CN100470777C - heat sink - Google Patents

Abstract

The heat dissipation device of the present invention comprises a bottom plate, which is in contact with an electronic component; a plurality of heat dissipation fins placed on the bottom plate, and a plurality of passages are formed between the heat dissipation fins; A mounting plate and a side plate placed on one side of the cooling fin; a fan installed on the side plate of the wind guide; The baffle wall extending downward and the first and second windshields extending downward from the two adjacent edges of the mounting plate, the baffle wall and the heat dissipation fins are spaced apart, the mounting plate and the top plate are spaced apart, the The first and second windshields are close to the top plate on the top of the heat dissipation fins, and the opposite sides of the first windshield are respectively connected to the second windshield and the wall, wherein a part of the fan faces the heat dissipation fins The other part of the channel extends beyond the heat dissipation fins and faces the area defined by the top plate on the top of the heat dissipation fins and the first and second windshields.

Description

heat sink

【Technical field】

The invention relates to a heat dissipation device, in particular to a heat dissipation device with a wind guide cover.

【Background technique】

With the rapid development of the electronic industry, the computing speed of the electronic components in the computer has been greatly increased, and the heat generated by it has also increased sharply. How to dissipate the heat of the electronic components to ensure their normal operation has always been a must for the industry. The problem. As we all know, the central processing unit installed on the motherboard is the core of the computer system. When the computer is running, the central processing unit generates heat. Excessive heat can prevent the CPU from functioning properly. In order to effectively dissipate the heat generated by the CPU during operation, a cooling device is usually installed on the CPU of the circuit board to dissipate the generated heat.

There are many transistors around the central processing unit on the computer motherboard. These transistors can supply power to the central processing unit. When the computer is running, these transistors will also generate a lot of heat. The transistors transfer the heat to the main board, causing the main board to The temperature rises, which in turn affects the service life of the motherboard.

In the prior art, a fan is usually installed on the cooling device, and the airflow generated by the fan flows through the radiator, thereby improving the cooling efficiency. For example, US Publication No. 20030137807A1 and US Publication No. 6832410B2 respectively disclose a heat dissipation device. The difference between the two lies in the relative positional relationship between the radiator and the fan in the heat dissipation device. The fan disclosed in US Publication No. 20030137807A1 is placed above the radiator, while the fan disclosed in US Publication No. 6832410B2 is placed on the side of the radiator.

However, regardless of the position of the fan disclosed in the two patents, since the airflow generated by the fan cannot blow to the transistors around the central processing unit, the heat dissipation devices cannot dissipate the heat generated by the transistors.

Therefore, it is necessary to design a new heat dissipation device, which can not only dissipate the heat generated by the central processing unit, but also dissipate heat from other electronic components around it.

【Content of invention】

The present invention is illustrated by the following examples.

An embodiment of the heat dissipation device of the present invention includes a bottom plate, which is in contact with an electronic component; a plurality of heat dissipation fins placed on the bottom plate, and a plurality of channels are formed between the above heat dissipation fins; A mounting plate on the top of the fin and a side plate placed on one side of the heat dissipation fin; a fan installed on the side plate of the air guide cover; a top plate is arranged on the top of the heat dissipation fin, against the heat dissipation fin, The wind guide cover also includes a baffle wall extending downward from one side of the mounting plate and first and second wind baffles extending downward from two adjacent edges of the mounting plate, the baffle wall and the heat dissipation fins The fins are arranged at intervals, the mounting plate and the top plate are arranged at intervals, the first and second windshields are close to the top plate on the top of the heat dissipation fins to prevent the airflow generated by the fan from flowing through the top of the heat dissipation fins, the One side of the first windshield is connected to the second windshield, and its opposite side is connected to one side of the baffle wall, wherein a part of the fan is facing the channel of the cooling fin, and the other part The area defined by the top plate extending beyond the cooling fins and facing the top of the cooling fins and the first and second windshields.

In the present invention, due to the cooperation between the first and second windshields and the top plate, the airflow at the top of the heat dissipation fins is guided to between the heat dissipation fins and the retaining wall, which reduces the loss of airflow and strengthens the connection between the retaining wall and the heat dissipation fins. The airflow intensity in the spaced area effectively de-cools the electronic components around the cooling fins.

The present invention will be further described below with reference to the accompanying drawings and embodiments.

【Description of drawings】

FIG. 1 is a partially exploded perspective view of the first embodiment of the heat sink of the present invention.

Fig. 2 is a perspective enlarged view of another angle of the air guide cover in Fig. 1 .

FIG. 3 is an assembly view of FIG. 1 .

Fig. 4 is an assembly view from another angle of Fig. 1 .

