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TW200835429A - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
TW200835429A
TW200835429A TW096105755A TW96105755A TW200835429A TW 200835429 A TW200835429 A TW 200835429A TW 096105755 A TW096105755 A TW 096105755A TW 96105755 A TW96105755 A TW 96105755A TW 200835429 A TW200835429 A TW 200835429A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
space
heat pipe
dissipation module
heat
Prior art date
Application number
TW096105755A
Other languages
Chinese (zh)
Inventor
Chia-Te Lin
Ching-Fu Yang
Original Assignee
Ama Precision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ama Precision Inc filed Critical Ama Precision Inc
Priority to TW096105755A priority Critical patent/TW200835429A/en
Priority to US12/025,056 priority patent/US20080196864A1/en
Publication of TW200835429A publication Critical patent/TW200835429A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H10W40/641
    • H10W40/73

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation module including a base, a heat pipe, and a fixing element is provided. The base has a space, and the heat pipe is disposed in the space. In addition, the fixing element is inserted in the space. The fixing element includes a body and at least an elastomer extended from the body, wherein the elastomer is suitable for pressing the heat pipe to make the heat pipe tightly assemble with the base.

Description

200835429 uy^U4〇/ 23225twf.doc/n 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種散熱模組,且特別是有關於一種 具有固定件之散熱模組。 【先前技術】 隨著電子產業的迅速發展,針對電子裝置的散熱處理 ⑩ 亦越來越被重視。舉例來說’ 一般led車燈具有高瓦數之 發熱功率,因此LED車燈中通常會配設散熱模組來降低 LED車燈之工作溫度。 圖1A繪示為習知之散熱模組的組合圖,圖iB繪示為 圖1A之散熱模組的分解圖。請參考圖ία與圖,在習 知之散熱模組100中,熱管110是藉由一迴焊製程而固接 於座體120之一貫孔122中,進而使得熱管11〇之一端部 H〇a與座體120有良好之接合關係。此外,熱管11〇之另 一端部ii〇b設有一鰭片組130,其中,鰭片組13〇同樣是 • S由迴焊製程來與熱管H0連接,以提升散熱模組100之 散熱效能。 然而,部份電子裝置之結構設計並無法讓已迴焊完成 之散熱模組100直接配置於電子裝置之内部空間中。舉例 來說,習知之LED車燈為一密閉殼件,其燈罩2⑽僅開設 一個供熱管110穿設之開孔202(請參考圖2,其綠示為圖 1B之散熱模組與燈罩的組合圖)。因此,已完成迴谭製程 之散熱模組100並無法直接穿過密閉殼件組設於燈罩· 5 200835429 0950467 23225twf.doc/n 中(已完成迴焊製程之散熱模組100會與開孔202干涉而無 法組設於燈罩200中)。為了配合上述燈罩2〇〇之結構設 計,唯一方法是先將熱管11〇穿設於開孔2〇2,並使熱管 110之兩端部分別位於開孔202之兩侧,接著再利用迴焊 製程來將座體120以及鰭片組130分別固接於熱管11〇之 兩端部,以將散熱模組100配設於高發熱功率之LED車燈 中。 瞻然而,一般之燈罩200材質為塑膠材質,塑膠材質並 無法承受迴焊製程之高溫環境。因此,先將熱管、座 體120以及鰭片組no裝配至燈罩2〇〇中,再對整個燈罩 200進行迴焊製程以將散熱模組1〇〇組裝至LED車燈之方 式並不恰當。具體地說,需藉由迴焊製程來組裝之熱管 110、座體120以及鰭片組130並不適合裝配於不耐高溫之 組件上。亦即,經由迴焊製程所製作之散熱模組1〇〇其應 用領域受限。 ^ " 此外,部分型式之散熱模組3〇〇是利用螺絲π:來將 i 熱管320固定於座體310中(請參考圖3,其繪示為習知之 另一種散熱模組的示意圖),然而當組裝人員欲將散熱模組 300配設於電子裝置之發熱源(未繪示)時,由於目前之電 子裝置均朝向輕薄化之設計趨勢,因此電子裝置内部並不 易&供足夠之空間來供例如是螺絲起子之鎖固工具作動, 衫%政熱拉組300之組裝效率,進而降低電子裝置之生產 6 200835429 uy3U4〇/ 23225twfdoc/n 【發明内容】 本發明提供一種散熱模組,其為組裝方式結合熱管與 座體,且在組裝至電子裝置之發熱源時不易受到組裝空間 之限制,進而提升電子裝置之生產效率,且使散熱模組具 有較廣泛之應用領域。 本發明長:出一種散熱权組’其包括一座體、一熱管以 及一固定件。座體具有一容置空間,熱管則穿設於容置空 間中。此外’固定件插置於容置空間,固定件具有一本體 以及至少一延伸自本體的彈片,其中彈片適於抵壓熱管, 使得插置於容置空間中之熱管與座體緊密裝配。 在本發明之一實施例中’座體更包括多個扣槽,固定 件更包括多個延伸自本體之卡鈎,而這些卡鈎適於扣合於 扣槽,以使固定件固定於座體。 在本發明之一實施例中,容置空間區分為一第一空間 以及一第二空間,且第一空間以及第二空間相通,使熱管 適於牙设於弟一空間,固定件適於插置於第二空間。 在本發明之一實施例中,固定件材質不限制,較佳為 一金屬件。 在本發明之一實施例中,座體之材質不限制,較佳為 金屬。 在本發明之一實施例中,熱管上相對於座體之一端, 更包括一散熱鰭片組,以增加散熱效率。 本發明是利用一具有多個彈片之固定件來使穿設於 容置空間之熱管與散熱模組之座體緊密裝配。相較於習知 200835429 23225twf;doc/n 技術本發明之散熱模組無彡貞軸迴焊製程來喊,因此 本發明之散触域於裝配於不耐高溫之崎上。亦即, 本,明之散熱模組錄歧之應用領域。