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TW200822172A - Pattern forming apparatus and pattern forming method - Google Patents

Pattern forming apparatus and pattern forming method Download PDF

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Publication number
TW200822172A
TW200822172A TW096131624A TW96131624A TW200822172A TW 200822172 A TW200822172 A TW 200822172A TW 096131624 A TW096131624 A TW 096131624A TW 96131624 A TW96131624 A TW 96131624A TW 200822172 A TW200822172 A TW 200822172A
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TW
Taiwan
Prior art keywords
substrate
light
pattern forming
irradiation
pattern
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TW096131624A
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Chinese (zh)
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TWI371057B (en
Inventor
Manabu Yabe
Masanobu Iwashima
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Dainippon Screen Mfg
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • H10P72/0448
    • H10P76/00

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Gas-Filled Discharge Tubes (AREA)

Abstract

In a pattern forming apparatus, while a light-curing patterning material (80) is ejected from each of a plurality of outlets (422) of a nozzle part (421), the nozzle part (421) and a light irradiation part (43) continuously move relatively to a substrate (9) with the nozzle part (421) preceding the light irradiation part (43) and a mask (46) is moved parallel to the substrate (9) at an interspace between the light irradiation part (43) and the substrate (9) by a mask moving part (45). Since a plurality of rectangle areas with various transmission factors are set in a two-dimensional array on the mask (46), an illumination distribution of irradiation light in an irradiation area on the substrate (9) changes irregularly with time. It is therefore possible to suppress "mura" (i. e., unevenness) of a rib pattern which is caused in the case that ribs whose widths are different due to nonuniformity of the plurality of outlets (422) and the like are formed on the substrate (9).

