200826815 九、發明說明： .【發明所屬之技術領域】 本發明涉及-種散熱裝置，特別係一種具有導流結構 之散熱裝置。 【先前技術】 、P迎者電子產業之迅速發展，如電腦中電子元件之運算 速度大幅度提高’其產生之熱量也隨之劇增，如何將電子 rit熱量f發出去，以保證其正常運行，—直係業者必 係雷腦^^ 丄 *裝在主機板上之中央處理器 糸、洗之核心，當電腦運行時，中央處理器產生埶量。 =熱量會導致中央處理器無法正常運行。為有效散發 中央處理器在運行過程中產生之熱量’通常在電路板上加 裝一與中央處理器接觸之散埶 發出去。 成…褒置以便將其產生之熱量散 1高散熱效率以滿足越來越高之散熱需求，目前很 二了熱管’並在該散熱裝置之-側加裝-風扇 力口快工氣^動。該散熱裝置通常包括-基座、複數平行 基座並間隔排列之散熱續 管及安裝於散_片-二連戶接t散熱歸片之u形熱 座上之水準W \ 風扇。前形熱管包括焊接在基 戶； 分別穿過散熱鰭片兩端之登直部。該風 =熱管安裝，其產生之強制氣流 I 士該等U形熱管將基座上之熱量傳導到散熱心:靠 200826815 向兩卩分’使散熱鰭片與熱管接觸處及其附近區域溫度 ，較问，如果對該集熱區域加快熱量之散發，將使該散熱裝 -置之散熱效率能得到相應之提高。 【發明内容】 有雲於此’有必要提供一種有效利用風扇氣流之散熱 裝置。 一種散熱裝置，包括一基座、至少一熱管以及複數散 ”、、〜片’該至少一熱管具有與該基座相連之吸熱部和穿設 於該散熱鰭片中之放熱部；該散熱鰭片間隔排列，且每相 鄰之兩散熱鰭片間形成供氣流通過之流道，該流道中設置 有導流結構，以將從流道入口流入之氣流導向該熱管之放 熱部與散熱鰭片之結合處。 本發明之散熱裝置之散熱鰭片上設置有導流結構，以 改變進入流道之氣流方向，以根據散熱鰭片各處之溫度高 低不同’重新分佈氣流，以使散熱鰭片與熱管結合之高溫 區域具有大量之氣流，針對性加快高熱區之散熱。 【實施方式】 圖1和圖2所示為本發明第一實施之散熱裝置，該散熱 裝置包括一散熱器10和一風扇20。該風扇20通過一對固定 於散熱器10兩側之風扇固定架30安裝於散熱器10前側。 該散熱器10包括一基座12，一第二散熱鰭片組16，一 導風架17，一第一散熱鰭片組18及用以將基座12和第一散 熱鰭片組18導熱連接之三熱管14。 7 200826815 * 該基座12具有一矩形本體120，該本體120頂面上開設 ，三相互平行之凹槽122，且三凹槽122中有兩相鄰之凹槽122 較另一凹槽122之兩端向内凹陷一些。該基座12之四角各連 接一凸耳124。該凸耳124靠近末端穿設緊固件50，用以將 散熱器10固定到中央處理器（圖未示）上。 每一熱管14均呈U形設置，並包括一吸熱部140及從吸 熱部140兩端向上延伸之二平行放熱部142，該吸熱部140收 容於基座12之凹槽124内以吸收來自基座12之熱量。如圖2 所示，三熱管14中最左邊之熱管14下端部分朝一側小角度 彎折，中間之熱管14下端部分朝一側更小角度彎折，最右 邊之熱管14則在同一平面上並無彎折。這兩下端部有彎折 之熱管14之吸熱部140容置在兩端有凹陷之凹槽122内。 該第二散熱鰭片組16可由鋁等材料一體彎折成型，該 第二散熱鰭片組16包括複數散熱片160、將散熱片160連接 之上摺邊162和下摺邊164。所有上、下摺邊162、164分別 形成上下平面，其中下摺邊164形成之下平面焊接在熱管16 吸熱部160之頂面上，這樣熱管16之部分熱量就可以傳導到 第二散熱鰭片組16上，由第二散熱鰭片組16散發到周圍之 環境中。 該導風架17夾置在第二散熱鰭片組16及第一散熱鰭片 組18之間，該導風架17可以用作導流罩，將由風扇20產生 之部分穿過第二散熱鰭片組16後之氣流導向位於中央處理 器周圍之電子元件（圖未示）上。該導風架17具有與第二 散熱鰭片組16之散熱片160垂直之一本體170,該本體170與 8 200826815 基座12相隔設置，本體17〇尾部邊緣彎折延伸出一向下彎汫 -並朝向基座12呈弧形彎曲之導風部172 ;本體170兩侧邊緣 各彎折延伸出一與本體170垂直之擋風板174。該本體17〇么 兩端開設有兩排相互平行之透孔176，每排有三個透扎 176,以供三熱管14之放熱部142從中穿過。 該第一散熱鰭片組18由複數相互扣合之散熱鰭片 堆疊排列而成，每一散熱鰭片188都與基座12保持平行，多 每兩相鄰散熱鰭片18〇之間形成沿前後方向延伸之抓= 188。該散熱鰭片之中央位置設置有一導流結構，在你 實施例中該導流結構為一楔形通孔182及沿其邊緣垂直二 折延伸之導流侧壁1820 ’該楔形通孔182之夹端正對風羽 20，即該炎端兩側之導流侧壁1820相對風扇2〇之氣流方向 傾斜；該兩側導流側壁1820靠近流道氣流入口之兩端部二 之距離小於該導流側壁1820遠離流道入口之兩端部間 離，該導流側壁1820之高度等於其所在流屋180對應之兩相 鄰散熱籍片⑽之距離，且該導流側璧1820:”2:產2 氣流有導流作用。散熱縛片18(3兩端上各設 穿1 184,該穿孔184用以收容熱管14之放熱部142 ’該穿孔18 邊緣延伸設有環壁卿，以增大第一散熱‘€片與放熱部 142接觸表面積，該等熱管14放熱部14G容置在所有散熱縛 片180之穿孔184和環壁1840組成之通道中’將基座12之熱 量傳導到散㈣片1獅端。該散熱1*片組1㈣相對側面上 各形成有一卡槽186,風扇固定架30卡制在卡槽186中，風 扇20通過_ (未標號）與風扇固定架3G連接從而實現與 9 200826815 第一散熱鰭片組18結合。 ^ 在該散熱器10工作時，安裝於第一散熱鰭片組18前侧 ，之風扇20運轉產生之氣流從中部進入流道188後將與位於 流道中部之導流側壁1820相遇，本來垂直風扇20扇葉面產 生之平行氣流撞擊在楔形通孔182之兩導流側壁1820上 後，氣流方向改變，被導向散熱鰭片180兩側與熱管14放熱 部142之結合處。這樣風扇20產生之氣流就可以更多地流經 第一散熱鰭片18與熱管14結合之溫度較高區域，從而使風 扇20產生之強制氣流得到有效之利用，極大地提高散熱器 10之整體散熱效率。 如圖4所示，在第二實施例中散熱鰭片190中部設置之 導流結構為一向下衝壓形成之楔形凸部192，該凸部192包 括一垂直散熱鰭片190之導流側壁1920及與散熱鰭片190平 行之楔形頂壁1922;如圖5所示，在第三實施例中散熱鰭片 150中部之導流結構為二相互成八字之直線形條孔152，該 二條孔152相鄰之内側分別向下彎折延伸一摺邊1520。上述 第二實施例之楔形凸部192尖端兩側之導流側壁1920或第 三實施例中之摺邊1520均和第一實施例一樣相對該風扇20 之氣流方向傾斜；每一該側壁1920或摺邊1520靠近流道氣 流入口之兩端部間之距離小於該側壁1920或摺邊1520遠離 流道入口之兩端部間之距離，它們之功效原理也均與第一 實施例之導流結構相同。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 200826815 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明第一實施例中散熱裝置之組裝圖。 圖2係圖1中之立體分解圖。 