TW200817450A - Epoxy resin, fabricating method thereof, epoxy resin composition by using the epoxy resin and cured product thereof - Google Patents

Abstract

This present invention provides an epoxy resin obtained by epoxidizing phenol resin having 160-230 g/eq hydroxyl equivalent, which represented by the following formula (1). The epoxy resin can provide a cured product with excellent low water absorptivity, low dielectric properties, heat resistance, and flame retardant. The present invention further provides an epoxy resin composition and a cured product. Wherein the epoxy resin composition includes the aforementioned epoxy resin and curing agent, and the cured product is formed by cuing the epoxy resin composition. In the formula, P, R, and m exist independently. P represents alkyl with carbon atoms in a number ranging from 1 to 6. R represents alkyl with hydrogen or carbon atoms in a number ranging from 1 to 6. m represents the integers from 0 to 3. n is the repeating times.

Description

200817450 25930pif.doc IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to an epoxy resin composition and an epoxy resin composition having the same and a hardened material, particularly An epoxy resin that is an electrically cured product of the composition. /, /, low and water-based and low-medium [prior art] c ο Epoxy resin is used for adhesives by hardening the shell, water repellency, chemical resistance, and mechanical formation by various hardeners. =, electrical properties and other excellent hard materials, photoresist (four) st) and so on] pan =. Laminated boards, molding materials, and prayer materials In recent years, with the high density of electrical and electronic instruments and the high-profile I, the Ministry of Electrical and Electronics (4) has to become an exhibition. For example, in the hardened material of the encapsulating material, it is eagerly desired and there is a material; and in terms of the material, it is required to have an excellent "2; ^ degree of low dielectric property of the raw material used for laminating the substrate; For the hardened material, it is required to have a ring-shaped product, and since it is discarded, it is used, and the harmful substances such as (dk>xine) of the object A are treated in the field, which contributes to the dioxin--someone has proposed the skeleton 竿=. The method of the problem has been developed even with di-halogen epoxy resins. In particular, the suspension of the bis-ester type compound, by selecting the resin 6 200817450 25930pif.doc skeleton ' compared with the previous s ^ θ chen resin Epoxy resin with excellent flame retardancy. It is not necessary to explore a resin skeleton which is often referred to as "no element, no phosphorus" and which exhibits flame retardancy. = The flame-retardant epoxy resin required for the above-mentioned requirements can be exemplified by phenol aralkyl epox, resin, which is highly demanding in recent years. Steps to improve the characteristics of the invention are disclosed in Japanese Laid-Open Patent Publication No. 2006-063207, and Japanese Patent Application No. 2001-172473. SUMMARY OF THE INVENTION The present invention aims to solve the above-mentioned problems of the prior art, and provides a ring capable of providing a cured product having excellent properties and heat resistance and having low, water-based and low dielectric properties. Oxygen resin and its manufacturing method. Other purposes of the present invention are to provide an epoxy resin composition comprising the above epoxy resin and a cured product thereof. The inventors of the present invention conducted intensive studies and found that low water absorption can be obtained by using a denatured epoxy resin having a skeleton derived from a 1,3 channel-substituted benzene and a xylene skeleton. Sized, low-medium, flame-retardant, and heat-resistant hardened material, thus completed

Bright. X is the main point of the present invention as follows. An epoxy resin obtained by the following formula (1) and having a hydroxyl group equivalent of 160 to 230 g/eq (phen 〇). Μ礼化(1) 200817450 25930pif.doc Ο ο

(Β)γ

OH (Hm π (wherein, P, R and m each exist independently, p mai f does not occupy a burning group of 1 to 6 in the early disk; R represents an integer of hydrogen or a carbon number of 1 to 0 to 3. η is The number of repetitions.) τ 2·- an epoxy resin composition containing the above-mentioned epoxy resin and hardener of 1 μμ 〃 。 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 组成 组成 组成 组成 组成4. A method for producing an epoxy resin. The method for producing an epoxy resin is characterized in that: (1) a phenolic resin and an epihalohydrin which are represented by a group having a hydroxyl equivalent of 160 to 230 g/eq. Reaction (R)r