Description

200822172 九、發明說明: 【發明所屬之技術領域】 本發明㈣於-種在基板上形錢案之技術。 【先前技術】 ::有於電漿顯示裝置等平面顯示褽置中所使用之於 板上形成隔壁(rib)之各種方法,例如,於日本專 即寸使V:/— 184303號公報中提出一隔壁形成裝置, 2朝基板上吐出糊狀之隔壁形成材料之喷嘴部、以及 基板上之隔壁形成材料照射紫外線之光照射 和沿者基板主面相對於基板而相對移動,由此 形成隔壁。 再者,於曰本專利特開平5 一 335223號公報中揭示有一 =二:吏電子束之照射位置於阻劑膜上之區域(field) 間私動,並且於各區域内進行主掃描,以於阻劑膜上逐次 描畫複數個相同圖形,此時於複數個相同圖形中 ϋ 之照射量隨機變動,以消除隨區域之週期中所 尺寸之變動。 又’圖案並非藉由連續吐出流動性材料而形成,但作 製造液晶等顯示裝置之彩色濾波器之方法,於特 開誦-279724號公報中揭示有以下方法,即,自各喷 嘴朝玻璃基板隨機喷出複數種液滴重量之液滴,由此防止 R(紅)、G(綠)、B(藍)此3色之不均。 而當使具有複數個吐出口之喷嘴部相對於基板進行相 對移動’以於基板上形成複數個隔壁圖案時,例如,由於 312XP/發明說明書(補件)/96-12/96131624 200822172 機械加工時所產生之吐出口之加工誤差、形成圖案之流動 f生材料中的微粒子成分之分散不均所導致之濡濕性變 化、吐出口附近之微量污潰而引起之表面特性之不同、或 ^來自光照射部之光之照度分布(即,照度之不均勻分布) 專θ在为別對應於複數個吐出口之複數個隔壁上,產生 寬度不均。實際上’各隔壁之寬度於掃描方向上大致固 定,由於複數個隔壁間之寬度不均,因而導致基板上之隔 壁圖案中產生不均(目測易看出之不均勻性)。 【發明内容】 本發明係關於一種在基板上形成圖案之圖案形成裝 =,其目的在於使用喷嘴部來抑制形成於基板上之圖案不 L) 本發明之圖案形成裝置具備:噴嘴部,自複數個吐出口 朝基板上吐出具有光硬化性之圖案形成材料;光照射部, 對吐出至基板上之圖案形成材料進行照射光之照射;移動 機構’在自噴嘴部吐出圖案形成材料期間,於嘴嘴 =射部沿著基板而移動之方向上,使噴嘴部前行且_於 相對連續地移動’由此於基板上形成由等間距地 Μ在垂直於移動方向之方向上的線狀之複數 素所構成之圖案;以及照射光變更部,在自喷 = 案形缝料期間,於照射光在基板及圖案形成材料上之二 致整個照射區域中’或者於照射區域中排列設定在 Τ動方向之方向上之複數個部分區域中,使圖案料 上之照射光之照度、照度分布、或移動方向上之照射範圍 312ΧΡ/發明說明書(補件)/96· 12/9613丨似 7 200822172 不規則地變化。 之=本發明’可使用喷嘴部來抑制形成於基板上之圖案 即本17二照射光變更部為下述機構, 部與基板之間之光路上的 2置於先知射 更^开〜為’先罩以平行於基板之方式移動,由此 光路上之光罩之透過率分布 交屆祜奶Μ , 1座玍夂化因此,使用光罩可 今易使舨射光之照度分布不規則地變化。 本發明之其他較佳形態為,來自光 板上之照射區域為線狀,其橫穿圖幸來点##、、、射先於基 更部為下述機構,即,在自照射光變 偁在自贺鳴部吐出圖案形成材料期 間’使知射區域於移動方向上對於複數個吐出口不規則地 微小移動’或者使照射區域以平行於基板之法線方向之轉 :軸為中心不規則地微小轉動。由此,可使照射光之照射 範圍於移動方向上對於吐出口不規則地變化。 於本發明之一態樣中,照射光變更部為如下機構,即, 在自喷嘴部吐出圖案形成材料期間,使光照射部於基板之 法線方向上不規則地移動。如上所述,使光照射部相對於 噴嘴部於基板之法線方向上移動,藉此可使照射光之照度 容易產生不規則地變化。 於本發明之其他態樣中,透過照射光變更部而不規則地 變化之照射光的照度之變動幅度為照射區域之空間且時 間照度之平均值的2%以上、1 〇%以下。 312XP/發明說明書(補件)/96-12/96131624 8 200822172‘ 本發明亦關於一種在某杯卜## R安 裡隹暴扳上形成圖案之圖案形成方法。 . ^目的及其他目的、特徵、態樣及優點 •照隨附圖式對本發明進行之詳細說明而可明瞭夕 【實施方式】 圖Η系表示本發明第!實施形態之圖 成圖。圖案形成裝置"系於電裝顯示裳 丄:: 基下,稱為「基板」)9上形成隔= 平面顯示襄置之組裝零件之面板。、他力驟而形成作為 於圖案形成裝置1中,於美Αη 凡 2,藉由平臺移動機構2可#二又有平臺移動機構 至不夕勒械構2可使水平保持有基 於圖1中所示之Υ方向上移動。於 板9之千至2〇 20之方式而固定框架12,並於框:叫越平臺 移動機構3而安裝掃描頭部4/、 、,!由掃描頭(head) 平臺移動機構2之構造為,將滾珠螺桿22連接 :21’更進-步將固定於平臺2()之螺帽23安裳於滾珠螺 22上。於滚珠螺桿22之上方固定導執24,在馬達21、: 轉時,平臺2〇隨螺帽23 -併沿著導執24於Y方向I: 滑地移動(即’掃描頭部4對基板9進行相對主掃千 掃描頭移動機構3具有由框架 於馬達之旋轉轴上之滾珠螺桿32、以及、連接 桿32上之螺帽33,由於 衣珠螺 中之X方向上移動。於螺帽33上 座40,由此可使婦描頭部4於基 312XP/發明說明書(補件)/96-12/96131624 g 200822172 基座40與固定於框架12上之導軌34連接,並由導執34 . 平滑地引導。 ’ . 掃描頭部4具有朝基板9上吐出具有流動性之糊狀圖案 形成材料之吐出部42、以及使基板9上之圖案形成材料 硬化之光照射部43,吐出部42及光照射部43安裝於在 基座4G上所时之升降機構41之下部。圖案形成=& 含藉由紫外線而開始硬化(交聯反應)之光起始咧及作為 广黏合劑之樹脂,更進-步包含作為玻璃粉體之^化點玻 璃粉,且圖案形成材料具有絕緣性。於吐出部42之下 面以可裝卸之方式安裝有噴嘴部42卜該噴嘴部421具^ 排列在X方向上之複數個吐出口。 ^ 喷:部421經由供給管441而連接於蓄存有圖案形 料之容器442,容器442上經由調節器443而連接有用於 供給高壓氣體之氣體供給部444。容器似可替換,♦圖 !?成裝置1中容器442内之圖案形成材料之殘餘量:: I ==下時,可由操作者更換為填充有圖案形成材料之其 :442。於下述隔壁圖案形成時,調節器 442内之氣嶋高於大氣昼,以對蓄存 : =形樣料進行加壓。亦即,將容器 = •與大氣壓之差的壓力ΓΤ μ仏「 ^刀 442 ,%為氣體差壓」)賦予容器 ‘成藉此,對喷嘴部421供給圖荦形 成材枓後自贺嘴部421之吐出案^ 上所述,於圖崇梆士、壯取 * 口系办成材科。如 、3案形成衣置1令,藉由供給管441、容哭442、 調節器443以及翕髀视,人如 ^ 442 ^ 、、’6邛444而構建對嘴嘴部421供給 312XP/#^_書(補件)/96-12/96131624 200822172 圖案形成材料之材料供給部44(亦稱為分注系統)。再者, .=並未自喷嘴部421吐出圖案形成材料之狀態下,氣體差 •壓設為〇(即,將容器442内之氣體壓力設為大氣壓,故 不對由材料供給部44對容器442内所供給之圖案形成材 料進行加壓。)。 光照射部43經由數條光纖束431(圖1中用J條粗線表 示,以下僅稱為「光纖431」)而連接於光源單元。光 (源單元432具備射出紫外線之光源(例如氙氣燈),且來自 光源之光藉由光纖431而導向光照射部43。實際上,光 照射部43中,數條光纖之與光源單元432相反侧之端部 係排列於X方向上,於喷嘴部421之(—¥)侧,對沿著複數 個吐出口之排列方向(即X方向)延伸之基板9上之大致線 狀區域照射紫外線。以下說明中,將自光照射部43照射 至基板9上之光稱為照射光。 圖2係表示喷嘴部421及光照射部43之前端附近之放 〇大圖。如圖2所示,喷嘴部421中與各吐出口 422相連之 流路423(在圖2中,僅對}個吐出口 422及i條流路423 標記符號),朝平行於YZ平面且相對於z方向傾斜之方向 (例如,傾斜45度之方向)上延伸。#此,於朝向基板9 .之⑽㈣主面(如下所述,其係成為隔壁圖案之形成對 •象之主面’以下稱為「對象面」)91且傾斜於對象面Μ 之吐出方向上’自吐出口 422吐出圖案形成材料8〇。又, 喷嘴部421之開口面424(嗔嘴部421前端之包含複數個 吐出口 422之面)亦同樣地,其法線平行於^平面且相對 312XP/發明說明書(補件)/96-12/96131624 π 200822172 於ζ方向傾斜。於噴嘴部421之圖2中 形成有平行於基板9之對象面91的 、立’ 祀士、胩里1丄t 日〕對向面425 ’於圖案 $成衣置!中’升降機構41視需要使噴嘴部42ι於 向上移動,藉此將形成隔壁圖案對 425與基板9之對象面μ間之間隙,保持為大致 :支小寬度t,使噴嘴部421經常處於接近基板9之對象面 1之狀悲。當自(一γ)側朝(+γ)方向觀看時,各吐出口 422 Γ 之形狀為矩形,並且該形壯夕γ 狀之Χ方向之寬度例如為100 “ ’吐出口 422之Χ方向之間距為300 再者,複 數個吐出π 422之排列方向亦可垂直於基板9之移動 且傾斜於沿著對象面91之方向(X方向)。 、又’於光照射部43之照射光之射出面((-Ζ)側之面)附 k於Υ方向上夾隔光照射部43而配置有2個下侧輥 451、452。在與喷嘴部421相反側((-Y)侧)之下側輥451 及喷嘴部421側之下側親452之上方,分別設有上侧輕 453、454,各上側輥453、454經由環狀帶455、456連接 於馬達457、458之旋轉軸。於上側輥453、454之間,經 由下側親45卜452而設有薄膜狀光罩46,光照射部43 之射出面((-z)側之面)與基板9之對象面91之間,被光 罩46之一部分隔開。光罩46之大部分捲曲於上侧輥454 之外周,於下述之隔壁圖案形成時,利用馬達457使(一γ) 側的捲繞用之上侧輥453旋轉,以將捲曲於侧的送出 用之上側輥454之外周的光罩46部分依序送出,在光照 射邛43與對象面91之間以平行於基板9之方式移動,並 312ΧΡ/發明說明書(補件)/96-12/96131624 200822172 捲繞於上側幸昆453。如上所述,藉由下側輕451與452、 .上側親453與454、環狀帶455與456、以及馬達457與 .458,而構建光罩移動機構45,該光罩移動機構μ使配置 於光照射部43與基板9之間之光路上的光罩46以平行於 基板9之方式移動。再者,馬達458於回捲光罩μ時被 利用。 圖3係表示配置於光照射部43與基板9之間之光罩46 ,的局部圖。如圖3中二點鏈線所示,於光罩46上設定有 、二維排列之複數個矩形區域46卜複數個矩形區域461 中,每-矩形區士或461 <照射光透㉟率呈現不規則地不 同。使X方向上矩形區域461之寬度為吐出口 422之間距 長^的複數倍(亦可為U),使γ方向之長度例如為0卜 3笔米(mm)。又,照射光透過率大致於87%〜93%之範圍内 變化,圖3中使矩形區域461上標記之平行斜線之間隔變 化,以此表示矩形區域461之透過率差異。實際上,將整 υ個光罩46之透過率的平均值(平均透過率)設^約9〇%, 使光罩46之透過率之變動幅度的平均值為6%。如此,光 罩46成為各位置之透過率隨機變化之減光如什al Density)濾波器。再者,光罩46可藉由例如於氟系樹脂 薄膜上印刷(使顏料附著)而製作。又,於光照射部43 ^ 光源單元432中設有熱線切割濾波器,光罩a不會因= 射光之照射所產生之熱量而發生變形等。 如圖1所示,平臺移動機構2之馬達21、調節器443、 光源單元432、掃描頭移動機構3之馬達31、掃插頭部* 312XP/發明說明書(補件)/96-12/96131624 13 200822172 之升降機構41以及光罩移動機構45之馬達457、458(參 照圖2)連接於控制部5,該等構成由控制部5控制,藉此 利用圖案形成裝置1於基板9上形成隔壁圖案。 其次,參照圖4,說明圖案形成裝置α基板9上形成 隔壁圖案之動作。於圖i之圖案形成裝置1中,首先,將 基板9載置於平臺20上,並將喷嘴部421藉由平臺移動 機構2及掃描頭移動機構3而配置於基板9之(々側端部 之上方。其次,開始自光照射部43射出照射光(步驟 sii) ’同時利用光罩移動機構45之驅動而開始進行光照 射部43與基板9之間的光罩46之移動,並如下所述,使 基板9上之射光之照射區域的照度分布不規則地變化 (步驟s⑵。其後’利用平臺移動機構2於吐出部42之 下方使平室20上之基板9朝(_γ)方向移動,由此喷嘴部 421及光照射部43 始相對於基板9於⑽)方向上進 1./ ㈣移動(步驟S13)。又,使容器442内之氣體差壓(即, 谷益442内之氣體壓力與大氣壓之差)為特定值,由此亦 開始連續吐出來自嘴嘴部421之各吐出口似 材料(步驟S14)。 风 實際上,如圖2所示,噴嘴部421在沿著對象面91之 方向上相對於基板9進行相對連續地移動,與此 與喷嘴部42!之相對移動方向相反之方向(亦即,= 向)上,自各吐出u 422不間斷地連 料,由此自各吐出口 422 # 岡安^ α 茶形成材 “ ^ U吐出之圖案形成材料8〇依序 者 9上。此時,喷嘴部421之開口面424傾斜成其 312ΧΡ/發明說明書(補件)/96-12/96131624 ^ 200822172 法線在吐出側((_Y)侧)與基板9之對象面91交又,藉此, 以使基板9上之Υ方向之各位置上,自(-Ζ)侧向( + Ζ;侧堆 =圖Γ:成材料之方式’自吐出口 422吐出圖案形成材 ;' ^圖案形成材料以高縱橫比之狀態附著於基板9 上。 、 /藉由喷嘴部421之相對於基板9進行相對行進之方向之 後方所配置的光照射部43,對^至基板9上 成材料8G自吐出口 422之上方位置經由光罩㈣行照射 光之照射。如上所述,圖案形成材料中添加有光起始劑後 具有光硬化性,因而可利用來自光照射部43之昭射光之 照射而易使基板9上之圖案形成材料8〇硬化。由此 微細之線狀隔壁,該隔壁在喷嘴部421之相對移動方向(Υ 方向)上延伸,並且成為隔壁圖案之要素。 u 又,在自喷嘴部421 口土出圖案形成材料8〇期間 射部43與對象面91之間,光罩46以與基板9相同之^ 度朝相同方向((-Υ)側)相對於光照射部43進行連續 動,由此光罩46之各部位相對固定於基板9之對象面w 上’於此狀態下’來自光照射部43之照射光經 而照射至剛朝基板9上吐出後之圖案形成材料8〇。由 位於光照射部43與基板9之間之光路上的光罩“之 it過率分布(即,與剛朝基板9上吐出後之圖案形成材料 80對應的光罩46之透過率分布)與圖3之光罩46上之複 數個矩形區域461的排列相對應,使基板9每移動2 則會產生不規則地變化,因而使照射光於基板 312XP/發明說明書(補件)/96-12/96131624 15 200822172 區域的照度(照射至每單位面積之光之強度)分布變化。其 -、、口果對自各吐出口 422吐出並附著於對象面91上之圖 •案形成材料80(相當於1個隔壁)所照射之照射光的照 度,因應於基板g上之γ方向之位置而變化,而於基板9 上之Y方向之各個位置,對自複數個吐出口 422吐出之圖 案形成材料80所照射之照射光的照度,㈣應於乂方向 之位置而變化。 卜 貝^上,由於來自光照射部43之照射光稍許擴散並照 向基板9,故光罩46之透過率分布並未正確地反映在照 射於基板9上之知射光之照度分布上,但光照射部^與 f反9之間之距離微小’且照射光之擴散角亦微小,故光 46之透過率分布大致反映在照射光之照度分布上。當 Γ卜’於岡圖安案形成裝置1 * ’亦可使光罩46在不干擾基板 之圖案形成材料之範圍内接近對象面91,藉此可使光 罩^6之透過率分布更高精度地反映在照射光於基板9上 上。再者,使光照射部43與基板9之間之光 r",以相對固定於基板9之對象面91上 動=可使基板9上之各位置的照射光之照度與光罩 46之圖案一致而變化,作 ,,Ο ^ ^ ηι 仁先罩46未必需以相對固定於基 板9之對象面91上之狀態而移動。 照:= 二自喷嘴部似吐出圖案形成材料期間,於 2岡#及所吐出之圖案形成材料上的整個昭射 區域’使該圖案形成材料上的照射光匕= 則地變化,由此,各隔壁 广刀帝、4不規 土之卩方向之稷數個部位的自吐出 312XP/發明說明書(補件)/96·12/9613ΐ624 16 200822172 圖案形成材料後直至硬化結束為止之 等而導致之形狀枬塌狀況(垂陷狀況)會^生=而因重力 述,使光罩46之透過率變動幅度為整個 =。如上所 過率之6%,由此,不規則土也變化之 =平均透 成隔壁期間的整個照射區域之 a度平均值的6%,亦即為照射區域之空間照 6%,且為照射區域之時間照度平均值的6%。又:、200822172 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention (4) is a technique for forming a money case on a substrate. [Prior Art] There are various methods for forming a rib on a board used in a flat display device such as a plasma display device, for example, in Japanese Laid-Open Patent Publication No. V:/-184303 A partition forming device 2 forms a nozzle portion on which a paste-like partition wall forming material is discharged onto a substrate, and a partition wall forming material on the substrate irradiates with ultraviolet light and relatively moves along the substrate main surface with respect to the substrate, thereby forming a partition wall. Further, it is disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. A plurality of identical patterns are successively drawn on the resist film, and at this time, the irradiation amount of ϋ in a plurality of identical patterns is randomly changed to eliminate the variation in the size in the period of the area. Further, the pattern is not formed by continuously ejecting a fluid material, but a method of manufacturing a color filter of a display device such as a liquid crystal is disclosed in Japanese Laid-Open Patent Publication No. Hei-279724, the entire disclosure of which is to The droplets of a plurality of droplet weights are ejected, thereby preventing unevenness of the three colors of R (red), G (green), and B (blue). When a nozzle portion having a plurality of discharge ports is relatively moved with respect to the substrate to form a plurality of partition patterns on the substrate, for example, due to machining of 312XP/invention specification (supplement)/96-12/96131624 200822172 The processing error of the generated discharge port, the change in the wettability caused by the uneven dispersion of the fine particle component in the flow patterning material, the difference in surface characteristics caused by the slight contamination near the discharge port, or the light from the light The illuminance distribution of the light of the illuminating portion (that is, the uneven distribution of the illuminance) is arbitrarily wide on the plurality of partition walls corresponding to the plurality of discharge ports. Actually, the width of each of the partition walls is substantially fixed in the scanning direction, and the width between the plurality of partition walls is uneven, resulting in unevenness in the partition pattern on the substrate (visible unevenness visually observed). SUMMARY OF THE INVENTION The present invention relates to a pattern forming device for forming a pattern on a substrate, which is intended to suppress a pattern formed on a substrate by using a nozzle portion. The pattern forming device of the present invention includes a nozzle portion, which is a self-complex One of the discharge outlets discharges a pattern-forming material having photocurability to the substrate; the light-irradiating portion irradiates the pattern-forming material discharged onto the substrate with irradiation light; and the moving mechanism 'discharges the pattern-forming material from the nozzle portion to the nozzle Mouth = the direction in which the emitter moves along the substrate, causing the nozzle portion to advance and _ relatively continuously moving ' thereby forming a linear number on the substrate that is equiangularly spaced in a direction perpendicular to the direction of movement The pattern formed by the element; and the illumination light changing portion are arranged in the entire irradiation region of the substrate and the pattern forming material during the self-injection of the pattern sewing material or in the irradiation region. In the plurality of partial regions in the direction of the direction, the illuminance, the illuminance distribution, or the irradiation range in the moving direction on the pattern material is 312 ΧΡ / Ming specification (s) / the 96-like 7200822172 12/9613 Shu varies irregularly. In the present invention, the nozzle portion can be used to suppress the pattern formed on the substrate, that is, the 17 second illumination light changing portion is a mechanism described below, and the 2 on the optical path between the portion and the substrate is placed in the foreground. The hood moves in a manner parallel to the substrate, whereby the transmittance of the reticle on the optical path is distributed to the milk, and the smear is changed. Therefore, the illuminance distribution of the ray is irregularly changed by using the reticle. . According to another preferred embodiment of the present invention, the illumination region from the optical plate is linear, and the traverse through the map is ##, and the pre-existing portion is the following mechanism, that is, the self-illumination light is changed. During the ejection of the pattern forming material from the whistling portion, 'the target region is irregularly moved slightly for the plurality of ejection openings in the moving direction' or the irradiation region is rotated parallel to the normal direction of the substrate: the axis is centered irregularly The ground is tiny. Thereby, the irradiation range of the irradiation light can be irregularly changed with respect to the discharge port in the moving direction. In one aspect of the invention, the irradiation light changing unit is configured to move the light irradiation unit irregularly in the normal direction of the substrate while discharging the pattern forming material from the nozzle unit. As described above, the light irradiation portion is moved in the normal direction of the substrate with respect to the nozzle portion, whereby the illuminance of the irradiation light is likely to be irregularly changed. In another aspect of the present invention, the illuminance of the illuminating light that is irregularly changed by the illuminating light changing portion is a width of the irradiation region and an average value of the illuminance of 2% or more and 1 〇% or less. 312XP/Invention Manual (Supplement)/96-12/96131624 8 200822172 ‘ The present invention also relates to a pattern forming method for forming a pattern on a cup of cloth ## R安里隹. The purpose and other objects, features, aspects and advantages of the present invention will be apparent from the accompanying drawings. Diagram of the embodiment. The pattern forming device " is a panel on which the assembly parts of the flat panel display are formed on the electrical display 裳:: 基, referred to as "substrate"). He is formed in the pattern forming device 1 as shown in Fig. 1 by means of the platform moving mechanism 2 and the platform moving mechanism to the yoke structure 2 Move in the direction shown. The frame 12 is fixed in the manner of a plate 9 to 2 〇 20, and the scanning head 4/, ,, is mounted in the frame: the platform moving mechanism 3 is mounted. The head moving mechanism 2 is configured to connect the ball screw 22: 21' to advance the nut 23 fixed to the platform 2 (on the ball screw 22). The guide 24 is fixed above the ball screw 22, and when the motor 21,: rotates, the platform 2 is slidably moved with the nut 23 - along the guide 24 in the Y direction I (ie, 'scanning head 4 to the substrate 9 Performing relative main scanning head The moving mechanism 3 has a ball screw 32 which is framed on a rotating shaft of the motor, and a nut 33 on the connecting rod 32, which is moved in the X direction in the bead screw. 