TW200834757A - Method of forming a micromechanical device with microfluidic lubricant channel - Google Patents

Abstract

A micromechanical device assembly includes a micromechanical device enclosed within a processing region and a lubricant channel formed through an interior wall of the processing region and in fluid communication with the processing region. Lubricant is injected into the lubricant channel via capillary forces and held therein via surface tension of the lubricant against the internal surfaces of the lubrication channel. The lubricant channel containing the lubricant provides a ready supply of fresh lubricant to prevent stiction from occurring between interacting components of the micromechanical device disposed within the processing region.

Description

</ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; , ° ^ [Prior Art] It is well known that as devices become smaller, the atomic and microscopic level of force between device components becomes more critical. Such problems with the type of force are quite common in micromechanical devices such as MEMS and NEMS. In particular, the ‘‘stationary’, force, which is moved during operation, and which is in contact with each other with thought or innocence, is a micromechanical problem. Adhesive failure occurs when the inter-gravitational force generated between the moving parts in contact with each other exceeds the restoring force. Therefore, the surfaces of these components are permanently or temporarily adhered to each other, causing malfunction or malfunction of the device. Adhesion is a complex surface phenomenon that typically includes: VanderWaal’s f〇rce, and electrostatic attraction. The technique used here = contact-like pick is the interaction between the two recording faces _, the _ surface actual entity =. Typical micro-mechanical (4) examples are: RF switch, optical modulator, micro-turn wheel, acceleration 2: wheel in == body nozzle, rotator, and other similar devices. L uses the term "MS device" to describe the micromechanical device in a general manner, including both the MEMS and NEMS devices discussed above. The problematic actuator is particularly prone to lubrication to reduce adhesion between component surfaces. And wear and tear of love 3 ϊ 形式 形式 和 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = Or laser patterning) to customize the texturing process by poetry (for example, the technique of micropatterning involves selecting the contact area of the material of a particular crucible to reduce the total adhesion. Another type of this, This reduces the surface energy of the contact surface, reduces the contact potential difference between charging, 5 200834757 or the component. The reference is recommended to add the opportunity of the adhesion-related failure in the area around the interaction device. Depending on the characteristics of the material, temperature, pressure, r, “New” riding is in the solid state or 2 delustering under the Week® conditions (ie room temperature and atmospheric pressure). Some of the prior art references describe the “steam, State Lubricant. This document uses the term "gas phase lubricant, to generally describe the mixing of ingredients, such as 'gas') and vaporized second ingredients, which are in proximity and pressure (eg Under S7P) is a solid or a liquid. Most of the solid or liquid lubricants remain in solid or liquid state at temperatures above room temperature and pressures below atmospheric pressure. VIII Under the ambient conditions and at temperatures well above ambient temperature, two examples of typical lubricants for solid corpuscles, gamma, are found in references such as U.S. Patent No. 6,93, 367. Such a conventional technique, a lubricating ship, consists of: (2) Dichlorodimethyl-infraline ("DDMS"), octadecyltrichloromethane ("D) deposited on each side component by a gas machine (" 〇ts, 〇, perfluorooctyl trichloro-Wei ("PFOTCS"), perfluorodecanoic acid ("PFDA,"), all-based triclosan ('卞^), perfluoropoly_ ("PFPE And gas-phase deposition processes ("F0TS"), such as atmospheric pressure chemical vapor deposition (APCVD), low pressure chemical vapor deposition (LPCVD), and plasma enhanced chemical vapor deposition ("F0TS"). PECVD) or other similar deposition processes. Techniques for forming a low surface energy organic passivation layer on the surface of a MEMS component are commonly referred to in the art as "steam lubricant" coatings, such as self-assembled monolayers (SAM). A serious drawback of low surface energy organic passivation layers such as coatings is that they are typically about a single layer, etc. Typically, because these types of coatings are susceptible to impact or wear due to the interaction of various moving components. Damage or displacement occurs, so they have a very limited usable life. Contact surface MEMS devices (such as optical modulators and RF switches) inevitably occur, and the contact surfaces described above are subject to frequent contact during use and substantial contact during product life. &quot; There is no way to reliably recover In the case of repairing a damaged coating, adhesion and lamination failure may occur. As shown in Fig. 1A, a method for lubricating a MEMS component is in a package (the 6 200834757 = base m, The 吸 〇 〇 4 and the seal 1 〇 6) provide a getter (God er) 11 〇, the array of the 娜 ^ 置 108 is located in the package 1 。. The ΐ β diagram illustrates a traditional package - its package The two MEMS device 108, and the getter in the head space 124 of the package 12〇, further includes a package substrate 128, a window 126, and a spacer ring 125. The two configurations 65843593 6 659795893

^Wei _ a type of reversible absorption getter to store lubricant molecules in the internal volume of the microtubes. In these designs, the source of the lubricant is kept in the suction &gt; ^ the amount of lubricant required to lubricate the naval unit 1〇8 in the normal operation period w &amp; 疋 ' increase reversible absorption _ _ _ _ _ _ The agent increases the seal = Na, and adds _ to the manufacturing process, which adds to the cost of parts and overall manufacturing costs. Therefore, the formation of these processes requires several labor-intensive and intensive treatment steps, for example: mixing getter 2 materials recorded in the package containing the device, curing the getter material, conditioning or starting and relying on the material, and then should The hall unit and getter are sealed in a sealed package. Less often, Chang Da Na actually has the particles, moisture and other pollutants in the towel, which is harmful to the === shipboard placement yield rate, and dirty S device drunk scale life. In the prevention of the ingenuity - the effort to complete the multiple processing steps of the hall MS device is typically done in a room environment (e.g., level 10 or better). Due to the high cost required to create and maintain the environment of the iq room, it is necessary to make such a clean room ring _ let ^ make the chicks, the money is less than the tenderness of the environment, the number of treatments of the kind of ntn face Na (10) secret and the surface silk Wei _ effort towel, · MS two will seal the leg (10) device in the device package, so that in the MEMS device week === special tank, the process is often required to be included in the device package (4); and, U-guap (especially wafer-level sealed package) During the sealing process

Such as _ (four) material crystal joints _ pass the bile seal process to / Lai, Qian Qichen put the lang to 2 thief to 45 (TC ΐ high connection if / strict device « slip agent type sub-pass and lead to lubrication Evaporation or failure of the agent after long-term exposure 7 200834757 The process of the process evaporates _ _ may re-condense the surface. Therefore, 'also need to - a type of device to seal the device ^ 'Asia and &gt; 5 dye the seal device manufacturing miscellaneous _For high temperature _ dew or material, 〜 _ _ 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承 承In the present invention, there is generally a method for forming a micromechanical device, a method of injecting a lubricant into a micromechanical device assembly, and transferring it to the "cutting (four) looking for" The package includes a substrate, an insert, and a method of attaching the device to the cover U, wherein

A step of forming a micromechanical device P and forming a lubricant passage in accordance with the present invention-embodiment, the lubricant extending through the micro-two mechanical wall, wherein a majority of the long-distance S3 region of the lubricant passage has a built-in assembly The appearance of the step, the passage of the passage through the micromechanical loading inlet is in fluid communication with the lubricant passage. Extending the anger of Langfang and being completely surrounded by it. Lin shot in the seal ϊί paid slipway +. When the lubrication is added, the position close to the opening of the lubrication channel into the treatment zone is added.

Processing, storing the riding agent in a step having a micromechanical device for extending through the inner wall of the processing zone, wherein the U cap is disposed in response to the light Radiation or heating to become a porous material = 2 hair · - Implementation of the woman riding a scorpion ship thief to install Wei Cheng _ 卞 method includes: the job is used to access the hole from the outside, and by capillary force t, i Steps in the pay slip channel. Holes can be formed with short-pulse lasers or long-pulse Rays 2 shots, and with _(four) shots, electron beam sources, or gambling seals = - only in the middle 'between the wiper channel and the outside The force difference is such that the pressure of 200834757 in the lubricant passage is equal to the external pressure. According to an embodiment of the invention, in a package having a micromechanical device and a processing zone for the micromechanical device, the method of transferring the lubricant to the micromechanical device in the form of a gas comprises: storing the fluid and the fluid in the treatment zone In the connected lubricant passage, and in the step of heating the package, the lubricant passage has a width of from 1 μm to 8 μm and a depth of from 1 μm to 2〇〇. The opening of the channel into the treatment zone has a cap disposed in the opening, the cap being constructed of a material that becomes porous in response to === or heating. θ...罕田射=present invention—implementation into a pour-on mechanical scoop method having a substrate, an insert, and a lid, the method comprising: forming a micromechanical device on the substrate; joining the insert to the substrate; ς ^ to the insert; At least one of the substrate, the insert, and the cover forms a lining agent, and the lubricant passage is in fluid communication with the processing zone of the micromechanical device. It can be joined at a lower temperature by a high temperature 1-pole bond, a eutectic bond, or a frit bond&apos; by using an epoxy:lipt joint. # When using high temperature joints, it will tear the Nagar Temple slippery towel. On the other hand, the #魏接= lubricant is added to the lubricant passage before the joining step. The advantage of the present invention is that the material formed in the package can transfer the amount of ''fresh') material to the area where adhesion may occur. In one view, the material is contained in - or more In a microchannel, these micro-passes will be moved by two = ^ by a channel in a sequential manner to bring people to the device / or two S-services, compared to the traditional lubricants, more cost-effective, Preventing equipment failure related to adhesion. [Embodiment] Simple, characteristic. However, it should be noted that 'these drawings only show the second type of this invention: ^本发发=== thinks that the invention is the same, because For the sake of clarity, the same reference numbers are used when applied to indicate the same elements that are common between the figures. It is contemplated that the features of one embodiment may be incorporated in other embodiments. Without further elaboration. The present invention generally relates to micromechanical devices. The micromechanical device can be reduced by the presence of one or more inclusions and transporting ride-channels with improved gamma lifetime. Each moving part of the device The possibility of sticking occurs between the embodiments of the present invention. The present invention includes a surrounding device package and a method of forming the device package, wherein the package 2 has one or more of her _ channels, and the sigma = S device. The MEMS device is provided with 4 trees, _ _ _ _ _ _ _ channel for riding fresh _ ready-made, the binding field in the device sealing area (10) device between the various interaction components. Fresh lubrication ^ = = for Replenishing the slip agent between the contact surfaces (depletion)