'CH2Hh?y η (1) (wherein, P, R and m each independently store a group of -6; and R represents an integer of 1 to 3 carbon atoms in the hydrogen or carbon source. η is a repeating bond. a 6-form group; m means that according to the present invention, by epoxidizing a phenolic resin, it is possible to provide a bismuth of a ruthenium, a 3-alkyl-substituted benzene, and a low-dielectric hardener. It has low water absorption to provide a method comprising the above epoxy oxime = oxygen resin and a method for producing the same. Rings useful in a wide variety of applications, such as electrical and electronic materials, and coatings, adhesives, and photoresists, are also useful in the context of the present invention. Easy to understand, the following is a better description of the following. A gas resin composition and a cured product thereof. And other purposes, features, and advantages can be more obvious, and in conjunction with the drawings, the county axis is made by, for example, money metal.

The reaction of 酴藤 resin and %虱_propane, which is represented by the following formula (1), is oxidized by the 溆俨 3 3 工 工 工 工 工 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 160 And get it.

(Formula: a a and m each independently exist, P represents a carbon number of 1 to, and fluorenyl 'R represents hydrogen or an alkyl group having 1 to 6 carbon atoms; m represents a capping of 〇3. The number of repetitions is.) u, 0 In the formula (1), P represents a group having 1 to 6 carbon atoms, and the group may be any of a linear chain, a branched chain, and a cyclic group. Examples of the alkyl group include a mercapto group, an ethyl group, a butyl group, a propyl group, a pentyl group, a hexyl group, a cyclohexyl group and the like. Among them, a methyl group is preferred. R represents a hydrogen atom or a group having a carbon number of 6 and the fluorenyl group may be any of a linear chain, a branched chain, and a cyclic group. The sulfhydryl group may be a hydrazine group, an ethyl group, a butyl group, a propyl group, a pentyl group, a hexyl group, a hexyl group, etc. The most suitable one is a hydrogen atom. Further, the number of repetitions η is usually an integer of 14 〇, preferably The integer is more preferably an integer of j to 5, and particularly preferably an integer of 1 to 2. The phenol resin represented by the formula U) can be synthesized, for example, by using an acid 200817450 25930pif.doc catalyst (inorganic strong acid such as sulfuric acid or nitric acid) ; an organic acid such as p-toluenesulfonic acid or diterpene benzenesulfonic acid or an organic acid such as oxalic acid; etc., such that 1,1 alkyl substituted benzene (m-diphenylbenzene, 1-fluorenyl-3-ylbenzene, L3- After reacting with furfural, it is reacted with a phenol (phenol or an alkyl-substituted phenol) to carry out the synthesis. It should be noted that, in the present invention, a phenol resin which can be used as a raw material, as long as it is The phenol resin represented by the above formula (1) may be a main component, and may further include other aromatic aldehyde resins which are by-produced in the process of synthesizing the resin.

The compound's base equivalent weight may be from 16Q to 23Qg/eq, and preferably the hydroxyl equivalent is from 180 to 21. a mixture of g/eq. Further, n in the above formula (1) usually represents an integer of 1 to 40. " Not an example of an epoxy resin, which uses the above-mentioned formula (1), and which is used to cure the glycidol. ()). In the present invention, oxychloropropion chloropropane is preferred. . Relative to the _tree represented by the above formula (1): =? : The amount of oxyhalide is usually 2~2. Moer, preferably Wu = In the above epoxidation reaction, it is preferred to give an oxide metal oxide as an oxide. It is indicated that the metal hydroxide, potassium hydroxide and the like can be tested. It can also be used in the form of its aqueous solution. In the second example, when the form of the product is used in the form of an aqueous solution, the alkali metal hydroxide can be prepared in an amount of 1 D, and the epoxy 1 10 200817450 25930 pif.doc reaction can be carried out by the following method. ^^ Μ .^^ n 4 —, Λ, Ρ 糸 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加 添加'兀 进 进 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀The amount of the ruthenium Un oxide of the phenol resin represented by the above formula 1 "-poor ^ ^ ^, formula (1) is usually 〇9 to 3 ears, preferably 1·0 to 2·〇莫The ear is more preferably 1 〇 15 15 m. ·,