Fig. 5 is an enlarged and partial cross-sectional view of the wind guide cover in the second embodiment of the present invention.

【Detailed ways】

Please refer to FIG. 1 . FIG. 1 shows a heat dissipation device 8 according to a first embodiment of the present invention. The heat dissipation device 8 includes a radiator 7 , a fan 6 and an air guide cover 5 . The heat sink 7 is installed on a circuit board 4 , and the heat sink 7 includes a bottom plate 70 , a top plate 74 parallel to the bottom plate, and a plurality of cooling fins 72 disposed between the bottom plate 70 and the top plate 74 . Four lugs 702 extend outward from the four corners of the bottom plate 70 . The four fasteners 3 pass through the corresponding lugs 702 and are screwed together with the backboard (not shown) placed on the back of the circuit board 4, so that the bottom board 70 and the central processing unit (not shown) installed on the circuit board 4 are thermally engaged. join. A pair of screw holes 740 are defined on the top plate 74 . A pair of parallel heat pipes 76 are installed in the radiator 7 . Each heat pipe 76 is substantially U-shaped and includes a heat absorbing portion 760 , a heat releasing portion 762 parallel to the heat absorbing portion 760 , and a connecting portion 750 vertically connecting the heat absorbing portion 760 and the heat releasing portion 762 (see FIG. 4 ). The heat absorbing portion 760 is accommodated between the bottom plate 70 and the bottom 720 of the cooling fins, so that the heat absorbing portion 760 is thermally connected to the base plate 70 , and the heat absorbed by the base plate 70 can be quickly transferred to the heat absorbing portion 760 . The heat releasing portion 762 is accommodated between the top plate 74 and the tops 722 of the cooling fins, so that the heat absorbed by the heat absorbing portion 760 can be quickly transferred to the tops 722 of the cooling fins 72 through the heat releasing portion 762 . The fan 6 is placed on the bottom plate 70 and faces the front side of the heat dissipation fins 72 so as to blow the airflow generated by the fan 6 into the passage 724 between the heat dissipation fins 72 . The channel 724 extends from the front to the back of the cooling fins 72 . The width L of the cooling fins 72 is smaller than the width of the fan 6 . The fan 6 is arranged in a square shape, which includes a top 60 and four corners 62 . Wherein, the top 60 is higher than the top of the top plate 74 . Each corner 62 defines a hole 620 .

Please also refer to FIG. 2 , the air guide cover 5 of the first embodiment of the present invention is formed by stamping and bending a metal sheet integrally. The wind deflector 5 includes a mounting plate 50 and a side plate 52 vertically extending from the mounting plate 50 . A tongue 54 extends horizontally from the center of the front side 500 of the mounting plate 50 . The mounting plate 50 defines a pair of positioning holes 540 corresponding to the screw holes 740 . A pair of support columns 56 are disposed on the bottom surface of the mounting plate 50 , and each support column 56 is substantially cylindrical. Adjacent first and second windshields 502 , 504 are vertically extended from two adjacent edges of the mounting plate 50 . Wherein the first windshield 502 is located on the rear side of the installation plate 50 . Adjacent first and second blocking walls 506 , 508 are vertically extended from the other edge of the mounting plate 50 , and the first and second blocking walls 506 , 508 are opposite to the second windshield 504 . The first and second blocking walls 506, 508 are placed adjacent to the connecting portion 750 of the heat pipe 76 (see FIG. 4 ), and an included angle is formed between the first blocking wall 506 and the second blocking wall 508 to prevent conduction. The wind shield 5 interferes with the connecting portion 750 of the heat pipe 76 . The side plate 52 includes an installation surface 520 , the installation surface 520 is provided with an installation hole 521 corresponding to the hole 620 of the fan 6 , and the installation surface 520 is parallel to the first windshield 502 . The side panel 52 defines an opening 522 . A pair of protruding ribs 524 are vertically extended from the sides of the opening 522 on the side panel 52 . The fan 6 is installed on the installation surface 520 by passing a screw (not shown) through the hole 620 of the fan 6 and screwing it into the installation hole 521 of the side plate 52 . The fan 6 is placed between the convex ribs 524 , and the airflow generated by the fan 6 blows to the radiator 7 through the opening 522 .

1 and 3-4, by extending the two screws 82 through the two positioning holes 540 of the mounting plate 50 and screwing them with the two screw holes 740 of the top plate 74, the air guide cover 5 is fixed to the radiator 7 superior. The support column 56 supports the wind deflector 5 on the top plate 74 , which is equivalent to a partition placed between the installation plate 50 and the top plate 74 so as to form a gap therebetween. Mounting plate 50 tongue piece 54 is placed on the top 60 of fan 6, and first and second windshield 502,504 is placed on top plate 74 and is used to prevent the airflow that fan 6 produces from flowing out from the top of radiator 7, and first baffle wall 506, the second retaining wall 508 and the cooling fins 72 close to the connection portion 750 of the heat pipe 76 form an air outlet 524. Since the width L of the cooling fins 72 is smaller than the width of the fan 6, part of the airflow generated by the fan 6 can bypass the cooling fins The sheet 72 is directly blown to transistors (not shown) around the central processing unit through the air outlet 524 .