33 upper seat 40, thereby enabling the female head 4 to be connected to the guide rail 34 fixed to the frame 12 by the base 34 312XP / invention manual (supplement) / 96-12 / 96131624 g 200822172, and by the guide 34 The scanning head portion 4 has a discharge portion 42 that discharges a paste-like pattern forming material having fluidity toward the substrate 9, and a light irradiation portion 43 that cures the pattern forming material on the substrate 9, and the discharge portion 42 The light-irradiating portion 43 is attached to the lower portion of the elevating mechanism 41 at the time of the susceptor 4G. Pattern formation = & The light-initiating enthalpy which starts to harden (crosslinking reaction) by ultraviolet rays and the resin as a wide binder , further step-by-step includes a glass powder as a glass powder, and a pattern forming material The nozzle portion 42 is detachably attached to the lower surface of the discharge portion 42. The nozzle portion 421 has a plurality of discharge ports arranged in the X direction. The spray portion 421 is connected to the supply tube 441 via the supply tube 441. A container 442 in which a pattern is stored, and a gas supply portion 444 for supplying a high-pressure gas is connected to the container 442 via a regulator 443. The container may be replaced by a pattern forming material in the container 442 of the device 1. Residual amount: When I ==, it can be replaced by the operator with the pattern forming material: 442. When the partition pattern is formed below, the gas in the regulator 442 is higher than the atmosphere, so as to save : = The sample is pressurized. That is, the pressure ΓΤ μ 仏 "^ knife 442 , % is the gas differential pressure" of the difference between the container and the atmospheric pressure is given to the container, and the nozzle portion 421 is supplied thereto. After the 荦 荦 荦 自 自 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 421 For example, in case 3, the clothing is set to 1 command, and the supply tube 441, the crying 442, the adjuster 443, and the contempt, the person such as ^ 442 ^, and '6邛444 are constructed to supply the mouth portion 421 to the 312XP/#. ^_书(补件)/96-12/96131624 200822172 Material supply portion 44 of a pattern forming material (also referred to as a dispensing system). In addition, in the state where the pattern forming material is not ejected from the nozzle unit 421, the gas difference pressure is set to 〇 (that is, the gas pressure in the container 442 is set to atmospheric pressure, so the material supply unit 44 does not face the container 442. The pattern forming material supplied therein is pressurized.). The light irradiation unit 43 is connected to the light source unit via a plurality of fiber bundles 431 (shown by thick lines J in Fig. 1, hereinafter simply referred to as "optical fibers 431"). Light (source unit 432 includes a light source that emits ultraviolet light (for example, a xenon lamp), and light from the light source is guided to light irradiation unit 43 by optical fiber 431. Actually, in light irradiation unit 43, a plurality of optical fibers are opposite to light source unit 432 The end portions of the side are arranged in the X direction, and on the (-¥) side of the nozzle portion 421, the substantially linear region on the substrate 9 extending in the direction in which the plurality of discharge ports are arranged (i.e., the X direction) is irradiated with ultraviolet rays. In the following description, the light that is irradiated onto the substrate 9 from the light irradiation unit 43 is referred to as irradiation light. Fig. 2 is a plan view showing the vicinity of the front end of the nozzle unit 421 and the light irradiation unit 43. In the portion 421, the flow path 423 connected to each of the discharge ports 422 (in FIG. 2, only the number of the discharge ports 422 and the i flow paths 423 are marked) is directed in a direction parallel to the YZ plane and inclined with respect to the z direction ( For example, it is extended upward in a direction inclined by 45 degrees. This is the main surface of the (10) (four) facing the substrate 9. (As described below, the main surface of the image forming the partition pattern is hereinafter referred to as the "object surface") 91 and inclined to the discharge direction of the object surface ' 'self-discharge outlet 42 2. The pattern forming material 8 is discharged. Further, the opening surface 424 of the nozzle portion 421 (the surface including the plurality of discharge ports 422 at the tip end of the mouth portion 421) is similarly normal, and the normal is parallel to the plane and relative to the 312XP/invention specification. (Supplement) /96-12/96131624 π 200822172 It is inclined in the ζ direction. In Fig. 2 of the nozzle portion 421, a pair of 'gentlemen' and 胩 丄 丄 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行 平行The facing surface 425 'in the pattern $ ready-to-wear! the middle lifting mechanism 41 moves the nozzle portion 42 ip upward as needed, thereby maintaining a gap between the partition pattern pair 425 and the target surface μ of the substrate 9 to be substantially small The width t is such that the nozzle portion 421 is often in a state close to the object surface 1 of the substrate 9. When viewed from the (gamma) side toward the (+γ) direction, the shape of each of the discharge ports 422 为 is rectangular, and the shape is strong. The width of the γ γ shape is, for example, 100 "". The distance between the directions of the discharge ports 422 is 300. Further, the arrangement direction of the plurality of discharges π 422 may be perpendicular to the movement of the substrate 9 and inclined to the object surface 91. The direction (X direction), and the 'lighting light of the light irradiation portion 43 The lower surface of the injection surface (the surface on the (-) side) is provided with two lower rollers 451 and 452 in the rubbing direction of the light-shielding portion 43. On the opposite side ((-Y) side) to the nozzle portion 421 The upper side rollers 451 and the lower side of the nozzle portion 421 side are provided with upper side lights 453 and 454, and the upper side rolls 453 and 454 are connected to the rotating shafts of the motors 457 and 458 via the endless belts 455 and 456. A film-shaped mask 46 is provided between the upper rollers 453 and 454 via the lower side 45, and the exit surface (the surface on the (-z) side) of the light irradiation portion 43 and the target surface 91 of the substrate 9 are provided. , separated by a portion of the reticle 46. Most of the mask 46 is curled on the outer circumference of the upper roller 454, and when the partition pattern is formed as described below, the upper side roller 453 for winding on the (one gamma) side is rotated by the motor 457 to curl the side. The mask 46 of the outer circumference of the upper roller 454 is sequentially sent out, and is moved parallel to the substrate 9 between the light irradiation 邛 43 and the target surface 91, and 312 ΧΡ / invention manual (supplement) / 96-12 /96131624 200822172 Winded on the upper side of the Lucky Kun 453. As described above, the reticle moving mechanism 45 is constructed by the lower side light 451 and 452, the upper side 453 and 454, the endless belts 455 and 456, and the motors 457 and .458, and the reticle moving mechanism μ is configured. The photomask 46 on the optical path between the light irradiation portion 43 and the substrate 9 moves in parallel with the substrate 9. Furthermore, the motor 458 is utilized when rewinding the mask μ. FIG. 3 is a partial view showing the photomask 46 disposed between the light irradiation unit 43 and the substrate 9. As shown by the two-dot chain line in FIG. 3, a plurality of rectangular regions 46 arranged in two dimensions are arranged on the mask 46, and a plurality of rectangular regions 461 are arranged, each of which is rectangular or 461 < The presentation is irregularly different. The width of the rectangular region 461 in the X direction is a multiple (or U) of the distance between the discharge ports 422, and the length in the γ direction is, for example, 0 b 3 meters (mm). Further, the irradiation light transmittance is changed in the range of approximately 87% to 93%. In Fig. 3, the interval between the parallel oblique lines marked on the rectangular region 461 is changed to indicate the difference in transmittance of the rectangular region 461. Actually, the average value (average transmittance) of the transmittance of the entire mask 46 is set to about 9 %, and the average value of the fluctuation range of the transmittance of the mask 46 is 6%. Thus, the reticle 46 becomes a dimming filter in which the transmittance of each position is randomly changed. Further, the photomask 46 can be produced by, for example, printing on a fluorine-based resin film (attaching a pigment). Further, a light-cutting filter is provided in the light-irradiating portion 43 ^ light source unit 432, and the mask a is not deformed by the heat generated by the irradiation of the light. As shown in Fig. 1, the motor 21 of the platform moving mechanism 2, the adjuster 443, the light source unit 432, the motor 31 of the scan head moving mechanism 3, the sweeping plug portion * 312XP / invention manual (supplement) / 96-12/96131624 13 The lifting mechanism 41 of 200822172 and the motors 457 and 458 (see FIG. 2) of the mask moving mechanism 45 are connected to the control unit 5, and these configurations are controlled by the control unit 5, whereby the partition pattern is formed on the substrate 9 by the pattern forming apparatus 1. . Next, an operation of forming a partition pattern on the pattern forming apparatus α substrate 9 will be described with reference to Fig. 4 . In the pattern forming apparatus 1 of FIG. 1, first, the substrate 9 is placed on the stage 20, and the nozzle unit 421 is disposed on the side of the substrate 9 by the stage moving mechanism 2 and the scanning head moving mechanism 3. Then, the irradiation of the irradiation light from the light irradiation unit 43 is started (step sii). At the same time, the movement of the mask 46 between the light irradiation unit 43 and the substrate 9 is started by the driving of the mask moving mechanism 45, and is as follows. The illuminance distribution of the irradiation region of the light emitted from the substrate 9 is irregularly changed (step s (2). Thereafter, the substrate 9 on the flat chamber 20 is moved in the (_γ) direction by the stage moving mechanism 2 below the discharge portion 42. Then, the nozzle portion 421 and the light irradiation portion 43 start moving in the direction of (10)) with respect to the substrate 9 (step S13). Further, the gas in the container 442 is differentially pressed (i.e., in the valley 442). The difference between the gas pressure and the atmospheric pressure is a specific value, and thus the discharge-like material from the nozzle portion 421 is continuously discharged (step S14). Actually, as shown in Fig. 2, the nozzle portion 421 is along the object. Relatively continuous with respect to the substrate 9 in the direction of the face 91 In the direction opposite to the direction in which the nozzle portion 42! is moved in the opposite direction (that is, in the direction of the direction), the discharge u 422 is continuously connected, and thus the outlets 422 # 冈安^ α茶形成材 ^ U is discharged from the pattern forming material 8 in order. At this time, the opening surface 424 of the nozzle portion 421 is inclined to be 312 ΧΡ / invention specification (supplement) / 96-12/96131624 ^ 200822172 normal line on the discharge side (( The _Y) side is placed on the object surface 91 of the substrate 9, whereby the position of the substrate 9 in the Υ direction is from the (-Ζ) side (+ Ζ; side stack = Γ: material) The method "discharges the pattern forming material from the discharge port 422;" ^ the pattern forming material adheres to the substrate 9 in a high aspect ratio. / / is disposed after the direction in which the nozzle portion 421 is relatively advanced with respect to the substrate 9 The light-irradiating portion 43 irradiates the material 8G on the substrate 9 from the position above the discharge port 422 through the mask (four). As described above, the photo-curing agent is added to the pattern-forming material to have photocurability. Therefore, it is possible to easily use the irradiation of the illuminating light from the light illuminating portion 43 to make the substrate 9 The pattern forming material 8 is hardened, whereby the fine linear partition wall extends in the relative movement direction (Υ direction) of the nozzle portion 421 and becomes an element of the partition pattern. Further, in the nozzle portion 421 Between the pattern forming material 8 and the target surface 91, the mask 46 continuously moves in the same direction ((-Υ) side) with respect to the light irradiation portion 43 at the same level as the substrate 9, thereby Each portion of the photomask 46 is fixed to the target surface w of the substrate 9 in the 'in this state', and the irradiation light from the light irradiation portion 43 is irradiated to the pattern forming material 8A immediately after being discharged onto the substrate 9. The transmittance of the mask "on the optical path between the light-irradiating portion 43 and the substrate 9" (that is, the transmittance distribution of the mask 46 corresponding to the pattern forming material 80 immediately after being ejected onto the substrate 9) The arrangement of the plurality of rectangular regions 461 on the mask 46 of Fig. 3 corresponds to each other, so that the substrate 9 is irregularly changed every time it moves 2, so that the illumination is applied to the substrate 312XP/invention specification (supplement)/96-12 /96131624 15 200822172 The illuminance of the area (the intensity of light per unit area) is changed. The -, and the fruit are discharged from the discharge port 422 and attached to the target surface 91. The illuminance of the irradiation light irradiated by the one partition wall changes in accordance with the position in the γ direction on the substrate g, and the pattern forming material 80 discharged from the plurality of discharge ports 422 at each position in the Y direction on the substrate 9 The illuminance of the illuminating light to be irradiated, (4) should be changed in the direction of the 乂 direction. Since the illuminating light from the light illuminating portion 43 is slightly diffused and directed toward the substrate 9, the transmittance distribution of the reticle 46 is not Correctly reflected on the substrate On the illuminance distribution of the illuminating light, the distance between the light illuminating part ^ and the f counter 9 is small and the diffusion angle of the illuminating light is also small, so the transmittance distribution of the light 46 is roughly reflected in the illuminance distribution of the illuminating light. When the 于 ' 'Uokaduan case forming device 1 * ' can also make the reticle 46 approach the object surface 91 within a range that does not interfere with the pattern forming material of the substrate, thereby making the transmittance distribution of the reticle 6 The light is irradiated on the substrate 9 with high precision. Further, the light r" between the light-irradiating portion 43 and the substrate 9 is relatively fixed to the target surface 91 of the substrate 9 to be made on the substrate 9. The illuminance of the illuminating light at each position changes in accordance with the pattern of the reticle 46, and the Ο^^ ηι nipple cover 46 does not have to be moved in a state of being fixed to the object surface 91 of the substrate 9. Photo: = 2 During the period in which the pattern forming material is discharged from the nozzle portion, the entire illuminating region ' on the pattern forming material that is ejected and the embossed area on the pattern forming material is changed so as to change the illuminating light on the pattern forming material. The emperor, 4 is not in the direction of the soil, the self-spit 312XP / hair Instruction manual (supplement) / 96·12/9613ΐ 624 16 200822172 The shape collapse condition (the sag condition) caused by the patterning material until the end of the hardening process will be generated by the gravity, and the reticle 46 will be transmitted. The rate of change is the whole = 6% of the above-mentioned rate, whereby the irregular soil also changes = 6% of the average value of the a-degree of the entire irradiation area during the average penetration into the partition wall, that is, the space of the irradiation area According to 6%, it is 6% of the average illuminance of the illumination area.

