200816883 九、發明說明： 本申請案主張2〇06年9月27日在日本專利局所提出之 曰本專利申請案第2006_263〇83號的優先權。以提及 併入該優先權申請案之全部。 二 【發明所屬之技術領域】 中 本揭露係有關於一種電子裝置，該電子裝置包括 所安裝之一電子組件及一天線。 /、 【先前技術】 盆例如：具有各種型態之電子裝置，該等電子裝置包括在 ，中所安裝之像主動元件及被動元件的電子組件。近幾年 ，:例如：具有一無線電通信模組（包括一射頻通信 單兀、一 MCU(微電腦）單元、一石英振盪器等）之 置經常使用於各種情況中。 、 圖1係顯示一種具有一無線電通信模組之電子裝置的 概要之圖式。參考圖1，在此圖式中所示之電子裝置具有 C下面結構：在一佈線基板丨上安裝構成該無線電通信模組 之複數個電子組件2及3。 士再者’該電子裝置藉由—天線之使用以實施無線電通 口此，在5亥佈線基板1上形成一由一圖案化導電層所 構成之天線4。 曰 另外，在圖2所示之電子裝置中，安裝一晶片天線5以 取代圖1所示之天線4。在該佈線基板1上，將用於該晶 片天線5之天線匹配組件6安裝在該晶片天線5之附近 中。 312XP/發明說明書(補件)/96-10/96133851 6 200816883 [專利文件1]日本專利未審查公告第2〇〇4—1 59287號。 [專利文件2]曰本專利未審查公告第2〇〇5 —1 91827號。 [專利文件3]曰本專利未審查公告第1〇-93332號。 然而，對於該電子ft置而纟，該天線佔用該安裝基板有 大的面知，此可能不利地造成有關該電子裝置之尺寸縮小 的問題。 例如：在圖1所示之電子裝置的情況中，為了實施該天 (線4之圖案化，以便該電子裝置具有一指定效能，在該佈 線基板1上所佔用之面積增加了，導致該電子裝置之尺寸 縮小的困難度。 再者’在圖2所示之電子裝置的情況中，雖然該晶片天 線5小於該天線4(天線圖案），但是需要與該等天線匹配 組件6 -起使用。基於此理由，考量該晶片天線與該等天 線匹配組件，在該佈線基板切佔用之面積㈣地增加 了。 (;【發明内容】 本發明之示範性具體例提供一種新穎且有用之電子裴 置。 & 本發明之示範性具體例提供一種電子裝置，該電子妒置 包括在該電子裝置中所安裝之—電子組件及—天線，其:中 該電子裝置之尺寸被縮小。 一種依據一個或多個示範性具體例之電子裝置包括··一 基板；-電子組件，被安裝在該基板上；―天、線，被安裝 在該基板上；以及-樹脂材料’包含—在該樹脂材料中^ 312XP/發明說明書(補件)/96-10/96133851 7 200816883 加入之介電常數調整材料且密封該電子組件及該天線。 依據本發明之一個或多個示範性具體例，變成可縮小一 電子裝置之尺寸，其中該電子裝置包括在該電子裝置中所 安裝之一電子組件及一天線。 再者，亦可接受該介電常數調整材料包括碳化矽（SiC) 及氮化矽（SiN)。 又另外，亦可接受該介電常數調整材料包括一金屬化合 物0 f 再者，亦可接受一構成該金屬化合物之金屬包括鋁 (A1)、鈦（Ti)、鈕（Ta)及錯（Zr)中之任何金屬。 然而，亦可接受該金屬化合物包括三氧化二鋁（Ah〇3) 或氮化铭（A1N)。 另外’亦可接受加入該彳電常數調整材料，以便該樹脂 之介電常數在該天線之附近比在該電子組件之附近高。 依據本發明之—個或多個示範性具體例，變成可縮小該 c电子衣置之尺寸，該電子裝置包括在該電子裝置中所安裝 之一電子組件及一天線。 從下面詳細描述’所附圖式及請求項可以明顯易知其它 特徵及優點。 【實施方式】 -種依據本發明之示範性具體例的電子裝置包括··一其 板；-電子組件，被安裝在該基板上；一天線，被安裝: 遠基板上；以及一樹脂材料 #人 , 曰何科包含一在該樹脂材料中所加 入之介電常數調整材料且密封該電子組件及該天線。 312XP/發明說明書(補件)/96-10/96133851 δ 200816883 例如··加入一高介電常數之金屬化合物（金屬氧化物或 金屬氮化物）的粉末至該樹脂材料，以能使該樹脂材料之 介電常數增加。再者，可以使用Sic或SiN做為該介電常 數調整材料。上述配置能使由該具有高介電常數之樹脂材 料所包圍之天線的尺寸縮小。再者，能使該電子裝置之尺 寸縮小’其中該電子裝置包括在該電子裝置中所安裝之一 電子組件及一天線。 然後，將參考所附圖式以描述該電子裝置之結構的特定 實施例。 [實施例1] 圖3係綱要性地顯示依據本發明之實施例丨的一電子裝 置的圖式。參考圖3，依據本發明之電子裝置1〇的略 圖係配置成如下。在一佈線基板n上安裝電子組件12_15 及一天線16。再者，以一樹脂材料17密封該等電子組件 12 -15及該天線16。 例如：該電子組件12包括一主動元件，以及該等電子 組件13-15包括被動元件。然而’料電子組件之數目及 該等主動元件與該等被動元件之比率並非侷限於此。因 此，對於該配置可以實施各種變更（增加或減少）。 一〜包卞殂仵構成一盔 通信模組時，在該佈縣们丨上安裝㈣應於—射頻（^) 通^兀或- MCIK微電腦）單元之電子組件12及 石英振盪器及電容器之電子組件—15。 在依據此實施例之電子裝置中， 丁衣罝T，將一用以調整該樹脂材 312XP/發明說明書(補件)/96-10/96133851 200816883 料π之介電常數的介電常數調整材料加至該樹脂材料 17例如·藉由使用一具有比相關技藝環氧樹脂材料（且 有約4之介電常數）高之介電常數的材料做為該介電常數 調整材料，可增加該樹脂材料17之介電常數。 結果，以一高介電常數材料（具有約8_2〇之介電常數） ，圍該天線16之周圍。因此，該天線16之小尺寸足以獲 侍相同於該相關技藝之特性。此能使該電子裝置丨〇之又 寸縮小。。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 All of the priority applications are incorporated by reference. [Technical Field of the Invention] The present disclosure relates to an electronic device including an electronic component mounted and an antenna. / / [Prior Art] A basin, for example, has various types of electronic devices including electronic components such as an active component and a passive component mounted in the same. In recent years, for example, having a radio communication module (including a radio frequency communication unit, an MCU (microcomputer) unit, a quartz oscillator, etc.) is often used in various situations. Figure 1 is a diagram showing an outline of an electronic device having a radio communication module. Referring to Fig. 1, the electronic device shown in this figure has a C underlying structure: a plurality of electronic components 2 and 3 constituting the radio communication module are mounted on a wiring substrate. Further, the electronic device employs an antenna to implement a radio port, and an antenna 4 composed of a patterned conductive layer is formed on the 5-inch wiring substrate 1. Further, in the electronic device shown in Fig. 2, a wafer antenna 5 is mounted in place of the antenna 4 shown in Fig. 1. On the wiring substrate 1, an antenna matching unit 6 for the wafer antenna 5 is mounted in the vicinity of the wafer antenna 5. 