The present invention is directed to the gift of a micromechanical device, such as a face 8 device, or other similar thermal device or fluid V. In the new case, the number and type of lubricants disposed in the channel are selected such that :==:; the wall of the r zone is "upper" and then as a sub-division = the technical person in the art can (4) solve the problem, the term made here provides the contact surface with clear, anti-rotation and/or anti-filament. The term "lubricant," is used to describe the use of the MS device and/or gaseous lubricants. The sub-J is in a liquid, exemplary system. In the prevention of MEMS or NEMS, the life of components is contaminated in "^(10) devices such as particles, moisture or other heterogeneous materials. Figure 2A illustrates a typical Cross-sectional view of the package 23 ^ 2008 200834757 The package 230 includes a meMS device 231 enclosed within a processing zone 234 formed between the seedling 232, the insert 235 and the substrate 233. Typically, the cover 232, the insert Both the 235 and the substrate ^33 are hermetically sealed or non-hermetically sealed such that the components in the processing zone 234 are isolated from external contamination that may interfere with the use of the device. An owing, Figure 2B illustrates the meMs device 231 in Figure 2A. Representative micromechanical device, which is used herein to describe various embodiments of the present invention. The device shown in Figure 2B outlines a single __ mirror assembly 1G1 included in a spatial light modulator (SLM) Cross-sectional view: As those skilled in the art will appreciate, the various embodiments described herein may be directed to other empirically adhered or otherwise problematic MEMS, NEMS, large scale face or other comparable devices, so care should be taken The intention of the hall MS device shown in the figure is not limited in any way. The following is a discussion of the invention of the NEMS type device or the various embodiments of the NEMS type device. The purpose of the configuration is not to limit the scope of the invention. By way of example, the single mirror assembly 101 can comprise: a mirror 102; a substrate 1〇3; and a flexible member 107' which connects the mirror 102 to the substrate 103. The substrate 1〇3 At least one electrode (element 1〇6A or 1〇6B) formed on the surface 105 of the substrate 1〇3 is generally provided. The substrate 1〇3 can be made of any suitable material and is mechanically stable and capable of The lion semiconductor processing technology is formed. In the case of the financial, the substrate 1G3 is formed by a semiconductor material such as a miscellaneous material, and is processed according to a semiconductor processing technology. Other materials can also be used in the present invention. In an alternative embodiment, the electrodes 106A, 1G6B may be made of any material that is electrically conductive. In one aspect, the 'electrodes 106A, 106B are made of metal (eg, Lu, Ti), and deposited on the substrate 1〇3 On the surface 105' and is engraved by the surname The MEMS device of this type is described in the commonly-assigned U.S. Patent Application Serial No. 帛1, er. 7, the entire disclosure of which is hereby incorporated by reference. It usually consists of a reflective surface 1〇2A and a mirror bottom 1〇2B. The reflective surface is usually formed by depositing a metal layer such as !g or other suitable material on the mirror bottom 1G2B. The member 107 is attached to the substrate 1 〇 3. In one aspect, the tract member 1 〇 7 is a cantilever 'elastic, which is adapted to bend in response to the applied force, and then returns to its original state after removing the applied force. shape. In one embodiment, the substrate phase is fabricated from a first monolithic material, and the pull-up structure 11 200834757 107 and the mirror base 102B are fabricated from a second monolithic material such as single crystal. It is important that the surface of the allowable-dip (eg, mirror 1G2) is in contact with the surface of the device (eg, 'substrate 1G3), thus resulting in any configuration with __ adhered It is within the scope of the invention. For example, it is simply suspended in response to the applied force: • Winding, miscellaneous axis rotation, so that the cantilever beam-termination is difficult to place another surface, which is within the scope of the present invention. ^ In one aspect, one or more optional landings are formed on the surface 1〇5 of the substrate 103 (elements 10仏 and 1〇4B in Fig. 2B). This is then formed, for example, by depositing a metal layer comprising indium, titanium nitride, tungsten or other suitable material. In the other ^2 • Next 塾 can be from Shi Xi (8), polycrystalline seconds (p*-si), nitriding seconds (SiN), carbonized stone (&amp;), gold-like, stone carbon (DLC), copper (〇 〇, titanium (five) and / or other suitable materials. First, 2C 5U children are in a twisted state of the single mirror 101 due to the application of electrostatic force Fe, the electrostatic force FE is used by the power supply 112 in the mirror and the electrode a The voltage ν is applied between them. As shown in Fig. 2C, it is often desirable to bias the pad (e.g., element 1〇4A) to the same potential as the mirror 102 to eliminate the contact area with respect to the mirror 1〇2. In the typical operation, the single mirror assembly 1〇1 is actuated, so that the mirror 1〇2 is in contact with the pad 104A to ensure that the mirror 1〇2 and the substrate 1〇3 are achieved. The angle is so large that the input light radiation "A" is reflected from the surface of the mirror 1〇2 in the desired direction %. The mirror 1〇2 is deflected toward the electrode 106A due to the application of the voltage Va, and The bending of the member 107 produces a recovery &amp; climbing force (e.g., moment). The magnitude of the restoring force is generally determined by the physical size and material of the flexible member 1〇7. Resistance, and a flexible member H) 7 is subjected twist to determine the size. The maximum restoring force is typically limited by the fact that the fine is limited by the moment applied by the electrostatic force Fe that can be generated by applying the maximum allowable voltage vA. In order to ensure contact between the mirror 102 and the subsequent turn 104A, the electrostatic force &amp; must be greater than the maximum restoring force. ▲ The distance between the P-lens 102 and the pad 104A is reduced, and the parental interaction of the surfaces of these components typically results in one or more of the spectacles 1G2 peak force. When this point is at or above the restoring force, a device failure occurs because the mirror 102 is prevented from moving to a different position when the static electricity generated by the voltage % is removed or reduced. Purely here, the adhesion is a complex surface usually consisting of three major components. 12 200834757 The main Wei is the so-called "capillary force", and the capillary force is due to the imbalance of the intermolecular forces in the liquid age (for example, Lapu reduction) Pressure difference), 岐 (four) and _ between the ages =

Attractive. The interaction of capillary forces in MEMS and NEMS hits is typically in the case of thin-layer liquid trapping, contact between components, and the surface is typically a water vapor in the surrounding. Adhesive brother - the main component is Van der Guan, the Van der Waals force is the basic quantum surface pre-force generated when Xuan or the molecules are very close to each other. #脱_接接骑骑,凡彳尔力力 went by polarization, the ship polarization is caused by the atomic disc of the second component - the atom of her piece. When using a very flat structure (such as those in the Na and _ devices), the adhesion of this surface may be very large due to the effective contact area. The second main component is the electrostatic force generated by the fresh Coulomb attraction generated by the interactive test towel. 〆_Device package group release 3A is a plan view of the MEMS device package 23A illustrated in FIG. 2A, the device package 230 A microfluidic channel or lubricant channel 3〇1 is formed therein. For the sake of clarity, the Schott, package 230 is illustrated with a portion 391 of the cover 232 removed. Lubricant channel 3〇1 疋 micropass 'i.e. a pipe having a hydraulic diameter of a few microns to less than about 1 mm, and may be formed in any wall of the treatment zone 234. In one embodiment, as shown in Figure 3A, the cover 232 A lubricant passage 3 is formed in the lower insert 235. Alternatively, the lubricant passage 301 may be formed in the cover 232 or the base 233 of the mems device package 230. In one embodiment, the lubricant passage 301 is from the surrounding treatment zone 234. The inner surface 235 of a wall is delayed To the channel inlet 302 (see Figure 3). The channel inlet 3〇2 penetrates the outer surface 235Α' to allow one or more lubricants to be introduced into the lubricant channel 3〇1. In an alternate embodiment, the lubricant channel 301 does not extend to the outer surface (refer to Fig. 51), and is formed on one of the walls of the second processing zone 234 (refer to the first map). TJ&quot; in the surrounding to prevent particles, moisture and other pollutants from the outside The environment enters the treatment zone 234 and the lubricant channel 301, and the lubricant channel 301 is configured such that it is sealed to the external environment. In a case of a case, as shown in the figure 3B, the lubricant is used (for clarity) The inlets 302 are sealed with the closure 302A after introduction into the lubricant passage 301. The following 13 200834757 incorporates the 6F and 6G diagrams to illustrate: this is used to form the closure 3〇2A according to this embodiment. A method of sealing the channel inlet 302. In another embodiment, as shown in the figure sc, after filling the lubricant port 301 with a lubricant, the cap 3〇4 is placed at the channel inlet 3〇2 Upper. Cap 3〇4 can be such as a ring Oxygen resin or fine polymer, or other solid material bonded to the outer surface 235A using conventional sealing techniques. After the capping agent is filled into the gradual channel 3gi, it is placed in the π 302 The material plug. The material plug that seals the inlet of the channel may be indium, which is a base. It is used as a solder and a droplet application port to the inlet of the channel, and may not be used for welding: (four). The indium alloy with ♦ and thus the outer surface 235 and the channel inlet 302. The material plug that seals the channel inlet may also include a water-repellent high vacuum grease such as Krytox®. The slip channel 301 is adapted to contain a desired amount of lubricant (not shown) which is dispersed into the treatment zone 234 as time is said. The rate at which the lubricant migrates into the treatment zone is affected by many factors, including the geometry of the lubricant channel 3〇1, the molecular weight of the lubricant, and the lubricant to the surface of the treatment zone (eg, by physical rhyme, chemisorption). The capillary strength, the lubricant temperature, and the internal pressure of the treatment zone 234 are generated by the strength of the lubricant, the surface tension of the inner surface of the lubricant slip channel 3m. In the case of a sample, the lubricant passage 3〇1 is adapted to contain a lubricant volume between about !·! η (ηι) to about 1〇〇〇nl. Referring to Fig. 3B, the volume of the lubricant passage 3〇1 is defined by the length of the formed 朿=run/moon passage, the cross-sectional area. As shown in Fig. 3B, the length of the lubricant passage is the length of the rhythm surface 235B from the outer surface 235A, that is, the length of the line segments A, B and c, and. The channel length is between 1G micron and 1mm. In the case of the wealth, the k-section of the lubricant passage is rectangular, and the cross-sectional area (not shown) is defined by the depth (not shown) and the width W of the lubricant passage 3〇1. In one embodiment, the width of the lubricant passage 3〇1 is between about 1 〇 micrometer (μπι) to about _μηι, and the depth is between about 1 〇 micrometer (μπι) to large, and the spoon is 200 μιη. The cross section of the lubricant through this 3 〇 1 need not be square or rectangular, and may be any desired shape without departing from the basic scope of the present invention. Figure 3D illustrates a lubricant passage 3〇1 having a volume of lubricant 5〇5 disposed therein to provide a ready supply of lubricant to the treatment zone 234. During the normal operation period of the MEMS device 231 14 200834757