Please refer to FIG. 5 . FIG. 5 shows the wind deflector in the second embodiment of the present invention, the wind deflector in the second embodiment is similar to the wind deflector in the first embodiment. The difference lies in that the support column 56' in the second embodiment replaces the support column 56 in the first embodiment, and the positioning hole 540' in the second embodiment replaces the positioning hole 540 in the first embodiment. Wherein, each support column 56' is substantially conical. Each positioning hole 540' is also substantially conical, and the positioning hole 540' is located in the center of the support column 56' and passes through the bottom wall of the support column 56'.

When the fan 6 is running, a part of the airflow generated is blown to the cooling fins 72 through the opening 522, and the airflow through the cooling fins 72 brings the heat generated by the central processing unit into the surrounding air. The cooling fins 72 absorb the heat generated by the central processing unit, and the heat generated by the central processing unit is quickly dissipated. Another part of the airflow generated by the fan 6 flows through the opening 522 and the air outlet 524 and blows directly to the transistors around the central processing unit. Since the air guide cover 5 is provided with the first and second windshields 502, 504 and the first and second baffles 506, 508, the airflow generated by the fan 6 will not be distributed around, so that the central processing unit and the The heat generated by the surrounding transistors is rapidly dissipated by the heat sink 8 at the same time, thereby improving the heat dissipation efficiency of the entire heat sink 8 .

When dismounting the wind guide cover 5 from the radiator 7, the screws 82 are removed from the top plate 74 and the mounting plate 50. The air guide cover 5 with fan 6 is just dismounted from radiator 7 .

The function of the air guide cover 5 of the present invention is not only to guide the airflow generated by the fan 6 to blow to the cooling fins 72 and transistors but also to install the fan 6 on the radiator 7 .

Claims (8)

1. A heat dissipation device, comprising a base plate, which is in contact with an electronic component; a plurality of cooling fins placed on the base plate, and a plurality of passages are formed between the above-mentioned cooling fins; A mounting plate on the top and a side plate placed on one side of the heat dissipation fin; a fan installed on the side plate of the air guide cover; it is characterized in that: a top plate is arranged on the top of the heat dissipation fin, against the heat dissipation The above-mentioned wind guide cover also includes a baffle wall extending downward from one side of the mounting plate and first and second wind baffles extending downward from two adjacent edges of the mounting plate, the baffle wall and the The heat dissipation fins are arranged at intervals, the mounting plate and the top plate are arranged at intervals, and the first and second windshields are close to the top plate at the top of the heat dissipation fins to prevent the airflow generated by the fan from flowing through the top of the heat dissipation fins , one side of the first windshield is connected to the second windshield, and the opposite side is connected to one side of the baffle wall, wherein a part of the fan is facing the channel of the cooling fin , the other part of which extends beyond the heat dissipation fins and faces the area defined by the top plate on the top of the heat dissipation fins and the first and second windshields. 2. The heat dissipation device according to claim 1, wherein the heat dissipation device further comprises a heat pipe, and the heat pipe includes a heat absorbing portion placed on the bottom plate, a heat dissipation portion placed between the top of the cooling fins and the top plate. part and a connecting part connecting the heat absorbing part and the heat dissipating part, and the connecting part is located between the heat dissipating fins and the retaining wall. 3. The heat dissipation device according to claim 2, wherein: the mounting plate of the above-mentioned air guide cover is provided with a support column, and the support column is pressed against the top of the cooling fin, so that the top plate at the top of the cooling fin and the mounting plate The interval is formed between them. 4. The heat dissipation device according to claim 1, characterized in that: the first windshield is parallel to the side plate, so as to prevent the airflow generated by the fan from flowing out through the top of the heat dissipation fins. 5. The heat dissipation device according to claim 2, characterized in that: the above-mentioned retaining wall is adjacent to the connecting portion of the heat pipe. 6. The heat dissipation device according to claim 5, wherein an air outlet is formed between the retaining wall and the heat dissipation fins. 7. The heat dissipation device according to claim 2, wherein the bottom plate includes four tabs, and the four buckles pass through the corresponding tabs. 8. The heat dissipation device according to claim 2, wherein a tongue is horizontally extended on one side of the mounting plate, and the tongue is placed on the top of the fan.

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