05twf.doc/n 200815829 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種顯示面板盥晶壯邮 是有關於-種液晶顯示面板與晶片封裝體。衣肢’且特別 【先前技術】 t 為了配合現代之生活料，視訊或 漸趨於輕薄。然而在傳統的顯示技術中降 (Cathode Ray Tube，CRT)顯示器雖然仍具有‘點，2 其内部電子腔的結構難以小型化的問題，使得^極= :頁示器之體積難以達到輕薄化的需求。此外在;極 == 象的：，亦會有產生，__生而二 «月Ί劳吾寺問題。因此，近车杳人命 CP^p =流便逐漸地取代陰極射線管顯示器而成為 圖U會示為習知液晶顯示面板之示意圖，而圖2繪示 :回1之日日片封裝體沿14’方向的剖面示意圖。請同時參 + =二人圖2，習知液晶顯示面板1(>〇包括一液晶顯示面 板肢110、—電路板12〇以及多個晶片封裝體2〇〇，其中 料體·連接至f板主體11G與電路 曰曰片封裝體2〇〇包括一軟性基板21〇、一圖案化線路 2 2 0、—日· 曰曰片230以及一防鲜層（s〇ider resist) 240。軟 性基板210具有一接合區212、一接合區214與介於雨者 200815829 ^ 9 μ * ^ ^ 05trwf.doc/π 之間的非接合區216。圖案化導電層22()配置於軟性基板 210上，且圖案化導電層22〇具有複數個接塾（ 222與接墊224。接墊朗立於接合區212上，並且接塾 222適於與液晶顯示面板· 11〇連接。接墊创位於接 口區214上，並且接墊224適於與電路板12〇連接。晶片 230以覆晶接合（fllp chip b〇ndmg)技術〇r捲帶式封夺士 (Tape Camer Package )TCP配置在非接合區2i6上且晶 片230與圖案化線路層no電性連接。防鲜層·配置於 权11基板210上，並且覆盖部分的圖案化線路層㈣。 一圊3、’、曰示為gj 1中習知液晶顯示面板〉m方向之剖 面示意圖。請參照圖3,連接晶片封裝體與液晶顯示 面板主體110 $電路才反120之間的方法可以是下列步驟。 首先將兴方〖生‘黾膠（an!s〇tr〇扣c 如f此，ACf ) 配置於液晶顯示面板主體11〇之相對應於接合區212的表 面上，以及將異方性導轉配置在電路板120之相對應於 接口區214的表面上。接著將晶片封裝體2〇〇的接合區212 與接合區214分別熱壓合至液晶顯示面板主體n〇與電路 板120之相對應的表面上。之後，將異方性導電膠固化， 以使曰曰片封裝體2GG分別與液晶顯示面板主體11()、電路 板120連接。圖4繪示為經過熱壓合後而發生變形之習知 液晶顯示面板的示意圖。請參照圖4，由於電路板12〇的 熱膨脹係數高於液晶顯示面板主體丨⑻之熱膨脹係數，因 此在白知液晶顯不面板1〇〇熱壓合的過程中，電路板12〇 之收縮量會高於液晶顯示面板线UG之㈣量。由於液 200815829 ----..J905twf.doc/n 晶顯示面板主體110與電路板120之間收縮量的差異，因 此造成最外側之晶片封裝體200與液晶顯示面板主體110 之間較容易產生剝離或是造成最外側之晶片封裝體200產 生損傷（例如是接墊222與224發生斷裂）。05twf.doc/n 200815829 IX. Description of the Invention: [Technical Field] The present invention relates to a liquid crystal display panel and a chip package. Apparel' and special [Prior Art] t In order to cope with modern living materials, video is becoming lighter and thinner. However, in the conventional display technology, the Cathode Ray Tube (CRT) display still has a 'point, 2 the structure of the internal electron cavity is difficult to be miniaturized, so that the volume of the pager is difficult to achieve thinness and lightness. demand. In addition; pole == elephant:, there will be production, __ birth and two «月Ί劳吾寺 problem. Therefore, the near-vehicle life CP^p=flow gradually replaces the cathode ray tube display to become a schematic diagram of the conventional liquid crystal display panel, and FIG. 2 shows: Schematic diagram of the 'direction. Please refer to +=two-person figure 2 at the same time. The conventional liquid crystal display panel 1 (> includes a liquid crystal display panel limb 110, a circuit board 12A, and a plurality of chip packages 2〇〇, wherein the material body is connected to f The board main body 11G and the circuit board package 2A include a flexible substrate 21A, a patterned line 220, a ruthenium sheet 230, and a s〇ider resist 240. The flexible substrate 210 has a junction region 212, a junction region 214 and a non-bonding region 216 between the rainer 200815829 ^ 9 μ * ^ ^ 05trwf.doc / π. The patterned conductive layer 22 () is disposed on the flexible substrate 210, The patterned conductive layer 22 has a plurality of interfaces (222 and pads 224. The pads are disposed on the bonding area 212, and the interface 