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TW200810838A - Apparatus for treating substrates - Google Patents

Apparatus for treating substrates Download PDF

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Publication number
TW200810838A
TW200810838A TW096124718A TW96124718A TW200810838A TW 200810838 A TW200810838 A TW 200810838A TW 096124718 A TW096124718 A TW 096124718A TW 96124718 A TW96124718 A TW 96124718A TW 200810838 A TW200810838 A TW 200810838A
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TW
Taiwan
Prior art keywords
liquid
liquid storage
substrate
auxiliary
outflow
Prior art date
Application number
TW096124718A
Other languages
Chinese (zh)
Other versions
TWI400131B (en
Inventor
Yuichi Imaoka
Yukinobu Nishibe
Original Assignee
Shibaura Mechatronics Corp
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Publication of TW200810838A publication Critical patent/TW200810838A/en
Application granted granted Critical
Publication of TWI400131B publication Critical patent/TWI400131B/en

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Classifications

    • H10P90/00
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60Substrates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H10P52/00
    • H10P76/2041

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Coating Apparatus (AREA)

Abstract

This invention is to provide a treating apparatus capable of providing bubble-free treating liquid to the substrates. The treating apparatus utilizes the treating liquid provided by the treating liquid providing apparatus to treat the surface of the conveyed substrates, and the aforementioned treating liquid providing apparatus comprises: main liquid storage part, connected with liquid providing pipes for providing treating liquid; outflowing holes, provided at the lower end of the main liquid storage part to enable the treating liquid provided by the liquid providing pipes and stored in the main liquid storage part to flow out; auxiliary liquid storage part, used for storing the treating liquid flowing out from the outflowing holes; a slit, provided at the auxiliary liquid storage part and providing the treating liquid flowing from the outflowing holes to the auxiliary liquid storage part onto the substrates; and first air discharging pipes, provided at the auxiliary liquid storage part and communicated with the atmosphere to discharge the air bubble flowing out together with the treating liquid from the outflowing holes to the atmosphere.

Description

200810838 九、發明說明: 【發明所屬之技術領域j 技術領域 本發明係有關於一種沿著與基板之運送方向交又<方 向供給處理液至前述基板上面以進行處理的基板處壯 置。 【先前技術3 背景技術。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 [Prior Art 3 Background]

例如,在液晶顯示裝置之製造製程中,具有將電路。 10案形成於玻璃製基板之製程。當將電路圖案形成於義才 時’係藉由將抗#劑塗布於業已成膜之基板,再進行曝 並在曝光後利用顯像液進行顯像處理,再以钱刻液進^ 刻處理,而於基板表面精密地形成電路圖案。 當基板業已形成電路圖案時,便利用剝離液除去霉占著 15殘留於前述基板表面之抗姓劑膜或抗餘劑殘潰等有機物 當業已利用剝離液除去有機物時,便利用洗淨液洗淨處理 前述基板之板面,再交接至下一個製程。 當利用顯像液、蚀刻液、制離液及洗淨液等處理液處 理基板時,係一面以運送裝置朝預定方向運送前述基板, -面朝與基板之運送方向交又的方向直線狀的供給二述處 理液,以處理前述基板之上面。專散獻丨顯示有將處理液 供給至所運送之基板的噴嘴體。 專利文獻1所示之噴嘴體的下面形成有多數吐出口,且 该等吐出口係沿著長度方向形成並隔有預定間隔者。又, 5 200810838 韵述噴嘴體包含有:儲存所供給之處理液的存液室;及一 端與前述吐出口連通,而另一端與前述存液室連通,並使 諸存於存液室之處理液流通至吐出口並吐出之處理液吐出 流路0For example, in the manufacturing process of a liquid crystal display device, there is a circuit. The case of 10 is formed on a glass substrate. When the circuit pattern is formed on the genius, the coating is applied to the substrate which has been formed into a film, and then exposed and exposed to the developing solution after the exposure, and then processed by the engraving liquid. And a circuit pattern is precisely formed on the surface of the substrate. When the circuit board has formed a circuit pattern, it is convenient to remove the mold by the stripping solution, and the organic substance such as the anti-surname film or the anti-residue residue remaining on the surface of the substrate is convenient to be washed with the washing liquid when the organic substance is removed by the stripping liquid. The surface of the substrate is cleaned and transferred to the next process. When the substrate is treated with a processing liquid such as a developing solution, an etching solution, a chaotropic solution, or a cleaning solution, the substrate is transported in a predetermined direction by a transport device, and the surface is linearly oriented in a direction perpendicular to the transport direction of the substrate. The treatment liquid described above is supplied to treat the upper surface of the substrate. The detachment shows a nozzle body that supplies the treatment liquid to the substrate to be transported. In the lower surface of the nozzle body shown in Patent Document 1, a plurality of discharge ports are formed, and the discharge ports are formed along the longitudinal direction with a predetermined interval therebetween. Further, 5 200810838 The rhyme nozzle body includes: a liquid storage chamber for storing the supplied processing liquid; and one end communicating with the discharge port, and the other end communicating with the liquid storage chamber, and storing the remaining in the liquid storage chamber The liquid that has passed through the discharge port and spit out is discharged from the flow path.