Ο In the above epoxidation reaction, in order to promote the reaction, it is preferred to add tetramethylmagnesium, tetra-w-ammonium bromide, and trimethyl(tetra)-based chlorinated fourth-order orphan as a catalyst. The amount of the fourth-order ammonium salt used is usually ai to i5 g, preferably 〇.2 to 10 g, based on the i-mon hydroxyl group of the resin represented by the above formula (1). In the above epoxidation reaction, in terms of the progress of the reaction, it is preferred to further add: an alcohol such as decyl alcohol, ethanol or isopropanol, an apron such as dimethyl milling, dimethyl sulfoxide, tetrahydrofuran or dioxane. Sexual polar solvents, etc., to enter the reaction. When the above alcohol is used, it is usually used in an amount of 2 to 50% by weight (wt%) based on the amount of the epihalohydrin used, preferably 4 to 2% by weight. When the aprotic polar solvent is used, it is usually 5 to 1 〇〇 wt%, preferably 1 〜 to 80 wt%, based on the use of the propylene element. In the above epoxidation reaction, the reaction temperature is usually from 3 Torr to 9 Torr. Hey, the luck is 35~80 °C. On the other hand, the reaction time is usually from 〜5 to iq hours, preferably from 1 to 8 hours. The reactant of the epoxidation reaction can be purified by washing with water or without washing with water, removing propylene oxide or a solvent under heating and reduced pressure. In addition, in order to further form a hydrolyzable oligosaccharide, the recovered reactant may be dissolved in a solvent such as methyl ketone or ketone, and an alkali gold such as sodium hydroxide or potassium hydroxide may be added: : Aqueous solution of agglomerate, a ring closure reaction of by-products is carried out to ensure a closed loop of the emulsion of the alcohol. In this case, the alkali metal cylinder and the upper amount are usually _~ with respect to the 1 mol hydroxyl group of the phenol resin represented by (1) in the epoxidation. .3 mole, preferably. . . . 5~ The degree of the substance is usually 50 to 120 ° C, and the reaction time is usually 〇·5~2 small sa reaction μ Ο ο In the above epoxidation reaction, after the reaction is completed, the formation =, washing with water, etc. Then, the solvent is removed under heat and reduced pressure, ': hunting: to obtain the epoxy of the present invention. It should be noted that this is the fat, preferably by using an epoxy thief as the epoxy resin represented by the epoxy resin (1) as the main component, " ^ glycerol butterfly obtained epoxy resin, 匕 (2) The epoxy tree is the main component of the epoxy tree. = Yes, in the formula (2), the descriptions of p, R, and m, such as ^, P, R, and m. 1)

(2) (wherein and m each independently exist, p represents a burnt group of a disc atom to 6 'R represents an integer of hydrogen or a sulfhydryl group of the carbon atom of 1 to 6 .f ^ 1 0 to 3. n is the number of repetitions, usually Indicates that the table of Bu*