222 is adapted to be connected to the liquid crystal display panel. The pads are located in the interface area. 214, and the pad 224 is adapted to be connected to the circuit board 12. The wafer 230 is flip-chip bonded (Tape Camer Package) TCP is disposed in the non-joining area 2i6. And the wafer 230 is electrically connected to the patterned circuit layer no. The anti-fresh layer is disposed on the substrate 11 and Covering part of the patterned circuit layer (4). A 圊3, ', 曰 is shown in the gj 1 conventional liquid crystal display panel> m direction schematic view. Please refer to Figure 3, connecting the chip package and the liquid crystal display panel body 110 circuit The method between the reverse 120 can be the following steps. First, the Xingfang 〖sheng' silicone (an!s〇tr〇c, such as f, ACf) is disposed on the liquid crystal display panel main body 11 corresponding to the joint area The surface of the 212, and the anisotropy is disposed on the surface of the circuit board 120 corresponding to the interface region 214. Then, the bonding region 212 of the chip package 2 and the bonding region 214 are respectively thermocompression bonded to the liquid crystal. The display panel main body n is on the surface corresponding to the circuit board 120. Thereafter, the anisotropic conductive paste is cured to connect the chip package 2GG to the liquid crystal display panel main body 11 () and the circuit board 120, respectively. 4 is a schematic view of a conventional liquid crystal display panel which is deformed after thermocompression bonding. Referring to FIG. 4, since the thermal expansion coefficient of the circuit board 12 is higher than the thermal expansion coefficient of the liquid crystal display panel main body (8), LCD does not show up During the thermal bonding of the board 1 , the shrinkage of the board 12 会 will be higher than the amount of the liquid crystal display panel line UG. Since the liquid 200815829 ----.. J905twf.doc / n crystal display panel body 110 and The difference in the amount of shrinkage between the circuit boards 120 is such that the outermost chip package 200 and the liquid crystal display panel body 110 are more likely to be peeled off or the outermost chip package 200 is damaged (for example, the pads 222 and 224 breaks).
然而，在習知液晶顯示面板1〇〇講求高解析度的趨勢 之下，晶片封裝體200的線距與線寬也逐漸地縮小。換言 之，在液晶顯示面板主體11〇與電路板12〇之間具有熱膨 脹係數不匹配的問題下，最外側之晶片封裝體2〇〇與液晶 顯不面板主體11〇之間更容易產生剝離。 【發明内容】 雕 β次此吁、'仗π叼曰的就定在提供一種晶片封裝 肢’其與液晶顯示面板主體或電路板之間具有較佳的接合 強度。 口 板，Hit明的另—目的就是在提供—種液晶顯示面 板其在熱壓合的情況下具有較佳的可靠度。 基於上述目的或其他目的，本發明f一 :’其適於連接一液晶顯示面板主體與一電路：門、衣 晶片封裝體包括-軟性基板、化二‘ °此 r以及一晶片。軟性基板具有-第=:複;個強 合區與位於兩者之問夕一非拉人丧口^ 一弟二接 軟性基板上。強化魏置^區。圖案化線路層配置於 基於上述目的或其他目的，本發明提出—種液晶 強化墊由第-接合區至^’且這些 區上’並與圖案化線路層連£ °日日片配置於非接合 示 顯 7 05twf.d〇c/n 200815829 面板其包括一液晶顯不面板主體、一電路板以及一曰 封裝體。晶片封裝體配置於液晶顯示面板主體以及電= 之間，且與液晶顯示面板主體與控制面板連接。此^ 裝體包括-軟性基板、-圖案化線路層、複數個強 及-晶片。軟性基板具有-第一接合區、—第二接合區血 位於兩者之間之—非接合區。圖案化線路層配置於二性美 板上。強化墊配置於_化線路層之兩側，且這些強化ς 由第-接合區延伸至非接合區。晶片配置於非接 Ρ， 並與圖案化線路層電性連接。 η °°二 上述之這些強化墊更可以是配置於第二接合區上，且 这些強化墊由第二接合區延伸至非接合區。 =之這些強化墊更可以是由第—接 二接合區。 