312XP/Invention Manual (supplement)/96-10/96133851 6 200816883 [Patent Document 1] Japanese Patent Unexamined Publication No. 2-4-1 59287. [Patent Document 2] 未Unexamined Patent Unexamined Bulletin No. 2〇〇5-1 91827. [Patent Document 3] Unexamined Patent No. 1933-93332. However, for the electronic ft, the antenna occupies a large area of the mounting substrate, which may disadvantageously cause a problem of downsizing of the electronic device. For example, in the case of the electronic device shown in FIG. 1, in order to implement the day (the patterning of the line 4 so that the electronic device has a specified performance, the area occupied on the wiring substrate 1 is increased, resulting in the electron Further, in the case of the electronic device shown in FIG. 2, although the wafer antenna 5 is smaller than the antenna 4 (antenna pattern), it is necessary to use the antenna matching unit 6 together. For this reason, considering the wafer antenna and the antenna matching components, the area occupied by the wiring substrate is increased (4). [Invention] The exemplary embodiment of the present invention provides a novel and useful electronic device. An exemplary embodiment of the present invention provides an electronic device including an electronic component and an antenna mounted in the electronic device, wherein the size of the electronic device is reduced. An electronic device of a plurality of exemplary embodiments includes: a substrate; an electronic component mounted on the substrate; "day, line, mounted on the substrate; and - The resin material 'comprises' - in the resin material ^ 312XP / invention specification (supplement) / 96-10/96133851 7 200816883 added dielectric constant adjusting material and seals the electronic component and the antenna. According to one or more of the present invention An exemplary embodiment becomes that the size of an electronic device can be reduced, wherein the electronic device includes an electronic component and an antenna mounted in the electronic device. Further, the dielectric constant adjusting material can also be accepted to include tantalum carbide. (SiC) and tantalum nitride (SiN). In addition, the dielectric constant adjusting material may also be accepted to include a metal compound 0 f. Further, a metal constituting the metal compound including aluminum (A1) and titanium may be acceptable. Any metal in Ti), button (Ta) and (Zr). However, it is also acceptable to include the metal compound including aluminum oxide (Ah〇3) or nitride (A1N). The electric constant adjusts the material such that the dielectric constant of the resin is higher in the vicinity of the antenna than in the vicinity of the electronic component. According to one or more exemplary embodiments of the present invention, the c-electronic clothing can be reduced. The electronic device includes an electronic component and an antenna mounted in the electronic device. Other features and advantages will be apparent from the following description of the drawings and claims. An electronic device according to an exemplary embodiment of the invention includes: a board; an electronic component mounted on the substrate; an antenna mounted on the far substrate; and a resin material #人, 曰科科包括一在a dielectric constant adjusting material added to the resin material and sealing the electronic component and the antenna. 