Indicates glycidyl group. Text, G The epoxy resin of the present invention can be used as a raw material for various resins, for example, a raw material such as 12 25930 pif.doc oxyacetic acid brittle and its compound. , Oxazolinone-based compound, cyclic carbonated vinegar ’ ’ 冗 冗 冗 冗 冗 ’ 冗 冗 m m m m m m m m m m m m m m m m m m m m m m The epoxy of the invention • 4 money•. The invention of the invention of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ When the wax is used in combination, the epoxy resin of the invention of the present invention and the content thereof are preferably contained in the epoxy resin as a whole. Correct%. However, it is particularly preferable to use the epoxy tree of the present invention as a modified composition, and when the wax is in the epoxy resin as a whole, the epoxy tree of the present invention is used as Can and the ring of the invention ~ 3 〇 (four). Can be listed as: _ varnish (_ 〇 1 = = he = oxygen tree month, 〇ΐ transformation ring _, etc.. Specific can be finished 1: age, fine, account, 4, bis-tetramethyl-[1, Γ -biphenyl]-4,4,-diol, "曰 and 酝3,35,5-three _(4 nal) torment, 1,1,2,2, (4^S two test, Cai Er When the system is replaced, the system is replaced by ==(- stupid: 'naphthalene, etc.) and formazan, B. ''Benzyl disk, for the base of the beetle; acid, p-acetophenone, ortho-group Ethyl ketone, two, basic bismuth from bis(chloromethyl)-U'-biphenyl, 4,4, _ junjun, benzene, (10) noodle benzene '4 her 13 200817450 25930pif.doc and their, sex, four desert Raw shrinking water >, halogenated double _ from the surface compound t, from alcohol-derived oxygen resin, glycidyl ester-based cyclic resin, glycidylamine-based ring or two or more. Used alone or twice For example, a curing agent containing f of an amine compound may be exemplified by a compound or the like. It is possible to use about a chemical compound, an acid anhydride compound, a carbaryl, and a diethylene glycol. Diphenyl phenyl soil _ month female - ethylene tetramine, diamine - the amine compound such as 砬 佛 佛 佛 佛 ketone diamine 2 Ϊ 系 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 成 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇 茇An acid anhydride compound such as phthalic acid, methyl nadic anhydride, hexahydrophthalic anhydride, mercapto hexahydrogen = o-dicarboxylic acid anhydride, bisphenol A, bisphenol F, bisphenol S, bisphenol, tetrabromobisphenol A and other halogenated bisphenols, such as bisphenols, box diphenols, VT-bisphenol, 2,2'-bisphenol, 3,3,5,5,_four Methyl _[u,-biphenyl]'4,-diol, hydrazine, resorcinol, naphthalenediol, tris-(4-phenylene)methane, oxime 2 2_tetrahydrobenzene Polyhydric phenolic compounds such as ethane, phenols (phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc.) and formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde a polycondensate of o-hydroxybenzaldehyde, p-aminophenylide, o-phenylphenidene, dicyclopentadiene, furfural, etc., and denatured thereof, as the above phenols and 4,4,_bis (chlorine) Methyl hydrazine, hydrazine-biphenyl, 4,4,-bis(methoxymethyl)_U _ Lianqi i bis (chlorine 14 200817450 25930pif.doc ΤΙ) aralkyl phenolic tree t of polycondensate of stupid, 5, bis(methoxyindenyl)benzene, etc. and their denatured, other imidazole, trifluoroboron An alkane-amine complex, a T-organism, a condensate of a phenol and a phenol, etc. Among them, an aralkyl phenol resin having a skeleton of the epoxy resin of the present invention is preferred. The above x W may be used alone. It is also possible to use two or more types. Ο Ο (1% equivalent of oxime in the epoxy resin composition of the present invention, relative to the total epoxy resin of the epoxy resin: the same as the epoxy resin and other epoxy resins) Oxygen oxime: 1:, selected as °. 7~u equivalent. If the relative content is less than 0.7 equivalents or more than L2 equivalents of the base surface, the example of 2-ethyl amide bite can be exemplified by: 2-mercaptomethylamine methyl) benzene test ^ 4 曱 base taste Saliva and other Mi Jun, 2 ren grade amines, triphenyl phenyl, etc. ^: ^^;:) 10 - carbon thin · 7 and so on 3, the amount of the agent according to the need of $ public compounds. Hardening meter (the epoxy tree of the present invention: the total amount of the hardening accelerator is selected as the total part of the epoxy resin, and the oxygen-selective tree is used, the same as the weight of the epoxy tree of the invention ==.1~, Parts by weight. Bmder resin. Adhesive extension can be added with acrylonitrile bismuth rubber as needed. _ phenol coating, nylon 4 resin, NBR (propylamine resin, poly-bromide tree, 匕, 曰, shout .R resin, poly brewing, 曰石夕树腊, etc., but not limited to 200817450 25930pif.doc