r 圖案;^圖述案之這些強化塾可以是具有一與電性連接無關之 個第圖第案置可:第具？人個第，以及多 接墊適於與液晶顯示面板主俨 —f且绝二弟 接合區上，且料第°弟二接墊配置於第二 Ί—接墊適於與電路板連接。 广:曰可以是以貼帶自動接合TAB ( tape 方式與圖案化線路層(ehlp°nfllm，C0F) 性美ΐί之晶i封f體更可以包括-防銲層，其配置於軟 性基板上’减蓋部分圖案化線路層。 8 200815829— 晶 暴於上述目的或其他目的，本發明提出一種晶片封裝 •’其適於連接一液晶顯示面板主體與一電路板之間。此 片封裝體包括此晶片封裝體包括/軟性基板、一圖案化 線路層、複數個強化墊以及一晶片。軟性基板具有一第一 接合區、一第二接合區與位於兩者之間之一非接合區。圖 案化線路層配置於軟性基板上。強化塾配置於第一接合區 内並且位於圖*化線路層之兩側。日日日片配置於非接合區 上，並與圖案化線路層電性連接。 基於上述目的或其他目的，本發明描巾4ώ '7^ B 0S ^ 面板，苴包括一谅曰骷一 本毛月扼出一種液晶顯不 ，、已栝/夜日日顯不面板主體、一電路你ri芬一曰Η 封裝體。晶片封裝體配置於曰- 曰曰 之間，且盥液曰顯、日日頌不面板主體以及電路板 J 、仗日日顯不面板主體斑批制；> 土 裝體包括一軟性基板、—圖案忒=板連接。此晶片封 及-晶片。軟性基板具有—第人:、複數個強化整以 位於兩者之間之一非接合區。圖^、一第二接合區與 板上。強化墊配置於第—接:/表路層配置於軟性基 之兩側。晶片配置於非接合=内亚且位於圖案化線路層 連接。 ^ 並與圖案化線路層電性 上述之這些強化墊更可以配置 位於圖案化線路層之兩侧。 、一接合區内，且赴 上述之這些強化墊可以具有―盥泰 案。 〃电性連接無關之圖However, under the tendency of the conventional liquid crystal display panel 1 to achieve high resolution, the line pitch and line width of the chip package 200 are also gradually reduced. In other words, under the problem that the thermal expansion coefficient does not match between the liquid crystal display panel main body 11A and the circuit board 12A, peeling is more likely to occur between the outermost chip package 2'' and the liquid crystal display panel main body 11'. SUMMARY OF THE INVENTION The embossing of β, the '仗π叼曰 is set to provide a chip package limb' which has a better bonding strength with the liquid crystal display panel body or the circuit board. The mouth plate, the other purpose of Hit, is to provide a liquid crystal display panel which has better reliability in the case of thermocompression bonding. Based on the above and other objects, the present invention is adapted to connect a liquid crystal display panel body and a circuit: the door and the package of the wafer include a flexible substrate, a second substrate, and a wafer. The flexible substrate has a -== complex; a strong area and a two-in-one on the soft substrate. Strengthen the Wei area. The patterned circuit layer is disposed for the above purpose or other purposes, and the present invention proposes a liquid crystal reinforced mat from the first junction region to the '' and on these regions' and is connected to the patterned circuit layer. The display panel 5 05twf.d〇c/n 200815829 panel includes a liquid crystal display panel body, a circuit board and a package. The chip package is disposed between the liquid crystal display panel main body and the electric device, and is connected to the liquid crystal display panel main body and the control panel. The package includes a flexible substrate, a patterned wiring layer, and a plurality of strong and - wafers. The flexible substrate has a first junction region, a second junction region, and a non-joining region. The patterned circuit layer is placed on the bisexual board. The reinforcing pads are disposed on both sides of the _ circuit layer, and the reinforcing ridges extend from the first land to the non-joining regions. The wafer is disposed in a non-connected manner and electrically connected to the patterned circuit layer. η ° ° 2 The above-mentioned