2〇 此外,具有前述結構之噴嘴體係以長度方向沿著與前 述基板之運送方向交叉的方向配置,並配置於所運送之前 述基板之上方。藉此,當從前述吐出口流出處理液時,可 沿著與運送方向交又之方向將前述處理液直線狀的供給至 朝預疋方向運送之基板上面。 前述噴嘴體之存液室連接有供給管,而可從前述供給 管供給處理液至存液室。處理液係一面儲存於前述存液 至,一面通過處理液吐出流路並從形成於噴嘴體下面之吐 出口吐出。 Μ而,依據前述結構,當從供給管供給處理液至存液 至%,處理液會有捲入空氣的情況。當處理液捲入空氣時, 則述空氣會變成氣泡,並與供給至基板之處理液—起從吐 出口流出。 與處理液-起流出之氣泡會殘留於基板而不破裂,在 該情況下,會成為處理液無法附著於基板殘留有氣泡之部 分的狀態,或附著量較其他部分少之狀態,因此以處理液 進仃之基板處理會有產生不均_的情況。 一已有贿案係在將處理液供給至基板時除去 ==;氣泡。專利文獻2顯示有-種不讓氣泡進 供、、、口至基板之處理液的處理裝置。 6 200810838 專利文獻2所示之處理裝置具有處理液吐出噴嘴。前述 處理液吐出喷嘴之框體上面連接有送液管與排液管,且下 面形成有吐出孔。而該處理裝置係從前述送液管供給處理 液至形成於前述框體之儲液處,再從前述吐出口朝基板之 5上面供給供給至儲液處之處理液。 產生於前述儲液處的氣泡會因浮力而附著於儲液處的 頂部面°又’頂部面形成朝前述排液f高度傾斜的傾斜面。 因此,產生於前述儲液處的氣泡會與處理液一起流至前述 送液管’故可防止從前述吐出孔供給至前述基板之處理液 10 含有氣泡。 【專利文獻1】特開2003-170086號公報 【專利文獻1】特開平11_156278號公報 Γ發明内容;j 發明揭示 15 發明欲解決之課題 在專利文獻2所揭示之結構中,係如前所述使含於處理 液之氣泡黏著於形成在框體之儲液處上面,並使前述氣泡 與處理液一起從前述排液管排出。 因此,框體必須連接有排液管,並且必須透過前述排 20液I使氣’包與處理液一同從前述儲液處排出,故具有導致 結構複雜化,且需要花費許多的時間與費用於處理所排出 之處理液的問題。 本發明係提供一種可使捲入處理液之氣泡與處理液分 離並確實地排出的基板處理裝置。 200810838 解決課題_之手段 U _ — 本發明係一種基板處理裝置,係利用由處理液供給裝 • 置所供給之處理液處理所運送之基板上面者,而前述處理 液供給裝置包含有:主貯液部,係連接有用以供給前述處 ^ 5理液之供液管者;第1流出部,係設於前述主貯液部下端, 並使從前述供液管供給且貯存於前述主貯液部之前述處理 • 液流出者;辅助貯液部,係用以貯存從前述第1流出部流出 • 之前述處理液者;第2流出部,係設於前述辅助貯液部,並 將從W述第1流出部流至前述辅助貯液部之前述處理液供 10,至前述基板上面者;及第!放出部,係設於前述輔助貯液 部,且與大氣連通,並將與來自前述第丨流出部之前述處理 液一起流出的氣泡放出至大氣者。 發明效果 據本务明,即使處理液捲入氣泡,含於處理液之氣 /包曰在則述處理液從主貯液部之第1流出部流至輔助貯液 • *且,留於輔助貯液部時,因浮力而上昇,並從與大氣連 =之第1放出部放出,因此可防止從設於前述輔助貯液部之 第2流出部供给至基板之處理液含有氣泡。 【資施方式】 20實施發明之最佳型態 2下一面參照圖式一面說明本發明之實施型態。 #第1圖至第4圖係顯示本發明第1實施型態。第1圖係沿 著t里衣置之寬度方向的縱向截面圖。該處理裝置具有室 月J述至1之結構包含有:上面具有開口之本體部2;及可 8 200810838 開關前述本體部2之上面開口的蓋體部3。蓋體部3之寬度方 向的~側由鉸鏈4連結於前述本體部2,並可旋動,而其寬 度方向之另一側設有未圖示之把手。 前述室1之本體部2於底部之寬度方向的兩端部設有支 5撐構件11。一對支撐構件11上安裝有可裝卸之運送裝置 12,且該運送裝置12業已單位化。前述運送裝置12具有一 對放置於前述支撐構件11之上面的基部構件13。/對基部 構件13係由多數,例如,3根連結構件14(第1圖中只顯示1 根)所連結。 1〇 各基部構件13沿著長度方向設有支撐板15。在與一對 支撐板15對應之位置上,隔著預定間隔設有軸承16。相對 應之一對軸承16支撐有運送軸17的兩端部,並使其可自由 方疋轉。即’ 一對基部構件13於與室1之寬度方向正交的長度 方向上,隔著預定間隔設有多數運送軸17。 又’雖然未圖示,但室1之長度方向的一側壁形成有輸 入口,而另一側形成有送出口,而可從前述輸入口將用於 液阳顯不裝置之玻璃製的基板w供給至室丨内。 各運达轴17上隔著預定間隔設有多數運送滾子18。前 j連結構件14之兩端部設有引導滾子18,其係用以引導從 、'述輪人口供入且由前述運送滚子18如後述般運送之基板 見度方向的兩端部者。引導滾子19可防止由運送滾子 18所運送之基板w蛇行。 則述運送軸17細驅動機構21之驅動而旋轉。前述驅 動機構21具有驅動源22,且於前述驅動源η之輪出轴^嵌 9 200810838 合有驅動齒輪24。又,别述驅動齒輪μ與後合於安裝軸25 之從動齒輪26互相咬合。说述安裝轴25與前述運送軸17之 • 端部設有互相咬合之齒輪(圖未示)。 藉此,當前述驅動源22運作時,便會驅動前述運送轴 17方疋轉,因此可以没於别述運送軸17之運送滾子18支撑且 運送供入前述室1内之基板W。 前述室1内設有作為處理液L之供給裝置的處理液供給 _ $置3卜其係沿著與基板W之運送方向正交之寬度方向直Further, the nozzle system having the above configuration is disposed in the longitudinal direction so as to intersect the direction in which the substrate is conveyed, and is disposed above the substrate to be transported. Thereby, when the treatment liquid flows out from the discharge port, the treatment liquid can be linearly supplied to the upper surface of the substrate which is conveyed in the forward direction in the direction overlapping with the conveyance direction. A supply pipe is connected to the liquid storage chamber of the nozzle body, and the processing liquid can be supplied from the supply pipe to the liquid storage chamber. The treatment liquid is stored in the storage liquid while being discharged through the treatment liquid, and is discharged from the discharge port formed on the lower surface of the nozzle body. Further, according to the above configuration, when the treatment liquid is supplied from the supply pipe to the storage liquid to %, the treatment liquid may be caught in the air. When the treatment liquid is entrained in the air, the air becomes a bubble and flows out from the discharge port together with the treatment liquid supplied to the substrate. The bubble which flows out from the treatment liquid remains on the substrate without being broken. In this case, the treatment liquid does not adhere to the portion where the bubble remains on the substrate, or the amount of adhesion is less than that of the other portion, so that the treatment is performed. The substrate processing of the liquid inlet may cause unevenness. A bribery case is removed when the treatment liquid is supplied to the substrate. Patent Document 2 discloses a processing apparatus for preventing a bubble from being supplied to a processing liquid of a substrate to a substrate. 6 200810838 The processing apparatus shown in Patent Document 2 has a processing liquid discharge nozzle. A liquid supply pipe and a liquid discharge pipe are connected to the upper surface of the casing of the treatment liquid discharge nozzle, and a discharge hole is formed below. Further, the treatment device supplies the treatment liquid from the liquid supply tube to the liquid storage portion formed in the casing, and supplies the treatment liquid supplied to the liquid storage portion from the discharge port toward the upper surface of the substrate. The bubble generated at the liquid storage portion adheres to the top surface of the liquid storage portion due to buoyancy, and the top surface forms an inclined surface which is inclined toward the liquid discharge f. Therefore, the air bubbles generated in the liquid storage portion flow to the liquid supply pipe together with the treatment liquid, so that the treatment liquid 10 supplied from the discharge port to the substrate can be prevented from containing air bubbles. [Patent Document 1] JP-A-2003-170086 (Patent Document 1) Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The bubbles contained in the treatment liquid are adhered to the liquid storage portion formed on the frame, and the bubbles are discharged from the discharge tube together with the treatment liquid. Therefore, the casing must be connected to the liquid discharge pipe, and the gas package must be discharged from the liquid storage together with the treatment liquid through the first liquid 20, so that the structure is complicated, and it takes a lot of time and expense. Handling the problem of the discharged treatment liquid. The present invention provides a substrate processing apparatus which can separate and reliably discharge air bubbles entrained in a processing liquid from a processing liquid. 