圖3係圖2中散熱片之放大圖。 圖4係本發明第二實施例中之散熱片之立體圖。 圖5係本發明第三實施例中之散熱片之立體圖。 【主要元件符號說明】 散熱器 10 基座 12 本體 120 凹槽 122 凸耳 124 熱管 14 吸熱部 140 放熱部 142 直線形條孔 152 摺邊 1520 第二散熱鰭片組 16 散熱片 160 上摺邊 162 下摺邊 164 導風架 17 本體 170 導風部 172 撞風板 174 透孔 176 第一散熱鰭片組 18 散熱籍片 150、180、 190 楔形通孔 182 導流側壁 1820 、 1920 穿孔 184 11 200826815 環壁 流道 楔形頂壁 風扇固定架 1840 卡槽 186 188 楔形凸部 192 1922 風扇 20 30 緊固件 50 12200826815 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device having a diversion structure. [Prior technology], P welcomes the rapid development of the electronics industry, such as the computer's electronic components in the speed of the operation is greatly improved 'the heat generated by it has also increased dramatically, how to send the electronic rit heat f to ensure its normal operation - Direct industry is the Thunderbolt ^^ 丄 * installed on the motherboard of the central processor 糸, wash the core, when the computer is running, the central processor produces 埶. = Heat can cause the CPU to not function properly. In order to effectively dissipate the heat generated by the central processing unit during operation, a dissipating contact with the central processing unit is usually added to the circuit board. In order to dissipate the heat generated by it to a high heat dissipation efficiency to meet the increasing heat dissipation demand, currently the heat pipe is installed and installed on the side of the heat sink - the fan force is fast . The heat dissipating device generally comprises a base, a plurality of parallel pedestals, and a heat dissipating tube arranged at intervals, and a level W\fan mounted on the u-shaped hot seat of the scatter-slice-two-connected heat sink. The front heat pipe includes a straight portion that is welded to the base; respectively, passing through the ends of the heat sink fin. The wind = heat pipe installation, the forced air flow generated by the U-shaped heat pipe to conduct the heat on the pedestal to the heat-dissipating core: by the 200826815 two-points 'to make the heat-dissipating fins and the heat pipe contact and the temperature of the vicinity thereof, More importantly, if the heat collection area is accelerated to dissipate heat, the heat dissipation efficiency of the heat dissipation device can be correspondingly improved. SUMMARY OF THE INVENTION There is a need for a heat sink that effectively utilizes fan airflow. A heat dissipating device includes a base, at least one heat pipe, and a plurality of heat pipes, wherein the at least one heat pipe has a heat absorption portion connected to the base and a heat radiation portion disposed in the heat dissipation fin; the heat dissipation fin The spacers are arranged at intervals, and a flow channel for airflow is formed between each adjacent two heat dissipation fins, and a flow guiding structure is disposed in the flow channel to guide the airflow flowing from the inlet of the flow channel to the heat radiation portion and the heat dissipation fin of the heat pipe. The heat dissipating fin of the heat dissipating device of the present invention is provided with