reinforcing pads may be disposed on the second bonding region, and the reinforcing pads extend from the second bonding region to the non-bonding region. = These reinforced pads can be made up of the first junction. r pattern; ^ These enhancements of the diagram can be a picture that has nothing to do with the electrical connection: the first case? The first and the plurality of pads are adapted to be connected to the main surface of the liquid crystal display panel, and the second pad is disposed on the second substrate, and the pad is adapted to be connected to the circuit board. Wide: 曰 can be automatically bonded with TAB (tape method and patterned circuit layer (ehlp°nfllm, C0F) ΐ 之 之 i i i i 更 更 更 更 更 更 更 更 更 更 更 更 更 更 更 更 更 更 更 更 防 防 防 防 防 防 防 防 防 防 防 防 防 , The cover portion is patterned circuit layer. 8 200815829 - Crystallization for the above purpose or other purposes, the present invention provides a chip package which is adapted to be connected between a liquid crystal display panel body and a circuit board. The chip package comprises/a flexible substrate, a patterned circuit layer, a plurality of reinforcing pads and a wafer. The flexible substrate has a first bonding region, a second bonding region and a non-bonding region between the two. The circuit layer is disposed on the flexible substrate. The reinforcing layer is disposed in the first bonding region and is located on both sides of the circuit layer. The day and day sheets are disposed on the non-bonding region and electrically connected to the patterned circuit layer. For the above purpose or other purposes, the present invention describes a ώ 47 '7^ B 0S ^ panel, including a understanding of a 毛 毛 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种 一种You rif a glimpse The package body is disposed between the 曰-曰曰, and the sputum is displayed, the panel body and the circuit board J are not in the daytime, and the panel body is blanked; > the soil body includes a The flexible substrate, the pattern 忒 = the board connection. The wafer is sealed with a wafer. The flexible substrate has a first person: a plurality of reinforcements are located in a non-joining area between the two. Figure 2, a second junction area and The reinforcing pad is disposed on the first connection: / the surface layer is disposed on both sides of the flexible substrate. The wafer is disposed in the non-bonding = inneria and is connected in the patterned circuit layer. ^ and electrically connected to the patterned circuit layer The reinforcing pads may be disposed on both sides of the patterned circuit layer, in a joint region, and the reinforcing pads to the above may have a "盥泰 case."