200810838 Problem Solving U _ - The present invention relates to a substrate processing apparatus which processes a substrate conveyed by a processing liquid supplied from a processing liquid supply device, and the processing liquid supply device includes a main storage The liquid portion is connected to a liquid supply pipe for supplying the liquid to the liquid; the first outflow portion is provided at a lower end of the main liquid storage portion, and is supplied from the liquid supply pipe and stored in the main storage liquid. The first processing of the unit, the liquid outflow, the auxiliary liquid storage unit for storing the treatment liquid flowing out from the first outflow portion, and the second outflow portion being provided in the auxiliary liquid storage unit and The first outflow portion flows to the processing liquid supply 10 of the auxiliary liquid storage portion to the upper surface of the substrate; and the first! The discharge portion is provided in the auxiliary liquid storage portion and communicates with the atmosphere, and discharges bubbles which flow out together with the treatment liquid from the second discharge portion to the atmosphere. According to the present invention, even if the treatment liquid is entrained in air bubbles, the gas/package contained in the treatment liquid flows from the first outflow portion of the main liquid storage portion to the auxiliary storage liquid. In the liquid storage portion, the liquid is lifted by the buoyancy and is discharged from the first discharge portion that is connected to the atmosphere. Therefore, it is possible to prevent the processing liquid supplied from the second outflow portion provided in the auxiliary liquid storage portion to the substrate from containing bubbles. [Effective Mode] 20 Best Mode for Carrying Out the Invention 2 The embodiment of the present invention will be described with reference to the drawings. #1 to 4 show the first embodiment of the present invention. Fig. 1 is a longitudinal sectional view taken along the width direction of the t-coat. The structure of the processing apparatus having the structure of the first embodiment includes: a body portion 2 having an opening thereon; and a cover portion 3 that opens and closes the upper surface of the body portion 2 in 200810838. The side of the width direction of the lid portion 3 is coupled to the main body portion 2 by a hinge 4, and is rotatable, and a handle (not shown) is provided on the other side in the width direction. The body portion 2 of the chamber 1 is provided with a support member 11 at both end portions in the width direction of the bottom portion. A detachable transport device 12 is mounted on a pair of support members 11, and the transport device 12 has been unitized. The aforementioned conveying device 12 has a pair of base members 13 placed on the upper surface of the aforementioned support member 11. The base member 13 is connected by a plurality of, for example, three connecting members 14 (only one is shown in Fig. 1). 1〇 Each base member 13 is provided with a support plate 15 along the longitudinal direction. Bearings 16 are provided at predetermined intervals corresponding to the pair of support plates 15. Correspondingly, the bearing 16 supports both ends of the transport shaft 17 and is freely rotatable. That is, the pair of base members 13 are provided with a plurality of transport shafts 17 at predetermined intervals in the longitudinal direction orthogonal to the width direction of the chamber 1. Further, although not shown, one side wall in the longitudinal direction of the chamber 1 is formed with an input port, and the other side is formed with a delivery port, and a glass substrate for the liquid positive display device can be used from the input port. Supply to the chamber. A plurality of transport rollers 18 are provided on the respective transport shafts 17 at predetermined intervals. The both ends of the front j-joining member 14 are provided with guide rollers 18 for guiding both ends of the substrate in the direction of the substrate transported from the above-mentioned transport rollers 18 as described later. . The guide roller 19 prevents the substrate w transported by the transport roller 18 from being snaked. The drive shaft 17 is driven to rotate by the drive of the thin drive mechanism 21. The driving mechanism 21 has a driving source 22, and a driving gear 24 is incorporated in the wheel-out shaft 9200810838 of the driving source η. Further, the drive gear μ and the driven gear 26 that is attached to the mounting shaft 25 are engaged with each other. The end portion of the mounting shaft 25 and the aforementioned conveying shaft 17 is provided with gears (not shown) that are engaged with each other. Thereby, when the driving source 22 is operated, the transport shaft 17 is driven to rotate, so that the substrate W fed into the chamber 1 can be supported without being supported by the transport roller 18 of the transport shaft 17. The processing liquid supply as the supply means of the processing liquid L is provided in the chamber 1 in the width direction orthogonal to the conveying direction of the substrate W.