:續:出圖案形成材料,當基…(+γ =1Γ之正下方後’停止吐出圖案形成材料(Ϊ 驟S15)。八後,停止基板9之移動(步驟si〇,並且 止光罩46之移動及自光照射部43射出照射光(步驟抓 S18)。 圖係表不形成於基板9上之隔壁81之局部俯視圖。 於基板9上排列有與吐出口 422之個數相同之隔壁Μ, 該隔壁81以相等間距(實際上為吐出〇似之間距,即 t 300 /zm)排列在與喷嘴部421之相對移動方向垂直的X方 向上,亚且於基板9上形成複數個隔壁81之圖案8。各 隔壁81之大部分會根據照射光之照度,於γ方向上2〜3 題(約為^出口 422之間距之1〇倍)之間出現一次χ方向 之極大寬度或極小寬度(或者寬度於γ方向上之變化率為 0之位置),该覓度之大小亦會產生不規則地變化。又了 於基板9上之γ方向之各個位置,關於隔壁81於χ方向 之寬度而言,在複數個隔壁81中呈現不規則地(圖5中, 於數個隔壁81之每一個均不規則地)不同。於本實施形態 312XP/發明說明書(補件)/96-12/96131624 17 200822172 中使用之圖案形成材料中,使光罩46之透過率變動範 為平均透過率之勝由此各隔㈣於X方向之寬度3 =壁81之平均寬度的⑽之範圍内變動。實際上,隔壁 在冋度方向(Z方向)上亦不均勻。再者,圖5中 有於X方向及Y方向之倍率互不相同之隔壁以。1 於本實施形態中,喷嘴部421僅掃描一次即完成 9+上^成隔案之作業,但亦可根據基板9之尺寸,由 贺嘴部421進行複數次掃描而於整個基板9上 壁8卜此時’每當噴嘴部42 隔 ^ Λ Λ Y ^ ^ ^ ^ 啊细、、、Ό采k ’使掃描頭 仏 特定之距離,並且亦使基板9移動至 初始位置後,重複上述動作。 經以上步驟所形成之隔壁圖案於 ;案形成材料中之樹脂成分,並且使低軟化點破璃= 之組裝零件的面板製作。 ^而凡成平面顯示裝置:Continued: the pattern forming material is discharged, and the pattern forming material is stopped after the base is pressed (directly after + γ = 1 Ϊ (step S15). After eight, the movement of the substrate 9 is stopped (step si 〇, and the light blocking cover 46 The movement and the light irradiation unit 43 emit the irradiation light (step S18). The figure shows a partial plan view of the partition 81 which is not formed on the substrate 9. The partition wall having the same number as the discharge port 422 is arranged on the substrate 9 The partition walls 81 are arranged in the X direction perpendicular to the relative moving direction of the nozzle portion 421 at an equal pitch (actually, the spitting distance, that is, t 300 /zm), and a plurality of partition walls 81 are formed on the substrate 9. The pattern 8. The majority of each of the partition walls 81 will have a maximum width or a minimum width in the χ direction between 2 and 3 questions in the γ direction (about 1 〇 of the distance between the outlets 422) according to the illuminance of the illumination light. (or the position where the width is 0 in the γ direction), the magnitude of the twist also changes irregularly. Further, at each position of the gamma direction on the substrate 9, the width of the partition 81 in the χ direction In other words, irregularities are present in a plurality of partitions 81 In Fig. 5, each of the plurality of partition walls 81 is irregularly different. In the pattern forming material used in the embodiment 312XP/invention specification (supplement)/96-12/96131624 17 200822172, the mask is made The transmittance variation of 46 is the average transmission rate, and thus the variation is in the range of (10) in the width direction of the X direction = (10) of the average width of the wall 81. In fact, the partition wall is also in the twist direction (Z direction). In addition, in FIG. 5, there are partition walls having different magnifications in the X direction and the Y direction. In the present embodiment, the nozzle portion 421 is scanned only once to complete the operation of the 9+ upper division. However, depending on the size of the substrate 9, a plurality of scans are performed by the mouthpiece portion 421, and the wall 8 of the entire substrate 9 is at this time. 'When the nozzle portion 42 is separated, Λ ^ Y ^ ^ ^ ^ 细,, Ό After k' is made to make the scanning head 仏 a certain distance, and the substrate 9 is also moved to the initial position, the above operation is repeated. The partition wall formed by the above steps forms the resin component in the material, and the low softening point is broken. = panel fabrication of assembled parts. ^ Wherever a flat display device

