱介質30 (例如導熱膠)均 勻塗布於基座11之底面,用來將基座11底面與電子元件 導熱連接,以提高基座11與電子元件間之導熱率。 導熱介質保護蓋20裝配在散熱器10之基座11上,並 覆蓋導熱介質30,以避免導熱介質30受到外界之污染或破 壞。導熱介質保護蓋20 —般採用塑膠材料一體製成,其包 括一平板狀本體21以及與該本體21相連之一第一角部210 和一第二角部212,第二角部212與第一角部210分佈於導 熱介質保護蓋20之對角位置。本體21朝一侧凸出有一蓋 體214,該蓋體214形成一導熱介質保護空間,可以抵禦外 力外物對導熱介質30之破壞,該導熱介質保護空間之大小 視導熱介質30之大小而定。 第一角部210具有兩鄰邊(未標號)及一連接該兩鄰 邊之對邊(未標號),該兩鄰邊相互垂直且長度相等,並 分別朝與上述蓋體214凸出方向相反之方向垂直延伸出第 _ 一固定側緣240、250,用以與散熱器10之基座11侧壁配 合,第一固定侧緣240、250於相鄰端緣彼此相連。第二角 部212與本體21 —體成型並也具有兩鄰邊,每一鄰邊均與 上述第一固定側緣240、250同向延伸出一用於與散熱器10 配合之第二固定侧緣22、23。第二固定侧緣22、23彼此垂 直,並分別與第一固定侧緣250、240平行,第二固定側緣 22、23相鄰端緣也彼此相連。第一固定侧緣240、250與第 二固定侧緣22、23 —道界定出一用於容納散熱器10基座 11之配合空間,該配合空間之尺寸稍小於散熱器10基座 9 200839491 11之尺寸,從而使導熱介質保護蓋20可通過過盈配合之方 式裝配於散熱器10之基座11上。 本實施例中,爲方便導熱介質保護蓋20之拆卸,令第 一角部210以對邊活動連接於本體21上,從而使第一角部 210可繞其對邊相對本體21翻轉。另外,爲使導熱介質保 護蓋20在安裝時實現預先定位,還於本體21上與上述第 一固定側緣240、250同向延伸出兩擋板24、25,該兩擋板 24、25分別與上述第二固定側緣22、23平行,從而第二固 定侧緣22、23界定出一預配合空間,可將導熱介質保護蓋 20預定位到散熱器10基座11上。擋板24與第二固定侧緣 23相鄰之端緣相距一定間隔,擋板25與第二固定侧緣22 相鄰之端緣也相隔一定間距,以在導熱介質保護蓋2〇之另 兩對角位置形成缺口,從而當導熱介質保護蓋20覆蓋在散 熱器10基座11上時,基座10另兩對角之角端暴露在外, 即可方便將導熱介質保護蓋20預定位在基座10上。 _ 組裝時,先將導熱介質保護蓋20之第一角部210翻 起,再將導熱介質保護蓋20套接在散熱器10基座11上, 並使本體21之第二角部212覆蓋在基座11之一角端,翻 折起之第一角部210對應佈置在與上述一角端對角之另一 角端處,第二角部212之第二固定侧緣22、23及本體21 之兩擋板24、24分別抵擋在基座11之四側壁上,實現了 導熱介質保護蓋20之預定位。最後,施力對第一角部210 朝散熱器10擠壓,將第一角部210套接在散熱器10基座 11之另一角端上,散熱器10基座11之上述兩對角位置之 200839491 角端與導熱介質保護蓋2〇之第一角部2i 之=過=’使得第—角部21〇之第一固定侧緣24〇、 A弟二'212之^第二固定側、缘22、23與散熱器10 :上貝’土之間産生較大之摩擦力’從而將導熱 盡2。牢固之裝配到散熱器1〇上。拆卸時,首先用力將第蔓 ^部二_,即可去掉導熱介質保護蓋2Q與散熱器Μ ^ 3之過盈力’進而去掉或降低導熱介質保護蓋2〇 /、土座11之間摩擦力’拆卸起來非常容易。 ^述帶有可翻折第―角部灿之過盈配合式導熱介質 保護盍20,與普通之過盈配合式導熱介質保護蓋相比,具 有如下k點.曰通過盈配合式導熱介質保護蓋拆卸時必須 整體拆卸,並由於拆卸保護蓋與散熱器接觸面積較大,而 導致保護蓋與散熱器間之摩擦力較大,拆卸比較困難,且 容易由於力道使用不當而刮擦到導熱介質,·而帶有可翻折 第-角部210之保護蓋2〇則可通過翻起第一角部训去 2G與散熱器1G間之過盈力之後,再輕鬆地將保護 盍2〇取下,在翻折第一角端21〇之過程中,本體21之位 置基本不發生變化,從而不會由於力道使用不當而導致 熱介質被刮擦。 另外,本發餐第-角部21Q設置成可翻轉式結構還 有其獨特之優勢,例如,單手即可將其翻折起,而不受散 熱器1G基座11尺寸A小之關,而其他位置設置成可翻 折結構對那些尺寸較大之散熱器基座10基座n用保護蓋 來說翻折相對較困難。 ’' 11 200839491 可以理解的疋,雖然上述實施例中保護蓋2〇僅包括〜 第-角部210及-第二角部212,且僅第一角部21〇可翻 轉,而在其他實施例中,也可以包括其他角部,且第二角 部212及其他角部也可設置成可翻轉式結構。 綜上所述,本發明符合發明專利要件,差依法 利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡 熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾 _或變化,皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1是本發明散熱裝置之組合圖。 圖2是圖1所示散熱裝置之局部分解圖。 圖3是圖1所示散熱裝置之分解圖。 主要元件符號說明】 散熱器 10 基座 11 散熱鰭片 13 導熱介質保護蓋 20 本體 21 第一角部 210 第二角部 212 蓋體 214 第一固定側緣 240、250 第二固定侧緣 22、23 擋板 22、23 導熱介質 30 12私 1 to FIG. 3 shows an embodiment of the heat sink of the present invention, which can be used to dissipate electronic components (eg, electricity 10 cpu) generated by: a heat sink 10 The heat-conducting shell 30 on the heat sink ι and the heat-conducting medium protection cover assembled on the heat sink 1〇. The heat-dissipating consultation 10 is made of a material such as copper, fame, and J aluminum temple having good thermal conductivity, which includes a pedestal and a symmetrical heart and a right-hand heat-releasing fin 13 . In the actual target example, the susceptor n is generally in the shape of a rectangular half-lifted plate, which has a bottom surface (not labeled) and a fishing rod for the electronic component, & The bottom surface is opposite to the top surface (not labeled). The ..., , , and Japanese sheets 13 are in the form of a sheet, and the parallel portions 8 1 are arranged on the top surface of the susceptor 11, 200839491 _ to increase the contact area with the air. A heat conductive medium 30 (for example, a thermal conductive adhesive) is uniformly applied to the bottom surface of the susceptor 11 for thermally connecting the bottom surface of the susceptor 11 to the electronic component to improve the thermal conductivity between the susceptor 11 and the