線狀的供給顯像液、钱刻液、剝離液或洗淨液等處理液L 至由设於4述運送軸17之運送滾子18以水平狀態運送之基 板W上面。 刖述處理液供給裝置31具冑如第2圖至第4圖所示之主 貯液部32。前述主载部32係沿著前述基㈣之寬度方 15向,即,至1之寬度方向形成細長且截面呈矩形之箱型狀。 引述主貝丁液部32之寬度尺寸設定成較前述基板界之寬度尺The processing liquid L such as a linear supply developing liquid, a money engraving liquid, a peeling liquid or a cleaning liquid is supplied onto the upper surface of the substrate W which is transported in a horizontal state by the transport rollers 18 provided on the transport shaft 17 described above. The processing liquid supply device 31 has the main liquid storage portion 32 as shown in Figs. 2 to 4 . The main carrier portion 32 is formed in a box shape which is elongated and has a rectangular cross section along the width direction of the base (4), that is, in the width direction of 1. The width dimension of the main bead liquid portion 32 is set to be larger than the width of the substrate boundary

_ 寸長,且其上面隔著預定間隔連接有多數用以供給處理液L ^述主貯液部32内之供液管33的-端。各供液管33之另 端係透過未圖示之流量控制閥連接於同樣未圖示之處理 、 液L的供給源。 2〇 二 月ij述主貞了液部32内部設有大致水平之平板狀承接構件 34,且該承接構件34位於與各供液管^相對之部分之高度 向的中間邠刀。别述承接構件34可承接從前述供液管μ 供給至主貯液部32的處理液[。藉此,從供液管挪給至主 貝宁液部32之處理液!^會平穩地流入主貯液部力内,故可減少 200810838 捲入處理液1^_之氣泡。 前述主貯液部32之底部壁32&的長度方向上隔著預定 間隔鑽有多數用以形成第m出部之流出孔36。藉此,從前 述供液官33供給至前述主貯液部32之處理紅可從前述流 5出孔36流出。 又,從供液管33供給之處理液L的供給量與從流出孔36 流出之流出量係被設定的,以使從供液管33供給之處理液L φ 充滿前述主貯液部32。 1〇 從前述流出孔36流出之處理液L係貯存於輔助貯液部 邛。如第4圖所示,前述辅助貯液部38係截面形狀呈漏斗 狀,且包含有··形成一對沿著前述主貯液部32之寬度方向 ^斜之傾斜面39a、3_v字型底部壁41;直立設於前述底 P 土41之其中一傾斜面39a側的上端,且與前述主貯液部% 15之側面平行並隔著間隔相對的側部壁42,·及設於前述側部 15壁42上端,並可關閉輔助貯液部38之上面開口的上部壁43。 • 前述底部壁41之另一傾斜面39b的上端部與朝前述主 、丁液。卩32之下面開啟之流出孔%相對。前述傾斜面39b之下 端’即’底部壁41之最下端開口形成有作為第2流出部之狹 ' 縫44,且該狹縫44橫跨於長度方向之大致全長。 2〇 供給至前述主貯液部32並從前述流出孔36流至前述傾 斜面3 9 b之上端部的處理液L係沿著傾斜面3 9 b流動,並貯存 於漏斗狀的底部壁41,再從形成於前述底部壁41之狹缝44 直線狀的流出。藉此,可橫跨與朝預定方向所運送之基板 W之運送方向交叉的寬度方向全長供給處理液乙。 200810838 又,前述流出孔36與狹縫44之面積係被設定的,且從 供液管33供給至主貯液部32之處理液L的供給量亦係被控 制的,以使一定量的處理液L貯存於前述輔助貯液部38之底 部壁41。即,從主貯液部32流至辅助貯液部38之處理液乙 5並非直接從狹縫44朝基板W上面流出,而是儲存於輔助貯 液部38預定時間之後,再從前述狹縫44流出。 從主貯液部32之流出孔36流出之處理液L係沿著輔助 貯液部39b之傾斜面流動。因此,若從前述流出孔%流出之 處理液L捲入氣泡的話,前述氣泡會在處理液。沿著傾斜面 10 39b流動時,因浮力上昇而與處理液Ε分離。 再者,流動於傾斜面39b之處理液L係貯存於辅助貯液 部38之底部壁41之後,再從狹縫44流出。因此,即使氣泡 殘留於所貯存的處理液L中,含於處理液[之氣泡仍會在處 理液L從狹縫44流出之前上昇,而與處理液L分離。 15 此外,由於處理液L貯存於輔助貯液部38,因此可使處 理液L沿著基板w之寬度方向從細長的狹缝44朝基板w均 一地流出。藉此,可均一地處理基板w的上面全體。 前述輔助貯液部38之上部壁43連接有作為第丨放出部 之第1排氣管45,其係用以放出與處理液!^分離且於前述輔 20助財液部38内上昇之氣泡者。藉此,與處理液L分離之氣泡 會通過前述第1排氣管45而放出至大氣。 又’如第1圖所示,第1排氣管45設於輔助貯液部38之 長度方向的兩端部。 根據具有前述結構之處理裝置,可於室丨内朝預定方向 12 200810838 運送供給至室1内之基板w,並可在運送途中,從處理液供 給裝置31沿著與基板w之運送方向交叉之寬度方向供給處 理液L至基板w上面。藉此,基板w係在經由處理液^處理 後送出室1。 5 前述處理液供給裝置31具有主貯液部32。由供液管33 供給至前述主貯液部32之處理液1並非直接從供液管33落 至主貯液部32内,而是由與供液管33相對設置之承接構件 34承接後再落下。藉此,處理液L會平穩地流入主貯液部32 内’因此亦可減少流入時捲入處理液L之氣泡的量。The _ inch is long, and a plurality of ends thereof for supplying the processing liquid L to the liquid supply pipe 33 in the main liquid storage portion 32 are connected to each other at a predetermined interval. The other end of each of the liquid supply pipes 33 is connected to a supply source of the liquid L, which is not shown, through a flow control valve (not shown). In the second month of February, the main portion of the liquid portion 32 is provided with a substantially horizontal flat-shaped receiving member 34, and the receiving member 34 is located at an intermediate trowel of a portion facing the respective liquid supply tubes. The receiving member 34 can receive the processing liquid supplied from the liquid supply tube μ to the main liquid storage portion 32. Thereby, the treatment liquid that is transferred from the liquid supply pipe to the main Bening liquid portion 32 smoothly flows into the force of the main liquid storage portion, so that the bubbles of the treatment liquid 1^_ can be reduced in 200810838. In the longitudinal direction of the bottom wall 32 & of the main liquid storage portion 32, a plurality of outflow holes 36 for forming the mth output portion are drilled at predetermined intervals. Thereby, the process red supplied from the liquid supply member 33 to the main liquid storage portion 32 can flow out from the discharge hole 36 of the flow. Moreover, the supply amount of the treatment liquid L supplied from the liquid supply pipe 33 and the outflow amount which flows out from the outflow hole 36 are set so that the process liquid Lφ supplied from the liquid supply pipe 33 is filled in the main liquid storage part 32. 1〇 The treatment liquid L flowing out of the outflow hole 36 is stored in the auxiliary liquid storage unit. As shown in Fig. 4, the auxiliary liquid storage portion 38 has a funnel shape in cross section, and includes a pair of inclined surfaces 39a and 3_v bottoms which are inclined along the width direction of the main liquid storage portion 32. a wall 41; an upper end that is erected on one of the inclined surfaces 39a of the bottom P-soil 41, and a side wall 42 that is parallel to the side surface of the main reservoir portion 15 and that is spaced apart from each other, and is provided on the side The upper end of the wall 42 is closed, and the upper wall 43 of the upper opening of the auxiliary reservoir 38 can be closed. • The upper end portion of the other inclined surface 39b of the bottom wall 41 faces the main and butyl liquid. The outflow holes opened below the 卩32 are relative to each other. The lower end of the inclined surface 39b, that is, the lowermost end opening of the bottom wall 41, is formed with a narrow slit 44 as a second outflow portion, and the slit 44 spans substantially the entire length in the longitudinal direction. The treatment liquid L supplied to the main liquid storage portion 32 and flowing from the outflow hole 36 to the upper end portion of the inclined surface 3 9 b flows along the inclined surface 3 9 b and is stored in the funnel-shaped bottom wall 41. Then, it flows out linearly from the slit 44 formed in the bottom wall 41. Thereby, the processing liquid B can be supplied over the entire length in the width direction crossing the conveying direction of the substrate W conveyed in the predetermined direction. 200810838 Further, the area of the outflow hole 36 and the slit 44 is set, and the supply amount of the processing liquid L supplied from the liquid supply pipe 33 to the main liquid storage unit 32 is also controlled so that a certain amount of processing is performed. The liquid L is stored in the bottom wall 41 of the auxiliary reservoir portion 38. That is, the treatment liquid B flowing from the main liquid storage portion 32 to the auxiliary liquid storage portion 38 does not directly flow out from the slit 44 toward the upper surface of the substrate W, but is stored in the auxiliary liquid storage portion 38 for a predetermined time, and then from the slit. 44 outflow. The treatment liquid L that has flowed out from the outflow hole 36 of the main liquid storage portion 32 flows along the inclined surface of the auxiliary liquid storage portion 39b. Therefore, when the treatment liquid L flowing out from the outflow hole % is filled with air bubbles, the bubbles are treated in the treatment liquid. When flowing along the inclined surface 10 39b, it is separated from the treatment liquid due to an increase in buoyancy. Further, the treatment liquid L flowing on the inclined surface 39b is stored in the bottom wall 41 of the auxiliary liquid storage portion 38, and then flows out from the slit 44. Therefore, even if the bubbles remain in the stored treatment liquid L, the bubbles contained in the treatment liquid rise before the treatment liquid L flows out from the slit 44, and are separated from the treatment liquid L. Further, since the processing liquid L is stored in the auxiliary liquid storage portion 38, the processing liquid L can be uniformly discharged from the elongated slit 44 toward the substrate w in the width direction of the substrate w. Thereby, the entire upper surface of the substrate w can be uniformly processed. A first exhaust pipe 45 as a second discharge portion is connected to the upper wall 43 of the auxiliary liquid storage portion 38, and is configured to release a bubble which is separated from the treatment liquid and rises in the auxiliary fuel supply portion 38. By. Thereby, the bubbles separated from the treatment liquid L are discharged to the atmosphere through the first exhaust pipe 45. Further, as shown in Fig. 1, the first exhaust pipe 45 is provided at both end portions in the longitudinal direction of the auxiliary reservoir portion 38. According to the processing apparatus having the above configuration, the substrate w supplied into the chamber 1 can be transported in the chamber toward the predetermined direction 12 200810838, and can be crossed from the processing liquid supply device 31 in the transport direction with the substrate w during transportation. The treatment liquid L is supplied to the upper surface of the substrate w in the width direction. Thereby, the substrate w is sent to the chamber 1 after being processed through the treatment liquid. 5 The processing liquid supply device 31 has a main liquid storage portion 32. The treatment liquid 1 supplied from the liquid supply pipe 33 to the main liquid storage portion 32 does not directly fall from the liquid supply pipe 33 into the main liquid storage portion 32, but is received by the receiving member 34 disposed opposite to the liquid supply pipe 33. fall. Thereby, the treatment liquid L smoothly flows into the main liquid storage portion 32. Therefore, the amount of bubbles entrained in the treatment liquid L at the time of inflow can also be reduced.