此外,本發明之 ^件無須藉由任何細王具來獅即可使歸與座體緊 =裝=。如此一來,本發明在將散熱模組組裝至其他電子 ’,言即不^受到組裝空間之限制。換言之,本發明之散 ,模組有難德裝便樣,㈣設有本發日績熱模組之 電子裝置即具有較佳之生產效率。 為讓本發明之上述和其他目的、特徵和優點能更明領 易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說 明如下。 【實施方式】 人圖4A繪不為本發明較佳實施例之一種散熱模組的組 a圖,圖4B繪示為圖4A之散熱模組的分解圖。 凊同時麥考圖4A與圖4B,本實施例之散熱模組4〇〇 包括一座體410、一熱管420以及一固定件43〇。其中,例 如是金屬材質之座體410具有一容置空間412,而熱管42〇 之一端部420a是穿設於容置空間412中。此外,固定件 43〇同樣是插置於容置空間412。 具體而言,本實施例之容置空間412可區分為一第一 ,間412a以及一第二空間41¾,第一空間412a以及第二 空間412b彼此相通,而熱管420之端部420a可穿設於第 —空間412a,固定件43G則可插置於第二空間412b。上述 200835429 i 23225twf.doc/n 第一空間412a之空間設計不限 别έ士接孕乂仏疋與熱管420之外 型、、、口構相對應,而弟二空間412b之处 件430之外型結構相對應。 卫日%又计較彳土可與固定 承上所述,本實施例之固定件43〇,例如是一全 ,、主要由-本體432以及至少—延伸 434所構成(本實施例在圖4B中緣示2 片434例如是藉由對本體432進行―沖壓 ^中2200835429 uy^U4〇/ 23225twf.doc/n IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module having a fixing member. [Prior Art] With the rapid development of the electronics industry, heat treatment 10 for electronic devices has also received increasing attention. For example, 'typical led lights have high wattage of heating power, so LED lights are usually equipped with thermal modules to reduce the operating temperature of LED lights. 1A is a combination view of a conventional heat dissipation module, and FIG. 1B is an exploded view of the heat dissipation module of FIG. 1A. Referring to FIG. 1 and FIG. 3, in the conventional heat dissipation module 100, the heat pipe 110 is fixed in the constant hole 122 of the base 120 by a reflow process, so that one end of the heat pipe 11 is H〇a and The seat body 120 has a good joint relationship. In addition, the other end portion ii〇b of the heat pipe 11 is provided with a fin set 130. The fin set 13〇 is also connected to the heat pipe H0 by a reflow process to improve the heat dissipation performance of the heat dissipation module 100. However, the structural design of some electronic devices does not allow the heat-removing module 100 that has been reflowed to be directly disposed in the internal space of the electronic device. For example, the conventional LED lamp is a sealed case member, and the lamp cover 2 (10) only has an opening 202 through which the heat pipe 110 is disposed (refer to FIG. 2, the green color is the combination of the heat dissipation module and the lamp cover of FIG. 1B). Figure). Therefore, the heat dissipation module 100 that has completed the process of returning to the Tan process cannot be directly disposed through the sealed case member in the lamp cover. 5 200835429 0950467 23225twf.doc/n (the heat dissipation module 100 and the opening hole 202 have been completed. Interference cannot be set in the lamp cover 200). In order to cooperate with the structural design of the lampshade 2〇〇, the only method is to first pass the heat pipe 11 through the opening 2〇2, and the two ends of the heat pipe 110 are respectively located on both sides of the opening 202, and then use the reflow. The manufacturing process is used to fix the base 120 and the fin set 130 to the two ends of the heat pipe 11 , to dispose the heat dissipation module 100 in the LED lamp with high heating power. However, the general lampshade 200 is made of plastic material, and the plastic material cannot withstand the high temperature environment of the reflow process. Therefore, it