electronic component. The heat transfer medium protective cover 20 is mounted on the base 11 of the heat sink 10 and covers the heat transfer medium 30 to prevent the heat transfer medium 30 from being contaminated or damaged by the outside. The heat conductive medium protection cover 20 is generally integrally formed of a plastic material, and includes a flat body 21 and a first corner portion 210 and a second corner portion 212 connected to the body 21, and the second corner portion 212 and the first portion The corners 210 are distributed at diagonal positions of the heat transfer medium protection cover 20. The body 21 protrudes toward a side of a cover body 214. The cover body 214 forms a heat-conducting medium protection space for resisting damage to the heat-conductive medium 30 by an external force. The size of the heat-conductive medium protection space depends on the size of the heat-conductive medium 30. The first corner portion 210 has two adjacent sides (not labeled) and a pair of opposite sides (not labeled) connecting the two adjacent sides. The two adjacent sides are perpendicular to each other and equal in length, and respectively protrude in a direction opposite to the cover body 214. The direction of the first fixed side edges 240, 250 extends perpendicularly to the side walls of the base 11 of the heat sink 10, and the first fixed side edges 240, 250 are connected to each other at adjacent end edges. The second corner portion 212 is integrally formed with the body 21 and has two adjacent sides. Each of the adjacent sides extends in the same direction as the first fixed side edges 240 and 250 to extend a second fixed side for engaging with the heat sink 10 . Edge 22, 23. The second fixed side edges 22, 23 are perpendicular to each other and are parallel to the first fixed side edges 250, 240, respectively, and the adjacent end edges of the second fixed side edges 22, 23 are also connected to each other. The first fixed side edges 240, 250 and the second fixed side edges 22, 23 define a mating space for accommodating the base 11 of the heat sink 10. The size of the mating space is slightly smaller than the base of the heat sink 10 200839491 11 The dimensions are such that the thermally conductive medium protective cover 20 can be assembled to the base 11 of the heat sink 10 by an interference fit. In this embodiment, in order to facilitate the disassembly of the heat-conducting medium protection cover 20, the first corner portion 210 is movably connected to the body 21 with the opposite sides, so that the first corner portion 210 can be turned around the opposite side 21 with respect to the opposite side. In addition, in order to realize the pre-positioning of the heat-transfer protective cover 20 during installation, the baffles 24 and 25 are further extended on the main body 21 in the same direction as the first fixed side edges 240 and 250, and the two baffles 24 and 25 respectively Parallel to the second fixed side edges 22, 23 described above, such that the second fixed side edges 22, 23 define a pre-mating space for pre-positioning the thermally conductive medium protective cover 20 onto the base 11 of the heat sink 10. The end edge of the baffle 24 adjacent to the second fixed side edge 23 is spaced apart from each other, and the edge of the baffle 25 adjacent to the second fixed side edge 22 is also spaced apart to the other two of the heat-transfer protective cover 2 The diagonal position is notched, so that when the heat conductive medium protection cover 20 is covered on the base 11 of the heat sink 10, the corner ends of the other two diagonal corners of the base 10 are exposed, so that