10 貯存於前述主貯液部32之處理液L係如第4圖之箭號A 所示,從形成於主貯液部32之下面的流出孔36流出,並沿 著形成於辅助貯液部38之底部壁41的傾斜面39b流動,再貯 存於輔助貯液部38之漏斗狀的底部壁41,接著從設於前述 傾斜面39b之下端的狹縫44流出,再供給至運送於室丨内之 15 基板W上面。 當k别述主貯液部32之流出孔36流出之處理液l含有 氣泡時,前述氣泡會在處理液L從流出孔3 6流出並沿著傾斜 面39b流動時上昇,而與處理液L分離,此時,未從處理液L 除去之氣泡係在流動於傾斜面3 9 b之處理液L從狹縫4 4流出 20之前,即,處理液1^貯存於輔助貯液部38之底部壁41上時依 浮力上昇,而與處理液L分離。 此外,由於與處理液L分離之氣泡係從第丨排氣管45放 出至大氣,因此從前述輔助貯液部38之狹縫44供給至基板 W之處理液L不會含有氣泡。故,可利用處理液£均一地處 13 200810838 理基板W之上面全體。 即,根據具有前述結構之處理液供給裝置31,由於供 給至主貯液部32之處理液L係先貯存於輔助貯液部38再供 給至基板w,因此處理液L所含有的氣泡係在處理液1從主 貯液部32流至輔助貯液部38時及貯存於輔助貯液部38時依 浮力上昇,而與處理液分離,再通過第丨排氣管45放出至大 氣。 因此,氣泡不會如習知般與處理液L一起排出,而可與 處理液L分離並放出至大氣,故可以簡單的結構確實地從處 10 理液L除去氣泡。 第5圖係顯示本發明第2實施型態之處理液供給裝置 31A。在本實施型態之處理液供給裝置31八中,主貯液部32 之側壁部32b的下端部形成有作為第〖流出部之流出孔 36A其係使供給至主貯液部32之處理液流至辅助貯液部% 15 者。 如箭號A所示,從前述流出孔36A流出的處理液1係流 入形成於前述主貯液部32之侧壁部32b外側的辅助貯液部 38,並暫時地貯存於該處,再從形成於輔助貯液部%之底 部壁41的狹縫44流出,且供給至朝預定方向運送的基板w 20 上面。 前述輔助貯液部38之上部壁43連接有作為第丨放出部 之第1排氣管45 ’而前述主貯液部32之側壁部上部連接有構 成第2放出部之第2排氣管51的-端。前述第2排氣管之中 間部設有開關閥52,且該第2排氣管51彎曲成L字狀,以使 14 200810838 • 另一端部之前端面5 la高於貯存於主貯液部32之處理液L的 〜 上面。 • 若先開啟前述開關閥52並使含於供給至前述主貯液部 32之處理液的氣泡與處理液分離的話,前述氣泡會從前述 5 第2排氣管51排至外部,而不會儲存於主貯液部32内的上 — 部。 • 根據具有前述結構之處理液供給裝置31A,使供給至主 貯液部32之處理液L流至辅助貯液部38的流出孔36A係形 ® 成於前述主貯液部32之侧壁部32b。 10 因此,前述流出孔36A係朝向與供給處理液l至主貯液 部32之供液管33之直線方向正交的方向,故從前述流出孔 36A流至輔助貯液部38之處理液L不易受從前述供液管% 供給至主貯液部32之處理液L的壓力影響。 這樣一來,從主貯液部32通過前述流出孔36八流至輔助 15貯液部38之處理液L的流量不易改變,因此可穩定從輔助貯 φ 液部38之狹縫44供給至基板W之處理液L的流出量,故可利 用處理液L穩定地進行基板界的處理。 , 第6圖係顯示本發明第3實施型態之處理液供給裝置 - 31B。本實施型態係第2實施型態之變形例,且形成輔助貯 20液部38之底部壁41的一對傾斜面39a、39b中,位於主貯^ 部32侧之其中一傾斜面现較另一傾斜面突出於下方7液 藉此,從狹縫44流出之處理液L係由其中一傾斜面 引導而平穩地供給至基板w上面。即,可防止因供給至義 板W上面之處理液L不穩定而捲入空氣,並在含有氣泡的二 15 200810838 態下供給至基板w上面的情況發生,故可確實且均一地進 行基板w的處理。 又,在第5圖與第6圖所示之第2、第3實施型態中,係 以同一符號標示與第1實施型態相同的部分,並省略其說 5 明。 在前述各實施型態中,係將流出孔形成於主貯液部, 並將狹缝形成於輔助貯液部,以作為第1、第2流出部,但 無論各流出部是流出孔還是狹缝皆不造成影響。 為了從輔助貯液部放出氣泡至大氣中,係將第1排氣管 10 連接於前述輔助貯液部,但亦可不連接第1排氣管,而只形 成排氣孔。 I:圖式簡單說明1 第1圖係顯示本發明第1實施型態之圖,且該圖係沿著 處理裝置之寬度方向的縱向截面圖。 15 第2圖係設於前述處理裝置内之處理液供給裝置的正 視圖。 第3圖係前述處理液供給裝置的截面圖。 第4圖係前述處理液供給裝置之放大縱向截面圖。 第5圖係顯示本發明第2實施型態之圖,且該圖係沿著 20 處理裝置之寬度方向的縱向截面圖。 第6圖係係顯示本發明第3實施型態之圖,且該圖係沿 著處理裝置之寬度方向的縱向截面圖。 16 200810838The treatment liquid L stored in the main liquid storage unit 32 is flowed out from the outflow hole 36 formed in the lower surface of the main liquid storage portion 32 as shown by the arrow A in Fig. 4, and is formed along the auxiliary liquid storage portion. The inclined surface 39b of the bottom wall 41 of 38 flows, is stored in the funnel-shaped bottom wall 41 of the auxiliary liquid storage portion 38, and then flows out from the slit 44 provided at the lower end of the inclined surface 39b, and is then supplied to the chamber. Inside the 15 substrate W. When the treatment liquid 1 flowing out of the outflow hole 36 of the main liquid storage portion 32 contains air bubbles, the air bubbles rise when the treatment liquid L flows out from the outflow hole 36 and flows along the inclined surface 39b, and the treatment liquid L Separation, at this time, the bubble which is not removed from the treatment liquid L is stored before the treatment liquid L flowing on the inclined surface 3 9 b from the slit 4 4, that is, the treatment liquid 1 is stored at the bottom of the auxiliary liquid storage portion 38. The wall 41 rises in buoyancy and is separated from the treatment liquid L. Further, since the bubble separated from the processing liquid L is discharged from the second exhaust pipe 45 to the atmosphere, the processing liquid L supplied from the slit 44 of the auxiliary liquid storage portion 38 to the substrate W does not contain air bubbles. Therefore, it is possible to use the treatment liquid to be uniformly located on the upper surface of the substrate 2008. In other words, according to the processing liquid supply device 31 having the above configuration, the processing liquid L supplied to the main liquid storage unit 32 is first stored in the auxiliary liquid storage unit 38 and then supplied to the substrate w, so that the bubble contained in the processing liquid L is When the treatment liquid 1 flows from the main liquid storage unit 32 to the auxiliary liquid storage unit 38 and when stored in the auxiliary liquid storage unit 38, it rises in buoyancy, is separated from the treatment liquid, and is discharged to the atmosphere through the second exhaust pipe 45. Therefore, the bubbles are not discharged together with the treatment liquid L as is conventionally, and can be separated from the treatment liquid L and released to the atmosphere, so that the bubbles can be reliably removed from the treatment liquid L with a simple structure. Fig. 5 is a view showing a treatment liquid supply device 31A according to a second embodiment of the present invention. In the treatment liquid supply device 31 of the present embodiment, the lower end portion of the side wall portion 32b of the main liquid storage portion 32 is formed with a treatment liquid which is supplied to the main liquid storage portion 32 as the outflow hole 36A of the first outflow portion. Flow to the auxiliary storage unit % 15 . As indicated by the arrow A, the processing liquid 1 flowing