上述之圖案化線路層可以I 個第二接塾。第-接墊配置於第1拉^第—接塾以及多 、弟接合區上，且這些第〜 200815829iow ^5twf.d〇c/n ^適於與液晶顯示面板主體連接。第二接墊配置於第二 妾口區上，且這些第二接墊適於與電路板連接。 上述之晶片可以是以TAB方式或C〇F方式與圖案化 線路層電性連接。 上述之晶片封裝體更可以包括一防銲層，其配置於軟 .性基板上，並覆蓋部分圖案化線路層。 • 綜上所述，本發明在晶片封裝體之圖案化線路層兩側 Φ 配置強化墊，因此在熱壓合下，使用此種晶片封裝體之液 晶顯示面板將具有較佳的可靠度。 #為瓖本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 【第一實施例】 圖5綠不為本發明第一實施例之液晶顯示面板的示意 圖。圖6A繪示為沿圖5之A-A，線的剖面示意圖，而圖6B ♦ 1 會不為沿圖5之B-B，線的剖面示意圖。請同時參照圖5、 圖6A與圖6B，液晶顯示面板30〇包括一液晶顯示面板主 體310、一電路板32〇以及多個晶片封裝體4〇〇，其中這些 。 晶片封裝體400連接於液晶顯示面板主體11〇與電路板 120之間。此外，連接晶片封裝體400與液晶顯示面板主 體310或電路板320之間的方法例如是利用異方性導電膠 來完成’而異方性導電膠固化的溫度例如是介於攝氏170 度至180度之間。 200815829. --3905twf.doc/n 晶片封裝體400包括一軟性基板4i〇、一圖案化線路 層420、多個強化墊43〇以及一晶片44〇。軟性基板41〇 包括一接合區412、一接合區414以及一非接合區416，其 中非接合區416介於接合區412與接合區414之間。圖案 化線路層420配置於軟性基板41〇上。晶片44〇配置於非 • 接合區416上，並且與圖案化線路層420連接。 ' 在本貫施例中，晶片440以TAB的方式與圖案化線 • 路層420連接。然而，晶片440也可以使用c〇F的方式與 固木化、、泉路層笔性連接（類似圖2所示）。值得注意的是， 上述之將晶片440與圖案化線路層42〇連接的方式並非用 以限定本發明所限定之範圍，凡適用於將晶片44〇與配置 於軟性基板410上之圖案化線路層42〇連接之技術皆適用 於本發明之液晶顯示面板3〇〇。 圖案化線路層420具有多個接墊422與接墊424。接 墊422配置於接合區412上，且接墊422適於盥 _ 面板主體3U)連接。接塾424配置於接合區414、上，錢 墊424適於與電路板32〇連接。 - 人。強化墊430配置於圖案化線路層、420之兩侧，且由接 『區川延伸至非接合區416，其中強化墊43〇為一與電 唑連接無關之圖案且強化墊43〇與圖案化 J同時形成：再者，強化墊·可由導電材如“化:路 运420之銅箔等構成或絕緣材如圖案化之防銲等，藉以增 =基板410剛性之材料所構成。在本實施例中；對‘ 早-晶片封裝體400而言，強化墊43〇是配置於這些接塾 11 200815829 〜“，w9〇5twf.doc/n 422中最外側之兩個接墊422旁，並且由接合區412延伸 至非接合區416。然而，在另一實施例中，強化墊43〇也 可以單獨配置於這些接墊424中最外側之兩個接墊424 旁，並且由接合區414延伸至非接合區416。 圖7與圖8緣示為圖5中另一種接塾的示意圖。請參 照圖7，強化墊430更可以同時分別配置於這些接墊422 與接墊424中最外側之兩個接墊424旁，並且分別由接合 φ 區412與接合區4M延伸至非接合區416。 請參照圖8,強化墊430a更可以由接合區412直接延 伸至接合區414。值得注意的是，上述之強化墊43〇或43〇a 的配置位置更可以視實際需要加以變化或混合使用。此 夕卜’上述之強化墊430或430a更可以具有與電性連接無關 之圖案（未繪示），以增加晶片封裝結構400與液晶顯示 面板主體110或晶片封裝結構400與電路板120之間的接 合力。 相較於習知技術’由於在晶片封裝體400之圖案化線 _ 路層420的兩側配置有強化墊430，因此在晶片封裝體4〇〇 與液晶顯示面板主體310或電路板32〇接合後，晶片封裝 體400之最外侧的接墊422與424較不易產生剝離或損傷。 【弟二貫施例】 圖9纟胃示為本發明弟一貫施例之液晶顯示面板示惫 圖。本實施例與上述實施例相似’其不同之處在於：在本 貝施例中，液晶顯示面板5〇〇包括一液晶顯示面板主體 410、一電路板420以及多個晶片封裝體600,其中這些晶 12 200815829^— 片封It體600連接於液晶顯示面板主體41〇與電路板42〇 之間。 晶片封裝體600包括一軟性基板41〇、一圖案化線路 層420、夕個強化墊430b以及一晶片440。在本實施例中， 晶片440以TAB的方式與圖案化線路層42〇電性連接（類 似圖5所示）。然而，晶片44〇也可以使用c〇F(chip〇nThe patterned circuit layer described above may have one second interface. The first pads are disposed on the first pull-and-contact pads and the plurality of pads, and the first to the first layers are connected to the main body of the liquid crystal display panel. The second pads are disposed on the second port area, and the second pads are adapted to be connected to the circuit board. The above wafer may be electrically connected to the patterned wiring layer in a TAB mode or a C〇F mode. The chip package described above may further include a solder resist layer disposed on the flexible substrate and covering a portion of the patterned wiring layer. In summary, the present invention provides a reinforced spacer on both sides of the patterned wiring layer of the chip package. Therefore, under thermal compression, a liquid crystal display panel using such a chip package will have better reliability. The above and other objects, features, and advantages of the present invention will become more apparent and understood by the appended claims appended claims [Embodiment] [First Embodiment] Fig. 5 is a schematic view showing a liquid crystal display panel of a first embodiment of the present invention. 