a diversion structure to change the direction of the airflow entering the flow channel, so as to redistribute the airflow according to the temperature of the heat dissipating fins, so that the heat dissipating fins and The heat pipe combined with the high temperature region has a large amount of airflow, and specifically accelerates the heat dissipation in the high heat region. [Embodiment] FIG. 1 and FIG. 2 show a heat dissipation device according to a first embodiment of the present invention, the heat dissipation device including a heat sink 10 and a fan. The fan 20 is mounted on the front side of the heat sink 10 by a pair of fan holders 30 fixed to the sides of the heat sink 10. The heat sink 10 includes a base 12 and a second heat sink fin set 16 An air guide frame 17, a first heat dissipation fin set 18 and three heat pipes 14 for thermally connecting the base 12 and the first heat dissipation fin group 18. 7 200826815 * The base 12 has a rectangular body 120, The top surface of the body 120 is provided with three mutually parallel grooves 122, and two adjacent grooves 122 of the three grooves 122 are recessed inwardly from opposite ends of the other groove 122. The four corners of the base 12 are respectively A lug 124 is attached. The lug 124 is disposed near the end of the fastener 50 for fixing the heat sink 10 to a central processing unit (not shown). Each heat pipe 14 is U-shaped and includes a heat absorption. The portion 140 and the two parallel heat releasing portions 142 extending upward from both ends of the heat absorbing portion 140 are received in the recess 124 of the susceptor 12 to absorb heat from the susceptor 12. As shown in FIG. 2, the three heat pipes 14 The lower end portion of the leftmost heat pipe 14 is bent at a small angle toward one side, the lower end portion of the heat pipe 14 is bent at a smaller angle toward one side, and the rightmost heat pipe 14 is not bent at the same plane. The heat absorbing portion 140 of the folded heat pipe 14 is received in the recess 122 having a recess at both ends. The fin group 16 may be integrally bent and formed of aluminum or the like. The second heat sink fin group 16 includes a plurality of heat sinks 160, and the heat sink 160 is connected to the upper flange 162 and the lower flange 164. All the upper and lower flanges 162. And 164 respectively form upper and lower planes, wherein the lower folded edge 164 forms a lower plane welded on the top surface of the heat absorbing portion 160 of the heat pipe 16, so that part of the heat of the heat pipe 16 can be conducted to the second heat radiating fin group 16, by the second The heat dissipation fin group 16 is radiated into the surrounding environment. The air guide frame 17 is interposed between the second heat dissipation fin group 16 and the first heat radiation fin group 18, and the air guiding frame 17 can be used as a shroud. The airflow passing through the second heat sink fin group 16 generated by the fan 20 is directed to electronic components (not shown) located around the central