out of the outflow hole 36A flows into the auxiliary liquid storage portion 38 formed outside the side wall portion 32b of the main liquid storage portion 32, and is temporarily stored therein, and then The slit 44 formed in the bottom wall 41 of the auxiliary reservoir portion % flows out and is supplied to the upper surface of the substrate w 20 which is conveyed in a predetermined direction. The upper portion 43 of the auxiliary liquid storage portion 38 is connected to the first exhaust pipe 45' as the second discharge portion, and the second exhaust pipe 51 constituting the second discharge portion is connected to the upper portion of the side wall portion of the main liquid storage portion 32. - end. An opening and closing valve 52 is provided in an intermediate portion of the second exhaust pipe, and the second exhaust pipe 51 is bent in an L shape so that 14 200810838 • the other end portion end face 5 la is higher than the main liquid storage portion 32 The treatment liquid L ~ above. • When the opening and closing valve 52 is opened and the air bubbles contained in the processing liquid supplied to the main liquid storage unit 32 are separated from the processing liquid, the air bubbles are discharged from the fifth and second exhaust pipes 51 to the outside without It is stored in the upper portion of the main reservoir portion 32. According to the processing liquid supply device 31A having the above-described configuration, the outflow hole 36A that flows the processing liquid L supplied to the main liquid storage portion 32 to the auxiliary liquid storage portion 38 is formed in the side wall portion of the main liquid storage portion 32. 32b. Therefore, since the outflow hole 36A faces the direction orthogonal to the linear direction of the supply pipe 33 to which the processing liquid 1 is supplied to the main reservoir portion 32, the treatment liquid L flowing from the outflow hole 36A to the auxiliary reservoir portion 38 is formed. It is less susceptible to the pressure of the treatment liquid L supplied from the liquid supply tube % to the main reservoir portion 32. As a result, the flow rate of the treatment liquid L flowing from the main reservoir portion 32 through the outflow hole 36 to the auxiliary 15 reservoir portion 38 is not easily changed, so that it can be stably supplied from the slit 44 of the auxiliary reservoir φ liquid portion 38 to the substrate. Since the outflow amount of the treatment liquid L is W, the treatment of the substrate boundary can be stably performed by the treatment liquid L. Fig. 6 is a view showing a treatment liquid supply device - 31B according to a third embodiment of the present invention. This embodiment is a modification of the second embodiment, and among the pair of inclined faces 39a and 39b forming the bottom wall 41 of the auxiliary reservoir 20 liquid portion 38, one of the inclined faces on the side of the main reservoir portion 32 is present. The other inclined surface protrudes from the lower seven liquids, whereby the processing liquid L flowing out from the slits 44 is guided by one inclined surface and smoothly supplied onto the substrate w. In other words, it is possible to prevent the processing liquid L supplied to the upper surface of the plate W from being unstable and entrapped in the air, and to supply the upper surface of the substrate w in the state of the bubble 15/200810838. Therefore, the substrate w can be surely and uniformly performed. Processing. In the second and third embodiments shown in the fifth and sixth embodiments, the same portions as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. In each of the above embodiments, the outflow hole is formed in the main liquid storage portion, and the slit is formed in the auxiliary liquid storage portion as the first and second outflow portions, but whether the respective outflow portions are outflow holes or narrow portions The seams are not affected. In order to discharge the air bubbles from the auxiliary liquid storage portion to the atmosphere, the first exhaust pipe 10 is connected to the auxiliary liquid storage portion, but only the first exhaust pipe may be connected, and only the exhaust holes may be formed. I. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a first embodiment of the present invention, and the drawing is a longitudinal sectional view along the width direction of the processing apparatus. 15 Fig. 2 is a front view of the processing liquid supply device provided in the processing apparatus. Fig. 3 is a cross-sectional view of the processing liquid supply device. Fig. 4 is an enlarged longitudinal sectional view of the aforementioned treatment liquid supply device. Fig. 5 is a view showing a second embodiment of the present invention, and is a longitudinal sectional view taken along the width direction of the 20 treatment device. Fig. 6 is a view showing a third embodiment of the present invention, and the drawing is a longitudinal sectional view along the width direction of the processing apparatus. 16 200810838