^ 234 ° &gt;F^'f #J 505 ^ MEMS access to the new and rotating _ series is m mutual, lubricant molecules in the processing area 234 = sub == r fresh Runqing J knife mouth The lubricant 505 in the lunar channel 301 is allowed to act as a moisturizing device, and the surface diffusion mechanism of the lubricant is diffused.

Reach the zone between the two interacting MEMS components. Within __ 23 = inside, the lubricant 5 〇 5 has a good diffusion on the surface contained in the treatment zone 234 == . The mechanism is the lubricant stored in the lubricant channel 3 〇 1 5 to 5 Interactions bribes ^: The vapor phase or gas phase migration between the junctions. In the - fortune, fresh, door:, the lubrication of the material storage _, so that it is sucked from these areas === I early = into the treatment area 234 in the form of gas or gas. During operation of the device, the lubricant "sub-zone 234" to equilibrium partial pressure (e, then migrates in a base gas state between the processing zone 234 and the interaction surface of the MEMS device 231) The type of conveying mechanism contributes to the establishment of the lubricant layer, thereby reducing the interaction of the _MS component, so that the lubrication flap is sent to the exposure area of the hall device ^~^ is commonly referred to as "supplement, lubricant layer, and Lubrication transmitted by any type of transfer mechanism is referred to as "moving lubricant." Typically, a sufficient amount of supplemental lubricant molecules are stored in the lubricant head 301 such that sufficient lubricant molecules are available for use in the product. The entire life cycle = between failures caused by adhesion at the interaction area of the MEMS device., port... In one embodiment, as illustrated in Figure 3E, the size of the lubricant channel 3〇1 is selected and selectively The inner surface 234A is treated such that the surface tension of the liquid lubricant 505 against the surface of the lubricant passage 3〇 and the inner surface 234A causes the lubricant 505 to be drawn from a position outside the MEMS device package 23 In the lubricant passage 3〇1, and then into the treatment zone 234. In this manner, the lubricant passage 301 acts as a liquid injection system that allows the user to use when the lubricant 505 contacts the wall of the lubricant passage 301. The resulting capillary force transfers an appropriate amount of lubrication 15 200834757 into the treatment zone 234. In one example, the cross section of the lubricant passage 301 is rectangular, and the width of the lubricant passage 301 is about 100 microns (pm) and approximately Between 600μηι, the depth is between about 100μ!η士 50μπι. When used, the capillary force can transfer an appropriate amount of lubricant = 〇5 to the treatment zone 234, the volume of the treatment zone 234 is smaller or larger than the lubricant channel 3〇1 In this configuration, two or more different lubricants of different volumes can be sequentially delivered via the same lubricant channel 3〇1. Alternatively, the lubricant channel 3〇1 can be used. The first lubricant is delivered, and then the second lubricant is held in the lubricant passage 3 in a subsequent step. In another embodiment, the lubricant 505 is selected such that a portion of the lubricant 5〇5 Steam, and steam or gas is formed in the treatment zone during the normal operation of the skirt. In the case of the light modulation H (SLM), the range of typical operating temperatures can be large and large. Between the 叱. The ability of the performance field or the seam depends on the unique factor and the balance part of the pressure, which depends on the temperature as a function; the pressure around the lubricant = area, the lubricant on the inner surface of the treatment zone 234 Bonding strength; and lubricant molecule 1. In the embodiment, the contact surface within the selected region 234 is rapidly diffused along the surface of the treatment zone 234 according to the lubricant 505, and the interior surface 234c of the treatment zone 234 is used as The non-wetting surface of the lubricant 505. In this way, the device is in the middle of another embodiment, and the Run No. 16 200834757 can be disposed in the lubricant channel 301 to prevent the interaction component in the MEMS device from sticking. Lubricant 505 is exemplified by perfluorinated polyether (PFPE), self-assembled monolayer (SAM), or other liquid lubricant. Some known types of ρ]ρρΕ lubricants are gamma or z-type lubricants available from Solvay Solexis, Inc. of Th^rofare, New Jersey (eg, Fomblm Z25), κ_χ from Dupont, and ?emmim from Co., Ltd. ®. Examples of SAM include: dichlorodimethyl shi shoubu (5) 骂,. , octadecane brothel ("ots") perfluorooctyl trichloropropene ("PFOTCS"), perfluorodecyl chloroform ("FDTS"), fluoroalkyl oxalate ("F〇TS" ). In an alternative embodiment, it may be desirable to modify the surface properties in the lubricant passage 301 to change the engagement of the agent with the surface of the inner region 3〇5 of the lubricant passage 301 (as shown in Figure 3B) • bL such as ' It may be desirable to use an organic passivation material such as a self-assembled monolayer (SAM) to etch the surface of the channel 3gi. Useful round materials include, but are not limited to, organic hydrazine [Z, such as octadecyldichlorodecane (0TS), perfluorodecyltrichlorodecane (FDTS). It can be modified by the __ channel's surface scale, wave, hard, or other form of electromagnetic firing to change the surface characteristics of the lubricant channel 3〇1. With the accompanying description, the conventional technology requires a retractable absorption getter to increase the resilience of the getter and the complexity of the device, and the steps are added. This view of the package design increases the cost of the two-two parts and the total manufacturing cost of the additional air-conditioning components. Therefore, the lubricant '3' is provided in the lubricant passage formed in or among the two or four crucibles around the respective walls of the treatment zone, and a reliable MEMS device. The use of the lubricant channel 3gi can go, the size of the fitting, the manufacturing cost, and the zero and the package ======= (Qing, getter material) The embodiment can also be changed to use the contact of the component Possibilities 'The slippery passage formed here is described here. 17200834757 Lubricant channel 301 is similar to the lubricant finger. Use the wafer level or wafer level packaging process, which is described above in Figure 2A.曰 round (four) neck Lu · - h #MEMS device around the 娜 装置 device package 23 〇 ; ;; in the next US w w 如 使用 使用 使用 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 MEMS MEMS 精 精 精 精 精 精 精 精 精 精 精 精 精炎^, 借ΗΗ® 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 罢 。 。 。 贝 贝 类似于 类似于 类似于 类似于 类似于 类似于 类似于A plurality of MEMS devices 231 may be formed on the substrate 233, or a plurality of MEMS devices 231 may be individually connected to the substrate 233. It is possible to sculpt the substrate 233, the plug-in crystal back and the glass wafer to form a dense use cutting, laser cutting, or die separation, and the individual MEMS device is _. The round-scale compact packaging and the residual and manual brewing after the die-singleization and the ultra-high clean room environment are required to reduce the total sealing cost of the manufacturing device. In addition, the embodiment of the present invention is described below for the conventional gauge (10) package. The process has advantages 'this is because the embodiment of the present invention removes the need to expose the MEMS device lubricant to high temperatures during the steps used to form the sealed processing region (10). Although the following discussion focuses on the wafer level packaging method, These techniques and general processing sequences are not required to be fabricated by the handle. Therefore, the embodiments of the present invention are not intended to be in the scope of the present invention. An example of a MEMS device package and a process for forming a MEM device package of a further embodiment is further described in the following document: a patent application in the co-pending application: 2 〇〇 3 years ι〇月24曰U.S. Patent Application Serial No. 10/693,323, the entire disclosure of which is incorporated herein by reference in its entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all U.S. Patent Application Serial No. 11/008,483, filed on Dec. 8, 2004, and attorney file number No. 4,027,017, 001, 001,300. Figure 4A illustrates a MEMS device package for forming a lubricant channel 3〇1 in accordance with an embodiment of the present invention. Processing sequence 400 of 230. Figures 5A-5F illustrate various states of one or more components of MEMS device package 230 after various steps of processing sequence 400 have been performed. Figure 5A is a diagram that can be used to form Figure 5F. A cross-sectional view of 18 200834757 wafer 235C of a plurality of MEMS device packages 230. The wafer 235C may be fabricated by, for example, a stone sho (Si), a gold corpse, a female material, a plastic material, a polymeric material, or other suitable material. The material is formed. The V-glass coupling material is now referred to 帛4A and f 5Bffl, and in step 450, a lubricant channel is formed on the top surface 4〇4 of the wafer 235C by conventional patterned male and dry side techniques. : and can The selected recess 40 is defined by the time and rate of implementation of the conventional dry side on the wafer 235C to set the depth D of the lubricant channel 301 and the recess 401. It should be noted that conventional etching, ablation or other fabrication techniques can be used. To form the lubricant channel 401 without departing from the scope of the basic invention. Concave now with reference to Figures 4A and 5C, in step 452, through conventional patterning and dry etching techniques through the depression The bottom wall 403 of 401 removes material from the back surface 4〇5 to form a through hole 402 that defines the inner surface 235B. Inner surface 235B, together with cover 232 and base 23 shown in Figures 5E-5F, defines a treatment zone 234_ of the meMS device package 23A. The 235C removes the material to form the vias 402. It can also be greened by conventional engraving, stripping or his similar manufacturing techniques. Alternatively, the wafer 235C having the via 402 can be formed in the previous step. In step 454, as shown in Figures 4A and 5D, the cover 232 is bonded to the top surface 404 of the wafer 235C to surround the lubricant channel 3〇1 and cover each of the through holes 4〇2. One

