200803704 九、發明說明： 【發明所屬之技術領域】 本發明之直組式熱傳遞散熱裝置製法，尤 過組件緊結技術以結合製作具開放區，外露 管直接熱接合於電子元件，以形成熱能傳遞 熱裝置製作方法，具有改善組件緊結性、熱 及降低成本。 【先前技術】 已知，目前所應用於電子元件之散熱裝置 要求較佳散熱效率之散熱裝置1 ，都是透過 1與散熱鰭片1 2組成，再透過熱導管1 1 所結合之導熱底座1 3與電子元件2形成面 合，以快速傳遞電子元件2產生之熱能，經 11傳遞至多數散熱鰭片12作大面積的熱 言之，熱導管1 1與導熱底座1 3之結合設 度等，都將直接反應與電子元件2間之熱 率，當然在製作及組件成本有較高。 又，如第一 A圖所示，為本國專利公報j 號之「包含有熱導管之散熱裝置的衝壓緊結 型專利案，此專利案所訴求之重點乃是在底 頂面具有至少一凹溝1 5 ，異於凹溝1 5的 多道凹槽1 6 ，熱導管1 7預置於凹溝1 5 指一種透 部份熱導 配置之散 傳遞效率 ，尤其是 熱導管1 延伸一端 積式熱接 由熱導管 發散，換 計與密合 源傳遞效 ^ M268112 構造」新 座1 4的 轴向成型 中，以及 5 200803704 散熱器之縛片1 8對應插入凹槽1 6 ，同時壓擎熱導 管17定位於底座14上，藉成型模具衝壓鰭片工8 兩侧之底座1 4表面，令其受壓產生外擴形變，使讀 片1 8得與底座1 4鉚合，且將熱導管1 7緊辞定位 於鰭片18和底座14間。 上述之專利案仍需透過底座與電子元件熱結合，換 言之，仍具有熱導管與底座間之緊結密合度及熱傳遞 效率問題。 【發明内容】 本發明之主要目的，在於解決上述傳統缺失，本發 明散熱裝置及其組件間之緊結方法重新設計，搭配> _間 單的治具架構、施壓技術及組件緊結，以形成免導熱 底座結合’而直接由製成之散熱裝置一開放區外露之 導熱管與電子元件直接熱結合傳遞熱能發散，對散熱 裝置之組件緊結方法及其製成品，改善組件緊結性、 熱傳遞效率及降低成本，以提供使用者更低廉但高傳 熱姝率與緊迫結合之實用散熱裝置。 為達上述目的’本發明之直組式熱傳遞散熱袭置 製法，該方法步驟包括：提供多數具上、下結合孔之 第〆散熱鰭片，以及多數具上結合孔與下置槽之第二 散熱鰭片，利用所設之扣件扣集形成間距排列並具有 6 200803704 一内凹開放區之鰭片組，於一熱管結合步驟，將 一熱導管穿置於上述鰭片組之上、下結合孔及下 而部份外露於開放區，接著，於一緊迫結合步驟 用一沖模裝置暨其多數沖壓件配合沖壓技術，對 熱鰭片與熱導管對應之預設緊結位置施以沖壓強 以形成預設緊結位置及熱導管之變形迫緊結合一 完成具開放區由熱導管以直接熱接合電子元件熱 散熱之散熱裝置製成品。 請參閱以下有關本發明一較佳實施例之詳細 及其附圖，將可進一步瞭解本發明之技術内容及 的功效；有關該實施例之附圖。 【實施方式】 茲有關本發明之技術内容及詳細說明，現配 式說明如下： 請參閱第二至七圖所示，係本發明之直組式 遞散熱裝置製法一實施例的製程步驟及其製成品 圖，如圖所示：本發明之直組式熱傳遞散熱裝置壤 其步驟至少包括： 步驟一之鰭片結合步驟： 提供多數第一散熱鰭片3 ，表面鏡射成型至 上、下結合孔3 1、3 2及連通於上結合孔3 1 槽3 3 ，穿槽3 3與上結合孔3 1間設有緊結單 4 ; 至少 置槽 ，利 各散 力， 體； 傳遞 說明 其目 合圖 熱傳 不意 法， 少. 之穿 元3 7 200803704 上述之上、下結合孔31 、32於其一端面更包 括設有環突壁3 1 1 、3 2 1 ，以增加與熱導管6之 緊結面積與緊密性，上結合孔3 1之環突壁3 1 1更 設有一缺口 3 1 2與穿槽3 3對應，另，前述之緊結 單元3 4是由第一散熱鰭片3表面成型之二個獨立、 對應之壓片3 4 1 、3 4 2所構成； 提供多數第二散熱鰭片4，表面鏡射成型至少一 上結合孔4 1 、下置槽4 2及連通於上結合孔4 1之 穿槽4 3 ，穿槽4 3與上結合孔4 1間設有緊結單元 4 4; 上述之上結合孔41於其一端面更包括設有環突 壁4 1 1 ，以增加與熱導管6之緊結面積與緊密性， 環突壁411更設有一缺口412與穿槽43對應； 下置槽4 2較佳是一半圓形、圓弧或弧形凹部，於其 一端設有弧突壁4 2 1以增加與熱導管6之接觸面 積；另，前述之緊結單元44是由第二散熱鰭片4表 面成型之二個獨立、對應之壓片4 4 1 、4 4 2所構 成； 將上述多數第一及第二散熱鰭片3 、4利用其於 侧端成型之扣件3 0、4 0扣集形成間距排列，並具 有一内凹開放區5 0之鰭片組5 ; 8 200803704 前述之開放區5 0較佳是利用多數第二散熱鰭片 4結合，而配置於多數第一散熱鰭片3結合之中間位 置，如第七圖所示，當然並不因此對本發明製作方法 形成限制； 步驟二之熱管結合步驟： 將至少一熱導管6穿置於上述鰭片組5之上、下 結合孔31 、41 、32及下置槽42，換言之，該 導熱管6之一端與第二散熱鰭片4是部份靠置於下置 槽4 2而部份外露於上述之開放區5 0 ，如第三圖所 示； 步驟三之緊迫治具配置： 提供一緊迫治具7，至少包含一上、下二沖壓件 71 、72 ，如第三圖所示，其中該上沖壓件71具 有至少一可通過上述穿槽3 3、43之壓部71 1 ， 以對應緊結單元4 4及熱導管6沖壓緊結一起，下沖 壓件7 2則具有一模突部7 2 1對應於上述開放區5 0，模突部7 2二側則分別對應每一下結合孔3 2設 有壓突部72 2 ，如第三、四圖所示； 步驟四之緊迫結合步驟： 應用壓力施加技術及其機具設備，如高度沖壓技 術，對上述緊迫治具7及其上、下二沖壓件7 1 、7 2施以強力沖壓作用力，由上沖壓件7 1之壓部7 1 1通過上述穿槽3 3 、43而緊迫緊結單元44及熱 導管6產生變形緊結一起，同時，下沖壓件7 2亦應 9 200803704 用沖壓作用力，由其壓突部7 2 2對鰭片組5暨每一 第一散熱鰭片3之下結合孔3 2沖壓，與熱導管6同 步產生變形緊結一起，並由其模突部7 2 1對外露於 開放區5 0之熱導管6端面沖壓，以形成一熱接合平 面，如第五、六圖所示，可以直接或進一步配合導熱 膏以直接熱接合於電子元件8; 當然在其他具體實施例結構中，該下沖壓件7 2 亦可不設有模突部7 2 1對外露於開放區5 0之熱導 管6端面沖壓，而是配合在該開放區5 0之熱導管6 間塗覆以導熱膏（圖中未繪示），以形成一熱接合面與 電子元件8熱結合配置； 步驟五：將緊迫治具7退出後，完成具有一開放 區5 0，外露部份熱導管6之散熱裝置5製成品，換 言之，可直接應用該開放區5 0所外露之熱導管.6 ， 或進一步配合導熱膏（圖中未繪示）而直接熱接合於 電子元件8以高效率傳遞熱能至鰭片組5發散（如第 七、七A圖），以改善與導熱底座之熱緊結性與熱傳遞 效率問題，亦可降低組裝及組件成本。 再請參閱第八圖所示，係本發明之直組式熱傳遞 散熱裝置製法的製程步驟之另一製成品實施例示意 圖，如圖所示：根據本發明之直組式熱傳遞散熱裝置 製法，於上述步驟二之熱管結合步驟，可進一步提供 一熱導管6 ，具有突延彎折部6 1適與上述鰭片組5 之開放區5 0對應，換言之，根據上述製程步驟緊結 組成後，突延彎折部6 1正突設於開放區5 0形成一 10 200803704 熱接合面，可與上述實施例相同之直接，或進一步 合導熱膏而熱接合於電子元件8 ，不需如習知再透 導熱底座緊結與熱接合。 上列詳細說明係針對本發明之一可行實施例之 體說明，惟該實施例並非用以限制本發明之專利 圍，凡未脫離本發明技藝精神所為之等效實施或 更，例如··等變化之等效性實施例，均應包含於本 之專利範圍中。 綜上所述，本案不但在方法步驟與緊結型態上確 創新，並能較習用物品增進上述多項功效，應已充 符合新穎性及進步性之法定發明專利要件，爰依法 出申請，懇請 貴局核准本件發明專利申請案，以 創作，至感德便。 【圖式簡單說明】 第一圖為習知散熱裝置之緊結組成製成品示意圖。 第一 A圖為另一習知散熱裝置之組合示意圖。 第二圖為本發明一實施例方法步驟一暨緊結前組件 解示意圖。 第三圖為本發明一實施例方法與緊迫治具於緊結施 前之示意圖。 第四圖為本發明一實施例方法之熱導管與鰭片組緊 配 過 具 範 變 案 屬 分 提 勵 分 作 結 11 200803704 前示意圖。 第五圖為本發明一實施例方法與緊迫治具於緊結施作 後之示意圖。 第六圖為本發明一實施例方法之熱導管與鰭片組緊結 後之示意圖。 第七圖為本發明一實施例方法緊結製作後之製成品示 意圖。 