312XP/Invention Manual (Supplement)/96-10/96133851 δ 200816883 For example, adding a high dielectric constant metal compound ( A powder of a metal oxide or a metal nitride is applied to the resin material to increase the dielectric constant of the resin material. Furthermore, Sic or SiN can be used as the dielectric constant adjusting material. The above configuration can reduce the size of the antenna surrounded by the resin material having a high dielectric constant. Furthermore, the size of the electronic device can be reduced. The electronic device includes an electronic component and an antenna mounted in the electronic device. A specific embodiment of the structure of the electronic device will now be described with reference to the drawings. [Embodiment 1] Fig. 3 is a view schematically showing an electronic device according to an embodiment of the present invention. Referring to Fig. 3, an outline of an electronic device 1 according to the present invention is configured as follows. An electronic component 12_15 and an antenna 16 are mounted on a wiring substrate n. Further, the electronic components 12-15 and the antenna 16 are sealed with a resin material 17. For example, the electronic component 12 includes an active component and the electronic components 13-15 include passive components. However, the number of electronic components and the ratio of the active components to the passive components are not limited thereto. Therefore, various changes (increase or decrease) can be implemented for this configuration. When the package is configured as a helmet communication module, the electronic components 12 and the electronic components of the quartz oscillator and capacitors of the radio frequency (^) or the MCIK microcomputer are installed on the cloth county. —15. In the electronic device according to this embodiment, a dielectric constant adjusting material for adjusting the dielectric constant of π of the resin material 312XP/invention specification (supplement)/96-10/96133851 200816883 is used. The resin material 17 can be added, for example, by using a material having a dielectric constant higher than that of the related art epoxy resin (and having a dielectric constant of about 4) as the dielectric constant adjusting material. The dielectric constant of material 17. As a result, the periphery of the antenna 16 is surrounded by a high dielectric constant material (having a dielectric constant of about 8 Torr). Therefore, the small size of the antenna 16 is sufficient to achieve the same characteristics as the related art. This can reduce the size of the electronic device.