end. Typical bonding processes may include anodic bonding (e.g., electrolysis processes), eutectic bonding, fused bonding, covalent bonding, and/or frit bonding processes. In one embodiment, the cover 232 is visible

, Coming^Eagle2000TM), a jjj 235C Bonding the cover 232 to the wafer 235C by using conventional anodic bonding techniques. Typically, the temperature of one or more of the components in the Schna apparatus package is about 35 〇C and about 45 在 in the transfer-anode bonding process. (In the meantime, more information on the anodic bonding process is provided in the U.S. Patent Application Serial No. 11/28,946, filed on Jan. 3, the entire disclosure of which is hereby incorporated by reference. It is to be noted that, as shown in FIGS. 4A and 5E, the substrate 233 having the plurality of sub-clothes 231 mounted thereon is bonded to the back surface 4〇5 of the wafer 235c to form the MEMS device 231. Processing zone 234 surrounded therein. Typically, an anodic bonding (eg, electrolysis process), eutectic bonding, fusion bonding, covalent bonding, and/or frit bonding process is used, 19 200834757 bonding substrate 233 to the wafer 235C. In one embodiment, substrate 233 is a germanium containing substrate, wafer 235C is a germanium containing wafer, and substrate 233 is bonded to wafer 235 using a frit bonding process. Typically at least one of the 'MEMS device hybrids or The temperature of more components is in the frit joint, the temperature between the process _ about 35GT: and about 45Gt:. Additional information about the glass-bonding process is put forward on January 3rd, 2G〇5 US Patent Application No. 11/028, 94 Provided in No. 6, which is hereby incorporated by reference in its entirety. Referring now to Figures 4A and 5F, in step 458, wafer stacks consisting of substrate 233, wafer 235C, and cover 232 are stacked using conventional dicing techniques. Separate to form a plurality of MEMS device packages 23. The excess or waste material 411 left after the dicing process can then be discarded. As part of step 458, conventional wire bonding can be performed on the formed Mgs device and Testing to ensure its durability and fabrication of the device for use in systems where the MEMS device package 230 can be used. Other cutting techniques can also be used, first exposing the bond pads to allow wafer level detection and grain classification, and then implementing the overall Singularization. Figure 6A is a MEMS device package 230 with a partially formed lubricant channel 301 = plan view, the MEMS device package trace can be formed using the process steps shown in Figure 4A to step 458. See, the device package 23A is removed after the cover Μ: = part of the section 6G1 。. As shown, only the lubricant = 301 is formed in the insert 235, The end of the lubricant passage 3 〇 ι close to the outer surface 235A is blocked by the excess insert material 5 〇 1 having a material thickness of 5 〇 2. Generally, the material thickness 5 〇 2 can be thin to allow for the removal of the side scales. Training, scale shooting · 1G micron -) to about imm. In this configuration, the lubricant passage is formed from the outlet 璋3〇3 = penetrating the inner surface 235B to the opposite end blocked by the excess insert material 501. In this manner, during the second step 460 of Figure 4A below, the treatment zone 234 remains sealed until the excess insert material 5〇1 is removed to remove the lubricant injection channel 3〇1. In the step of processing the sequence 働, as illustrated in the first and the πth, the channel = 02 is formed to the lubricant channel 3〇1 towel. As illustrated in Figure 6b, the step of excess insert material 501 can be used to form a channel entry. Alternatively, the entanglement, grinding, or polishing technique of the ferrule removes substantially all of the excess insert 枓 501 to expose the lubricant passage as illustrated in the figures. In a view 20 200834757, when excess insert material is removed to ensure that particles cannot enter the processing zone 234, it is desirable to clean and remove any particles produced by the lubricant channels. Since the accuracy of the excess insert material 501 of the package 230 is removed, the thickness control aperture (10) can be formed near the lubricant passage 3〇1 during the formation process of the lubricant channel 301, such as the 6A. The figure shows. The presence of the thickness control aperture 503 allows for a deviation 504 in the removal of excess insert material 5〇1 (see Figure 6A) without affecting the material thickness of 5〇2.

In one embodiment, as illustrated in FIG. 6B, the channel is introduced into π 3G2 by transferring energy such as a laser pulse or an electron beam pulse to drill through the excess insert material and to be lubricated. The aperture of the agent channel 301. Laser can be applied to channel inlet 302 using short pulsed lasers such as ultraviolet (uv) lasers, or long pulsed lasers such as infrared (IR) lasers, or constant (cw) lasers. drilling. For example, when the excess insert material 5〇1 is made of material and the material thickness is about 1GG to 2_η thick, the m 2ge/shg 532 switch laser can be used. In this case, the average for the drilling (4) is set between about ι 〇 and the maximum force is 2.5W 'use about 3 〇〇〇 to 6000 pulses (depending on the exact thickness of the excess insert material 5〇1) And miscellaneous), Q is less than about the touch, the pulse width is about 6 lang

And 18ns. Alternatively, an IR laser can be used for laser drilling to form a channel entrance 3〇2, such as a 2〇w fiber laser with an L06_laser wavelength. In this case, depending on the exact value of the material thickness 502, a pulse between about 2, _ and 1 〇, _ is transmitted ^ and the pulse is transmitted at a frequency between 25 kHz and 40 kHz. It is believed that the use of IR lasers results in the formation of liquids in the X-hot material due to the higher energy absorption rate of these wavelengths and the reduction in the number of particles produced during the drilling process. _Backflush the ship on the inner surface of this 301. Thus, the use of IR lasers can substantially reduce particle contamination formed in the lubricant passages and/or treatment zone 234. The inventor of the present case "set, IR laser secret _ generation of the output can be minimized by optimizing the laser setting. For example, when the excess insert material 5〇1 is a ruthenium-containing material and the material thickness is about 100 to 200 μm thick, the channel entrance 302 having a diameter of about 1 〇 to about 3 〇 μηη is formed by adjusting the IR laser. The generated particles can be minimized. Furthermore, in order to minimize oxidation of excess insert material 5〇1 during laser drilling of +46 〇, the laser drilling process can be performed in anaerobic. For example, the step bias can occur in a chamber filled with an inert gas (eg, brother 21 200834757 inert gas or rare gas nitrogen) or a rare gas (eg, argon). Alternatively, it can be used as a partial purge gas mask. In one embodiment, during formation of the MEMS device package 230, the gas conditioned zone 234 is used to a pressure greater than atmospheric pressure such that any particles generated during the removal of the excess plug material 5〇1 are processed from the effluent gas. The region 234 is expelled. In one aspect, the +-generation pole (i.e., the process of joining the substrate 233 to the back surface 4〇5 of the wafer 235C is $, the charge treatment zone is Μ to a pressure above atmospheric pressure. In this case The production site performing step 456 is maintained at a pressure above atmospheric pressure so that when the processing zone 234 is fully formed, ^