【主要元件符號說明】 1…室 32b...側壁部 2…本體部 33...供液管 3…蓋體部 34…承接構件 4…鉸鏈 36,36A...流出孔 11…支撐構件 38…輔助貯液部 12…運送裝置 39a39b·.·傾斜面 13…基部構件 41...底部壁 14…連結構件 42...側部壁 15…支撐板 43...上部壁 16...轴承 44· _ ·狹縫 17…運送軸 45…第1排氣管 18…運送滾子 51…第2#氣管 19…引導滾子 51a··.前端面 21…驅動機構 52...開關閥 22· · ·驅動源 A…箭號 23...輸出軸 W…鉍 24…驅動齒輪 L· · ·處里液 25.. .安裝軸 26…從動齒輪 31,31八,3敗..處理液供給裝置 32.. .主貯液部 32a...底部壁 17[Description of main component symbols] 1... Chamber 32b... Side wall portion 2: Main body portion 33: Liquid supply pipe 3... Cover portion 34: Receiving member 4: Hinge 36, 36A... Outflow hole 11... Support member 38... auxiliary storage unit 12... conveying device 39a39b·. inclined surface 13... base member 41... bottom wall 14... connecting member 42... side wall 15... support plate 43... upper wall 16... Bearing 44· _ · Slit 17 ... transport shaft 45 ... first exhaust pipe 18 ... transport roller 51 ... 2 # air pipe 19 ... guide roller 51 a · · front end face 21 ... drive mechanism 52 ... switch Valve 22···Drive source A...Arrow 23...Output shaft W...铋24...Drive gear L···Liquid liquid 25.. Install shaft 26...Driver gear 31, 31, 3, 3 defeat. Process liquid supply device 32.. main liquid storage portion 32a... bottom wall 17