is not appropriate to first assemble the heat pipe, the seat body 120, and the fin group no into the lamp cover 2, and then perform a reflow process on the entire lamp cover 200 to assemble the heat dissipation module 1 to the LED lamp. Specifically, the heat pipe 110, the seat body 120, and the fin set 130 to be assembled by the reflow process are not suitable for assembly on a component that is not resistant to high temperatures. That is, the heat dissipation module 1 manufactured by the reflow process is limited in its application field. ^ " In addition, a partial type of heat dissipation module 3 is to fix the i heat pipe 320 to the base body 310 by using a screw π: (refer to FIG. 3, which is a schematic diagram of another conventional heat dissipation module) However, when the assembler wants to dispose the heat dissipation module 300 in a heat source (not shown) of the electronic device, since the current electronic device is designed to be light and thin, the inside of the electronic device is not easy enough. The space is provided by a locking tool such as a screwdriver, and the assembly efficiency of the shirt is reduced, thereby reducing the production of the electronic device. 6 200835429 uy3U4〇 / 23225twfdoc/n [Invention] The present invention provides a heat dissipation module. The assembly method combines the heat pipe and the seat body, and is not limited by the assembly space when assembled to the heat source of the electronic device, thereby improving the production efficiency of the electronic device, and the heat dissipation module has a wide application field. The present invention is directed to a heat dissipation group which includes a body, a heat pipe, and a fixing member. The seat body has an accommodating space, and the heat pipe is disposed in the accommodating space. In addition, the fixing member is inserted into the accommodating space, and the fixing member has a body and at least one elastic piece extending from the body, wherein the elastic piece is adapted to press the heat pipe, so that the heat pipe inserted in the accommodating space is tightly assembled with the seat body. In one embodiment of the present invention, the seat body further includes a plurality of buckle grooves, and the fixing member further includes a plurality of hooks extending from the body, and the hooks are adapted to be fastened to the buckle groove to fix the fixing member to the seat. body. In an embodiment of the present invention, the accommodating space is divided into a first space and a second space, and the first space and the second space are connected to each other, so that the heat pipe is adapted to be disposed in the space of the brother, and the fixing member is adapted to be inserted. Placed in the second space. In an embodiment of the invention, the material of the fixing member is not limited, and is preferably a metal member. In an embodiment of the invention, the material of the seat body is not limited, and is preferably metal. In an embodiment of the invention, the heat pipe further includes a heat dissipation fin set relative to one end of the base body to increase heat dissipation efficiency. The invention utilizes a fixing member having a plurality of