Lj 4:亡=’於圖1之圖案形成裳置”,在自噴嘴部 421 ^ 光硬化性之圖案形成材料期間,在噴嘴;Lj 4: dies = 'formed in the pattern of Fig. 1", during the formation of the material from the nozzle portion 421 ^ photohardenable pattern, at the nozzle;

421及光照射部43沿著基板9而移動 在贺W 部421前行且相對於基板9進行相 ^ ’使贺嘴 罩移動機構45使光罩46在光照射部移動,並且光 =行於基板9之方式移動,故使用光罩^ -91; r t" " ^ ^ ^ ^ 貝見對基板9上之隔壁圖案不均 稽 壁圖案之不均係由於複數個吐出σ ’上述隔 之開口面積或流 312ΧΡ/Μ 說明書(補件)/96·12/96131624 18 200822172 態之不均勾、或者自光照射部43射出之光之強 又再去專,而上混雜地形成寬度不同之隔壁時所產生。 光IH基板9上之圖案不均被抑制,則亦可使用如下 P ’使X方向之甲央部之诱P左jii w 時使各端部(例如,X透過率隨機變化’同 , 方向之靶圍僅占所有吐出口 422所 =之乾圍的m以下之部分)之透過率固定。亦即,於 圖案形成裝置1中,在自喷嘴 、 間,於日n 畏自贺以421吐出圖案形成材料期 致整個照㈣域,可㈣_成材料上 的之照度分布不規則地變化(於下述第 轭形悲中相同)。 貝 叙1之圖案形成裝置1中,使光罩46之透過率之變 = 壁於γ方向之複數個 位置的見度於該隔壁之平均寬度的±3%範圍内變動,由此 在不設置光罩46時,複數個隔壁中產生之於平均 之範圍内的寬度不均勾之影響,故可有效地 =基板9上之隔壁圖案之不均。通常’不設置光軍铛 犄禝數個隔壁中產生之寬度變動範圍為平均寬度之+ 1%〜 ±5%’此時’若使光罩46之透過率之變動幅度為平均透過 率的2%以上、10%以下,以使不規則變化之照射光於圖案 =材料上的照度之變動幅度為照射區域之空間且時間 度平均值的2%以上、10%以下’則可適當地抑制基板9 上之隔壁圖案之不均。又,於圖案形成裝置i中,較 使於剛吐出至基板9上後之圖案形成材料上的照射光之 照度分布變化,以便使各隔壁中在吐出口奶之間距(隔 312XP/發明說明書(補件)/96-12/96131624 19 200822172 壁之間距)的1至100倍(更佳為5至10倍)之範圍内出現 . 1次峰值(極大或極小)(於下述第2及第3實施形態中相 同)。 此處,就圖3之光罩4 6之除印刷以外的製作方法加以 描述。圖6係表示樹脂薄膜之透過率與波長之關係圖。圖 6中標有符號A1之線係表示厚度為25 //m之PCTFE(聚氣 三氟乙烯,polychloro-trifluoroethylene)薄膜之透過 率,標有符號A2之線係表示厚度為25//m之ETFE(四氟 f、 乙稀-乙烯共聚物,tetrafluoroethylene-ethylene copolymer)薄膜之透過率,標有符號A3之線表示厚度為 25/zm 之 FEP(四氟乙烯-六氟丙烯共聚物, tetrafluoroethylene-hexafluoropropy1ene copolymer) 薄膜之透過率,標有符號A4之線係表示厚度為25 // m之 PFA(四氟乙烯-全氟烷基乙烯基醚共聚物, tetrafluoroethylene-perfluoroalky1 vinyl ether I copolymer)薄膜之透過率,標有符號A5之線係表示厚度 為25/zm之PE(聚乙烯,polyethylene)薄膜之透過率, 標有符號A6之線係表示厚度為135 /zm之破璃之透過 率,標有符號A7之線係表示厚度為40//m之PVC(聚氯乙 . 烯,polyvinylchloride)薄膜之透過率。 如圖6所示,PCTFE、ETFE、FEP及PFA此類氣系薄膜 於紫外線波長帶(例如,250〜400 nm)内具有高透過率, 可對氟系薄膜實施壓紋加工等以使厚度局部地變化,因此 可容易製作具有不規則之透過率分布之光罩。當然,可根 312XP/發明說明書(補件)/96-12/96131624 20 200822172 外喰透過率^ 光之強度’而使料乙烯等紫 、、表透匕率較低之薄膜來製 料之硬化時所使用::根據圖案形成材 〕先之波長贡,PET(聚對苯二甲酸乙二 " 代 ylene terephthalate)等薄膜。 …丨圖案形成裝置1之其他例加以說明。圖7係表 圖案形成裝置丨之光罩移動機構 ,: =與喷嘴部421相反侧觀看(即,自; 向硯看)時之光照射部43之下部附近。 罩移動機構恤中’於X方向上夾隔光照射部 43而权置有下側輥⑸、似,於各下側幸昆45卜452之上 方配置有經由環狀帶455、456而連接於馬達似、似之 上側輕453、454。於圖案形成裝置丨中,來自光 3之照射光之光路上的光罩46a之部位,藉由光罩移^ 機構45a而沿著喷嘴部421之吐出口似之排列方向(即 X方向)移動。 C圖8係表示配置於光照射部43與基板9之間之光罩46a 之局部圖。圖8之光罩46a係僅形成有圖3之光罩^中 的排列於Y方向上之一行矩形區域461者(但圖8之光罩 46a中之縱橫比不同),同樣地,複數個矩形區域《Η中 照射光之透過率呈現不規則地不同。 於具有® 7之光罩移動機構45a之圖案形成裝置j中, 在自喷嘴部421吐出圖案形成材料期間,亦於噴嘴部42| 及光照射部43沿著基板9之移動方向上,使噴嘴部421 前行且相對於基板9進行相對連續地移動,同時使與剛吐 312XP/發明說明書(補件)/96-12/96131624 21 200822172 、土板Θ上後之圖案形成材料對應的光罩部位之透 ^分t不規則地變化。由此,使用光罩46a可容易使照 、一之…、度刀布不規則地變化,故可抑制形成於基板9上 之隔壁圖案之不均。 再者於圖2之光罩移動機構45中,上侧輥454被配 置於光照射部43與噴嘴部421之間之狹窄空間内,相對 於此於圖7之光罩移動機構45a巾,上側棍453、454 -置於X方向上光照射部43之外側的較廣空間内,因 匕人圖2之光罩移動機構45之圖案形成裝置】相 比可谷易進仃圖案形成裝置1之組裝。但為了對應於光 罩46之圖案以使形成於基板9上之隔壁產生不規則性, 車乂<為士目2之光罩移動機構,使配置於光照射部 與基板9之間之光罩在喷嘴部421之移動方向上移動。 口口圖9係表示本發明第2實%形態之圖案形成裝置之光源 單兀432a之構成圖。圖9之光源單元432a具有射出紫外 ί;線之光源433(但圖9中僅表示光源433之射出部),在光 源433(之射出部)與光纖431(實際上為光纖束。)之間, 配置有圓板狀之濾波器434及透鏡435。濾波器4料以平 行於光源433與光纖431之間的光軸之旋轉軸J2為中 心,藉由馬達436而旋轉,於濾波器434上之複數個部位 (規則或不規則地分割而成之複數個部位),紫外線透過率 呈現不規則地不同。圖案形成裝置之其他結構與圖丨相 同,故標記相同符號。 其次,根據圖4來說明具有圖9之光源單元432之圖案 312XP/發明說明書(補件)/96-12/96131624 22 200822172 1衣置於基板9上形成隔壁圖案之動作。於圖案形成裝 置中,將基板9载置於平臺2〇上後,開放光源433内之 擒閘’自光源433射出紫外線,由此開始自光照射部43 =出照射光(步驟S11)。又,藉由馬達懦使滤波器似 = 由此使來自光照射部43之射出光之強度不規 則地受化(步驟S12)。其後,使嘴嘴部421及光照射部43 開始相對於基板9進行相對移動,並且開始自噴嘴部似 =各吐出口 422吐出圖案形成材料(步驟S13、su),一 L朝基板9上吐出圖案形成材料,一邊對剛吐出至基板9 上後之圖案形成材料照射來自光照射部43之照射光。 此時’使來自光照射部43之照射光之強度經時不規則 麦化口此,對自複數個吐出口 422吐出並附著於對象 面91上之圖案形成材料所照射的照射光之照度,根據基 板9上之γ方向之位置而變化。如上所述,在自噴嘴部 421吐出圖案形成材料期間’於照射光在基板9及所吐出 之圖案形成材料上之整個照射區域中,使圖案形成材料上 之?射光:照度不規則地變化,故γ方向上複數個位置的 各隔壁之見度隨照射光之照度而不規則地變動。再者,形 成於基板9上之所有隔壁之寬度極小或極大的γ方向之位 置大致相同。 '、;後^基板9之(+ Υ)側之端部附近到達喷嘴部421之 正下方枯,停止吐出圖案形成材料(步驟S15)。其後,停 止基板9之移動(步驟S16),並且亦停止濾波器之旋 轉及自光恥射部43射出照射光(步驟S17、S18)。 312XP/^__(補件)/96·12/96131624 23 200822172 如上所說明’於具有圖9之光源單元432之圖案形成裝 置中在自喷嘴部421吐出圖案形成材料期間,使對剛吐 出至基板9上後之圖案形成材料整體所照射的照射光之 照度不規則地變化,由此可使γ方向上複數個位置的各隔 壁之寬度不規則地變動。實際上,基板9上所有隔壁於隔 壁延伸方向之各位置的寬度變化率大致相同,但上述情況 下,亦可抑制基板9上之隔壁圖案之不均。 又’使對剛吐出至基板9上後之圖案形成材料整體所昭 射的照射光之照度不規則變化,亦可以其他方法而實現。 圖10係表示圖案形成裝置之掃描頭部之其他例圖。於圖 10之掃描頭部4a中,於升降機構41之下料有汽缸機 構47’汽缸機構47之可動部471固定於光照射部43,由 此使光照射部43可在平行於基板9之法線方向之方向(圖 中之z方向)上移動。χ,光照射部43藉由導向部^ 在Ζ方向上平滑地引導。 在利用具有圖10之掃描頭部乜之圖案形成裝置於基板 9上形成隔壁圖案時,首先,將基板9載置於平臺2〇1, 其次,開始自光照射部43射出照射光(圖4中步驟su) i 又,開始對汽缸機構47進行驅動,藉此光照射部43開始 在基板9之法線方向上僅以微小距離(例如,自基準位置 =Z方向上之±1 mm之範圍内)不規則地移土動(步驟 S12)。八後,使喷嘴部421及光照射部43開始相對於美 板9進行相對移動,並且開始自喷嘴部421之各吐出= 422吐出圖案形成材料(步驟S13、S14),一邊朝基板9上 312XP/發明說明書(補件)/96-12/96131624 24 200822172 :土案形成材料’一邊對剛吐出 成材料照射來自光照射部43之照射光。後之⑽ 動::;光照射部43於基板9之法線方向上不規則地移 動僅微小之距離,因此, 砂 著於對象面91上之圖宰:固吐出口 422吐出並附 度,根據基板9上之Y 所照射的照射光之照 果,形成於基板9上之所奸:上而=則地變化。其結 寬度不規則地變化。仏壁^方向之複數個位置的 然後,當基板9之(+Υ)側之端部附近到達喷嘴部421之 I方日守’ jT止吐出圖案形成材料(步驟幻5)。其後,停 :板9之移動(步驟S16),同時亦停止汽缸機構〇之 區力及自光照射部43射出照射光(步驟S17、S18)。 /:上,說明’於具有圖1G之掃描頭部4a之圖案形成裝 43 /射嘴部421吐出圖案形成材料期間,光照射部 43相對於贺嘴部421在基板9之法線方向上以僅微小之 距離不規則地移動,故對剛吐出至基板9上後之圖案 材料整體所照射的照射光之照度會容易不規則地變化^ 此’可使基板9上之各隔壁於γ方向之複數個位置的寬产 不規則地變化’因而可抑制基板9上之隔壁圖案之不均= 再者,將光照射部43於ζ方向上移動之機構,亦 螺線管或振盪器等而實現。 曰田 、士圖11所示,當於光源單元432内設有可自外部 進行調變控制之電源437時,可利用控制部5之控制來; 由電源437賦予光源433❸電壓之大小不規則地變化,故 312ΧΡ/發明說明書(補件)/96-12/96131624 25 200822172 亦可使來自光照射部43之昭矣 但此種電請比較昂貴射先之強度不規則地變化。 圖12係表示本發明第3實施形態的圖案形成裝置 之構成圖’圖12中僅表示光照射部43及,; 端部附近。於圖12之掃描頭冑4b中,設有以平 ^於吐出Z 422之排列方向(即X方向)之轉動軸J3為中 心而使光射部43以微小角度轉動之轉動機構❿: 在利用具有圖12之掃描頭部处之圖案形成裝置 9上形成隔壁圖案時,首先,開始自光照射部㈣ 反 1, 4中步驟S⑴,並且開始對轉動機構…進行驅動,丄圖匕 先,射部43開始以轉動軸;3為中心而於特定之微小旋轉 角靶圍内進行不規則地轉動(步驟S12)。其後,使嘴 421及光照射部43開始相對於基板9進行相對移動,1 且開始自喷嘴部421之各吐出D 422吐出圖案形成材料 (步驟S13、S14)。藉此,自複數個吐出口 422在排列於X 方向上之狀態下朝基板9上吐出圖案形成材料,同時對橫 穿剛吐出至基才反9上後之圖案形成材料的線狀照射‘ 域,照射來自光照射部43之照射光。 此時,光照射部43以轉動轴J3為中心不規則地轉動, 由此使照射至基板9上之照射光於γ方向之照射範圍(圖 12中以標有符號R1之箭頭所示之範圍)相應於吐出口 進行微小(例如,自旋轉角為〇度時之位置起於γ方向上 之±lmm的範圍内)且不規則地變化。因此,在形成於基板 9上之各隔壁於γ方向之複數個部位,在自吐出圖案形成 312XP/發明說明書(補件)/96-12/96131624 26 200822172 材料後直至照射光之照射為止 而導致的形狀濟塌狀沉將不均。::“同’故因重力等 點鏈線表轉動㈣轉角以後之切射中’用二 然後,當基板9之(+Y)側之端邛附沂 正下方時,停止吐中同安/ 近到達喷嘴部421之 止^ Q 7 Θ案形成材料(步驟S15)。1後,停The light-irradiating portion 421 and the light-irradiating portion 43 are moved along the substrate 9 to advance in the W portion 421 and are moved relative to the substrate 9 so that the mask moving mechanism 45 moves the mask 46 in the light-irradiating portion, and the light is in the line Since the substrate 9 moves, the mask is used, and the unevenness of the pattern of the partition wall pattern on the substrate 9 is due to a plurality of spouts σ 'the above Opening area or flow 312ΧΡ/Μ Specification (supplement)/96·12/96131624 18 200822172 The unevenness of the state or the intensity of the light emitted from the light-irradiating portion 43 is again de-specialized, and the width of the mixture is different. Produced at the next door. When the pattern unevenness on the light IH substrate 9 is suppressed, the following P' may be used to make the end portions of the X-direction of the X-direction of the X-direction of the X-direction (for example, the X transmittance is randomly changed 'the same direction, the direction The transmittance of the target circumference is only a part of m of the dry circumference of all the discharge ports 422 = fixed. That is, in the pattern forming apparatus 1, the entire illumination (fourth) domain is emitted from the nozzles, and the illuminance distribution on the (four)_material is irregularly changed. It is the same in the following yoke shape). In the pattern forming apparatus 1 of Besei 1, the transmittance of the mask 46 is changed = the visibility of the plurality of positions of the wall in the γ direction is within ±3% of the average width of the partition, thereby not being set. In the case of the mask 46, the influence of the width unevenness in the average range generated in the plurality of partition walls can effectively reduce the unevenness of the partition pattern on the substrate 9. Usually, the width variation range generated in the number of partitions is not +1% to ±5% of the average width. At this time, if the transmittance of the mask 46 is changed to the average transmittance 2 % or more and 10% or less, in order to appropriately suppress the substrate, the fluctuation range of the illuminance in the pattern = material is the space of the irradiation region and the time average value is 2% or more and 10% or less. 9 The uneven pattern on the next door. Further, in the pattern forming apparatus i, the illuminance distribution of the irradiation light on the pattern forming material immediately after being discharged onto the substrate 9 is changed so as to make the distance between the discharge outlets in each of the partition walls (the 312XP/invention specification ( Included in the range of 1 to 100 times (more preferably 5 to 10 times) of the wall). (1st and 2nd) 3 in the same embodiment). Here, a description will be given of a manufacturing method other than printing of the mask 46 of Fig. 3. Fig. 6 is a graph showing the relationship between the transmittance of a resin film and the wavelength. The line labeled with symbol A1 in Fig. 6 indicates the transmittance of a PCTFE (polychloro-trifluoroethylene) film having a thickness of 25 // m, and the line labeled with symbol A2 indicates an ETFE having a thickness of 25/m. The transmittance of a film of tetrafluoroethylene-ethylene copolymer (tetrafluoroethylene-ethylene copolymer), the line marked with the symbol A3 indicates FEP (tetrafluoroethylene-hexafluoropropene1ene) having a thickness of 25/zm. Copolymer) The transmittance of the film, the line marked with the symbol A4, indicates the transmittance of a film of PFA (tetrafluoroethylene-perfluoroalky1 vinyl ether I copolymer) having a thickness of 25 // m. The line marked with the symbol A5 indicates the transmittance of a PE (polyethylene) film having a thickness of 25/zm, and the line marked with the symbol A6 indicates the transmittance of the glass having a thickness of 135 /zm, marked with a symbol. The line of A7 indicates the transmittance of a PVC (polyvinyl chloride) film having a thickness of 40/m. As shown in Fig. 6, gas films such as PCTFE, ETFE, FEP, and PFA have high transmittance in an ultraviolet wavelength band (for example, 250 to 400 nm), and embossing can be performed on a fluorine-based film to make the thickness partial. The ground changes, so that it is easy to produce a photomask having an irregular transmittance distribution. Of course, the root can be hardened by the 312XP/invention specification (supplement)/96-12/96131624 20 200822172, the transmittance of the light, the intensity of the light, and the purple, and the low permeability of the film. When used: according to the pattern forming material] first wavelength tribute, PET (polyethylene terephthalate " ylene terephthalate) and other films. Other examples of the pattern forming device 1 will be described. Fig. 7 is a reticle moving mechanism of the pattern forming device ,: = = near the lower portion of the light illuminating portion 43 when viewed from the opposite side of the nozzle portion 421 (i.e., viewed from the side). In the cover moving mechanism shirt, the lower side roller (5) is placed in the X direction, and the lower side roller (5) is placed, and the lower side of the lower side is disposed above the lower side, and the fifth belt 452 is connected via the endless belts 455 and 456. The motor looks like the upper side is light 453, 454. In the pattern forming apparatus, the portion of the mask 46a on the optical path of the illumination light from the light 3 is moved along the discharge direction of the nozzle portion 421 (i.e., the X direction) by the mask transfer mechanism 45a. . FIG. 8 is a partial view showing the photomask 46a disposed between the light irradiation unit 43 and the substrate 9. The reticle 46a of FIG. 8 is formed only by a rectangular area 461 arranged in the Y direction in the reticle of FIG. 3 (but the aspect ratio is different in the reticle 46a of FIG. 8), and similarly, a plurality of rectangles The transmittance of the illuminating light in the area is irregularly different. In the pattern forming apparatus j having the reticle moving mechanism 45a of the 707, during the ejection of the pattern forming material from the nozzle portion 421, the nozzle is also moved in the moving direction of the nozzle portion 42| and the light illuminating portion 43 along the substrate 9. The portion 421 is advanced and relatively continuously moved relative to the substrate 9, and at the same time, a mask corresponding to the pattern forming material immediately after the spit 312XP/invention specification (supplement)/96-12/96131624 21 200822172 The penetration of the part t varies irregularly. As a result, the mask 46a can be used to easily change the illumination, the knives, and the knives irregularly, so that the unevenness of the partition pattern formed on the substrate 9 can be suppressed. Further, in the reticle moving mechanism 45 of Fig. 2, the upper roller 454 is disposed in a narrow space between the light illuminating portion 43 and the nozzle portion 421, and the upper side of the reticle moving mechanism 45a of Fig. 7 The sticks 453 and 454 are placed in a wider space on the outer side of the light-irradiating portion 43 in the X direction, and the pattern forming device of the mask moving mechanism 45 of FIG. 2 is assembled as compared with the pattern forming device 1 in the valley. However, in order to correspond to the pattern of the mask 46 to cause irregularities in the partition wall formed on the substrate 9, the rudder is a reticle moving mechanism of the stalk 2, and the light disposed between the light illuminating portion and the substrate 9 is made. The cover moves in the moving direction of the nozzle portion 421. Fig. 9 is a view showing the configuration of a light source unit 432a of the pattern forming apparatus of the second aspect of the present invention. The light source unit 432a of Fig. 9 has a light source 433 that emits ultraviolet light (but only the emitting portion of the light source 433 is shown in Fig. 9), between the light source 433 (the emitting portion) and the optical fiber 431 (actually a fiber bundle). A disk-shaped filter 434 and a lens 435 are disposed. The filter 4 is rotated by a motor 436 centering on a rotation axis J2 parallel to the optical axis between the light source 433 and the optical fiber 431, and is divided into a plurality of portions on the filter 434 (regularly or irregularly divided) In multiple parts, the ultraviolet transmittance is irregularly different. The other structure of the patterning device is the same as that of the figure, so the same reference numerals are used. Next, an operation of forming a partition pattern on the substrate 9 by the pattern 312XP/invention specification (supplement)/96-12/96131624 22 200822172 having the light source unit 432 of Fig. 9 will be described with reference to Fig. 4 . In the pattern forming apparatus, after the substrate 9 is placed on the stage 2, the shutters in the open source 433 emit ultraviolet rays from the light source 433, thereby starting the light irradiation from the light irradiation unit 43 (step S11). Further, the filter is made to be similar to the intensity of the light emitted from the light-irradiating portion 43 by the motor ( (step S12). Then, the nozzle portion 421 and the light irradiation portion 43 start to move relative to the substrate 9, and the pattern forming material (steps S13, su) is ejected from the nozzle portion = each discharge port 422, and one L is directed toward the substrate 9. The pattern forming material is ejected, and the pattern forming material that has been discharged onto the substrate 9 is irradiated with the irradiation light from the light irradiation unit 43. At this time, the illuminance of the irradiation light irradiated by the pattern forming material which is discharged from the plurality of discharge ports 422 and adhered to the target surface 91 is caused by the irregularity of the intensity of the irradiation light from the light irradiation unit 43 over time. It changes according to the position of the gamma direction on the substrate 9. As described above, during the ejection of the pattern forming material from the nozzle portion 421, the patterning material is formed on the entire irradiation region of the substrate 9 and the discharged pattern forming material. Light: The illuminance changes irregularly, so the visibility of each of the plurality of positions in the γ direction irregularly changes with the illuminance of the illuminating light. Further, the positions of all the partition walls formed on the substrate 9 having extremely small or extremely large γ directions are substantially the same. The vicinity of the end portion on the (+ Υ) side of the rear substrate 9 reaches the immediately below the nozzle portion 421, and the discharge of the pattern forming material is stopped (step S15). Thereafter, the movement of the substrate 9 is stopped (step S16), and the rotation of the filter is stopped and the irradiation light is emitted from the maser portion 43 (steps S17, S18). 312XP/^__(supplement)/96·12/96131624 23 200822172 As described above, in the pattern forming apparatus having the light source unit 432 of FIG. 9, during the ejection of the pattern forming material from the nozzle portion 421, the pair is immediately ejected to the substrate. The illuminance of the irradiation light irradiated by the entire pattern forming material after 9 is irregularly changed, whereby the width of each of the plurality of positions in the γ direction can be irregularly changed. Actually, the width change rates of all the partition walls on the substrate 9 at the respective positions in the direction in which the partition walls extend are substantially the same. However, in the above case, the unevenness of the partition wall pattern on the substrate 9 can be suppressed. Further, the illuminance of the illuminating light which is reflected by the entire pattern forming material which has just been ejected onto the substrate 9 may be irregularly changed, and may be realized by another method. Fig. 10 is a view showing another example of the scanning head of the pattern forming apparatus. In the scanning head portion 4a of FIG. 10, the movable portion 471 of the cylinder mechanism 47 is fixed to the light irradiation portion 43 under the elevating mechanism 41, whereby the light irradiation portion 43 can be parallel to the substrate 9. Move in the direction of the normal direction (z direction in the figure). That is, the light irradiation portion 43 is smoothly guided by the guide portion in the x direction. When a partition pattern is formed on the substrate 9 by the pattern forming apparatus having the scanning head 图 of FIG. 10, first, the substrate 9 is placed on the stage 2〇1, and then, the irradiation light is emitted from the light irradiation unit 43 (FIG. 4). In the step su) i, the cylinder mechanism 47 is started to be driven, whereby the light irradiation unit 43 starts to have a small distance in the normal direction of the substrate 9 (for example, a range of ±1 mm from the reference position=Z direction). Internally, the earth is moved irregularly (step S12). After that, the nozzle unit 421 and the light irradiation unit 43 start relative movement with respect to the color plate 9, and the discharge of the pattern forming material from the respective discharges 422 of the nozzle unit 421 (steps S13 and S14) is performed, and the substrate 9 is 312XP. /Inventive Manual (Supplement)/96-12/96131624 24 200822172: The soil forming material 'is irradiated with the light from the light-irradiating portion 43 to the material immediately after discharge. After the (10) movement::; the light irradiation portion 43 irregularly moves only a small distance in the normal direction of the substrate 9, and therefore, the sanding on the target surface 91: the solid discharge outlet 422 is discharged and attached, According to the illumination of the irradiation light irradiated by Y on the substrate 9, the smear formed on the substrate 9 changes upwards. The knot width varies irregularly. Then, in the vicinity of the end portion of the substrate 9 on the (+Υ) side, the nozzle portion 421 reaches the nozzle portion 421 and the pattern forming material is formed (step 5). Thereafter, the movement of the plate 9 is stopped (step S16), and the cylinder mechanism 〇 is also stopped and the irradiation light is emitted from the light irradiation unit 43 (steps S17 and S18). In the case where the pattern forming material is formed in the pattern forming device 43 / the nozzle portion 421 having the scanning head portion 4a of FIG. 1G, the light irradiation portion 43 is in the normal direction of the substrate 9 with respect to the mouthpiece portion 421. Since only a small distance moves irregularly, the illuminance of the illumination light irradiated to the entire pattern material immediately after being ejected onto the substrate 9 is likely to be irregularly changed. This allows the respective partition walls on the substrate 9 to be in the γ direction. The wide variation of the plurality of positions is irregularly changed. Thus, the unevenness of the partition pattern on the substrate 9 can be suppressed. Further, the mechanism for moving the light-irradiating portion 43 in the x-direction is also realized by a solenoid or an oscillator. . As shown in FIG. 11 , when the power source 437 capable of externally controlling the modulation is provided in the light source unit 432, the control unit 5 can be used to control the voltage of the light source 433 by the power source 437. Change, so 312 ΧΡ / invention manual (supplement) / 96-12/96131624 25 200822172 It is also possible to make the intensity from the light illuminating unit 43 irregularly change the intensity of the first shot. Fig. 12 is a view showing a configuration of a pattern forming apparatus according to a third embodiment of the present invention. Fig. 12 shows only the light-irradiating portion 43 and the vicinity of the end portion. In the scanning head 胄 4b of Fig. 12, a rotating mechanism for rotating the light-emitting portion 43 at a slight angle centering on the rotation axis J3 which is arranged in the arrangement direction (i.e., the X direction) of the discharge Z 422 is provided: When the partition pattern is formed on the pattern forming device 9 having the scanning head portion of Fig. 12, first, the step S(1) in the light irradiation portion (4) is reversed, and the driving mechanism is started to be driven. The portion 43 starts to rotate irregularly within a specific minute rotation angle target center around the rotation axis 3 (step S12). Then, the nozzle 421 and the light-irradiating portion 43 start to move relative to the substrate 9, and the discharge of the pattern forming material from the respective discharges D 422 of the nozzle portion 421 is started (steps S13 and S14). Thereby, the pattern forming material is discharged onto the substrate 9 in a state in which the plurality of discharge ports 422 are arranged in the X direction, and the linear irradiation 'field of the pattern forming material that has just been discharged to the base 9 is traversed. The illumination light from the light irradiation unit 43 is irradiated. At this time, the light-irradiating portion 43 is irregularly rotated about the rotation axis J3, thereby irradiating the irradiation light irradiated onto the substrate 9 in the γ-direction (the range indicated by the arrow indicated by the symbol R1 in FIG. 12) Correspondingly, the discharge port is made minute (for example, the position when the rotation angle is the 〇 degree is within the range of ±1 mm in the γ direction) and changes irregularly. Therefore, a plurality of portions of the partition walls formed on the substrate 9 in the γ direction are caused by the self-discharge pattern formation 312XP/invention specification (supplement)/96-12/96131624 26 200822172 material until the irradiation of the irradiation light The shape of the collapse will be uneven. :: "Same", because of the point of rotation of the point line of gravity, etc. (4) After the corner is cut, 'Use two, then when the end of the (+Y) side of the substrate 9 is directly below the sputum, stop the spit in the near/near When the nozzle portion 421 is reached, the material is formed (step S15).