Claims (1)

200810838 十、申請專利範圍: 1. 一種基板處理裝置,係利用由處理液供給裝置所供給之 處理液處理所運送之基板上面者, 而前述處理液供給裝置包含有: 5 主貯液部,係連接有用以供給前述處理液之供液管 者; 第1流出部,係設於前述主貯液部下端,並使從前 述供液管供給且貯存於前述主貯液部之前述處理液流 出者; 10 輔助貯液部,係用以貯存從前述第1流出部流出之 前述處理液者; 第2流出部,係設於前述輔助貯液部,並將從前述 第1流出部流至前述輔助貯液部之前述處理液供給至前 述基板上面者;及 15 第1放出部,係設於前述輔助貯液部,且與大氣連 通,並將與來自前述第1流出部之前述處理液一起流出 的氣泡放出至大氣者。 2. 如申請專利範圍第1項之基板處理裝置,其中前述第1 流出部形成於前述貯液部之底部壁。 20 3·如申請專利範圍第1項之基板處理裝置,其中前述第1 流出部形成於前述貯液部之侧部壁。 4.如申請專利範圍第1項之基板處理裝置,其中前述貯液 部形成有第2放出部,其係將與來自前述供液管之前述 處理液一起供給至前述主貯液部的氣泡放出至大氣者。 18 200810838 5.如申請專利範圍第1項之基板處理裝置,其中從前述主 貯液部之第1流出部流至前述輔助貯液部的前述處理液 在暫時地貯存於前述輔助貯液部之後,再從辅助貯液部 之第2流出部流出。 5 6.如申請專利範圍第1項之基板處理裝置,其中前述主貯 液部設有用以承接從前述供液部所供給之前述處理液 的承接構件。 7. 如申請專利範圍第1項之基板處理裝置,其中前述第2 流出部係沿著與前述基板之運送方向交叉之方向形成 10 的狹缝。 8. 如申請專利範圍第1項之基板處理裝置,其中前述輔助 貯液部形成有用以承接從前述第1流出部流出之前述處 理液的傾斜面,且前述傾斜面之下端設有前述第2流出 部。 19200810838 X. Patent Application Range: 1. A substrate processing apparatus for processing a substrate conveyed by a processing liquid supplied from a processing liquid supply device, wherein the processing liquid supply device comprises: 5 a main liquid storage portion Connecting a liquid supply pipe for supplying the treatment liquid; the first outflow portion is provided at a lower end of the main liquid storage portion, and the treatment liquid outflow supplied from the liquid supply pipe and stored in the main liquid storage portion The auxiliary liquid storage unit is configured to store the processing liquid flowing out from the first outflow portion; the second outflow portion is provided in the auxiliary liquid storage unit, and flows from the first outflow portion to the auxiliary The processing liquid supplied from the liquid storage unit is supplied to the substrate; and the first discharge unit is connected to the auxiliary liquid storage unit and communicates with the atmosphere, and flows out together with the processing liquid from the first outflow unit. The bubbles are released to the atmosphere. 2. The substrate processing apparatus according to claim 1, wherein the first outflow portion is formed on a bottom wall of the liquid reservoir. The substrate processing apparatus according to claim 1, wherein the first outflow portion is formed on a side wall of the liquid reservoir. 4. The substrate processing apparatus according to claim 1, wherein the liquid storage portion is formed with a second discharge portion that discharges bubbles to the main liquid storage portion together with the processing liquid from the liquid supply tube. To the atmosphere. The substrate processing apparatus according to the first aspect of the invention, wherein the processing liquid flowing from the first outflow portion of the main liquid storage portion to the auxiliary liquid storage portion is temporarily stored in the auxiliary liquid storage portion Then, it flows out from the second outflow portion of the auxiliary liquid storage unit. The substrate processing apparatus according to claim 1, wherein the main liquid storage portion is provided with a receiving member for receiving the processing liquid supplied from the liquid supply portion. 7. The substrate processing apparatus according to claim 1, wherein the second outflow portion forms a slit of 10 in a direction crossing a direction in which the substrate is conveyed. 8. The substrate processing apparatus according to claim 1, wherein the auxiliary liquid storage portion forms an inclined surface for receiving the processing liquid flowing out from the first outflow portion, and the second end of the inclined surface is provided with the second portion Outflow section. 19
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