6A is a cross-sectional view taken along line A-A of FIG. 5, and FIG. 6B ♦ 1 is not a cross-sectional view taken along line B-B of FIG. 5. Referring to FIG. 5, FIG. 6A and FIG. 6B simultaneously, the liquid crystal display panel 30A includes a liquid crystal display panel main body 310, a circuit board 32A, and a plurality of chip packages 4A, among which. The chip package 400 is connected between the liquid crystal display panel main body 11A and the circuit board 120. In addition, the method of connecting the chip package 400 to the liquid crystal display panel main body 310 or the circuit board 320 is performed, for example, by using an anisotropic conductive paste, and the temperature at which the anisotropic conductive paste is cured is, for example, between 170 and 180 degrees Celsius. Between degrees. 200815829. - 3905 twf.doc/n The chip package 400 includes a flexible substrate 4i, a patterned wiring layer 420, a plurality of reinforcing pads 43A, and a wafer 44A. The flexible substrate 41A includes a land 412, a land 414, and a non-bonding zone 416, wherein the non-bonding zone 416 is interposed between the land 412 and the land 414. The patterned wiring layer 420 is disposed on the flexible substrate 41. The wafer 44 is disposed on the non-bonding region 416 and is connected to the patterned wiring layer 420. In the present embodiment, the wafer 440 is connected to the patterned line layer 420 in a TAB manner. However, the wafer 440 can also be connected to the solid wood and the spring layer using a c〇F method (similar to that shown in Fig. 2). It should be noted that the above-described manner of connecting the wafer 440 to the patterned wiring layer 42 is not intended to limit the scope of the present invention, and is applicable to the patterned circuit layer of the wafer 44 and the flexible substrate 410. The 42 〇 connection technique is applicable to the liquid crystal display panel 3 of the present invention. The patterned circuit layer 420 has a plurality of pads 422 and pads 424. The pads 422 are disposed on the land 412, and the pads 422 are adapted to be connected to the panel body 3U). The port 424 is disposed on the land 414, and the pad 424 is adapted to be coupled to the circuit board 32A. - People. The reinforcing pad 430 is disposed on both sides of the patterned circuit layer 420, and is extended from the region to the non-bonding region 416, wherein the reinforcing pad 43 is a pattern unrelated to the connection of the electrosazole and the reinforcing pad 43 is patterned and patterned. J is formed at the same time: In addition, the reinforcing pad may be composed of a conductive material such as "construction: copper foil of road 420 or the like, or an insulating material such as patterned soldering prevention, etc., by increasing the rigidity of the substrate 410. In the example, for the early-chip package 400, the reinforcing pads 43A are disposed adjacent to the two outermost pads 422 of the interface 11 200815829~", w9〇5twf.doc/n 422, and The land 412 extends to the non-joining zone 416. However, in another embodiment, the reinforcing pads 43A may also be separately disposed adjacent the outermost two pads 424 of the pads 424 and extend from the land 414 to the non-bonding region 416. 