The atmosphere at atmospheric pressure is trapped in the treatment zone 234. The gas held in the treatment zone 234 can be η = a gas, such as nitrogen or argon. In another embodiment, the device is placed in a beak ring sealed container having a transparent wall that allows UV or IR laser beam penetration. The vessel is evacuated to a vacuum pressure of millimeters of mercury before being drilled to form a channel inlet 3〇2. The large pressure difference between the treatment zone 2; 34 and the evacuated chamber is step-inhibited: during the formation of the channel inlet 3〇2, the particles produced by the laser drilling are enriched in the channel 3G1. Subsequently, the desired gas, such as dry nitrogen or dry argon, is used to backfill the container and apparatus prior to removal of the device from the sealed container. The tea test is shown in Fig. 4A, and in step 461, one or more lubricants are introduced into the lubricant through 301. As described above in connection with Fig. 3E, the lubricant passage 3〇1 and the passage inlet 302 can be configured such that the capillary force draws the lubricant 5〇5 into the lubricant passage ,8 as illustrated in the figure. Therefore, the lubricant can be filled with the lubricant 5〇5 by using a syringe, a pipette or the like to place the appropriate lubricating material 5 near the inlet of the passage recognized by the outer surface 23. 301. ^ In Figure 4A, in step 462, the channel inlet 3〇2 is sealed to pass the lubricant, the treatment zone 234, and the lubricant 5〇5 disposed therein, external to the device package 230. Environmental isolation. In one embodiment, as illustrated in Figure 6e, the cap is mounted and routed into 1 302 to seal the lubricant passage. The composition of the cap 3〇4 has been described above in connection with Fig. 3^. In another embodiment, a spot welding method such as laser welding can be used to seal the carrier n 3G2. In the point of view, a laser such as an IR laser or a continuous laser is used for the process. In order to minimize manufacturing costs, IR, which is substantially similar to the laser used in the step Yang (i.e., the step of forming the channel inlet 302 through the 22 200834757 remnant material 501), may also be used in step 462 (ie, , the step of sealing the lubricant passage 3〇1). For example, when the excess insert material 501 is a tantalum-containing material and the channel inlet 3〇2 has a diameter between about 1 μm and about 30 μm, R〇fm StarWdd 4〇 having a laser wavelength of 106 μm can be used in the single pulse mode. The channel inlet 3〇2 is sealed with a pulse width of about 1 ns, an energy between about 〇1 and 〇6J, and a spot size between about ημηι and 4〇〇μηι. Figure 6F illustrates a method of sealing a skid channel 3〇1 using an IR laser according to one embodiment, 'where the laser is used to heat a region adjacent to the channel inlet 3〇2, so some excess plug material 501 is dissolved. It is pushed and pushed to the channel entrance 3〇2. In this embodiment, a weld pit 52 is formed on the outer surface 235A using Han or its 7-pulse laser, and a portion 521 of the weld pit 52 is privately placed over the passage inlet 302, thereby sealing the lubricant passage 3〇1. Figure 6G illustrates another method of sealing a lubricant passage 3〇1 using a melon laser according to an embodiment in which one or more laser pulses are used to heat a region on the outer surface to be within the lubricant passage 301. One or more seals 522 are produced. In this embodiment, sufficient energy is allowed to form one or more weld pits 523 in the weld zone 524 to form a lubricant in weld 1 524 as shown in the figure = internal seal lubricant passage 3 The geometry of the channel 3〇1 ensures that the weld pit 523 completely seals the lubricant passage 3〇1 to the surrounding environment. For example, the portion of the lubricant passage 3〇 corresponding to the position of the weld pit 523 may be disposed closer to the outer face, and/or it may form a remainder substantially narrower than the lubricant passage 3〇1. As illustrated in Figure 6G, the use of weld pits 523 to seal the lubricant passage minimizes the amount of oxidized material contained in the seal portion. &quot; Figure 4B illustrates a process sequence 410 for forming a garment package 230 comprising a lubricant channel 301 in accordance with one embodiment of the present invention. Steps 450 and 452 in processing sequence 41 are substantially the same as steps 450 and 452 in processing sequence 400, and have been described above in connection with Figures 4A, 5A, SB, and 5C. Referring now to FIG. 4B, in step 494, a cover having a plurality of channel inlets 302 is aligned with the top surface 4A4 of the wafer 235C and bonded to the top surface of the wafer c. 301 and cover one end of each through hole, as shown in the f 5G diagram. Figure 5G is a cross-sectional view of wafer 235C and cover 432 after bonding. Step Milk 4 Substance 23 200834757 is similar to step 454 of processing sequence 4i, except that cover 432 includes a plurality of channel inlets 302' that provide these channel inlets 3〇2 and respective lubricant channels 3 formed in the wafer use. A part of 〇1_ is aligned. Alternatively, channel inlet 302 may be formed in two sub-432s after cover 432 is bonded to wafer 235c. In this case, the channel entrance 3〇2 can be formed by lithography, stripping, and/or etching techniques that are commonly known in the art. In either case, the formation or alignment of the channel entrance 302 is part of the wafer level process. As noted above, wafer level processes typically reduce the manufacturing cost of the device compared to wafer level processes. In step 496, as shown in FIG. 4 and FIG. 5, a substrate 233 having a plurality of MEMS devices thereon is bonded to the back surface 405 of the wafer 235C to form a MEMS in which the 231 is disposed. The processed area 234 is surrounded. Step 496 is substantially similar to step 456 of processing sequence 400 in FIG. 8A. In step 498, as shown in FIGS. 4B and 51, lubricant 5〇5 is introduced into the wafer=process. Each lubricant channel is in 3〇1. In this embodiment, before the lubricant 5〇5 slip agent, 3()1, there is no need to cut the wafer stack formed by the substrate 233, the wafer and the lid into a plurality of tearing devices. Package 23〇. Conversely, an appropriate amount of lubricant 5〇5 can be placed in the vicinity of each opening in the inlet 3G2 by using, a main liquid pipe, or the like, and used. Capillary refines the lubricant channel in 3G1. In this manner, the number of wafer level fabrication steps required to fabricate the garment 230 is minimized. In step 499, as shown in Figures 4B and 5J, the second = ring is separated. Step 499 of processing sequence 410 is substantially similar to step 462 of processing sequence 400, the difference being step = 4 =============================================================== A part of the transfer pit is eutectic solder, glassy or its type, "", "10" oxy-resin, in step 458, as shown in Figure 4 and Figure 5, using conventional cutting techniques will be 24 200834757 The wafers consisting of lids 232 are stacked to form a plurality of garment seals. The step 458 of process sequence 10 is substantially the same as the processing sequence 4〇〇4—58: and has been incorporated above with reference to FIG. And Figure 5F illustrates. Then, you can drop the excess or waste material 4n left after the cutting process. As part of step 458 (4) i device fine _! 丨 hybrid and ship, (d) miscellaneous and ^ MEMS attack It is used in a system for the use of a money-saving device. It is also possible to first expose the bonding defects to allow wafer level detection and grain classification, while FIG. 5L illustrates a device package according to an embodiment of the present invention. In the figure, ^, the channel inlet 3〇2 is formed in the cover 432, does not penetrate the outer surface = thousand face brother 4 Figure C - In accordance with one embodiment of the present invention for forming a chamber treatment, the fine MS device package 23G includes: a lubricant channel and a = slip agent base. Steps 45 and 452 in the process sequence 420 are substantially The processing sequence is identical to steps 450 and 452, and has been described above in connection with Figure 5A and Figure 5C. U-Le plus circle and now with reference to Figure 4C, in step 4, there will be a plurality of Laker devices The upper substrate 233 is aligned with the back surface 4G5 of the crystal 1] 235c, and bonded = the back surface 4〇5 of the grease layer wafer 235C, as illustrated in FIG. 5M. The 5th portion is formed later. The wafer 235C of the region 234 and the cross-section of the substrate 233. The epoxy bonding process of step 484 is a type of bonding process compared to % pole bonding, eutectic bonding, material bonding, covalent bonding, and/or bonding. Low temperature process. As mentioned above, lubrication 508 is also formed in each slip agent « 301 to open the rope 234 and the lubricant passage 3 〇 / knife. As mentioned above, the lubricant plug 5 〇 8 can Is a polymer such as a photoresist that is converted into a porous material when exposed to radiation of UY or other wavelengths. In the alternative, the lubricating scorpion sputum may be a polymer or other heat sensitive material that fails or changes physical properties when exposed to heat. In step 486 'as shown in Figures 4C and 5N, one or more The lubricant is introduced into the 55通^01. Because in this processing step, the lubricant passage 301 is open, and the lubricant 5 〇 5 is sucked into the lubricant passage 3 〇 1 towel. Lubricant plug 25 200834757 Sub 508 prevents lubricant 505 from entering treatment zone 234. In step 487, as shown in Figures 4C and 50, cover 432 is aligned with top surface 404 of wafer 235C and is A second epoxy layer 507 is bonded to the top surface 404 of the wafer 235C as illustrated in FIG. The fifth drawing is a yellow cross-sectional view of the wafer 235C, the substrate 233, and the cover 432 after bonding with the second epoxy layer 5〇7. The cover 432 is joined to the top surface 404 to surround the lubricant passage 3〇1 and the lubricant 5〇5 contained therein, and the treatment zone 234 in which the contact device 231 is completed is completed. In step 488, as shown in Figures 4C and 5P, the seal of the lubricant plug 508 is broken or physically altered to allow the lubricant 5〇5 to enter the treatment zone 234. The removal process can involve exposure to UV radiation passing through the cover 232 or exposure to heat. In step 458, as shown in Fig. 4C, the lamellae consisting of substrate 233, round 235C, and cover 232 are stacked by conventional cutting techniques to form a plurality of device packages 230. Step 458 is illustrated above in connection with Figures 4A and 5F. In an alternate embodiment, the lubricant passage 301 is formed such that the contents of the lubricant passage 301 can be seen through an optically transparent wall (e.g., cover 232) surrounding the treatment zone. In this configuration, the lubricant passage 301 is formed in the cover 232 or the insert 235 so that the contents of the lubricant passage 3〇1 can be seen by the optically transparent tweezers 232. This configuration is useful because it allows the user to check the contents of the lubricant passage 301 to see how much lubricant 505 remains in the lubricant passage 3〇1 so that corrective action can be taken if necessary. In another embodiment, the amount of lubricant introduced into the lubricant passage 3〇1 and the treatment zone 234 is improved by diluting