第七A圖為本發明一實施例方法緊結製作後之製成品 和熱源貼合示意圖。 第八圖為本發明方法緊結製作後之另一製成品實施例 示意圖。 12 200803704 【主要元件符號說明】 習知主要元件符號說明： 散熱裝置------------1 電子元件------------2 熱導管------------11 散熱鰭片-----------12 導熱底座-----------13 底座-------------14 凹溝-------------15 凹槽---------- 16 熱導管------------17 籍片 本發明主要元件符號說明： 3 4 5 6 7 8 第一散熱鰭片------ 第二散熱鰭片------ 籍片組一一一一一一一一一 熱導管--------- 緊迫治具-------- 電子元件-------- 3 0 、4 0200803704 IX. Description of the invention: [Technical field of the invention] The method of the direct heat transfer heat dissipating device of the present invention, in particular, the component tight-bonding technology is combined to produce an open area, and the exposed tube is directly thermally bonded to the electronic component to form a heat transfer. The method of manufacturing a thermal device has the advantages of improving component tightness, heat, and cost. [Prior Art] It is known that the heat dissipating device 1 which is currently applied to the heat dissipating device of the electronic component requires a heat dissipating efficiency, which is composed of a heat dissipating fin 1 and a heat dissipating fin 1 which is combined with the heat dissipating fin 1 3 forming a surface contact with the electronic component 2 to quickly transfer the thermal energy generated by the electronic component 2, and transmitting it to the majority of the heat dissipation fins 12 for a large area, the combination of the heat pipe 1 1 and the heat conductive base 13 , will directly reflect the heat rate between the electronic components 2, of course, the cost of production and components is higher. Moreover, as shown in FIG. A, it is a stamping and tight type patent case including a heat pipe heat sink of the national patent publication No. J. The focus of the patent application is to have at least one groove on the bottom surface. 1 5 , a plurality of grooves 16 different from the groove 1 5 , the heat pipe 17 is preset in the groove 1 5 refers to a partial transfer efficiency of the partial heat conduction configuration, especially the heat pipe 1 extends one end product The heat connection is diverged by the heat pipe, and the heat transfer is carried out in the axial forming of the new seat 14 of the M268112 structure, and the 510 of the 200803704 heat sink is inserted into the groove 16 and the heat pipe is pressed. 17 is positioned on the base 14, and the surface of the base 14 of the fins 8 is stamped by the forming die, so that the pressure is deformed and deformed, so that the reading piece 18 is riveted with the base 14 and the heat pipe 1 is 7 is positioned between the fin 18 and the base 14. The above patents still need to be thermally coupled to the electronic components through the base, in other words, still have tight junction tightness and heat transfer efficiency between the heat pipe and the base. SUMMARY OF THE INVENTION The main object of the present invention is to solve the above-mentioned conventional deficiencies, and the method for tightening the heat dissipating device and the components thereof of the present invention is redesigned, matched with the jig structure, the pressing technology and the component tightness to form The heat-conducting base is combined with the direct heat-dissipating heat-dissipating tube and the electronic component directly exposed by the heat-dissipating heat-dissipating device to transmit heat energy, and the assembly method and the finished product of the heat-dissipating device are improved, and the assembly tightness and heat transfer efficiency are improved. And to reduce costs, to provide users with a