the heat conductive medium protection cover 20 can be conveniently pre-positioned on the base. On the seat 10. _ When assembling, the first corner portion 210 of the heat-conductive medium protection cover 20 is turned up, and then the heat-transfer medium protection cover 20 is sleeved on the base 11 of the heat sink 10, and the second corner portion 212 of the body 21 is covered. One corner end of the base 11 , the first corner portion 210 folded up is correspondingly disposed at the other corner end opposite to the corner end, and the second fixed side edges 22 , 23 of the second corner portion 212 and the body 21 The baffles 24, 24 respectively abut against the four side walls of the base 11, achieving a predetermined position of the heat transfer medium protection cover 20. Finally, the first corner portion 210 is pressed against the heat sink 10, and the first corner portion 210 is sleeved on the other corner end of the base 11 of the heat sink 10. The two diagonal positions of the base 11 of the heat sink 10 are 200839491 The angle between the corner end and the first corner portion 2i of the heat-conducting medium protection cover 2 is over=' such that the first fixed side edge 24〇 of the first corner portion 21〇, the second fixed side of the second brother's 212, The edges 22, 23 and the heat sink 10: a large friction between the upper shell 'soil' will heat the heat 2 . Firmly assembled to the radiator 1〇. When disassembling, firstly remove the first vine part _, and then remove the interference force of the heat transfer medium protection cover 2Q and the heat sink Μ ^ 3 to remove or reduce the friction between the heat transfer medium protection cover 2 〇 /, the soil seat 11 Force 'disassembled is very easy. ^There is an over-filled heat-conducting medium protection 盍20 with a foldable angle-corner, which has the following k points compared with the ordinary interference-fit heat-conductive medium protective cover. When the cover is disassembled, it must be disassembled as a whole, and because the contact area between the protective cover and the heat sink is large, the friction between the protective cover and the heat sink is large, the disassembly is difficult, and the heat transfer medium is easily scraped due to improper use of the force channel. , and the protective cover 2 with the foldable corner-corner 210 can be easily lifted by lifting the first corner to the interference between the 2G and the radiator 1G. Next, during the folding of the first corner end 21〇, the position of the body 21 does not substantially change, so that the heat medium is not scratched due to improper use of the force channel. In addition, the first corner of the present meal 21Q is set to a reversible structure and has its unique advantages, for example, it can be folded up with one hand, without being restricted by the size A of the base 1 of the radiator 1G. Other locations are provided in a foldable configuration. It is relatively difficult to fold the base of the heat sink base 10, which is larger in size, with a protective cover. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; Other corners may also be included, and the second corner 212 and other corners may also be provided in a reversible structure. In summary, the present invention complies with the requirements of the invention patent, and is poorly applied according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a combination diagram of a heat sink of the present invention. Figure 2 is a partially exploded view of the heat sink of Figure 1. Figure 3 is an exploded view of the heat sink shown in Figure 1. Main component symbol description] heat sink 10 base 11 heat sink fin 13 heat transfer medium protection cover 20 body 21 first corner portion 210 second corner portion 212 cover body 214 first fixed side edge 240, 250 second fixed side edge 22, 23 baffles 22, 23 heat transfer medium 30 12