elastic pieces to tightly assemble the heat pipe which is disposed in the accommodating space and the seat body of the heat dissipation module. Compared with the conventional 200835429 23225twf; doc/n technology, the heat dissipation module of the present invention is called without a shaft reflow process, so the touch field of the present invention is assembled on a high temperature resistant strip. That is to say, this is the application field of the thermal module. In addition, the article of the present invention does not need to be brought to the seat by any fine king to the lion. As a result, the present invention integrates the heat dissipating module into other electronic devices, which is not limited by the assembly space. In other words, the module of the present invention has a difficult-to-use sample, and (4) an electronic device having a heat module of the present invention has better production efficiency. The above and other objects, features and advantages of the present invention will become more apparent from [FIG. 4A] FIG. 4A is a partial view of a heat dissipation module according to a preferred embodiment of the present invention, and FIG. 4B is an exploded view of the heat dissipation module of FIG. 4A. At the same time, the heat dissipation module 4A of the present embodiment includes a body 410, a heat pipe 420, and a fixing member 43A. The seat 410 of the metal material has an accommodating space 412, and one end 420a of the heat pipe 42 穿 is disposed in the accommodating space 412. Further, the fixing member 43 is also inserted into the accommodating space 412. Specifically, the accommodating space 412 of the embodiment can be divided into a first portion, a first portion 412a and a second space 412b. The first space 412a and the second space 412b are in communication with each other, and the end portion 420a of the heat pipe 420 can be disposed. In the first space 412a, the fixing member 43G can be inserted into the second space 412b. The space design of the first space 412a of the above-mentioned 200835429 i 23225 twf.doc/n is not limited to the other types, and the mouth structure corresponds to the heat pipe 420, and the second space 412b is outside the part 430. The type structure corresponds. The sunroof % can also be compared with the alumina and the fixed bearing. The fixing member 43 of the embodiment is, for example, a full body, and is mainly composed of a body 432 and at least an extension 434 (this embodiment is shown in FIG. 4B). The middle edge shows that the two pieces 434 are, for example, by "punching" the body 432.

片。值得—提的是,當熱管伽與蚊件_ 同日^又於谷置空間時’延伸自本體Μ2的彈片Μ4會抵 壓熱管420,進而使得插置於容置空間412中之教管0侧 與座體緊錄配。下文巾,本實施娜詳細說明固定 件是如何使熱管420與座體410緊密裝配。 圖5繪不為圖4A之散熱模組沿w,線的剖面圖。請同 時參考圖4B與圖5,在本實施例中,當熱管與固定件 430同時配設於容置空間時,熱管42〇會與固定件之 彈片434接觸,並對彈片434施予一下壓力量,使得彈片 434叉到彈性壓縮。相對地,延伸自本體432之彈片4料 在文到彈性壓縮之後,彈片434會相對本體432對熱管420 施予一彈性力,而熱管420在承受彈片434所施予之彈性 力之後即能與座體410緊密裝配。 當然,在其他較佳實施例中,可以依據使用需求來更 改彈片434之之尺寸及外型,進而使得彈片434能夠產生 足夠之彈性力來使熱管420與座體410緊密接合。具體地 說,本實施例在此並不對彈片434之尺寸及外型作任何限 9 200835429 uyju^+〇 / 23225tw£doc/n 制,凡能使熱管420與座體410緊密接合之彈片434均屬 本發明之精神與範疇。 此外,在本實施例中,為能讓固定件43〇穩固地固定 於座體410,以使熱管420與座體410間能維持緊密裝配 之狀態,本實施例可以於固定件430設置多個延伸自本體 432之卡鈎436,而於座體410上設置多個卡鈎436相對應 之扣槽414。