Jit bonded tree (4) contains the remaining data according to f (4) ring, the flame retardancy of the cured product of the composition, resistance to shell: Γ〇 乳 milk 5 = a total of 1 () 〇 by weight, the adhesive resin contains 'usually 〇. (b to 50 parts by weight, preferably 〇〇5 to 2 parts by weight. 吊 a a 〇 In addition, an inorganic filler is added to the epoxy tree test towel of the present invention. The inorganic filler can be refined according to the basis Distillation, oxidation|g, 鍅石^:; ^ fossil, r-nitrogen, boron nitride, two stones, titanium dioxide, talc powder, or other beads, but not limited The above test benefit;: 2_ is used to obtain, can also be two or more;; use, "in the ^ Ming can be a separate wax composition, the above inorganic filler:: excellent; epoxy tree • It is particularly preferably 70 to 95% by weight. In the case of the (4) fat composition, it is possible to add: a mixture of a mixture, a stearic acid mold, a pigment, etc., and various thermosetting resins. Two = each person, ^ word The above fat composition is hardened and easily obtained. Specifically, 'for example, use a weaving machine, kneading the epoxy resin, hardening as needed. And according to the needs of the two ^ 200817450 25930pif.doc gentleman 匕 k back, willing machine filler, etc.) fully mixed until uniform, to get the cyclized product 'this epoxy resin composition, after using the scales The machine or the like is molded, and further, the hardened material of the epoxy resin composition of the present invention can be obtained by adding f2 to 1% under (10) to C. f) Ο In addition, the epoxy resin composition of the present invention For the hardened material, the above epoxy wax composition can be dissolved in toluene, xylene, acetone, butyl hydrazine, decyl isobutyl _, dimethyl decylamine, trimethyl acetamide, N-methyl pyridine Slightly 嗣, etc., to form the county resin domain _ varnish (vanish), then, the varnish is penetrated into the glass fiber, carbon fiber, poly = fiber, oxidation _ dimensional, paper and other substrates, heat drying, 斤 传i^^(pre_preg) is obtained by hot press forming. It should be noted that in the mixture of the fat composition and the solvent, the solvent used in the epoxy resin composition 2V is usually used in an amount of 1. to 70 wt. %, preferably 15~70 wt%. In addition, when the epoxy resin of the present invention is to be used When it is used as a modifier for a film-type epoxy resin, specifically, it can be used for the softening of wood. The above-mentioned film-type epoxy resin composition, for example, can be hunted by the above epoxy resin. The varnish of the composition is coated on the release film, and the solvent is removed under heating to obtain a sheet-like adhesive. [Taste: Mixture] can be used as an interlayer insulating layer of a multilayer substrate or the like. w ^ Epoxy of the present invention The resin composition and the cured product thereof can be used in various applications such as eight doses and encapsulating materials. The above #mixture can be used for wood, construction, automotive, general affairs, and medical use, 17 200817450 25930pif.doc and Adhesive for electronic materials. Specific examples of the binder for an electronic material include an interlayer adhesive for a multilayer substrate such as a build-up substrate, a chip bonding (out of 13 〇 11 哗) agent, and an underfill (1111 卜 | 111). For the reinforcement of the underfill, the anisotropic conductive film (using a conductive adhesive (ACP) and other packaging adhesives. The above packaging materials include capacitors, transistors, diodes, Ο Ο „ pole tube, IC, LSI, etc. use shouting, impregnation, transfer razor fin package, Ic, 〇c的b, coffee B package: cover iP_eW solution (4) underfill, and so on. * Sealing at the time of IC type mounting (underfill for reinforcement) <<:Examples>> The present invention will be described in more detail by way of example, but the description of this example is not clear. In the following, as long as the ring gas: 曰::月', the "parts" in the composition indicates the parts by weight. In addition, the preparation and softening point of the clothes are as follows (1) Epoxy equivalent, unit is g/eq. The method described in JIS K-7236 is carried out by the method described in (2) Softening point 祆fe JISK-7234. The unit is .c (Refer to Synthesis Example 1) The method described in the publication No. 277717, the aralkyl phenolic resin represented by the formula (b) (XLC-31^, Mitsui Chemicals, Inc., 2008 20085050 25930pif.doc, OH) The equivalent oxidation is 172 g/eq, and the softening point is 7 Γ〇.