cheaper but high heat transfer rate and a practical combination of heat sinks. In order to achieve the above object, the direct heat transfer heat-dissipating method of the present invention comprises the steps of: providing a plurality of second fins having upper and lower bonding holes, and a plurality of upper and lower slots a heat dissipating fin, which is formed by using a fastener set to form a fin group having a spacing of 6 200803704 and a concave open area, and a heat pipe is placed on the fin group in a heat pipe bonding step, The lower bonding hole and the lower part are exposed in the open area, and then, in a pressing bonding step, a punching device and most of the stamping parts are combined with the stamping technology, and the preset sealing position corresponding to the hot fin and the heat pipe is punched. In order to form a preset tight-knit position and a deformation of the heat pipe, a heat-dissipating device having an open area and a heat-dissipating heat-dissipating electronic component is thermally bonded to the heat-dissipating device. The details of the present invention and the accompanying drawings will be further described in the following detailed description of the preferred embodiments of the invention. [Embodiment] The technical content and detailed description of the present invention are as follows: Please refer to the second to seventh embodiments, which are the process steps of an embodiment of the method for manufacturing a direct-type heat sink according to the present invention. The finished product diagram is as shown in the figure: the direct heat transfer heat dissipating device of the present invention comprises at least the following steps: Step 1: Fin bonding step: providing a plurality of first heat dissipating fins 3, surface mirroring to upper and lower combined The holes 3 1 and 3 2 are connected to the upper joint hole 3 1 and the groove 3 3 , and the through groove 3 3 and the upper joint hole 3 1 are provided with a tight joint 4; at least the groove is provided, and the force is scattered, and the body is conveyed; The heat transfer is not intended, less. The wearer 3 7 200803704 The upper and lower joint holes 31, 32 further include a ring-shaped wall 3 1 1 , 3 2 1 at one end thereof to increase the heat pipe 6 The tight junction area and the tightness, the ring protrusion wall 31 of the upper coupling hole 3 1 is further provided with a notch 3 1 2 corresponding to the groove 3 3 , and the aforementioned fastening unit 34 is the surface of the first heat dissipation fin 3 Two independent, corresponding compression pieces 3 4 1 , 3 4 2 are formed; The second heat dissipating fins 4 are surface-image-molded with at least one upper bonding hole 4 1 , an lower groove 4 2 and a through groove 4 3 communicating with the upper bonding hole 4 1 , and the through groove 4 3 and the upper bonding hole 4 1 are disposed. There is a fastening unit 44; the upper coupling hole 41 further includes a ring protruding wall 41 1 at one end surface thereof to increase the tightness and tightness with the heat pipe 6, and the ring protruding wall 411 is further provided with a notch 412 and The through groove 43 corresponds to; the lower groove 4 2 is preferably a semicircular, circular arc or curved concave portion, and is provided with an arcuate wall 42 1 at one end thereof to increase the contact area with the heat pipe 6; The unit 44 is composed of two independent and corresponding pressing pieces 4 4 1 and 4 4 2 formed on the surface of the second heat dissipating fin 4; the plurality of first and