processing unit. The air guiding frame 17 has a body 170 perpendicular to the heat sink 160 of the second heat dissipation fin group 16, and the body 170 is disposed apart from the base 12 of the 200826815 body. The tail edge of the body 17 is bent to extend downwardly. And the air guiding portion 172 is curved toward the base 12; the two sides of the body 170 are bent to extend a wind deflector 174 perpendicular to the body 170. The main body 17 has two rows of mutually parallel through holes 176 at two ends, and three rows 176 are arranged in each row for the heat radiating portion 142 of the three heat pipes 14 to pass therethrough. The first heat-dissipating fin group 18 is formed by stacking a plurality of heat-dissipating fins that are mutually fastened, and each of the heat-dissipating fins 188 is parallel to the susceptor 12, and an edge is formed between each of the two adjacent heat-dissipating fins 18 Stretching in the front and rear direction = 188. A guiding structure is disposed at a central position of the heat dissipating fin. In the embodiment, the guiding structure is a wedge-shaped through hole 182 and a guiding sidewall 1820 extending perpendicularly along the edge thereof. The wedge-shaped through hole 182 is clamped. The wind plume 20, that is, the flow guiding sidewalls 1820 on both sides of the inflammatory end are inclined with respect to the airflow direction of the fan 2〇; the distance between the two side guiding sidewalls 1820 adjacent to the two ends of the flow channel inlet is smaller than the diversion The side wall 1820 is away from the two ends of the flow path inlet. The height of the flow guiding side wall 1820 is equal to the distance between two adjacent heat radiating pieces (10) corresponding to the flow house 180, and the guiding side is 1820: "2: 2 The airflow has a diversion function. The heat dissipation tabs 18 (3 are respectively provided on the two ends of the 184, the perforations 184 are used for accommodating the heat radiating portion 142 of the heat pipe 14), and the edge of the perforation 18 is extended with a ring wall to increase the number A heat dissipating sheet contacts the surface area of the heat radiating portion 142, and the heat radiating portion 14G is accommodated in the passage formed by the perforations 184 and the ring wall 1840 of all the heat dissipating tabs 180 to conduct the heat of the susceptor 12 to the dispersing (four) sheet. 1 lion end. The heat dissipation 1* chip set 1 (four) has a card slot 186 formed on each of the opposite sides. The fan holder 30 is locked in the card slot 186, and the fan 20 is connected to the fan holder 3G through _ (not labeled) to achieve the combination with the 9 200826815 first heat sink fin group 18. ^ When the heat sink 10 is in operation, the installation On the front side of the first heat dissipation fin group 18, the airflow generated by the operation of the fan 20 will enter the flow channel 188 from the middle portion and will meet the flow guiding sidewall 1820 located in the middle of the flow channel, and