Claims (1)

200839491 «ι 十、申請專利範圍: 1 · 一種散熱裝置,包括一散熱器、一塗覆於該散熱器上之 導熱介質以及一過盈配合於該散熱器上之導熱介質保護 蓋,該導熱介質保護蓋包括一形成有導熱介質保護空間 之士體及一與該本體相連並包覆於所述散熱器之一角端 之第-角部;該第-角部具有兩鄰邊以及—連接該兩鄰 邊之對邊,每一鄰邊均延伸出一與所述散熱器一角端之 • 侧壁配合之第一固定侧緣;其改良在於:所述第一角部 以其對邊轉動連接於所述本體上,使該第一角部可相; 所述本體翻轉。 ' 2. 如申請專利範圍第.1項所述之散熱裝置,其中所述第— 角部之兩第一固定侧緣於相鄰端緣彼此相連。 3. 如申請專利範圍第2項所述之散熱裝置,其中所述兩 一固定侧緣彼此垂直。 4·,申請專利範圍第1至3任一項所述之散熱裝置,其中 還包括一與所述本體連接並包覆所述散熱器盘所述一 2角之另-角端之第二角部’該第二角部與所述第一 角部位於對角位置。 5如申請專利範圍第4項所述之散熱裝置,其中所一 ::具有兩鄰邊,每一鄰邊均延伸出有一與所述散二: 二角端之側壁配合之第二固定側緣’該兩第二固;: 緣於相鄰端緣彼此相連。 6如申請專利範圍帛5項所述之散熱裝置,其中該第二角 13 200839491 角部之兩第一固定 IS:固定侧緣分別與所述第- 其中所述第 如^申請專利範圍第5項所述之散熱裝置 角部之兩第二固定側緣彼此垂直。 ^申請專鄉㈣5韻狀散歸置,其巾所述本體 還延伸出有分別與所述第二角部之兩第二固定侧緣平 行之兩擋板。 _ 9·如申請專利範圍第8項所述之散熱裝置,其中所述每一 擋板均與相鄰第二固定側緣之相鄰端緣相距一定距離。 io ·如申請專利範圍第1項所述之散熱裝置,其中所述散 熱器包括一基座以及若干從該基座延伸出來之散熱鰭 片’所述導熱介質塗覆於所述基座之底面,所述導熱介 質保護蓋過盈配合於所述基座上。200839491 «Im. Patent application scope: 1 · A heat dissipating device comprising a heat sink, a heat conducting medium coated on the heat sink and a heat conductive medium protective cover interspersed with the heat sink The protective cover includes a body formed with a heat-protecting medium protection space and a first-corner portion connected to the body and covering a corner end of the heat-radiating portion; the first-corner portion has two adjacent sides and - connecting the two An opposite side of the adjacent side, each of the adjacent sides extending a first fixed side edge that cooperates with the side wall of the one end of the heat sink; the improvement is that the first corner is rotatably connected to the opposite side thereof On the body, the first corner portion is phased; the body is turned over. 2. The heat sink of claim 1, wherein the first fixed side edges of the first corner are connected to each other at adjacent edges. 3. The heat sink of claim 2, wherein the two fixed side edges are perpendicular to each other. The heat dissipating device according to any one of claims 1 to 3, further comprising a second corner connected to the body and covering the other corner end of the two corners of the radiator disk The second corner is located at a diagonal position with the first corner. [5] The heat dissipating device of claim 4, wherein: one of: has two adjacent sides, each of which has a second fixed side edge extending to the side wall of the two ends: 'The two second solids;: The adjacent end edges are connected to each other. [6] The heat dissipating device according to claim 5, wherein the second corner 13 200839491 has two first fixed ISs: fixed side edges and the first side - wherein the fifth patent application scope is 5th The two second fixed side edges of the heat sink corners are perpendicular to each other. ^Application of the hometown (4) 5 rhyme scattered, the body of the towel also extends with two baffles respectively parallel to the second fixed side edges of the second corner. The heat dissipating device of claim 8, wherein each of the baffles is at a distance from an adjacent end edge of the adjacent second fixed side edge. The heat dissipating device of claim 1, wherein the heat sink comprises a base and a plurality of heat dissipating fins extending from the base. The heat conducting medium is coated on the bottom surface of the base The heat conductive medium protection cover is interference fit on the base. 1414
TW96109283A 2007-03-19 2007-03-19 Heat dissipating device TWI327270B (en)

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