7 and FIG. 8 are schematic views showing another interface of FIG. 5. Referring to FIG. 7, the reinforcing pads 430 may be disposed at the same time adjacent to the outermost two pads 424 of the pads 422 and the pads 424, respectively, and extend from the bonding φ region 412 and the bonding region 4M to the non-bonding region 416, respectively. . Referring to Figure 8, the reinforcing pad 430a may extend directly from the land 412 to the land 414. It is to be noted that the arrangement positions of the above-mentioned reinforcing pads 43A or 43〇a can be changed or mixed as needed. Further, the above-mentioned reinforcing pad 430 or 430a may further have a pattern (not shown) irrespective of electrical connection to increase between the chip package structure 400 and the liquid crystal display panel body 110 or the chip package structure 400 and the circuit board 120. Engagement force. Compared with the prior art, since the reinforcing pads 430 are disposed on both sides of the patterned line _ layer 420 of the chip package 400, the chip package 4 〇 is bonded to the liquid crystal display panel main body 310 or the circuit board 32 Thereafter, the outermost pads 422 and 424 of the chip package 400 are less likely to be peeled off or damaged. [Different application of the second embodiment] Fig. 9 shows the display of the liquid crystal display panel according to the consistent embodiment of the invention. This embodiment is similar to the above-described embodiment. The difference is that, in the embodiment, the liquid crystal display panel 5 includes a liquid crystal display panel main body 410, a circuit board 420, and a plurality of chip packages 600, wherein these Crystal 12 200815829^—The sheet-sealed It body 600 is connected between the liquid crystal display panel main body 41A and the circuit board 42A. The chip package 600 includes a flexible substrate 41, a patterned wiring layer 420, a reinforced pad 430b, and a wafer 440. In the present embodiment, the wafer 440 is electrically connected to the patterned wiring layer 42 in a TAB manner (similar to that shown in Fig. 5). However, wafer 44 can also use c〇F (chip〇n
film)的方式與圖案化線路層電性連接（類似圖2所 示）〇 值得注意的是，本實施例之強化墊4 3 〇 b只配置於接合 區412上，並且位於圖案化線路層42〇的兩側。在另一^ 施例中，強化墊430b也可以只配置於接合區414内上，二 且位於圖案化線路層42〇的兩側。或者，強化墊4施更可 以同.時配置於接合區412與接合區414内，並且位於安 化線路層420的兩側^ ° 综上所述，本發明由於在晶片封裝體之圖案化線路層 白、兩側配置有強化墊，而此強化墊可以配置在接合區上 是橫跨接合區與非接合區上，因此在w封裝體^液晶領 不面板主難電路板完成接合後，晶㈣裝體與液示 面板主體或電路板之間較不易產生剝離的現象。換古之，The film is electrically connected to the patterned circuit layer (similar to that shown in FIG. 2). It is noted that the reinforced pad 4 3 〇b of the present embodiment is disposed only on the land 412 and is located on the patterned circuit layer 42. The sides of the cockroach. In another embodiment, the reinforcing pads 430b may be disposed only in the land 414 and on both sides of the patterned circuit layer 42A. Alternatively, the reinforcing pad 4 can be disposed in the bonding region 412 