士再者丄當例如使用-金屬化合物於該介電常數調整材料 日令可各易地增加該樹脂材料之介電常數。例如可使用鋁 ^ )鈦（Ti )、鈕（Ta)及鍅（Zr)之任何金屬做為用以形成 該金屬化合物之金屬。在另一情況中，亦可以以混合方式 使用這些金屬或金屬化合物。 例如：金屬氧化物Al2〇3及金屬氮化物A1N 一 =化合物之特定實施例，以及容易獲得且可以低成=來 製造’因而比較好。特別地，Ah()3具有高介電常數，以及 容1以粉末（粒子）狀來形成，以便被加入該樹脂材料。因 為这些理由，Ah03做為該介電常數調整材料係更好的。再 者，該介電常數調整材料不侷限於這些材料。例如·可以 使用被 5 示成 Tix〇y、Ta»〇n 及 ZrP〇q(其中 x、y、m、n、P 及q之每一個係一整數）之材料。 入=二例如亦可使用一像SiC《SiN之發化合物做為該 吊數調整材料。例如：—模樹脂（環氧或聚亞酿胺樹 月曰）可以包含一含有被稱為矽石之Si〇2的材料，該以〇2做 312XP/發明說明書(補件)/96_1〇/96133851 10 200816883 為一被加入該模樹脂中以做 而，c; η θ 士 ^ 土！成分。麸 而Si〇2具有約4之介電常數。因此 :、、Further, for example, the use of a -metal compound in the dielectric constant adjusting material can easily increase the dielectric constant of the resin material. For example, any metal of aluminum (Ti), button (Ta), and ytterbium (Zr) can be used as the metal for forming the metal compound. In another case, these metals or metal compounds can also be used in a mixed manner. For example, a specific embodiment of the metal oxide Al2〇3 and the metal nitride A1N= compound, as well as being readily available and which can be made low to manufacture, is preferred. Specifically, Ah()3 has a high dielectric constant, and the volume 1 is formed in the form of a powder (particles) so as to be added to the resin material. For these reasons, Ah03 is better as the dielectric constant adjusting material. Further, the dielectric constant adjusting material is not limited to these materials. For example, a material denoted by Tix〇y, Ta»〇n, and ZrP〇q (where each of x, y, m, n, P, and q is an integer) can be used. For example, a SiC "SiN hair compound" can be used as the lift number adjusting material. For example: - Mold resin (epoxy or polyamidamine tree) may contain a material containing Si〇2 called vermiculite, which is 312XP/invention specification (supplement)/96_1〇/ 96133851 10 200816883 To be added to the mold resin, c; η θ 士 ^ soil! ingredient. Bran and Si〇2 has a dielectric constant of about 4. Therefore :,,
或SiN之呈古古士人 日用一像SiC ^ ，、有问於矽石之介電常數的矽化合物做為誃八 電：數調整材料，可增加該樹脂材料之介電常數。、…丨 藉由加入一適當量之介電常數調整材料至例 樹脂’變成可調整（增加）該樹脂材料之介電常數至一= 值0 n 然而，當該所要加入之介電常數調整材料之數量太 =，無法獲得使該介電常數增加之充分效果。另一方面， 當該添加量太大時，喪失該樹脂之物理特性，以致於該樹 脂之硬化變得困難。因此，最好以約7〇體積百分比至8〇 體積百分比之量將該介電常數調整材料加至該樹脂材 料。再者，§该樹脂材料之介電常數太低時，該等效果係 小的。然而，該樹脂材料之太高介電常數造成低無線電波 輻射效率。因此，最好設定該介電常數為約6 —2〇。 I 圖4係顯示在該電子裝置10中所使用之天線16的立體 圖。藉由彎曲一例如銅之板狀導電材料形成該天線16。 因此，它具有一所謂倒F型天線之形狀。此一倒F型天線 係一使用共振之天線。因此，最好以使阻抗成為一指定值 之形狀（尺寸）來形成該天線16。因而，在該相關技藝中 很難保證該倒F型天線之安裝空間。再者，關於一相關技 藝通信單元，可以採用一種使該天線及該通信模組彼此分 離及分別安裝之方法。 在此情況下，在此實施例中，此一倒F型天線被安裝在 312XP/發明說明書(補件)/96-10/96133851 n 200816883 以 可Or the Sigu of the ancient Gu Shi people, such as SiC ^, 矽 compound with the dielectric constant of the meteorite as the 誃 eight electric: number adjustment material, can increase the dielectric constant of the resin material. , by adding an appropriate amount of dielectric constant adjusting material to the resin, the resin becomes adjustable (increased) to the dielectric constant of the resin material to a value of 0 n. However, when the dielectric constant adjusting material to be added is added The number is too = and a sufficient effect of increasing the dielectric constant cannot be obtained. On the other hand, when the amount of addition is too large, the physical properties of the resin are lost, so that hardening of the resin becomes difficult. Therefore, it is preferable to add the dielectric constant adjusting material to the resin material in an amount of from about 7 volume percent to about 8 volume percent. Further, when the dielectric constant of the resin material is too low, the effects are small. However, the too high dielectric constant of the resin material causes low radio wave radiation efficiency. Therefore, it is preferable to set the dielectric constant to be about 6 - 2 Torr. I Fig. 4 is a perspective view showing the antenna 16 used in the electronic device 10. The antenna 16 is formed by bending a plate-like conductive material such as copper. Therefore, it has the