因此,當固定件430插置於容置空間412 ^ Φ 使熱管42〇與座體410緊密裝配時,固定件430之卡鈎436 月b扣合於座體410之扣槽414。如此一來,固定件430即 不易受到不當外力影響而自座體410上鬆脫。亦即,熱管 420與座體410在受到不當外力影響時仍能保持緊密裝配 狀態。 此外,為能使散熱模組有較佳之散熱效能,本實施例 =可於熱官420之另一端部420b配設一鰭片組6〇〇(請參 圖6,其繪示圖4A之散熱模組與一鰭片組的組合圖)。 f此一來,料至散熱模組400之熱量即可經由鰭片組_ 境讀錄紅大氣巾,進而提高散熱模組_ 之政熱效率。 ,上所述,本發明之散熱模組係利用一具有多個彈片 件來使穿没於容置空間之熱管與座體緊钱配。相 車父於習知技術,本發明有下列優點: 座發日狀餘触是藉由—定絲使熱管與 體緊贫衣配,而錢經由迴焊製財絲管固接於座體 ,因此本發明讀熱餘雜裝崎不耐高溫之組件 200835429sheet. It is worth mentioning that when the heat pipe gamma and the mosquito _ the same day ^ is in the valley space, the sprocket 延伸 4 extending from the body Μ 2 will press the heat pipe 420, thereby inserting the teaching tube 0 side in the accommodating space 412. Closely recorded with the seat. In the following, the present embodiment details how the fixing member closely fits the heat pipe 420 and the seat body 410. FIG. 5 is a cross-sectional view of the heat dissipation module of FIG. 4A taken along line w and line. Referring to FIG. 4B and FIG. 5 simultaneously, in the embodiment, when the heat pipe and the fixing member 430 are disposed in the accommodating space at the same time, the heat pipe 42 接触 contacts the elastic piece 434 of the fixing member, and applies pressure to the elastic piece 434. The amount is such that the shrapnel 434 is forked to elastic compression. In contrast, after the elastic piece 4 extending from the body 432 is elastically compressed, the elastic piece 434 applies an elastic force to the heat pipe 420 with respect to the body 432, and the heat pipe 420 can withstand the elastic force applied by the elastic piece 434. The seat 410 is tightly assembled. Of course, in other preferred embodiments, the size and shape of the elastic piece 434 can be changed according to the use requirement, so that the elastic piece 434 can generate sufficient elastic force to tightly engage the heat pipe 420 and the base 410. Specifically, the present embodiment does not impose any limitation on the size and appearance of the elastic piece 434. The elastic piece 434 which can tightly join the heat pipe 420 and the base 410 can be used. It is the spirit and scope of the present invention. In addition, in this embodiment, in order to enable the fixing member 43 to be firmly fixed to the base 410 so that the heat pipe 420 and the base 410 can be closely assembled, the present embodiment can be provided in the fixing member 430. The hook 436 extends from the body 432, and the plurality of hooks 436 corresponding to the buckle 414 are disposed on the base 410. Therefore, when the fixing member 430 is inserted into the accommodating space 412 ^ Φ to closely fit the heat pipe 42 〇 with the seat body 410, the hook 436 of the fixing member 430 is fastened to the buckle groove 414 of the seat body 410. As a result, the fixing member 430 is less likely to be loosened from the seat body 410 by the external force. That is, the heat pipe 420 and the seat body 410 can maintain a tightly assembled state when subjected to an improper external force. In addition, in order to enable the heat dissipation module to have better heat dissipation performance, the present embodiment can be configured with a fin group 6 另一 at the other end portion 420b of the heat register 420 (refer to FIG. 6 , which illustrates the heat