the lubricant with another liquid prior to injecting the lubricant into the MEMS device package 23〇. control. In some applications, it is important to accurately and reproducibly transfer a quantity of lubricant to the lubricant passage 301. Too much lubricant may supersaturate the lubricant vapor in the treatment zone 234, resulting in a cohesive lubrication night at the contact zone between the interacting MJEMS components, which may cause adhesion-related failures. Too little lubricant may shorten the life of the chamber 231 contained in the device package 230. However, the volume of lubricant required for the package 23 可能 may be as small as the nanoliter level, and the known accurate volume transfer of the liquid is only applicable to liquid volumes one or more orders of magnitude larger than the volume. The inventors of the present invention have determined that by diluting the lubricant in another liquid, the 26 200834757 liquid introduced into the MEMS device package 23 can be substantially increased, for example, 10 times or 100 times without being introduced into the MEMS device package. The amount of lubricant in 230. In one aspect of this embodiment, the lubricant is diluted with a solvent having a lower steaming &gt;% ink force and a much larger volume than the lubrication. After sealing the lubricant-solvent solution in the lubricant channel 301, the MEMS device package 230 undergoes a drying and pumping process to remove the solvent because the overpressure causes the vaporized solvent molecules to diffuse out of the MEMS package 230. In another aspect of the invention, the lubricant is mixed with a much larger volume of liquid which has a higher vapor pressure than the lubricant and is at least slightly miscible with the lubricant. After sealing the combined lubricant and the higher vapor pressure liquid in the lubricant passage 3.1, the MEMS device package is dried at a temperature that is higher than the vaporization temperature of the lubricant (eg, 200 C)' and The vaporization temperature of the liquid below the higher vapor pressure (eg, 6 (8).). In this manner, the lubricant is activated, i.e., vaporized and can diffuse into the treatment zone 234, while the inter-solution containing the lubricant is suitably held in position in the lubricant passage 3〇1. One advantage of an embodiment of the invention described herein relates to the general sequence and timing of transferring the lubricant 5〇5 into a 1EMS device package 23〇. Generally, one or more embodiments of the invention described herein provide a sequence in which lubricant 5 is after all high temperature device packages = (eg, anodic bonding and frit bonding) have been performed. 〇 5 is transmitted = area towel. The sequence is low or the premature release or failure of the slip agent during the in-service high temperature bonding process, which is achieved. c to Liu. The temperature of c = the ability to tear the lubricant into the lubricant channel 3〇1 and the treatment zone 2 after the high temperature bonding step allows the following smashing material: the sliding material may be in a typical joint temperature production, And / or reduce the lubricant material in the hall - device formation process failure or ^ ^ This technical person also knows that she enters the crystal - level packaging process, which uses the wafer level sealing device package formed in the run-up channel 301 money ... Another advantage of the embodiment after implementing the dirty S, for example, anodic bonding, soldering, electron beam soldering, involves the formation of a _s device package that requires inhalation. Conventional MEMS device fabrication processes require the following salt-forming MEMS The device seals the test Wei _ difficult to turn the job to his group ^ 27 200834757 surface, and 2) heat the package to start the getter skirt. Removing these steps reduces the number of processing sequence steps that need to be performed in a clean room environment, and thus reduces the cost of forming the device. The presence of conventional reversible absorption getters also limits the temperature at which the device package is tightly sealed, especially for wafer level processing. Although the first theory only describes such a MEMS device package, ie a MEMS device and a single lubricant channel for transferring lubricant material to the processing zone 234, a plurality of different geometric features are formed in the device package 23〇 and The position of the lubricant channel fine MEMS encapsulating towel is more filthy and filthy. Ayi is specially incorporated into the lubricant channel to act as a particle transition or a particle trap. The geometric features of this can be used in Different stages of product life transfer different diagrams with multiple lubricant channels 3 〇ΐΑ · The same ΐ production, open a plurality of lubricant channels 301 fine skin formed to have no different ίί 财 , , , , , , , The device package 230 is uniformly self-lubricating channel __ molecules in the whole = large grain size device is particularly beneficial. The pair of sounds with the 3〇lC can be adjusted to the optimum of the lubricant channel 3〇1Α in the case of the charm. , a - clothing 1 / cost ' or the body of the lubricant to be included in the lubricant channel, the first type __ ^ 子 子 material. In one implementation there was a slippery channel 3G1A towel. The κ _ f &amp; channel 3G1A transmission, or the storage channel 3〇1B transmission, or stored in the lubrication ^gong 3 〇 = slip = sub = = by the lubricant flux in the molecule is placed in the positive f In operation, the second, middle, and second shifts have a non-mobility rate i S in the entire package, and there is no balance of partial pressure and/or per slip agent in another embodiment, the second - 2 From which, in the case where the lubricant molecules of the treatment zone are introduced into the inner surface of the treatment zone, the movement of the first type is selected 28 200834757 and then the lubricant of the second type is widely formed to form a uniform single layer. The multiple monolayers in the meMS are loaded with (4) (four) life agent molecules J to adjust the turbidity agent described herein; the second = deposits - in terms of degrees, the type of lubricant that should be treated in f. The cross-sectional view of the crane and the surface rough sugar and the 3G1E crane. These two have different geometric materials to smash the ship or the surface, and export the bribe or fine to the processing zone. As shown, the lubricant channel ^ has a second 彳 channel, the first rim, the cross-sectional area 埠 303A to reduce the lubricant to the treatment zone 234 Β 〇 〇 ^ ^ ^ :) 'Second lubricant Channel 3〇1E has a large cross-sectional area to use this Pu and = Miscellaneous Shan 2 when combined with fine PWiLA from # ♦ 田Γ«弟一/门α Μ通逼3〇1Ε can be used in the start of MEMS devices The surface inside f4 is saturated. However, the first lubricant passage 3〇id can slowly transfer fresh lubricant to the treatment zone 234 during the smear of the garment. - 7C tooth (7D figure δ 儿 ming contains another filter case 3 (10) of the filter channel 6 〇 5 filter, zone 605 contains a plurality of obstacles 〇 1 , these obstacles 〇 1 for The flow of particles of a particular size from the environment outside the MEMS package to the processing zone 234 is minimized. The barriers are generally configured to have a desired length of 6〇3, a width of 6〇4, and a height. (not shown, ie, 'into the page') each of the obstacles 601 has a desired spacing of 6〇2, and thus acts as a filter 1 § to prevent the size of the particles from flowing into the treatment zone 234. It may be formed The obstacle 601 is formed in the lubricant passage 301F during the process of the lubricant passage 301F using conventional patterning, lithography, and dry engraving techniques. In one embodiment, the lubricant passage 3〇1F width w and is disposed in the lubrication The obstacle 6〇1 direction in the agent transport 301F is configured to maximize the flow of lubricant to the treatment zone. In another embodiment, the width w of the lubricant passage 3〇1F and the obstacles disposed therein The direction of 601 is configured to control the flow of lubricant. Usually, it is thought The number and direction of the obstacles 601 and the interval 602 and depth of the space between the obstacles 601 are selected (not shown; that is, into the page of the 7D map) so that the particles of the desired size cannot enter. In one embodiment, the barrier 601 has a length between about 50 μτη to about 200 μm, a width between about Ιμπι and about 50 μm, and a spacing 602 between about 〇μχη and about 2 。. In the embodiment, it is possible to prevent particles as small as Ιμη from entering the treatment zone 234. In one aspect, the depth of the interval 602 may be the same as the depth of the channel. In another embodiment, the lubricant channel 301G includes a plurality of obstacles 601. Arrays, these arrays are staggered along a portion of the length of the lubricant channel 301G. In this configuration, particles having a size smaller than the filter gap (i.e., interval 602) can also be effectively blocked. In another embodiment In the middle, a plurality of sets of obstacles 601 or a plurality of filter zones 605 are placed in different areas of the lubricant passage to further prevent particles from entering the treatment zone of the formed device. As shown in Fig. 7c, it may be desirable to have a filtration zone 6〇5α close to the inlet of the lubricant passage and another filtration zone 605Β located in the lubricant passage close to the treatment zone, and the filtration zone 605Α may be used for collection from The externally entering particles of the MEMS device package, the filter zone 6〇5Β is used as the final filter device before entering the treatment zone 234. Figure 7 is a cross-sectional view of the wall containing two lubricant channels, the two lubricant channels having Different outlet configurations may be useful to enhance the distribution and transfer of lubricant to the processing zone 234. In one embodiment, the lubricant channel 301G has a plurality of outlet arrays, such as outlet ports 303C-303D), which The outlet is adapted to improve the rate of transfer of the lubricant to the treatment zone and/or to improve the distribution of the lubricant to different zones in the treatment zone. In another embodiment, the lubricant passage 301H has a large outlet port 303E that acts as a nozzle that facilitates transfer of lubricant to the treatment zone 234. In another embodiment, as shown in Fig. 8, a resistive element 921 and a temperature controller 922 can be used to control the temperature of the lubricant contained in the lubricant passage 301 to further control the transfer of the lubricant. In this configuration, the controller 922 is adapted to deliver a desired amount of power to the resistive element 921 to control the temperature of the lubricant disposed in the lubricant passage 3.1 and thereby control the lubricant to the treatment zone 234. Mobility. In another aspect, the resistive element 921 is worn over the outer surface 235A of one of the walls surrounding the processing zone 234 to facilitate control of the lubricant temperature in the lubricant passage 301. In one aspect, resistive element 921 is a metal deposited on the surface of 30 200834757 surrounding the walls of processing zone 234. It should be noted that since both vaporization and dispersion are subject to heat and the process is inevitable, the migration of the ship to the ship’s 3 (1)