〇 (where η is about 3 (average value).) In detail, 100 parts of XLC-3L and 268 parts of epichlorohydrin are added to a flask equipped with a stirrer, a reflux condenser, and a stirring device, and the temperature is raised to 120. At ° C, it was dissolved, and 58 parts by weight of an aqueous sodium hydroxide solution was slowly added dropwise to the solution over 3 hours. In the dropwise addition, while using, the Dean-Stark water separator discharges the azeotropic water out of the system and the private epoxy chlorinated to reach the system and react '. 'And another wide reaction temperature is maintained at 100~; [pits are carried out. After the completion of the dropwise addition, the reflux was carried out again, and the reaction was started after the water was no longer distilled off, and further simmered for 1 hour. Then, the reaction solution is cooled to the chamber, W, gland, and the salt is removed by filtration, at the highest ▲ 14 叱 heart#

St" epichlorohydrin, an epoxide of an aromatic: phenol-p-lipid represented by the above formula (8) (crude) is obtained. The epoxide of the _ type is dissolved in a tertiary courtyard solution of 4 ===. Therefore, in the W methyl *T-based ketone, a total of 12,290 parts of 2% aqueous solution of bismuth hydrogen bismuth hydride in the form of a total of 5 〇t was obtained, three times. In the pure water of the pottery, as a residue, obtained; ; ^ 备 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Eq, the softening point is 52.0 ° C. (Example 1) 100 parts of xylene-based resin represented by the following formula (3) is added to a flask equipped with a stirrer, a reflux condenser, and a stirring device (Xystar) GP%, manufactured by FUDOW Co., Ltd., 〇H equivalent is IN g/eq, softening point is 85 ° C):

(wherein, η represents the number of repetitions.), 187 parts of epichlorohydrin and u parts of methanol were heated to 75 with stirring. 〇, to dissolve it, after adding 21 parts of flaky sodium hydroxide in batches over 90 minutes, the temperature was maintained at Naiyi, and the reaction was performed for one hour. After the reaction is completed, it is washed with water and a rotary evaporator (r〇tary)

Evaporator, at 144 ° C under reduced pressure, excess solvent such as epoxidized chloropropanone is distilled off from the oil layer. To the residue you are made by ‘ λ 0/11 A TM e M

(Example 2 and Comparative Example)

Epoxy resin paid (b)

) 'Use the reference as a comparative example' using KAYAHARD 200817450 25930pif.doc GPH-65 (7) The chemical company (stock) company, the equivalent weight is ΐ99 lion, softening = 6D.0C, biphenyl-cracked condensed aromatic alkyl (Resin resin) as hardening two or:: use strict? (diphenylphosphine, manufactured by Beixing Chemical Industry Co., Ltd.) (4) 'Prepare according to the formula shown in Table 1 (parts by weight), prepare the use of ~ Resin composition. ϋ by transfer molding (175 Ο ο basin on 16 this ^ 5 turn _ shouting into a riding reduction body, and then (4) 〇 C under hardening for 2 hours, and _ step under · c harden for 8 hours. Table <

: This operation is measured by the following method. The results are shown in Table 2. Tian Yihang Female (3) Water absorption test The hardened material was made into a pi μ diameter of 5 cmx and a thickness of 4 mm. The test piece was obtained under the following conditions. (3) The weight increase after boiling in the water (4) is in the discussion (4), the relative humidity increase rate (%). The weight after the 24 hours of the shell (4) The dielectric constant is measured as %. Use 1 GHZ cavity resonance meter (Kanto Electronics)门 门 / / / as a dielectric loss factor measuring fixture, measuring dielectric ^: Nu (stock) company) 200817450 25930pif.doc Table 2 - -~-- Example 2 Comparative Example 1 Water absorption (〇 / 0) (8) (%; l〇〇°C/water x24Hr) 0.91 1.04 (b) (%; 85〇C/85%RHx24Hr) 0.55 0.64 121°C/l〇〇%RHx24Hr) 1.11 1.23 3.03 3.11 (Example 3 and comparison Example 2) Using the epoxy resin (a) obtained in Example 1, the epoxy resin (9) obtained in Reference Synthesis Example 1 was used as a comparative example, KAYAHARD GPH-65 was used as a curing agent, and TPP was used as a hardening accelerator. MSR-2212 (manufactured by Ronsen Co., Ltd.) was used as an inorganic filler.