dissipation of FIG. 4A . Combination of module and a fin set). f. In this way, the heat of the heat dissipation module 400 can be read through the fin group to read the red air towel, thereby improving the thermal efficiency of the heat dissipation module. As described above, the heat dissipating module of the present invention utilizes a plurality of elastic pieces to tightly match the heat pipe worn in the accommodating space with the seat body. According to the conventional technology, the present invention has the following advantages: The daily contact of the seat is made by fixing the heat pipe and the body tightly, and the money is fixed to the seat by the reflow soldering tube. Therefore, the present invention reads the heat-retaining assembly and is not resistant to high temperature components 200835429

KjyjvHO / 23225twf.d〇c/n 上。^即,本發批散熱触錄敍之應用領域。 熱管與座件無須任何鎖固工具來辅助即可使 他衣配’ ^此本發明在將散熱模組組裝至其 ,子衣糾,不會有翻1具纽於組裝㈣之情況發 亦艮卩本杳明之散熱模組有較佳之組裝便利性。KjyjvHO / 23225twf.d〇c/n. ^ That is, this batch of heat-dissipation touches the application field. The heat pipe and the seat piece can be equipped with any locking tool to assist him. ^This invention is assembled in the heat-dissipating module, and the sub-clothing is corrected, and there is no need to turn over the assembly (4). The heat dissipation module of the present invention has better assembly convenience.

(二)由於本發明之散熱额有較佳之組裝便利性 =設有本發明之散鏡_電子裝置有較佳之生產效 4 = H任何熟習此技#者,在*脫離本發明之精神 ^祀圍内,當可作些許之更動與潤飾,因此本發明之保 扼圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1A繪示為習知之散熱模組的組合圖。 圖1β繪示為圖1A之散熱模組的分解圖。 圖2繪示為圖1B之散熱模組與燈罩的組合圖。 圖3綠示為習知之另一種散熱模組的示意圖。 圖4A繪示為本發明較佳實施例之—種散熱模組的组 合圖。 圖4B繪示為圖4A之散熱模組的分解圖。 圖5繪示為圖4A之散熱模組沿14,線的剖面圖。 圖6繪示圖4A之散熱模組與一鰭片組的組合圖。 【主要元件符號說明】 11 200835429 23225twf.doc/n 100 :散熱模組 110 :熱管 110a、110b :熱管之端部 120 :座體 122 ·•貫孔 130 :鰭片組 200 :燈罩 202 :開孔 • 300:散熱模組 302 ·•螺絲 310 :座體 320 :熱管 400 :散熱模組 410:座體 412 :容置空間 412a:第一空間 412b :第二空間 • 414 :扣槽 420 :熱管 420a、420b :熱管之端部 430 :固定件 432 :本體 434 :彈片 436 ·•卡鈎 600 :鰭片組 12(2) Since the heat dissipating amount of the present invention has better assembly convenience = the mirror of the present invention is provided - the electronic device has a better production effect 4 = H, any of those skilled in the art, in the spirit of the present invention In the meantime, it is possible to make some changes and refinements. Therefore, the warranty of the present invention is defined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a combination diagram of a conventional heat dissipation module. FIG. 1β is an exploded view of the heat dissipation module of FIG. 1A. 2 is a combination diagram of the heat dissipation module and the lamp cover of FIG. 1B. Figure 3 is a schematic view of another heat dissipation module of the prior art. 4A is a combination diagram of a heat dissipation module according to a preferred embodiment of the present invention. 4B is an exploded view of the heat dissipation module of FIG. 4A. FIG. 5 is a cross-sectional view of the heat dissipation module of FIG. 4A taken along line 14. 6 is a combination diagram of the heat dissipation module and a fin set of FIG. 4A. [Main component symbol description] 11 200835429 23225twf.doc/n 100 : Heat dissipation module 110 : heat pipe 110a, 110b : heat pipe end portion 120 : seat body 122 · through hole 130 : fin group 200 : lamp cover 202 : opening • 300: heat dissipation module 302 ••screw 310: seat body 320: heat pipe 400: heat dissipation module 410: seat body 412: accommodation space 412a: first space 412b: second space • 414: buckle groove 420: heat pipe 420a 420b: heat pipe end 430: fixing member 432: body 434: elastic piece 436 ·• hook 600: fin group 12