The enthalpy of the temperature is increased, and the lubricant set in the lubricant passage 3〇1 is discharged to the crucible 303, and is contracted when the temperature in the lubricant passage 301 is lowered. In the case where the lubricant is a viscous liquid and/or has a strong surface with the inner surface of the lubricant passage 301, the volume of the gas 9G1 may be slightly higher than the pressure of the treatment zone 234. Increase power: When the scale is poorly accumulating, the gas mirror slowly transfers the lubricant to the treatment zone. In one embodiment, as shown in Figure 9, the cap 3〇4Α can be inserted into the crucible 303 to isolate the lubricant passage 301 from the treatment zone 234 until the cap is removed 3 to allow for turbidity. The agent 505 it enters the processing zone 234. In one aspect, the cap 3 is a polymer such as a light-based polymer that remains on the exit 埠3〇3 until exposed to some form of light shot or heat. This optical radiation or heating causes a change in phase separation or physical properties contained in the cap, thereby converting the cap 3〇4Α into a porous material. The position of Run 301 is configured adjacent to the cover 232 (refer to Figure 2 and the figure), and the above configuration is formed by the special money peach, which allows the light of the desired wavelength to be made by two

In one embodiment, track 301 and at least a portion of MEMS device component 950 are as illustrated in FIG. 9B. The plug-in 235 can be formed as shown in the figure, and the person such as the cap 3G4A fails. In another embodiment, the cap a is adapted to fail when the temperature is increased. This configuration allows the desired amount of lubricant to be enclosed in the Run_Channel 3G1 prior to joining the device substrate using a lower temperature sealing method (e.g., epoxy seal). A lubricant pass can be formed on the substrate 233. The remaining portion 2 of the lubricant passage 301 is formed in the wall of the insert as shown, or is formed entirely in the base 233. The splitting device π member 950 is disposed close to a portion of the substrate 233 where the lubricant passage 3〇1 is formed, so that the portion 951 of the thinner device 950 can be actuated to cover the lubricant passage 3〇1 Out of 31 200834757 =埠3〇3. The applicator member 95 = can be formed in the substrate 233 while forming the MEMS farm 231. In this configuration, the fine chamber device 95 () can be activated from the outside by the power supply ι 2 to cover or expose the outlet 埠 303 so that the hall milk device component can be used as a lubricant material from the lubricant channel 3 () 1 Flow regulating valve. The portion 951 can be pivoted using a bias voltage applied by the power source m (refer to the processing in a 9BW in one implementation, such as _ 1GA _ 1GB riding day irm3s encapsulation processing _ shooting includes the sliding channel including One or more sides are geometric features of the particle trap. The first GA map is a flat gate of a hall MS device having a lubricant passage 1〇〇1 according to an embodiment of the present invention, and the ship's channel surface is formed with For the sake of clarity, the application device package surface is illustrated with the partial section of the cover 232 removed. As shown, the lubricant passage face is formed in the insert 235 and from the insert 23S The outer surface 235A extends to the inner surface 23. The lubricant passage is substantially similar to the lubricant passage described above, the difference being the lubricant passage contact! The formation has a particle trap 1002. The particle trap 1 〇 02 is such a cavity Body: It is formed to be in fluid communication with the inner region 30 of the lubricant channel and is placed opposite the channel inlet 3〇2. Since the particle trap 1〇〇2 is set, by material removal or other similar process When the channel entrance is moved, it enters Most of the particles in the region 305 will be collected in the particle trapping surface. This is especially true when using the laser drilling process to form the channel inlet 302. As shown, the particle trap is followed by a dead zone, a "dead" The end volume, which is not the portion of the fluid passage between the outer surface 235A of the insert 235 and the inner surface 235β. Therefore, when the lubricant is introduced into the slip agent passage 1001 by the passage inlet 3〇2, the particle The particles collected by the obscured 1002 towel are not transported into the processing zone 234 within the hall 1030. n To further reduce the number of particles transported into the processing zone 234, when laser tunneling is used to form the inlet 302, The particle trapping surface can also be configured to reduce the number of particles produced in the inner region 3 〇 5. The inventors have determined that the laser beam can produce particles during the laser drilling of the surface of the inner region 305 during laser drilling. The inner surface 1〇〇3 of the inner region 3〇5 may be peeled off by the drilled laser after the passage of the inlet of the passage and the recursive laser. The number of particles generated by the peeling of the drilled laser to the surface 1003 Minimized, particle trap The dirty card can be grouped so that the surface is offset from the focal plane of the drilled laser. The focal point 10〇4 represented by the intersecting point 32 of the light and the surface is substantially coincident with the channel entrance 3〇2. By moving the surface away from the focus and channel entrance 3〇2, the energy density of the penetrating laser beam is reduced when incident on the surface circle. It is believed that the internal region 3G5 is formed. Less particles. Particles present in the inner region 305 will generally fuse to the surface 1003 and other inner surfaces, so 'non-moving particles will not be transported into the treatment zone 234. Figure 10B is a lubrication according to an embodiment of the invention The device channel of the agent channel 1〇11 is a plan view of=1031, and the lubricant channel 1〇11 is formed with a nonlinear particle trap. In a preferred embodiment, the lubricant passage 1〇11 is substantially similar to the lubricant passage 1〇〇1 in Figure 1A, except that the lubricant passage 1011 forms a particle trap with a non-linearity. 〇9. In this embodiment, the non-linear particle trap 1009 causes the position of the surface 1〇13 to be a distance from the focus 1004 of the penetrating laser beam, and the particles collected in the nonlinear particle trap 1〇〇9 and the insert 235 The fluid passage between outer surface 235A and inner surface 23A is further isolated. In the embodiment illustrated in Figure /B, the non-linear particle trapping 1〇〇9 configuration has one. Bending, but it is conceivable that the loggers can also be provided with a money of more than or less than 90. The curvature is formed to collect the particles formed during the formation of the channel entrance 3〇2. Lubricant Debulking Step In one embodiment, it is desirable to connect a pump (not shown) to the passage inlet 3〇2 (as shown in Figure 6B) so that it can be used to evacuate the treatment zone to remove One or more fine slip agents and/or lions contained therein. In this case, it is possible to evacuate the treatment zone to a sufficient pressure to allow the lubricant to evaporate and thereby be removed from the device package. In another embodiment, it is desirable to connect a gas source (not shown) to one implant 埠' ('eg, element 301A in Figure 7A), and then inject 埠 from another (eg, 7a) The element 3〇1B) in the figure removes the cap (e.g., the component class in Figure 7A) such that the gas delivered from the gas source can be used to remove any used or degraded lubricant material. In either case, these types of techniques can be used to remove old and/or degraded lubricant materials such that new lubricant materials can be added to the treatment zone using the methods described above to extend the life of the device. However, although the description herein is directed to embodiments of the present invention, it is contemplated that the invention can be devised by the following application. Decide. ^ [Simplified description of the drawings] The first AU outlines the cross-sectional view of the device package assembly according to the embodiment of the present invention. FIG. 2B is a schematic view showing the implementation of the device package assembly according to the embodiment of the present invention. A cross-sectional view of a single mirror assembly.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 21 is a cross-sectional plan view of a device package assembly in accordance with an embodiment of the present invention. FIG. 3B and FIG. 3C illustrate a third embodiment of a single-mirror assembly in a partial state in accordance with the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3D is a close-up view of a lubricant passage from a drawing section in accordance with an embodiment of the present invention; FIG. 3D illustrates a lubricant passage having a set-up of a lubricant volume provided to provide a ready supply of lubricant to a process in accordance with an embodiment of the present invention. A section 3E illustrates a cross-sectional plan view of a device sealing assembly in accordance with an embodiment of the present invention; FIG. 3F illustrates a device in accordance with the present invention, a package package total fine viewing level _ sturdy package assembly in the device package total a channel having a channel in accordance with an embodiment of the present invention; a stent assembly having a channel containing a lubricant on an inner surface of the treatment zone;

4A-4C illustrate a processing sequence for forming a device package including a lubricant channel in accordance with an embodiment of the present invention; MS 5A-5P illustrates the production sequence illustrated in Figures 4A, 4B, and 4C. After each step in the process, the various forms of one or more components of the MEMS device package, FIG. 6A illustrates the total package of the device after performing multiple steps in the process sequence illustrated in FIG. 4A in accordance with an embodiment of the present invention. A cross-sectional plan view; FIG. 6B and FIG. 6C illustrate a channel inlet formed into the lubricant passage in accordance with an embodiment of the present invention; FIG. 6D illustrates the lubricant being drawn into the lubricant passage in accordance with an embodiment of the present invention. 34 200834757 rear cross-sectional plan view of the device package assembly; FIG. 6E illustrates a cap installed on the inlet of the channel for the purpose of loading and unloading according to an embodiment of the present invention; FIG. 6F and FIG. The embodiment of the present invention uses the method of the Han Road; the seventh embodiment of the device package assembly according to the embodiment of the present invention illustrates a cross-sectional plane of the apparatus package, and FIG. 7B illustrates a device seal according to an embodiment of the present invention. Part of multicast = myopia assembly, the first portion 7C myopic view illustrating assembly of the device package of the embodiment of FIG face ^ embodiment of the present invention;

The first claw diagram illustrates a near view of the device package assembly according to an embodiment of the present invention. FIG. 8 illustrates a near view portion of the device package assembly according to an embodiment of the present invention. FIG. 8 illustrates an embodiment of the present invention. A near-view portion of the device package assembly; FIG. 9 and FIG. 9 are diagrams showing the device package start: diagram, cross-sectional view, and the myopic portion of the myopic portion according to an embodiment of the present invention. A plan view of a chamber having a lubricant passage, a lubricant passage formed with particles, and a plan view of a garment according to an embodiment of the present invention, in accordance with an embodiment of the present invention, The lubricant passage is formed with a nonlinear particle trap. Packaged flat