shape of a so-called inverted F antenna. This inverted F-type antenna is an antenna that uses resonance. Therefore, it is preferable to form the antenna 16 with a shape (size) in which the impedance becomes a specified value. Therefore, it is difficult to secure the installation space of the inverted-F antenna in the related art. Furthermore, with respect to a related art communication unit, a method of separating and separately mounting the antenna and the communication module from each other can be employed. In this case, in this embodiment, the inverted-F antenna is mounted on the 312XP/invention specification (supplement)/96-10/96133851 n 200816883.
一安裝有一通信模組之基板上，以及以-樹脂材料與用 構成該通信模組之電子組件—起被密封。由於此理由， 整合地安裝該等電子組件及該天線，並以縮小 之尺寸。 衣 再者’如以上所述，整 此，亦可配置該電子裝置 該等安裝電子組件在平面 置之尺寸的縮小。 合地密封該天線及該等元件。因 10 ’以便该天線16之一部分與 配置中重疊，此有利於該電子裝A substrate on which a communication module is mounted is sealed with a resin material and an electronic component constituting the communication module. For this reason, the electronic components and the antenna are integrally mounted and reduced in size. As described above, the electronic device can also be configured to reduce the size of the mounted electronic components in a planar manner. The antenna and the components are sealed in place. 10 ′ so that one part of the antenna 16 overlaps with the configuration, which is advantageous for the electronic device
圖5顯示圖3之電子裝置1〇沿著χ_χ，的剖面圖。夂考 圖5,完成安裝，以便該天線16之至少一部分位於在該 佈線基板11上所安裝之電子組件（例如：電子組件12)上 方。完成該配置’以便該等電子組件與該天線之至少一部 分在平面配置中重疊。 基於此理由’例如：相較於—先前有Μ 1或2所述之 相關技藝電子裝置，其中f要將料f子組件及該天線安 裝在該佈線基板上之相同平面上，依據此實施例之電子裝 置可將該天線及該等電子組件配置在一較窄空間中。因 此，依據此實施例，變成可縮小該電子裝置之尺寸，其中 該電子裝置包括在其中所安裝之電子組件及天線兩者。 另外，本發明並非侷限於該示範性實施例。如下面實施 例2 4所示，可以多方面地變更及修改實施例1。 [實施例2] ' 圖6係顯示依據本發明之實施例2的一電子裝置之圖 式’以及-對應於實施例i之圖5的圖*。然而，先前所 312XP/發明說明書(補件)/96-1 〇/96133851 12 200816883 ’因而可以省略其描 同於貫施例1之電子 述之元件係給予相同元件符號及記號 述。再者，未特別描述之元件具有相 裝置的元件之結構。 參考圖6，依據本發明之電子？'置係其中—對應於實施 =1之樹脂材料17的樹脂材料17A包括具有不同的介電 常數之一樹脂材料17a及一樹脂材料17b。 书 亦即’在此實施例之情況中，加入一介電常數調整材 料’以便用以密封該等電子組件12_15(圖3所示）及該天 線16之樹脂材料17A的介電常數在該天線16之附 (樹脂材料i7a)比在該#電子組件12_15之 材料17b)高。 T曰 此使下面描述成為可能。將在該等電子組件之附近中嗖 定低的介電常數（例如，大約4)，以便減少在該等電子 件與佈線上所施加之寄生電容。因此，在保持該通信模組 之操作速度的同時，實施該天線之尺寸的縮小。 I;在此實施例之情況中，採用下面結構（雙模結構）。形成 該樹脂材料17a(包含一在其中所加入之介電常數調整材 料及具有-高介電常數）’以便覆蓋該天線16之周圍。進 一步以該樹脂材料l7b來密封被該樹脂材料17a所覆蓋之 天線1 6。 1 當形成依據此實施例之電子裝置時，基本上只可以實施 下面私序^>首先，在該佈線基板u上安裝被該樹脂材料 1 7a所覆盍之天線1 6。藉由具有低於該樹脂材料〗&之介 電常數的樹脂材料〗7b之使用，密封被該樹脂材料na所 312XP/發明說明書(補件)/96-10/96133851 13 200816883 覆蓋之天線16。名里 _ φ _ 牡另一情況中，當形成被該樹脂材料17a 所覆盍之天線1 6拄，M , 面朴 才猎由例如靜電吸附以該樹脂材料1 7a 覆盍該天線16。 [實施例3] …、而圖7係顯不依據本發明之實施例3的-電子裝置 2圖式以及-對應於實施例！之圖5的圖式。可是，先 ::述之το件係給予相同元件符號及記號，因而可以省略 ί 」田述。再者’未特別描述之元件具有相同於實施例1之 電子裝置的元件之結構。 主在此圖式中所不之情況中，如同實施例2(圖6)所示之 月、力入^丨電私數調整材料，以便用以密封該等電子 2 12_1/(圖3所示）及該天線16之樹脂材料ΠΒ的介 電常數在該天線16之附近中（樹脂材料17a)比在該等電 子組件12-15之附近中（樹脂材料⑽高。基於此理由， 產生相同於實施例2之情況的效果。然而，在此實施例之 情況中，特徵在於該樹脂材料17β具有—2_層結構，並 中使具有不同介電常數之樹脂材料彼此堆疊。 亦即，對於該下層（該等電子組件12_15及該佈線基板 之附近）而言’形成具有一低介電常數之樹脂材料 nb。然而’對於該上層（在該天線16之周圍）而言，形成 该包含被加入之介電常數調整材料且具 之樹脂材料17a。 ^ _ 由於此理由’相較於實施例2 ’可比較容易形成一從一 部分至另-部分具有不同介電常數之樹脂材料。附帶地， 312ΧΡ/發明說明書(補件)/96-10/96133851 200816883 當形成上述結構時，例如：基本上只 該樹脂材料1 7 a之順序實施密封。 [實施例4] 圖8係顯示依據本發明之實施例4 式’以及一對應於實施例1之圖5的圖 述之元件係給予相同元件符號及記號，Figure 5 is a cross-sectional view of the electronic device 1 of Figure 3 taken along χ_χ. Referring to Fig. 5, the mounting is completed such that at least a portion of the antenna 16 is located above the electronic component (e.g., electronic component 12) mounted on the wiring substrate 11. This configuration is done 'so that the electronic components overlap with at least a portion of the antenna in a planar configuration. For this reason, 'for example: compared to the related art electronic device previously described in Μ 1 or 2, wherein f is to mount the material sub-assembly and the antenna on the same plane on the wiring substrate, according to this embodiment The electronic device can configure the antenna and the electronic components in a narrow space. Therefore, according to this embodiment, the size of the electronic device can be reduced, wherein the electronic device includes both the electronic component and the antenna mounted therein. Further, the invention is not limited to the exemplary embodiment. As shown in the following embodiment 24, the embodiment 1 can be changed and modified in various ways. [Embodiment 2] Fig. 6 is a view showing an electronic device according to Embodiment 2 of the present invention and - Fig. 5 corresponding to Fig. 5 of Embodiment i. However, the previous 312 XP/Invention Manual (Supplement)/96-1 〇/96133851 12 200816883' can be omitted, and the same elements are denoted by the same reference numerals and symbols as those described in the first embodiment. Furthermore, elements not specifically described have the structure of the elements of the phase device. Referring to Figure 6, an electronic device in accordance with the present invention? The resin material 17A corresponding to the resin material 17 subjected to =1 includes a resin material 17a having a different dielectric constant and a resin material 17b. In the case of this embodiment, a dielectric constant adjusting material is added to seal the dielectric constants of the electronic components 12_15 (shown in FIG. 3) and the resin material 17A of the antenna 16 at the antenna. The attachment of 16 (resin material i7a) is higher than the material 17b) of the #electronic component 12_15. T曰 This makes the following description possible. A low dielectric constant (e.g., about 4) will be set in the vicinity of the electronic components to reduce the parasitic capacitance applied to the electronic components and wiring. Therefore, the size of the antenna is reduced while maintaining the operating speed of the communication module. I; In the case of this embodiment, the following structure (dual mode structure) is employed. The resin material 17a (including a dielectric constant adjusting material added thereto and having a high dielectric constant) is formed so as to cover the periphery of the antenna 16. The antenna 16 covered by the resin material 17a is further sealed with the resin material 17b. When the electronic device according to this embodiment is formed, basically only the following private sequence can be implemented. First, the antenna 16 covered by the resin material 17a is mounted on the wiring substrate u. The antenna 16 covered by the resin material na 312XP/invention specification (supplement)/96-10/96133851 13 200816883 is sealed by the use of a resin material 7b having a dielectric constant lower than that of the resin material & . In the other case, in the case where the antenna 16 6 拄, M covered by the resin material 17a is formed, the antenna 16 is covered with the resin material 17a by electrostatic adsorption, for example. [Embodiment 3] ..., and Fig. 7 shows an electronic device 2 according to Embodiment 3 of the present invention and - corresponding to the embodiment! Figure 5 is a diagram. However, the following descriptions are given to the same component symbols and symbols, so that ί" can be omitted. Further, the element which is not specifically described has the same structure as that of the electronic device of the embodiment 1. In the case of the main figure in this figure, as shown in the embodiment 2 (Fig. 6), the force is adjusted to the material to seal the electrons 2 12_1 / (shown in Figure 3 And the dielectric constant of the resin material 该 of the antenna 16 is in the vicinity of the antenna 16 (resin material 17a) is higher in the vicinity of the electronic components 12-15 (resin material (10). For this reason, it is the same as The effect of the case of Embodiment 2. However, in the case of this embodiment, the resin material 17β has a -2_layer structure, and resin materials having different dielectric constants are stacked on each other. The lower layer (these electronic components 12_15 and the vicinity of the wiring substrate) 'forms a resin material nb having a low dielectric constant. However, for the upper layer (around the antenna 16), the inclusion of the inclusion is formed The dielectric constant adjusting material and the resin material 17a. ^ _ For this reason, it is relatively easy to form a resin material having a different dielectric constant from a part to another part in comparison with Example 2. Incidentally, 312 ΧΡ / Invention Book (Supplement)/96-10/96133851 200816883 When the above structure is formed, for example, sealing is basically performed only in the order of the resin material 1 7 a. [Embodiment 4] Fig. 8 shows Embodiment 4 according to the present invention. The elements of the formulas and the figures corresponding to the figures of FIG. 5 of the embodiment 1 are given the same component symbols and symbols.
述。另外，未特別描述之元件具有相同 裝置的元件之結構。 在此實施例之情況中，如同該樹脂材料17b =材料17C具有-2-層結構，該2~層結構係由且有一 低，「电常數之樹脂㈣17b與-包含被加人之介 調整材料且具有一高介電常數之樹脂材料W所構：。 在=實施例之情況中，特徵在於藉由圖案化來形 t貝㈣1之天線16的天線16A。例如··當製造此圖 式中所不之電子裝置時，基本上只實施下面程序。Said. Further, elements not specifically described have the structure of the elements of the same device. In the case of this embodiment, as the resin material 17b = material 17C has a-2-layer structure, the 2-layer structure is composed of and has a low, "electrical constant resin (4) 17b and - contains an adjustment material to be added And a resin material W having a high dielectric constant: in the case of the embodiment, characterized by patterning the antenna 16A of the antenna 16 of the T4. For example, when manufacturing this figure In the case of an electronic device, basically only the following procedure is implemented.
依該樹脂材料 17b及 的一電子裝置之圖 式。然而，先前所 因而可以省略其描 於貫施例1之電子 首先，在該佈線基板11上安裝該等電子組件12_15(圖 ^所：）。然後’以該具有一低介電常數之樹脂材料”匕 始、封這些電子組件12~ 15。 接著，在該樹脂材料17b上堆疊一包含被加入之介 數調整材料且具有—高介電常數之樹脂材料17a。在此， 形成-穿過該等樹脂材料17a及17b之介層孔。再者，例 如以-電鍍法填滿該介層孔，以形成—介層插塞i6B。 然後，在該樹脂材料17a上藉由圖案化來形成要連接至 胃介層插塞16B之天線16A。該天線16A可藉由例如使用 312XP/發明說明書(補件)/96-1〇/961338、51 200816883 一罩幕圖案之濺鍍、CVD或沉積所形成。在另一情況中 該天線16A可以下列方式來形成。形成—覆蓋該樹脂材料 17a之導電膜，以及然後，使該導電膜經歷圖案蝕刻。接 著，再次形成該樹脂材料17a，以覆蓋該形成天線16a。 在此方式中，可形成被該樹脂材料17a所覆蓋之天 16A。 依據此實施例，可容易微加工該天線之圖案形狀。此進 ^ 一步能使該電子裝置之尺寸微型化及縮小。 直到目前，已描述本發明之較佳具體例。然而，本發明 並非侷限於此等特定具體例，以及在所附請求項所述:主 旨的範圍内可允許各種修改/變更。 依據本發明，變成可縮小一電子裝置之尺寸，該電子裝 置包括在其中所安裝之一電子組件及一天線。 【圖式簡單說明】 圖1係顯示一相關技藝電子裝置之圖式（第一）； (; 圖2係顯示一相關技藝電子裝置之圖式（第二）； 圖3係顯示依據實施例1之一電子裝置的圖式； 圖4係在圖3之電子裝置中所使用之一天線的立體圖； 圖5係圖3之電子裝置的剖面圖； 圖6係依據實施例2之一電子裝置的剖面圖； 圖7係依據實施例3之一電子裝置的剖面圖；以及 圖8係依據實施例4之一電子裝置的剖面圖。 