止基板9之移動(步驟S16), ,、俊V 驅動及自光昭射邱4q # φ 、’亦停止轉動機構47a之 =先肩43射出照射光(步驟sn、⑽。 σ所祝明,於具有圖12之掃描 置中,在自喷嘴部421吐出圖㈣& 形成叙 部43以轉動軸了3為中心規7 =期間’使光照射 似相對於基板9進行相對移動^方也轉動,由此於喷嘴部 _ 助之方向上,照射光之,昭射 個吐出口侧,)吐出至:板!也:小移動, 日1㈣私丄 後之圖案形成材料整體所 旧射的舨射光之移動方向上的昭 7…、射摩巳圍產生不規則地變 化。由此,可使基板9上之各 又 认☆命π ,日,, 土於Υ方向之複數個位置 規則地變動,故可抑制基板9上之隔壁圖案之不 ,形成於基板9上之所有隔壁之寬度極小或極大 的¥方向之位置大致相同。又’使照射光之照射區域對於 吐出口 422微小蒋動之方、、土,△丨, 、 J移動之方法,例如,亦可藉由設置使光昭 射部43相對於喷嘴部421於ν 士 ^ , t 實現。 …2…方向上進行移動之機構而 如上所述於上述第1至第3實施形態之圖案形成農置 令,在自喷嘴部421吐出圖案形成材料期間,於照射光在 基板9及所吐出之圖案形成材料上的大致整個照射區域 312XP/發明說明書(補件)/96-12/96131624 27 200822172 ,使圖案形成材料上的照射光之照度分布、照度或移動 -方向上的照射範圍產生不規則地變化,由此抑制隔壁圖案 ' ^不均,但無需對整個照射區域進行照射光之照度分布、 照度或移動方向之照射範圍之變更。 _例如’於圖1之圖案形成裝置1中,亦可使用圖13所 :之光罩46b來取替圖3之光罩46,於光罩4牝中將 、准排列之複數個矩形區域1中排列於Y方向上之矩形 (區域461之行作為矩形區域行462,並且僅使一部分矩形 區域行462a(以下,稱為「特定矩形區域行462叼)中包 含之矩形區域461之透過率不規則地變化,而剩餘矩形區 域行462中各矩形區域461之透過率固定。又,於圖 之光罩46b中,複數個特定矩形區域行462a相互鄰接 設置。 於具有光罩46b之圖案形成裝置中,在自噴嘴部421吐 出圖案形成材料期間,於照射光在基板9及所吐出之圖案 I形成材料上之照射區域中,在與特定矩形區域行大 致對向且排列設定於X方向上之複數個部分區域中,使圖 案形成材料上的照射光之照度分布不規則地變化。由此, X方向上之位置包含於部分區域範圍内的各隔壁於γ方向 •之複數個部位的X方向之寬度不規則地變化,此時,亦可 抑制形成於基板9上之隔壁圖案之不均。然而,如上所 述,僅於複數個部分區域中使照度分布經時不規則地變化 時’就適當抑制隔壁圖案之不均之觀點而言,較佳為,使 形成於基板9上之隔壁總數中30%以上(較佳為5〇%以上) 312XP/發明說明書(補件)/96-12/96131624 28 200822172 之個數之隔壁的寬度於γ方向上產生不規則地變化 為,於照射區域中,在χ方向上均等配置有使照度 規則地變化之複數個(例如3以上之)部分區域。又刀 又亦可使用圖14所示之光罩46c來取代圖13之光罩 46b、,—於圖14之光罩46c中,相互分開地設置有特定矩形 區域打462a。此時,在自噴嘴部421吐出圖案形成材料 期間’於照射光在基板9及所吐出之圖案形成材料上之昭 射區域中,在與特定矩形區域行462a大致對向且排列言= 定於X方向上之複數個冑分區支或中,使圖案形成材料上的 照射光之照度不規則地變化,由此可抑制形成於基板9上 之隔壁圖案之不均。再者,於圖13及圖14之光罩4扑、 46c中,較佳為,複數個特定矩形區域行462a中γ方向 之各位置之透過率呈現不規則地互不相同,即便複數個特 定矩形區域行462a中Υ方向之各位置之透過率相同時, 只要Y方向之複數個位置之透過率不規則地變化,則亦可 抑制基板9上之隔壁圖案之不均。 又,如圖15所示,亦可將光照射部43設置為複數個照 射區塊(block)430之集合,並且於一部分照射區塊(圖15 中以符號430a所表示)之每一個中設置圖丨〇之汽缸機構 4 7 ’使其他照射區塊4 3 0固定於喷嘴部4 21上,在隔壁圖 案形成時使照射區塊4 3 0 a於Z方向上不規則地移動,由 此’來自光照射部43之照射光所照射之照射區域中,在 分別與照射區塊430a大致對向之複數個部分區域(此 時,複數個部分區域之面積約占照射區域之50%)中,使 312XP/發明說明書(補件)/96-12/96131624 29 200822172 圖=材料上的照射光之照 圖16係另表示其 :: 圖。於圖16之搞口茱形成策置之掃描頭部如之 =;;rr43(=== 則地轉動。於γ方向上較粗)僅以微小角度不規 中圖=:說Β:光:射部43之轉動動作之圖。圖Π 昭射dii曰儿之虛線矩形表示照射光於基板9上之 :射w m鏈線來表示光 後之照射區域B1。 和勒系角度 B1=所二來自光照射部43之照射光之照射區域 為線狀’其k牙自複數個以σ 422剛向基板 出後之圖案形成材料(圖17中,以二點鏈線表示 ^ 板9上之圖案形成材料80),如圖17中實線及二點騎 所不,由於光照射部43之轉動,照射區域βι之與吐出口 422對應之Y方向之範圍中,於χ方向上遠離轉動轴^ 之部分隨者與轉動軸J4之距離變大而產生較大地變化, 而轉動軸J4附近之部分幾乎未變化。 如上所述’於具有圖16之掃描頭部^之圖案形成裂置 中’在自喷嘴部421吐出圖案形成材料期間,轉動機構 47b使照射光之照射區域Β1以轉動軸J4為中心不規則地 微小轉動,由此,於照射光在基板9及所吐出之圖案形成 材料上之照射區域B1中,於在x方向上遠離轉動軸“之 312XP/發明說明書(補件)/96-12/96131624 200822172 與各吐出口 422對應之部分區域中 材料上之Y方向的照射範圍不規則地射=圖案形成 成於基板9上之隔壁圖案之不均&精在可午制形 7所^於㈣形成裝置中’在自沿著基板9 2之嘴㈣421吐出圖案形成材料期間,圖2之光軍, 動機構45、圖7之光罩移動機構 先軍广 】1〇之汽缸機構^圖U之電源437、圖=3動6機 構47a以及圖1 β之轉動機構4 而n ^, ⑺刀別作為照射光變更部 :作動,因此,於照射光在基板9及所吐出之 ^ 垂直於移動方向之方向上之複域中排列在 ^^ 禝數個部分區域中,使圖牵报 成材料上的照射光之照度分布吏η案形 网^ , 、没或移動方向之,昭射· 圍不規則地變化,以抑制形成於美 _πι”、、射靶 均。亦可根據圖案形成装置之《隔壁圖案之不 及昭鼾蓼R ^. 之°又汁而使照射光之照度分布 化祀圍、或者照度及照射範圍兩者產生不規則地變 限定ί上貫施形態進行了說明,但本發明並非 疋於上述貝施形悲,可進行各種變形。 口 1 8係表不格子狀圖幸8A立 逋A—4 茶8a之局^圖’圖19係圖18令箭 、 之位置的圖案之縱剖面圖。在 8a時,首先,於基板9上形成由二 所構成之圖案,其後,將喷嘴部二:=: 有不同間距者,並且使絲9之朝 ~ - 1丨』义更90度,以於隔 312Χ___(補件)/96·12/96131624 31 200822172 = 案要素㈣所構成之曙 ,9上之P°辟8 ^ 間的間隔加以㈣,以免與基板 涉)。而且,對圖案8a進行燒成,由 ?:成電漿顯示裝置用隔壁。在形成The movement of the substrate 9 is stopped (step S16), , and the V drive and the self-lighting camera 4q # φ , 'also stop the rotation mechanism 47a = the shoulder 34 emits the illumination light (steps sn, (10). In the scanning center of Fig. 12, the image is ejected from the nozzle portion 421 (4) & the forming portion 43 is rotated with the rotation axis 3 as the center 7 = period ', and the light is irradiated as if relative to the substrate 9 is rotated. In the direction of the nozzle part _ help, the light is irradiated, and the light is emitted from the side of the discharge port, and the discharge is performed on the plate: also: small movement, the movement of the ray light of the entire pattern forming material after the day 1 (four) privately In the direction of the Zhao 7..., the shooting around the square produces irregular changes. As a result, the plurality of positions on the substrate 9 can be regularly changed, and the plurality of positions in the Υ direction can be regularly changed. Therefore, it is possible to suppress the pattern of the partition walls on the substrate 9 and to form all of the spacers on the substrate 9. The position of the side wall is extremely small or the position of the ¥ direction is substantially the same. Further, a method of moving the irradiation region of the irradiation light to the side of the discharge port 422, the soil, the Δ丨, and the J, for example, the light-emitting portion 43 may be provided with respect to the nozzle portion 421. ^ , t implementation. In the above-described first to third embodiments, the pattern is formed in the direction of the second embodiment, and the patterning material is discharged from the nozzle unit 421, and the irradiation light is on the substrate 9 and discharged. The substantially entire illumination area 312XP/invention specification (supplement)/96-12/96131624 27 200822172 on the pattern forming material causes irregularity in illumination distribution, illumination, or movement-direction illumination range on the pattern forming material. The ground pattern is changed, thereby suppressing the partition pattern '^ unevenness, but it is not necessary to change the illumination range of the irradiation light, the illuminance, or the irradiation range of the moving direction in the entire irradiation region. For example, in the pattern forming apparatus 1 of FIG. 1, the mask 46 of FIG. 13 can also be used to replace the mask 46 of FIG. 3, and a plurality of rectangular regions 1 which are aligned and aligned in the mask 4 A rectangle arranged in the Y direction (the line of the area 461 is taken as the rectangular area line 462, and only the transmittance of the rectangular area 461 included in a part of the rectangular area line 462a (hereinafter referred to as "specific rectangular area line 462") is not Regularly changing, and the transmittance of each rectangular region 461 in the remaining rectangular region row 462 is fixed. Further, in the photomask 46b of the figure, a plurality of specific rectangular region rows 462a are adjacent to each other. The pattern forming device having the photomask 46b During the discharge of the pattern forming material from the nozzle portion 421, the irradiation light is substantially aligned with the row of the specific rectangular region and arranged in the X direction in the irradiation region where the irradiation light is applied to the substrate 9 and the pattern I formed by the discharge. In the plurality of partial regions, the illuminance distribution of the illumination light on the pattern forming material is irregularly changed. Thereby, the position in the X direction is included in a plurality of portions of the partition walls in the γ direction in the range of the partial regions. The width of the X direction is irregularly changed, and in this case, the unevenness of the partition pattern formed on the substrate 9 can be suppressed. However, as described above, the illuminance distribution is irregularly changed over time in only a plurality of partial regions. In view of the fact that the unevenness of the partition pattern is appropriately suppressed, it is preferable that 30% or more (preferably 5% or more) of the total number of the partition walls formed on the substrate 9 312XP/invention specification (supplement)/ 96-12/96131624 28 200822172 The width of the partition wall is irregularly changed in the γ direction. In the irradiation region, a plurality of illuminances are regularly arranged in the χ direction (for example, 3 or more) In the partial area, the reticle 46c shown in Fig. 14 can be used instead of the reticle 46b of Fig. 13, and in the reticle 46c of Fig. 14, a specific rectangular area 462a is provided separately from each other. At the time of discharging the pattern forming material from the nozzle portion 421, the irradiation light is substantially aligned with the specific rectangular region row 462a in the illuminating region on the substrate 9 and the discharged pattern forming material, and is arranged at X. Multiple points in the direction In the branch or the middle, the illuminance of the illumination light on the pattern forming material is irregularly changed, whereby the unevenness of the partition pattern formed on the substrate 9 can be suppressed. Furthermore, the mask 4 in FIGS. 13 and 14 is swept, In 46c, it is preferable that the transmittances of the respective positions in the γ direction of the plurality of specific rectangular region rows 462a are irregularly different from each other, even when the transmittances of the respective positions in the plurality of specific rectangular region rows 462a are the same. As long as the transmittance of the plurality of positions in the Y direction changes irregularly, the unevenness of the partition pattern on the substrate 9 can be suppressed. Further, as shown in FIG. 15, the light irradiation portion 43 can be provided in plural irradiation. A collection of blocks 430, and a cylinder mechanism 4 7 ' of each of the illumination blocks (represented by symbol 430a in Fig. 15) is provided to fix the other illumination blocks 430 to the nozzles. In the portion 4 21, the irradiation block 4 3 0 a is irregularly moved in the Z direction when the partition pattern is formed, whereby the irradiation region irradiated by the irradiation light from the light irradiation portion 43 is respectively in the irradiation region Block 430a is substantially opposite to the plurality of parts The area (in this case, the area of the plurality of partial areas accounts for about 50% of the irradiated area), so that the 312XP/invention specification (supplement)/96-12/96131624 29 200822172 Fig. Also indicate its:: Figure. In Fig. 16, the scan head of the mouth is formed as follows;; rr43 (=== then rotates in the direction of γ), and only in a slight angle, the figure is irregular: =: Β: light: A diagram of the rotation of the shot portion 43. The dotted rectangle of the 射 di di di 表示 表示 表示 表示 表示 表示 表示 表示 表示 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线 虚线And the angle B1 = the irradiation area of the illumination light from the light irradiation unit 43 is linear. The k-shaped teeth are formed from a plurality of pattern forming materials which are immediately after the σ 422 is discharged to the substrate (in FIG. 17, the two-point chain) The line indicates the pattern forming material 80 on the board 9, as shown by the solid line and the two-point riding in FIG. 17, and the Y-direction of the irradiation area β1 and the discharge port 422 due to the rotation of the light-irradiating portion 43 The distance from the portion of the rotating shaft that is away from the rotating shaft in the direction of the turn becomes larger as the distance from the rotating shaft J4 becomes larger, and the portion near the rotating shaft J4 hardly changes. When the pattern forming material is ejected from the nozzle portion 421 as described above, the rotating mechanism 47b irregularly illuminates the irradiation region Β1 of the irradiation light around the rotation axis J4. Tiny rotation, whereby the irradiation light is on the substrate 9 and the irradiated region B1 on the discharged pattern forming material, away from the rotating shaft in the x direction "312XP / invention manual (supplement) / 96-12/96131624 200822172 The irradiation range in the Y direction on the material in the partial region corresponding to each of the discharge ports 422 is irregularly projected = the unevenness of the partition pattern formed on the substrate 9 in the pattern & fine in the form of the can be formed in the afternoon (4) In the forming apparatus, during the process of discharging the pattern forming material from the mouth (four) 421 along the substrate 912, the light army of FIG. 2, the moving mechanism 45, and the reticle moving mechanism of FIG. 7 are first used by the military. The power supply 437, the diagram 3, the movement mechanism 4a, and the rotation mechanism 4 of FIG. 1 and n^, (7) the knife is actuated as the illumination light changing unit. Therefore, the illumination light is on the substrate 9 and the discharge is perpendicular to the movement direction. In the direction of the complex domain, arranged in ^^ 禝In the sub-area, the illuminance distribution of the illumination light on the material is reported as 案η 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形 形Shoot the target. According to the pattern of the pattern forming device, the illuminance of the illuminating light may be distributed irregularly, or the illuminance and the illuminating range may be irregularly limited. Although the form has been described, the present invention is not limited to the above-described shape, and various modifications can be made. Port 1 8 series table does not have a grid pattern. Fortunately, 8A stands 逋A—4 Tea 8a. ^ Figure 19 is a longitudinal section of the pattern of the 18th arrow. At 8a, first, a pattern composed of two is formed on the substrate 9, and thereafter, the nozzle portion 2:=: has a different pitch, and the wire 9 is made 90 degrees more toward the -1 丨Between 312 Χ ___ (supplement) / 96 · 12 / 96131624 31 200822172 = case element (four) constitutes the 曙, 9 on the P ° 8 8 ^ interval between (4), so as not to be involved with the substrate). Further, the pattern 8a is fired by ?: into a partition wall for a plasma display device. In formation

