200819366 九、發明說明： 【發明所屬之技術領域】 本發明為與電子產品之製造流程有關，特別是指一種 供電子產品使用之出貨用承載盤的使用方式。 【先前技術】 在一般電子產品(如：快閃記憶體、積體電路晶片等） 的衣中’该等電子產品的成品或是半成品均是放置 於承載盤(tmy)巾進行製造㈣之各流程。 、一般的承載盤20，請參閱第二圖所示，為一由塑膠一 ，成形^矩形盤體，其上具㈣干以凸肋所圈圍出之承載 —承載部22之形狀與電子產品(圖示巾顯示為記 mm但尺寸較大’可供—電子產品24放置於其 中’而不會任意移動。 15 為了承又衣造程序所可能遇到的高溫、高壓定環 蜒，承載盤需具有耐高、、w、古始 、 :前述之特性，習用之承載盤= 格是ί較，。廠商製== 購買廠_ ^ 4樣是放置在承載射交付給 運==载盤的重量與體積較大，因此會增加 購買廠商，-定比例的成本。當 需要費用的，而且，比然而回收的動作也是 有利於製造廠商。x 收的承麵也不見的較 4 20 200819366 【發明内容】 方法本之主要目的在於提供—種出貨料载盤的使用 _田 較制且快速之方式讓電子產品由-般製造 可吏用之承麵轉移至出㈣承載盤。 般呈述之發明目的，本發明所提供之出貨用承載 二’其分佈狀態與—般製造所使用之承載 衣l所使用之承麵轉移至本發明之 承 =。’以本發明之出貨用承載盤與電子產品—併上 【實施方式】 15 為了詳細說明本發明之構造及特點所在 較佳實施例並配合圖式說明如后·· +以下之 、明翏閱第-圖與第二圖所示，本發明所提供 中央八有-承載區12,周圍具有—結合部14。 為-凹陷區，具有與習用之承健2G呈 ^ : =承=排列之承載部16，每一承载部 等承載部16橫斷面之形狀類似於記針24之㈣中ί 分佈狀態(layout)與習用之承健2〇之承载部U呈互= 5 20 200819366 ^態。各該承载部ί6之底端t央更具有—向下突出之凸部 在操作時’首先製造者利用習用之承载盤2〇谁〜 產品之各製程，而完成後該等電子產品 ：电子 承載盤20之各承载部22令。然 用之 將該出貨用承载盤U)倒扣在f用之承載盤1二圖， 盤ω之各承載部16糾σ射且神起習==承载 各伽2。該出貨用承載盤1〇之=二:， ==與定位的作用，俾使該二承載盤1〇,2==狀 各该承，部16, 22是保持在解之狀態。 ’ 1。二:第示，將合併之該出貨用承載盤 15 20 20轉至該出貨用承載盤1〇之上方，此時，習用之 ΤίίΓ载部22中之電子產品24會自動掉落至該出貨ΐ 载盤載部16巾。之彳_開上方之習用之承 m 圖所示，即完成了將電子產品24由習用之 二12G移轉至本發明之出貨躲賴1()之動作，如 ，、圖所示。 布 在將電子產品運送至購買廠商時，可將盛裝有電子產 ^的出f用承載盤1G堆疊在—起，請參閱第七圖所示， 日守’、上方之出貨用承載盤10之結合部14與下方之出貨 用承載盤1G之結合部14會成緊配合的形態結合在_起。 6 200819366 上方承載部16底端之凸部I8會進入下方之出貨用承载般 10之承載部16中，並壓抵其中之電子產品24，讓該等電 子產品24於運送的過程中較不易產生晃動。 本舍明所提供之出貨用 抗塵與抗靜電等特性，.要娜之耐高溫、 以降低成本與減輕重量等塑膠材料製成薄片狀， 可有效降低。另外，本發明口：=貨給購買廠商時之成本 料製成，如此可讓製造^、、主#出貨用承載盤可以透明之材 與狀態。 Θ @觀察到各電子產品之位置 7 200819366 15 【圖式簡單說明】 第一圖為本發明一較佳實施例之立體圖， 之承載盤與習用之承載盤； 第一圖為本發明一較佳實施例之立體圖， 之承載盤準備倒扣在習用之承載盤上； 第二圖為本發明一較佳實施例之剖視圖， 之承載盤倒扣在習用之承載盤上； 第四圖為本發明—較佳實補之剖視圖，作； 第五圖為本發明一較佳實施例之剖視圖 用之承載盤； 口第/、圖為本發明一較佳實施例之立體圖 品轉^至本發明之承载盤上；以及 第七圖為本發明一較佳實施例之剖視圖 之承载盤疊置在一起。 晨負 示本發明 示本發明 _示本發明 _示翻轉動 _示移開習 顯示電子產 顯示本發明 20 【主要元件符號說明】 10出貨用承載盤12承載區 16承載部 18凸部 20習用承載盤22承載部 14結合部 24電子產品 8200819366 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a manufacturing process of an electronic product, and more particularly to a use mode of a shipping carrier for use in an electronic product. [Prior Art] In the clothing of general electronic products (such as flash memory, integrated circuit chips, etc.), the finished or semi-finished products of these electronic products are placed on the carrier (tmy) for manufacturing (4). Process. The general carrier tray 20, as shown in the second figure, is a plastic-shaped, rectangular-shaped disk body having the shape of the carrier-bearing portion 22 and the electronic product surrounded by the ribs. (The illustration towel is shown as mm but the size is larger - available - the electronic product 24 is placed in it' and does not move arbitrarily. 15 In order to meet the high temperature and high pressure ring 蜒, the carrier plate Need to have high resistance, w, ancient,: the aforementioned characteristics, the conventional carrier plate = grid is ί,. Manufacturer system == purchase factory _ ^ 4 sample is placed in the load bearing delivery to the transport == carrier The weight and volume are large, so it will increase the cost of the purchaser, and the cost will be proportional to the cost of the manufacturer. Contents] The main purpose of the method is to provide the use of a kind of shipping material carrier. _ Tian is relatively fast and the electronic product is transferred from the general-purpose manufacturing surface to the (4) carrier. The purpose of the invention is to provide a shipping load provided by the present invention. Secondly, the distribution state and the bearing surface used for the carrier 1 used in the general manufacturing are transferred to the carrier of the present invention. 