Claims (1)

200835429 / 23225twf.doc/n 十、申請專利範圍·· 1.一種散熱模組,包括: 一座體,具有一容置空間; 一熱官,該熱管穿設於該容置空間;以及 H二5:’具有—本體以及至少-延伸自該本體的彈 片’違固疋件插置於該容置",使該彈片抵壓該熱管, 而於該容置空間中之該熱管與該座體緊密裝配。 2·如申請專利範圍第i項所述之散熱模組,其中該座 體更包括多個扣槽,該固定件更包括多個延伸自該本體之 卡鈎,而該些卡鈎適於扣合於該些扣槽,以使該固定件固 定於該座體。 3·如申請專利範圍第1項所述之散熱模組,其中該容 置空間區分為一第一空間以及一第二空間,該第一空間以 及該第二空間相通,而該熱管適於穿設於該第一空間,該 固定件適於插置於該第二空間。 4·如申請專利範圍第1項所述之散熱模組,其中該固 定件為一金屬件。 5·如申請專利範圍第1項所述之散熱模經,其中該座 體之材質為金屬。 6·如申請專利範圍第1項所述之散熱模組,其於該熱 管上相對於該座體之一端,更包括一散熱鰭片組。 13200835429 / 23225twf.doc/n X. Patent application scope ·· 1. A heat dissipation module comprising: a body having an accommodation space; a heat officer, the heat pipe is disposed in the accommodation space; and H 2 : 'having a body and at least extending a spring piece extending from the body into the receiving portion, causing the elastic piece to press against the heat pipe, and the heat pipe and the seat body in the accommodating space Tight assembly. The heat dissipation module of claim i, wherein the base further comprises a plurality of buckle grooves, the fixing member further comprising a plurality of hooks extending from the body, and the hooks are adapted to buckle The buckle grooves are engaged to fix the fixing member to the seat body. 3. The heat dissipation module of claim 1, wherein the accommodating space is divided into a first space and a second space, the first space and the second space are in communication, and the heat pipe is suitable for wearing Provided in the first space, the fixing member is adapted to be inserted into the second space. 4. The heat dissipation module of claim 1, wherein the fixing member is a metal member. 5. The heat dissipation mold according to claim 1, wherein the seat is made of metal. The heat dissipation module of claim 1, wherein the heat pipe further comprises a heat dissipation fin set on one end of the heat pipe. 13
TW096105755A 2007-02-15 2007-02-15 Heat dissipation module TW200835429A (en)

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TW201124069A (en) * 2009-12-29 2011-07-01 Wistron Corp Heat dissipation module and portable device having the heat dissipation module
US20110290450A1 (en) * 2010-05-31 2011-12-01 Asia Vital Components Co., Ltd. Heat Dissipation Module
TWI445490B (en) * 2010-09-27 2014-07-11 Asus Global Pte Ltd Heat dissipating apparatus
US10408544B2 (en) * 2014-05-20 2019-09-10 Bell Helicopter Textron Inc. Composite top case with embedded heat pipes
EP3266288A4 (en) * 2015-04-20 2018-11-14 Hewlett Packard Enterprise Development LP Supplemental air cooling
CN108509001B (en) * 2018-04-02 2021-01-15 联想(北京)有限公司 Electronic equipment and water-cooling server thereof

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US3361903A (en) * 1965-12-03 1968-01-02 Cons Electrodynamics Corp Light source for a film projector
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