#,亦與上述第i至第3Al^ 〇1D . L 弟3貝細形恶相同,使所吐出之圖案 子狀隔壁==:糾板9上之格 用於形成圖案之具有光硬化 外線以外之波長帶之光亦可且有光石 成材料’對於紫 照射部43射出之光包含該波長帶。又:0=:自光 …低軟化點玻璃粉,但根據形成有圖== 交 進行煅燒。 、固案形成後對圖案形成材料 於圖案形成裝置中,平臺2〇上 對於掃描頭部而移動,但亦可:==上相 於基板9相對移動。# 方向上相對 421及光照射部43在γ古/p、要圖案形成裳置中喷嘴部 對移動即可。 11彳目對於基板9之移動為相 於圖4之圖案形成動作中,依序開始 射區域的照射光之照度、照度 :、:射出、照 地變更、基板9之移動、以及圖^5、、、射耗圍之不規則 依相反順序停止該等斤 θ 成材料之吐出,其後, 理,即,在自噴;广’=4之動作實質上為如下處 W 421吐出圖案形成材料之動作之同 312XP/發明說明書(補件)/96·12/96⑶似 % 200822172 時,由光照射部43對基板9上之圖案形成材料進行职射 .光之照射,使噴嘴部421及光照射部43相對於基板^'進 •行相對地移動,更進一步,使照射區域的照射光之照度、 照度分布或照射範圍不規則地變化。 、又#, is also the same as the above-mentioned i-th to 3rd Al^ 〇1D. L brother 3 shell fine, so that the pattern of the spit is sub-wall ==: the grid on the correction board 9 is used to form a pattern other than the photo-curing outer line The light of the wavelength band may also be a material of the phosgene. The light emitted from the violet illuminating unit 43 includes the wavelength band. Also: 0 =: from the light ... low softening point glass powder, but calcined according to the formation of the map == intersection. After the solid case is formed, the pattern forming material is applied to the pattern forming device, and the stage 2 is moved on the scanning head, but it is also possible that: == the upper phase moves relative to the substrate 9. In the direction 421 and the light-irradiating portion 43, the nozzle portion may be moved in the γ-ray/p pattern to be formed. In the pattern forming operation of FIG. 4, the illuminance and illuminance of the illuminating light in the starting region are sequentially: the emission, the illuminating change, the movement of the substrate 9, and the image of FIG. And the irregularity of the radiation consumption is stopped in the reverse order, and then the discharge of the material is stopped, and then, that is, the self-spraying; the operation of the wide '=4 is substantially the following operation of the W 421 discharge pattern forming material In the case of the 312XP/invention specification (supplement)/96·12/96(3) like %200822172, the light-irradiating portion 43 irradiates the pattern forming material on the substrate 9 with light, and the nozzle portion 421 and the light-irradiating portion are irradiated. 43 is relatively moved with respect to the substrate, and further, the illuminance, illuminance distribution, or irradiation range of the irradiation light of the irradiation region is irregularly changed. ,also

又,圖案形成裝置可於場發射顯示裝置(FkMMoreover, the pattern forming device can be used in a field emission display device (FkM