second heat dissipating fins 3 and 4 are used at the side end The formed fasteners 30, 40 are arranged in a pitch arrangement and have a recessed open area 50 of the fin set 5; 8 200803704 The aforementioned open area 50 is preferably combined by a plurality of second heat sink fins 4 And disposed in the middle of the combination of the plurality of first heat dissipation fins 3, as shown in the seventh figure, of course, the method of the present invention is not formed. Restriction; Step 2 of the heat pipe bonding step: the at least one heat pipe 6 is placed on the above fin group 5, the lower bonding holes 31, 41, 32 and the lower groove 42, in other words, one end of the heat pipe 6 The heat-dissipating fins 4 are partially placed in the lower groove 42 and partially exposed in the open area 50, as shown in the third figure. The third step is to provide a pressing fixture 7. At least one upper and lower stamping members 71, 72 are included, as shown in the third figure, wherein the upper stamping member 71 has at least one pressing portion 71 1 which can pass through the through grooves 3 3, 43 to correspond to the tightening unit 4 4 And the heat pipe 6 is stamped and tightly joined together, the lower punching member 72 has a die protrusion 7 2 1 corresponding to the open area 50, and the two sides of the die protrusion 7 2 respectively have a pressure protrusion corresponding to each lower joint hole 3 2 . Part 72 2 , as shown in the third and fourth figures; step 4 of the urgent combination of steps: the application of pressure application technology and its equipment, such as high-pressure stamping technology, the above-mentioned pressing fixture 7 and its upper and lower stamping parts 7 1 And 7 2 is applied with a strong pressing force, and the pressing portion 7 1 1 of the upper stamping member 7 1 passes through the above-mentioned through groove 3 3 , 43 and the pressing unit 44 and the heat pipe 6 are deformed and tightly joined together, and at the same time, the lower stamping part 7 2 should also be used for the punching force of the 200803704, and the first group of fins 5 and the first heat sink by the pressing portion 7 2 2 The fins 3 are punched under the bonding holes 32, and are deformed together with the heat pipes 6 and are stamped by the die protrusions 7 2 1 to the end faces of the heat pipes 6 exposed in the open area 50 to form a heat bonding plane. As shown in the fifth and sixth figures, the thermal paste can be directly or further combined to be directly thermally bonded to the electronic component 8; of course, in other embodiments, the lower stamping member 7 2 may not be provided with the die protrusion 7 2 . 1 is exposed to the end face of the heat pipe 6 exposed in the open area 50, but is coated with a heat conductive paste (not shown) between the heat pipes 6 of the open area 50 to form a thermal joint surface and electrons. The component 8 is thermally coupled; Step 5: After the pressing fixture 7 is withdrawn, the heat sink 5 having an open area 50 and the exposed portion of the heat pipe 6 is finished, in other words, the open area 50 can be directly exposed. Heat pipe .6 , or further with thermal paste (not shown) Directly thermally bonded to the electronic component 8 to transfer thermal energy with high efficiency to the fin group 5 to divergence (as shown in the seventh, seventh, and seventh drawings) to improve the heat tightness and heat transfer efficiency with the thermally conductive base, and also reduce assembly And component costs. Referring to FIG. 8 again, it is a schematic view