'With the carrier disk and the electronic product of the present invention—once [Embodiment] 15 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S) The present invention is provided with a preferred embodiment of the present invention and is described in conjunction with the drawings. The following is a description of the following: There is a joint portion 14 in the periphery. The recessed portion has a bearing portion 16 which is arranged with the conventional bearing 2G, and the bearing portion 16 of each carrying portion is shaped like a pin 24 . (4) The distribution state of the ί distribution and the load bearing part of the conventional bearing 2 are mutually = 5 20 200819366 ^ state. The bottom end of each of the carrying portions ί6 has a convex portion that protrudes downward. When the manufacturer first uses the conventional carrier 2, who is the product, and after the completion of the electronic products: the respective carrier 22 of the electronic carrier 20, the carrier is used for the shipment. The reverse buckle is used in the carrier plate 1 for f, and the load-bearing portions 16 of the disk ω are corrected and the gods start == Each carrying 2 gal. The shipping carrier 1 , = 2:, == and the positioning function, so that the two carrier disks 1 〇, 2 == each of the bearings, the portions 16, 22 are maintained in a state of solution. ' 1. Second, the first embodiment, the merged carrier tray 15 20 20 is transferred to the top of the shipping tray 1 , at this time, the electronic product 24 in the carrier 22 is automatically dropped to the Shipment 16 16 sets of trays. After the above, the action of shifting the electronic product 24 from the conventional 12G to the shipment avoidance 1() of the present invention is completed, as shown in the figure. When the electronic product is shipped to the purchaser, the carrier 1G for the electronic product can be stacked, as shown in the seventh figure, the Japanese carrier's carrier 10 is shipped. The joint portion 14 is joined to the joint portion 14 of the lower shipping tray 1G in a tight fit. 6 200819366 The convex portion I8 at the bottom end of the upper carrying portion 16 enters the carrying portion 16 of the carrier 10 in the lower direction and is pressed against the electronic product 24 therein, making the electronic products 24 less likely to be transported. Shaking. The properties of dust and antistatic, such as those provided by Ben Sheming, can be effectively reduced by high-temperature, low-cost and light-weight plastic materials. In addition, the invention has the following advantages: = the cost of the goods to the purchaser is made, so that the manufacturing trays for manufacturing, the main #, and the carrier can be transparent. Θ@ Observing the position of each electronic product 7 200819366 15 [Simplified description of the drawings] The first figure is a perspective view of a preferred embodiment of the present invention, a carrier disk and a conventional carrier disk; The perspective view of the embodiment, the carrier tray is ready to be reversed on the conventional carrier tray; the second figure is a cross-sectional view of the preferred embodiment of the present invention, the carrier tray is reversed on the conventional carrier tray; - Figure 5 is a cross-sectional view of a preferred embodiment of the present invention; a third embodiment of the present invention is a perspective view of a preferred embodiment of the present invention; The carrier tray is stacked on the carrier tray; and the seventh diagram is a cross-sectional view of the preferred embodiment of the present invention. The present invention is shown in the present invention. The present invention is shown in the present invention. The present invention is shown in the following paragraph. [The main component symbol description] 10 shipping carrier 12 bearing area 16 carrying portion 18 convex portion 20 Conventional carrier tray 22 carrying portion 14 joint portion 24 electronic product 8