Emission Display)用之基板中,用於分隔件圖案之形成 等,亦可利用在除顯示裝置以外而使用之玻璃基板、電路 (基板、陶瓷基板、半導體基板等上形成圖案時。於圖案形 成裝置中,可於各種基板上形成由等間距地排列於一個^ 向上之線狀的複數個圖案要素所構成之圖案,並且可 該圖案之不均。 別 以上對本發明進行了詳細描述,但所述說明僅為例示, 而非限定於此。因此可理解為,只要在未脫離本發明之範 圍内,則可進行多種變形或具有多種態樣。 21 【圖式簡單說明】 I 圖1係表示第1實施形態之圖案形成裝置之構成圖。 圖2係表不噴嘴部及光照射部之前端附近之放大圖。 圖3係表示光罩之局部圖。 圖4係表示於基板上形成隔壁圖案之動作之流程圖。 圖5係表示形成於基板上之隔壁之俯視圖。 圖6係表示樹脂薄膜之透過率與波長之關係之圖。 圖7係表示光罩移動機構之其他例圖。 圖8係表示光罩之其他例圖。 圖9係表示第2實施形態之光源單元之構成圖。 312XP___件购細搬4 200822172 圖10係表示掃描頭部之其他例圖。 圖11係表示光源單元之其他例圖。 二2係表示第3實施形態之掃描頭部之構成圖。 圖係表示光罩之更進-步其他例圖。 圖14係表示光罩之更進-步其他例圖。 圖丨5係表示光照射部之其他例圖。 圖16係表示掃描頭部之更進一步其他例圖。 圖17係用以說明光照射部之轉動動作之圖。 圖18係表示格子狀圖案之一部分之圖。 圖19係格子狀圖案之剖面圖。 【主要元件符號說明】 1 圖案形成裝置 2 平臺移動機構 3 掃描頭移動機構 4 ^ 4a ^ 4b 掃描頭部 5 控制部 8 圖案 9 基板 11 基台 12 框架 20 平臺 21 、 31 、 457 、 458 馬達 22、32 滾珠螺桿 23、33 螺帽 312XP/發明說明書(補件)/96-12/96131624 34 200822172 24、34 導執 40 基座 41 升降機構 42 吐出部 43 光照射部 44 材料供給部 45 、 45a 光罩移動機構 46 、 46a λ 46b 、 46c 光罩 47 汽缸機構 47a 、 47b 轉動機構 48 導向部 80 圖案形成材料 81 、 81a 、 81b 隔壁 91 對象面 421 喷嘴部 422 吐出口 423 流路 424 開口面 425 對向面 430 、 430a 照射區塊 431 光纖 432 、 432a 光源單元 433 光源 434 濾波器 312XP/發明說明書(補件)/96-12/96131624 35 200822172In the substrate used for the Emission Display, the patterning of the spacer pattern or the like may be performed by using a glass substrate or a circuit (a substrate, a ceramic substrate, a semiconductor substrate, or the like) used in addition to the display device. In the above, a pattern composed of a plurality of pattern elements arranged at equal intervals in a line shape may be formed on various substrates, and the pattern may be uneven. The present invention has been described in detail above, but the The description is only for the purpose of illustration and not limitation. It is to be understood that various modifications and various embodiments may be made without departing from the scope of the invention. Fig. 2 is an enlarged view showing the vicinity of the front end of the nozzle portion and the light irradiation portion. Fig. 3 is a partial view showing the photomask. Fig. 4 is a view showing the formation of the partition wall pattern on the substrate. Fig. 5 is a plan view showing a partition wall formed on a substrate. Fig. 6 is a view showing a relationship between a transmittance of a resin film and a wavelength. Fig. 7 is a view showing light. Fig. 8 is a view showing another example of a reticle. Fig. 9 is a view showing a configuration of a light source unit according to a second embodiment. 312XP___件购细搬4 200822172 Fig. 10 shows a scanning head Fig. 11 is a view showing another example of a light source unit. Fig. 11 is a view showing a configuration of a scanning head according to a third embodiment. Fig. 14 is a view showing another example of a mask. Figure 5 is a view showing another example of the light-irradiating portion. Figure 16 is a view showing still another example of the scanning head. Figure 17 is a view for explaining the turning operation of the light-irradiating portion. Fig. 18 is a view showing a portion of a lattice pattern. Fig. 19 is a sectional view of a lattice pattern. [Description of main component symbols] 1 pattern forming device 2 platform moving mechanism 3 scanning head moving mechanism 4 ^ 4a ^ 4b scanning head Part 5 Control part 8 Pattern 9 Substrate 11 Base 12 Frame 20 Platform 21, 31, 457, 458 Motor 22, 32 Ball screw 23, 33 Nut 312XP / Invention manual (supplement) / 96-12/96131624 34 200822172 24 , 34 guides 40 Base 41 Lifting mechanism 42 Dispensing portion 43 Light illuminating portion 44 Material supply portion 45, 45a Mask moving mechanism 46, 46a λ 46b, 46c Photomask 47 Cylinder mechanism 47a, 47b Rotating mechanism 48 Guide portion 80 Pattern forming materials 81, 81a 81b partition 91 target surface 421 nozzle portion 422 discharge port 423 flow path 424 opening surface 425 opposite surface 430, 430a irradiation block 431 optical fiber 432, 432a light source unit 433 light source 434 filter 312XP / invention manual (supplement) / 96 -12/96131624 35 200822172

/ 435 透鏡 436 馬達 437 電源 441 供給管 442 容器 443 調節器 444 氣體供給部 45卜 452 下側輥 453 、 454 上側幸昆 455 、 456 環狀帶 461 矩形區域 462 矩形區域行 462a 特定矩形區域行 471 可動部 A1〜A7 、 R1 符號 B1 照射區域 J1 光轴 J2 旋轉軸 J3、J4 轉動軸 312XP/發明說明書(補件)/96-12/96131624 36/ 435 Lens 436 Motor 437 Power supply 441 Supply pipe 442 Container 443 Regulator 444 Gas supply part 45 452 Lower side roll 453, 454 Upper side Xun Kun 455, 456 Annular band 461 Rectangular area 462 Rectangular area line 462a Specific rectangular area line 471 Movable parts A1 to A7, R1 Symbol B1 Irradiation area J1 Optical axis J2 Rotation axis J3, J4 Rotation axis 312XP / Invention manual (supplement) / 96-12/96131624 36

Claims (1)

200822172 十、申請專利範圍: L 一種圖案形成裝置,係於基板上形成圖案;1且 圖:::材:r個—朝一具有二之 射對吐出至上述基板上之圖案形成材料進行照 :動:構’在自上述喷嘴部吐出圖案形成材料期間,於 am、部及上述光照射部沿著上述基板而移動之方向 ^ ’使上述噴嘴部前行且相對於上述基板連續地移動,由 上述基板上,形成由等間距地排列在垂直於上述移動 σ之方向上的線狀之複數個圖案要素所構成之圖案;以 及 7光變更部,在自上述喷嘴部吐出圖案形成材料期 Β 、上述妝射光在上述基板及上述圖案形成材料上之大 $整個照射區域中,或者於上述照射區域中排列設定在垂 於上述移動方向之方向上之複數個部分區域中,使上述 圖案形成材料上之上述照射光之照度、照度分布、或上述 私動方向上之照射範圍不規則地變化。 2’如申凊專利範圍第1項之圖案形成裝置,J:中, 上述照射光變更部為如下機構,即,在自上述嗔嘴部吐 出圖案形成材料期間’使配置於上述光照射部與上述基板 之間之光路上的光罩之透過率分布不規則地變化。 3.如申請專利範圍第2項之圖案形成裝置,其中, 上述光罩以平行於上述基板之方式移動,由此使上述光 312ΧΡ/發明說明書(補件)/96-12/96131624 37 200822172 路上之上述光罩之透過率分布變化。 ^如申請專利範圍第1項之圖案形成裝置,其中, ::土述光照射部之上述照射光於、 區域為線狀,其橫穿上述圖案形成材料, …射 吐=:::變更部為如下機構,即,在自上述喷嘴部 上,相對於\ 期間’使上述照射區域於上述移動方向 上比昭心、數個吐出口不規則地微小移動,或者使 Ο L) 中心,不招目丨丄 、上述基板之法線方向之轉動軸為 ^ 不規則地微小轉動。 5.如申睛專利範圍第1項之圖案形成裝置,1中, ^照射光變更部為如下機構’即’在自上述 =案形成材料期間,使上述光照射部於上述基板之法線 方向上不規則地移動。 、、' 6 ·如申凊專利範圍第1 置,其中, 固弟1至5項中任-項之圖案形成裝 透過上述恥射光變更部而不規則地變化之上述昭射 :上:照度之變動幅度為上述照射區域之空間且時間昭 度之平均值的2%以上、10%以下。 1…、 7 -種圖案形成方法,係於基板上形成圖案;其具備 a)自嘴嘴部之複數個吐出口朝基板上 性之圖案形成材料之步驟; 、有先硬化 二)對土出至上述基板上之圖案形成材料照射 射部之照射光; 尤…、 〇與上述a)步驟並行’於上述嘴嘴部及上述光照射部 312XP/發明說明書(補件)/96-12/96131624 38 200822172 石著上述基板而移動之方向上,使上述喷嘴部前行且相對 於上述基板連續地移動,由此於上述基板上,形成由等間 距地排列在垂直於上述移動方向之方向上的線狀之複^ 個圖案要素所構成之圖案;以及 d)與上述a)步驟並行,於上述照射光在上述基板及上 述圖案形成材料上之大致整個照射區域中 射區域令排列設定在垂直於上述移動方向之戈方者 數個部分㈣中’使上述圖案形成材料上之上述照射光之 照度、照度分布、或上述移動方向之照射範圍不規 化。 8. 如申請專利範圍第7項之圖案形成方法,其中, 於上述d)步驟中M吏配置於上$光照射部與上述基板 之間之光路上的光罩之透過率分布不規則地變化。 9. 如申請專利範圍第8項之圖案形成方法,其中, 上述光罩以平行於上述基板之方式移動,由此使上述光 路上之上述光罩之透過率分布變化。 10·如申請專利範圍第7項之圖案形成方法,其中, 來自上述光照射部之上述照射光於上述基板上之照射 區域為線狀,其橫穿上述圖案形成材料; 於上述d)步驟中,上述照射區域於上述移動方向上, 相對於上賴數個以口不規則崎小移動,或者上述照 射區域以平行於上述基板之法線方向之轉動軸為中心,而 不規則地微小轉動。 11 ·如申明專利範圍第7項之圖案形成方法,其中, 312XP/發明說明書(補件)/96-12/96131624 39 200822172 於上述d)步驟中,上述光照射部於上述基板之法線方 向上不規則地移動。 12·如申明專利範圍第7至丨丨項中任一項之圖案形成方 法,其中, 於上述d)步驟中,不規則地變化之上述照射光的上述 照度之變動幅度為上述照射區域之空間且時間照度之平 均值的2%以上、10%以下。 40 312XP/發明說明書(補件)/96-12/96131624200822172 X. Patent application scope: L A pattern forming device for forming a pattern on a substrate; 1 and a drawing::: material: r--for a pattern forming material which is discharged onto the substrate by a beam of two; During the discharge of the pattern forming material from the nozzle portion, the nozzle portion is advanced in the direction in which the am, the portion, and the light irradiation portion move along the substrate, and the substrate is continuously moved. a pattern formed by a plurality of linear pattern elements arranged at equal intervals in a direction perpendicular to the movement σ; and a 7-light changing unit for discharging the pattern forming material from the nozzle portion, Forming the light on the substrate and the pattern forming material in a large amount of the entire irradiation region, or arranging the plurality of partial regions in the direction of the moving direction in the irradiation region to make the pattern forming material The illuminance, the illuminance distribution, or the irradiation range in the above-described private movement direction of the above-described irradiation light changes irregularly. In the pattern forming apparatus of the first aspect of the invention, the illumination light changing unit is a mechanism for disposing the light irradiation unit during the discharge of the pattern forming material from the mouth portion. The transmittance distribution of the mask on the optical path between the substrates is irregularly changed. 3. The pattern forming apparatus of claim 2, wherein the photomask is moved parallel to the substrate, thereby causing the light 312ΧΡ/invention specification (supplement)/96-12/96131624 37 200822172 The transmittance distribution of the photomask described above changes. The pattern forming apparatus according to the first aspect of the invention, wherein the irradiation light of the :-the light irradiation unit is in a line shape, and traverses the pattern forming material, ...the injection =::: change unit The mechanism is such that, in the nozzle portion, the irradiation region is irregularly moved slightly in the moving direction from the center of the movement or the plurality of discharge ports with respect to the "period", or the center is not moved. It is seen that the rotation axis of the normal direction of the substrate is irregularly minutely rotated. 5. The pattern forming apparatus according to claim 1, wherein the illumination light changing unit is a mechanism that causes the light irradiation unit to be in a normal direction of the substrate during the formation of the material from the above-mentioned method. Move irregularly. , "6", as claimed in the first paragraph of the application, in which the pattern forming device of the 1st to 5th items of the Gudi is irregularly changed by the above-mentioned shame light changing unit: upper: illuminance The fluctuation range is 2% or more and 10% or less of the average of the space of the irradiation area and the time range. 1..., 7-pattern forming method for forming a pattern on a substrate; the method comprising the steps of: a) forming a material from a plurality of spouts of the mouth portion toward the substrate pattern; and first hardening the second) The patterning material on the substrate is irradiated with the irradiation light of the emitting portion; in particular, 〇 is parallel to the step a) above, in the nozzle portion and the light irradiation portion 312XP/invention specification (supplement)/96-12/96131624 38 200822172 moving in the direction in which the substrate moves, the nozzle portion is advanced and continuously moved relative to the substrate, whereby the substrate is formed at equal intervals in a direction perpendicular to the moving direction And a pattern formed by the plurality of pattern elements in a line shape; and d) in parallel with the step a), the arrangement of the irradiation light in the substantially entire illumination area of the substrate and the pattern forming material is set to be perpendicular to In the plurality of parts (4) of the moving direction, the illuminance, the illuminance distribution, or the irradiation range of the above-mentioned moving light on the pattern forming material is irregular . 8. The pattern forming method of claim 7, wherein the transmittance distribution of the mask disposed on the optical path between the upper light irradiation portion and the substrate is irregularly changed in the step d) . 9. The pattern forming method according to claim 8, wherein the mask is moved parallel to the substrate, thereby changing a transmittance distribution of the mask on the optical path. The pattern forming method according to claim 7, wherein the irradiation region of the irradiation light from the light irradiation portion on the substrate is linear and traverses the pattern forming material; in the step d) In the moving direction, the irradiation region moves irregularly with respect to a plurality of irregularities, or the irradiation region is irregularly minutely rotated about a rotation axis parallel to a normal direction of the substrate. 11: The method for forming a pattern according to the seventh aspect of the invention, wherein the 312XP/invention specification (supplement)/96-12/96131624 39 200822172 in the above step d), the light irradiation portion is in the normal direction of the substrate Move irregularly. The method for forming a pattern according to any one of claims 7 to 3, wherein, in the step d), the fluctuation range of the illuminance of the illumination light that changes irregularly is the space of the illumination area The average value of the time illuminance is 2% or more and 10% or less. 40 312XP/Invention Manual (supplement)/96-12/96131624
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