and the bonding region 414 at the same time, and is located on both sides of the security circuit layer 420. The present invention is based on the patterned circuit in the chip package. The white layer and the two sides are provided with a reinforcing pad, and the reinforcing pad can be disposed on the bonding area across the bonding area and the non-bonding area, so after the w package body is not connected to the main hard circuit board of the panel, the crystal (4) The phenomenon that the body and the liquid display panel main body or the circuit board are less likely to be peeled off is less likely to occur. In the past,
^熱壓合的情況下，本發明之液晶顯示面板具有較^可 罪度。 ， 』J 雖然本發明已以較佳實施例揭露如上，麸其並 =明:任何熟習此技藝者，在不脫離:發明之:: 和犯圍内’當可作些許之更動與潤飾，因此本發明之保】 13 200815829一/n 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1繪不為習知液晶顯不面板之不意圖。 圖2繪示為圖1之晶片封裝體沿Ι-Γ方向的剖面示意 圖。 圖3繪示為圖1中習知液晶顯示面板沿J-J’方向之剖 面示意圖。 圖4繪示為經過熱壓合後而發生變形之習知液晶顯示 面板的不意圖。 圖5繪示為本發明第一實施例之液晶顯示面板示意 圖。 . 圖6A繪示為沿圖5之A-A’線的剖面示意圖。 .圖6B繪示為沿圖5之B-B’線的剖面示意圖。 圖7與圖8繪示為圖5中另一種接替的示意圖。 圖9繪示為本發明第二實施例之液晶顯示面板示意 • 【主要元件符號說明】 100 ·習知液晶顯不面板 " 110、310 :液晶顯示面板主體 120、320 ··電路板 200、400、600 ·•晶片封裝體 210、410 :軟性基板 212、214、412、414 :接合區 216、416 :非接合區 14 200815829_doc/n 220、420 :圖案化線路層 222、224、422、424 :接墊 230、440 :晶片 240、460 :防銲層 300、500 :液晶顯示面板 430、430a、430b :強化墊 15In the case of thermocompression bonding, the liquid crystal display panel of the present invention has a relatively high degree of suspicion. Although the present invention has been disclosed in the above preferred embodiments, the bran is not clear: any person skilled in the art can not make a departure from the invention: The scope of the invention is as defined in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is not intended to be a conventional liquid crystal display panel. 2 is a cross-sectional view of the chip package of FIG. 1 taken along the Ι-Γ direction. 3 is a cross-sectional view of the conventional liquid crystal display panel of FIG. 1 taken along the J-J' direction. Fig. 4 is a view showing a conventional liquid crystal display panel which is deformed by thermocompression bonding. Fig. 5 is a view showing a liquid crystal display panel according to a first embodiment of the present invention. Figure 6A is a cross-sectional view taken along line A-A' of Figure 5. Fig. 6B is a schematic cross-sectional view taken along line B-B' of Fig. 5. FIG. 7 and FIG. 8 are schematic diagrams showing another alternative in FIG. 5. 9 is a schematic diagram of a liquid crystal display panel according to a second embodiment of the present invention. [Main component symbol description] 100. A conventional liquid crystal display panel is omitted. 110, 310: liquid crystal display panel main body 120, 320 · · circuit board 200, 400, 600 · chip package 210, 410: flexible substrate 212, 214, 412, 414: bonding region 216, 416: non-bonding region 14 200815829_doc / n 220, 420: patterned circuit layer 222, 224, 422, 424 : pads 230, 440: wafers 240, 460: solder resist layers 300, 500: liquid crystal display panels 430, 430a, 430b: reinforced pads 15