Carnauba No. 1 (manufactured by CERARICA NODA Co., Ltd.) as a wax, and using KBM-303 (manufactured by Shin-Etsu Chemical Co., Ltd.) as a decane coupling agent, prepared according to the formulation (parts by weight) shown in Table j Invention and comparative epoxy resin composition. The epoxy resin composition was made into a resin molded body by being transferred to S (175 〇 c, 60 seconds), and then cured at 160 ° C for 2 hours, and further hardened at 180 ° C for 8 hours. . Example 3 Comparative Example 2 Epoxy Resin (a) 20 Epoxy Resin (b) 20 _ KAYAHARD GPH-65 One TPP One part by weight 14.3 16.7 0.20 0.20 __ MSR-2212 174.8" 187.2 One Carnauba No. 1 0.63 to 0.68 — KBM-303 0.70] 〇.7^_ ❹ __ Table 3 The flame retardancy of the cured product obtained in this way was measured by the following method. The results are shown in Table 4. (5) Flame retardancy 22 200817450 25930pif.doc The total burning time of test pieces of thick 〇·8 mtn and 1·6 mm was measured according to UL-94. It should be noted that the total burning time refers to the time until the self-extinguishing. --- Example 3 Comparative Example 2 lij (thickness 0-8 mm) Total burning time (seconds) 25 32 (thickness 1.6 mm) Total burning time (seconds) 55 75 ^" (Example 4) Implementation The epoxy resin (a) obtained in Example 1 was represented by the above formula (3), which was represented by Xystar GP9®, manufactured by FUD〇w Co., Ltd., 〇H, when set to I97 g/eq, and the softening point was 85 as a hardening accelerator, according to the daily ¥ 5 ^ for the Zha Shi and the use of the epoxy resin composition of the present invention in parts by weight, the second generation of the epoxy tree test object into ^ by transfer molding (175 ° c, (9) c After hardening for 2 hours, Feng Xiaozhi molded the body, and then hardened it for 8 hours at 160 u. Example 4 --------- yy Zl L__ parts by weight |~ ι4> - Example 2 The water absorption rate of the a7a substance and the water absorption rate and dielectric constant of the method of Example 2 are shown in Table 6. 23 200817450 25930pif.doc Γ—^一表6_ ^-__ rfTf \ JT ——_____ ______ Example 4 and water^) (%; 100°c/water x24Hr) { } ; 85〇C/85%RHx24Hr) 1 °C /1 〇〇%RHx24Hr) 0.88 0.44 1.10 2.98 ---- --- 乂 气 树脂 resin group The cured product of the product, as shown in Table 2, had a low absorption ratio and a low dielectric property as compared with the cured product of the epoxy resin composition of the comparative example. Further, as shown in Table 4, the ring of the present invention = &,, and the cured product of the product is a cured product having a burning time and properties. On the other day, the gentleman H /, 啕丨 Ο ο MU MU Ah contains the same aralkyl phenolic resin composition as the invention: the main moon frame, can be named The hardships of humanization are too hard to listen to financial sighs and low dielectric properties. The above characteristics are useful in electrical and electronic materials. In the case of a +-conductor seal, the present invention has been disclosed in the preferred embodiments, and the present invention is defined, and any such (four), = sub-African, and within the scope, when a slight change can be made with the spirit of the 2 county invention Attached Patent Application _Definition = Protection of the Invention [Simple description of the drawing] The latter is subject to change. -fe 〇 η,, [Description of main component symbols] 24

Claims (1)

200817450 25930pif.doc X. Patent application range: Anthraquinone resin, which is obtained by epoxidizing a resin of 160 to 230 g/eq represented by the following formula (1) to obtain a type of " 1 each independently exists, p represents a carbon atom number of 1 to 6 white tti Γ or a carbon number of 1 to 6, m represents a positive number of 〇 〜 3, n is the number of repetitions, • CH2-^3--Η (^)m^ Π OH Ο υ Λ (1) 2·- an epoxy tree composition containing 4 fans of epoxy resin and hardener. A month of patented dry brothers, a kind of hardened material, will be formed as a hard surface of the composition of the milk tree. The ring described in the item (4) (4) The manufacturing method has a feature quantity of 160 to 23. (4) Resin and 'carboniferous atomic number Ϊ; broadly p, R and m exist independently, p denotes a burning group, m ΐ 'R _ _ _ sub-number is 1 to 6, an integer of 0 to 3, η is repeat times, 25 (1) 200817450 25930pif.doc VII. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the component symbols of this representative figure: None. 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: f, none.