100 package 101 mirror assembly 102 mirror 102 A reflective surface 102B mirror base 103. substrate 104 cover 104A, 104B followed by 塾 105 surface [main component symbol description] 35 200834757 106 seal 106A electrode 106B electrode 107 flexible member 108 MEMS device 110 Getter 111 substrate 112 power supply 120 package

124 head space 125 spacer ring 126 window 128 package substrate 230 MEMS device package 231 MEMS device 232 cover 233 substrate 234 processing region 234A, 234B, 234C inner surface 234D slot 235 insert 235A outer surface 235B inner surface 235C wafer 301, 301A, 301B , 301C, 301D, 301E, 301F, 301G, 301H Lubricant channel 302 Channel inlet 302A Enclosure 303, 303A, 303B, 303C, 303D, 303E Exit 埠 36 200834757

304 cap 305 inner region 391 partial section 400, 410, 420 sequence 401 recess 402 through hole 403 bottom wall 404 top surface 405 back surface 411 waste material 432 cover 432A upper surface 450, 452, 454, 456, 458, 460, 46 462 Steps 484, 486, 487, 488 Steps 494, 496, 498, 499 Step 501 Insert Material 502 Material Thickness 503 Control Pore 504 Deviation 505 Lubricant 506. Epoxy Layer 507 Second Epoxy Layer 508 Lubricant Plug 520 Weld pit 521 Part 522 Seal 523 Weld pit 524 Weld area 601 Part section / Obstacle 37 200834757

602 Clearance 603 Length 604 Width 605, 605A, 605B Filter Zone 901 Gas 921 Resistive Element 922 Temperature Controller 950 MEMS Device Element 951 Part 1001 Lubricant Channel 1002 Particle Trap 1003 Surface 1004 Focus 1006, 1007 Light Intersection Point 1009 Particles Trap 1011 Lubricant Channel 1013 Surface 1030 MEMS Device Package 1031 MEMS Device Package 1091 Partial Section

Claims (1)

200834757 X. Patent Application Range: 1. A method of forming a micromechanical device assembly, comprising the steps of: forming a micromechanical device; and forming a lubricant passage extending through an inner wall of a processing region of the micromechanical device, wherein The substantial length of the moisturizing/renal passage extends into the inner wall to be completely surrounded. 2. The method of claim 1, wherein the method further comprises: forming an entrance of the passage through the outer surface of the micromechanical device assembly and the run. ^ The method of transporting into the 3rd, as described in the second paragraph of the patent application scope, further includes: In the approach of the microcomputer, although the nucleus of the channel is inspected, the channel (4) is sealed (four). 4. If you apply for a patent scope! The method of the invention, further comprising: the step of providing a particle filter in the lubricant. 5. The method described in the third paragraph of the patent application includes: the step of using the organic passivation material to _Wei_ shouting face. The mechanical device is provided with a micromechanical device and for the micro lubricant to be added to the lubrication; And being completely surrounded; and 7. The method of sealing the package before the step of adding the lubricant, as in the method of claim 6 of the patent application. δ. The method of claim 7, further comprising the steps of: 39 200834757 = into a hole for externally accessing the lubricant passage; and injecting the lubricant through the hole by capillary force In the lubricant channel. 9. The method of claim 6, further comprising the step of sealing the package after the step of adding the lubricant. 10. The method described in claim 9 of the patent scope further includes: A step of disposing a cap in the lubricant passage adjacent the lubricant passage into the opening of the treatment zone, wherein the cap comprises a material that becomes porous in response to optical radiation or heating. 11. A method of injecting a lubricant into a lubricant passage of a micromechanical device assembly, comprising the steps of: forming a hole for receiving the lubricant passage from the outside; and passing the lubricant through the capillary force A hole is injected into the lubricant passage. 12. The method of claim n, wherein the step of forming the hole comprises the step of using a short pulse laser and a long pulse laser. Every shot 13. The method of claim 12, further comprising: using the "can (4) step of the towel, the energy of the shorter pulse laser, the laser and the electron beam source of the long pulse 14. The method of claim 12, comprising: the step of sealing the hole with grease. 1S. The method of claim U, further comprising the steps of: = lubricating the channel and the outer 敎 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑 润滑, 中 懕 200834757 ; and 1Ξ = Π. The method of claim 1, wherein the method of claim 1 The cap is made of a material that is responsive to light spurting or heating, and the opening of the processing zone has a cap disposed in the opening, and the method of the invention is as described in claim 17, Included: The step of exposing the cap to optical radiation during the heating step. The method of claim 16, wherein the lubricant passage has an open channel configuration. The method of claim 16, wherein the substantial length of the lubrication channel extends into the inner wall of the treatment zone to be completely surrounded. 21 - A method of forming a packaged micromechanical device, the package comprising a substrate, the method comprising the steps of: forming a micromechanical device on the substrate; bonding the insert to the substrate and joining the cover To the insert; and forming a flow channel in the substrate, the insert, and at least the lid of the lid, wherein the lubricant passage is in fluid communication with the processing zone of the micromechanical device. The method of claim 21, wherein the insert is bonded to the substrate by an epoxy layer, the cover being bonded to the insert by an epoxy layer 41 200834757. The method of item 22, further comprising the step of adding a lubricant to the lubricant passage during the joining step. The method of claim 23, further comprising: into the opening of the lubricant channel adjacent to the paste channel into the processing zone. The method of claim 21, further comprising: To the substrate, and the cover assembly by the high temperature bonding process, comprising: a micromechanical device surrounded by the processing zone; and a lubricant channel that is in fluid communication with the bribe zone Wherein the substantial length of the lubricant passage extends into the at least one inner wall to be completely surrounded. The device assembly of claim 26, wherein the lubricant passage has a volume of between about 1 liter and about 10,000 liters. 28. The device assembly of claim 27, wherein the lubricant is disposed in the lubricant passage. The device assembly of claim 26, wherein the lubricant passage has a hydraulic diameter of less than about 1 mm, the lubricant passage having a length that is substantially greater than a hydraulic diameter of the lubricant passage. 42 200834757 Further comprising: wherein the passage inlet is formed to pass through a passage inlet of the apparatus assembly as described in claim 26, in fluid communication with the lubricant passage, past the outer surface of the assembly. 31. The device assembly of claim 30, further comprising: a plug disposed in the inlet of the channel proximate the outer surface of the device assembly. 32. The device assembly of claim 26, further comprising: a particle filter disposed in the lubricant passage. 33. The device assembly of claim 32, wherein the particle filter comprises: a plurality of obstacles formed on an inner surface of the lubricant passage. 34. The device assembly of claim 26, wherein the first lubricant passage and the second lubricant passage are each formed via a different inner wall of the treatment zone and in fluid communication with the treatment zone. 35. The device assembly of claim 34, wherein a lubricant is not disposed in the first and second lubricant passages, and a lubricant disposed in the first lubricant passage is different from being disposed in a lubricant in the second lubricant passage. 36. A device assembly comprising: a micromechanical device surrounded by a treatment zone; and a lubricant passage formed on at least one inner wall of the treatment zone, wherein the lubricant passage is along its entire length In fluid communication with the treatment zone, the lubricant passage is configured such that the lubricant for the micromechanical device is retained in the lubricant passage by the surface tension of the lubricant to the inner surface of the lubricant passage in. The apparatus assembly of claim 36, wherein the lubricant passage has a width of 1 〇 to 8 〇〇 μηη, and the lubricant passage has a depth of 1 (^111 to 2 〇〇). 38. The device assembly of claim 37, wherein the volume of the lubricant passage is between about 〇 丨 升 and about 1 〇〇〇, the hydraulic diameter of the lubricant passage. 39. The device assembly of claim 36, further comprising: another = lubricant passage 'which is formed via at least one inner wall of the treatment zone and is in fluid communication with the treatment zone' The device has a substantial length extending into at least one of the inner walls and is completely surrounded. The device assembly as described in claim 36, wherein the first and The second lubricant passages are fluidly connected to the treatment zone along the entire length of the treatment zone, at least one inner wall of the control zone, and the second lubricant channel and the second lubricant passage, Φ, the flute is 7 馇-m Packaged micromechanical devices, including: 42. If the patent application scope is 4ljj month, the epoxy layer is inserted between: The packaged micromechanical device of the present invention, wherein the cover and the insert are between the insert and the insert, and the insert and the base 44. The lubricant passage extends into the at least one inner wall to be completely surrounded. 44. The packaged micromechanical device of claim 43, further comprising: a cap disposed in the lubricant passage adjacent the opening of the lubricant passage into the treatment zone. 45. The packaged micromechanical device of claim 44, wherein the cap comprises: a material that becomes porous in response to optical radiation or heating. 46. The packaged micromechanical device of claim 42, further comprising: another lubricant passage formed on at least one inner wall of the treatment zone, wherein the other lubricant passage is along the same The entire length is in fluid communication with the processing zone. 47. The packaged micromechanical device of claim 41, wherein the cover and the insert are material bonded or eutectic bonded, the insert and the substrate being joined or eutectic bonded. 48. The packaged micromechanical device of claim 47, further comprising: a channel inlet in fluid communication with the lubricant channel, wherein the channel inlet is formed via the outer surface of the device. 49. The packaged micromechanical device of claim 48, further comprising: a plug disposed in the channel inlet adjacent the outer surface of the device. 50. The packaged micromechanical device of claim 41, wherein the lubricant channel is formed in the substrate. 45