【主要元件符號說明】 1 佈線基板 312XP/發明說明書(補件)/96-10/96133851 16 200816883 Γ ί. 2 電子組件 3 電子組件 4 天線 5 晶片天線 6 天線匹配組件 10 電子裝置 11 佈線基板 12 電子組件 13 電子組件 14 電子組件 15 電子組件 16 天線 16A 天線 16B 介層插塞 17 樹脂材料 17A 樹脂材料 17B 樹脂材料 17C 樹脂材料 17a 樹脂材料 17b 樹脂材料 312ΧΡ/發明說明書(補件)/96-10/96133851 17According to the pattern of the resin material 17b and an electronic device. However, the electrons described in the first embodiment can be omitted in the first place. First, the electronic components 12_15 (Fig. 2) are mounted on the wiring substrate 11. Then, the electronic components 12 to 15 are started and sealed by the resin material having a low dielectric constant. Next, a dielectric adjusting material containing the added dielectric adjusting material is stacked on the resin material 17b and has a high dielectric constant. The resin material 17a is formed therein through a via hole of the resin materials 17a and 17b. Further, the via hole is filled, for example, by electroplating to form a via plug i6B. Then, An antenna 16A to be connected to the gastric interlayer plug 16B is formed by patterning on the resin material 17a. The antenna 16A can be used, for example, by using 312XP/invention specification (supplement)/96-1〇/961338, 51. 200816883 is formed by sputtering, CVD or deposition of a mask pattern. In another case, the antenna 16A can be formed in the following manner: forming a conductive film covering the resin material 17a, and then subjecting the conductive film to pattern etching Then, the resin material 17a is formed again to cover the antenna 16a. In this manner, the sky 16A covered by the resin material 17a can be formed. According to this embodiment, the pattern shape of the antenna can be easily micromachined. This enters ^ The size of the electronic device can be miniaturized and reduced in one step. Until now, the preferred embodiment of the present invention has been described. However, the present invention is not limited to these specific specific examples, and as described in the appended claims: Various modifications/changes are allowed within the scope. According to the present invention, the size of an electronic device can be reduced, and the electronic device includes one of the electronic components and an antenna mounted therein. [Schematic Description] FIG. 1 shows a correlation. Figure 2 is a diagram showing a related art electronic device (second); Figure 3 is a diagram showing an electronic device according to Embodiment 1; 3 is a perspective view of an electronic device used in the electronic device; FIG. 5 is a cross-sectional view of the electronic device of FIG. 3; FIG. 6 is a cross-sectional view of the electronic device according to Embodiment 2; A cross-sectional view of an electronic device; and Fig. 8 is a cross-sectional view of an electronic device according to Embodiment 4. [Explanation of main component symbols] 1 Wiring substrate 312XP/Invention manual (supplement)/96-10/96133851 16 200816883 Γ 2 Electronic components 3 Electronic components 4 Antennas 5 Chip antennas 6 Antenna matching components 10 Electronic devices 11 Wiring boards 12 Electronic components 13 Electronic components 14 Electronic components 15 Electronic components 16 Antenna 16A Antenna 16B Interlayer plug 17 Resin material 17A Resin material 17B Resin material 17C Resin material 17a Resin material 17b Resin material 312ΧΡ/Invention manual (supplement)/96-10/96133851 17