the parallel airflow generated by the fan blade surface of the vertical fan 20 will be struck. After the two flow guiding sidewalls 1820 of the wedge-shaped through holes 182, the airflow direction is changed, and is guided to the junction of the heat radiating fins 180 on both sides of the heat radiating fins 142. Thus, the airflow generated by the fan 20 can flow more through the first portion. A heat sink fin 18 is combined with the heat pipe 14 at a relatively high temperature region, so that the forced airflow generated by the fan 20 is effectively utilized, thereby greatly improving the overall heat dissipation efficiency of the heat sink 10. As shown in Fig. 4, in the second embodiment The guiding structure disposed in the middle of the middle heat dissipating fin 190 is a downwardly stamped wedge-shaped convex portion 192. The convex portion 192 includes a guiding sidewall 1920 of a vertical heat dissipating fin 190 and a wedge-shaped top wall 19 parallel to the heat dissipating fin 190. 22, as shown in FIG. 5, in the third embodiment, the flow guiding structure in the middle of the heat dissipating fins 150 is two straight strip holes 152 which are formed in a splayed shape, and the inner sides of the two holes 152 are respectively bent downward and extended. Folding edge 1520. The flow guiding side wall 1920 on both sides of the tip end of the wedge-shaped convex portion 192 of the second embodiment or the flange 1520 in the third embodiment are inclined with respect to the air flow direction of the fan 20 as in the first embodiment; The distance between the two ends of the side wall 1920 or the flange 1520 near the inlet of the flow channel is smaller than the distance between the ends of the side wall 1920 or the flange 1520 away from the entrance of the flow channel, and the principle of operation thereof is also the same as that of the first embodiment. The flow guiding structure is the same. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention in the spirit of the present invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an assembled view of a heat dissipating device in a first embodiment of the present invention. Figure 2 is an exploded perspective view of Figure 1. Figure 3 is an enlarged view of the heat sink of Figure 2. Figure 4 is a perspective view of a heat sink in a second embodiment of the present invention. Figure 5 is a perspective view of a heat sink in a third embodiment of the present invention. [Main component symbol description] Heat sink 10 Base 12 Body 120 Groove 122 Lug 124 Heat pipe 14 Heat absorbing part 140 Heat releasing part 142 Straight hole 152 Folding 1520 Second heat sink fin group 16 Heat sink 160 Upper flange 162 Bottom Folding 164 Wind Guide Rack 17 Body 170 Air Guide 172 Bellows 174 Through Hole 176 First Heat Sink Set 18 Heat Dissipating Film 150, 180, 190 Wedge Through Hole 182 Diversion Side Wall 1820, 1920 Perforation 184 11 200826815 Ring wall flow channel wedge top wall fan holder 1840 card slot 186 188 wedge protrusion 192 1922 fan 20 30 fastener 50 12