of another manufacturing embodiment of the manufacturing process of the direct heat transfer heat dissipating device of the present invention, as shown in the drawing: a method for manufacturing a direct heat transfer heat dissipating device according to the present invention. Further, in the heat pipe bonding step of the above step 2, a heat pipe 6 may be further provided, and the protruding bending portion 61 is adapted to correspond to the open area 50 of the fin group 5, in other words, after the composition is tightly assembled according to the above process steps, The protruding bending portion 6 1 is protruded from the open region 50 to form a 10 200803704 thermal bonding surface, which can be directly bonded to the electronic component 8 directly or in combination with the thermal conductive paste, as in the prior art. The heat-transmissive base is then tightly bonded to the heat. The above detailed description is intended to be illustrative of a possible embodiment of the invention, and is not intended to limit the scope of the invention. Variations of equivalence embodiments are intended to be included in the scope of this patent. In summary, this case is not only innovative in method steps and tight-fitting styles, but also can enhance the above-mentioned multiple functions compared with the conventional articles. It should be filled with the statutory invention patents that meet the novelty and progress, and apply for it according to law. The bureau approved the application for the invention patent, in order to create it. [Simple description of the drawings] The first figure is a schematic diagram of the finished components of the conventional heat dissipating device. The first A is a schematic diagram of a combination of another conventional heat sink. The second figure is a schematic diagram of the steps of the first step and the pre-tightening of the method according to an embodiment of the present invention. The third figure is a schematic view of a method and an emergency jig in accordance with an embodiment of the present invention. The fourth figure is a schematic diagram of the heat pipe and the fin set of the method according to an embodiment of the present invention. The fifth figure is a schematic view of a method and a pressing jig according to an embodiment of the present invention. The sixth figure is a schematic view of the heat pipe and the fin set of the method according to an embodiment of the present invention. Fig. 7 is a schematic view showing the finished product after the method is compacted according to an embodiment of the present invention. Figure 7A is a schematic view showing the bonding of the finished product and the heat source after the method is compacted according to an embodiment of the present invention. Figure 8 is a schematic illustration of another embodiment of the finished article after the method of the present invention has been compacted. 12 200803704 [Description of main component symbols] Conventional main components Symbol Description: Heat sink ------------1 Electronic components ------------ 2 Heat pipes --- ---------11 Cooling fins-----------12 Thermal base-----------13 Base---------- ---14 沟沟-------------15 Groove---------- 16 Heat pipe ------------17 The main components of the present invention are illustrated by: 3 4 5 6 7 8 The first heat sink fin ------ The second heat sink fin ------ The film group one by one, one, one, one, one, one heat pipe - -------- Emergency Fixture --------- Electronic Components -------- 3 0 , 4 0
扣件一一一一一一一一一一 上結合孔-------- 13 200803704 下結合孔 穿槽—— 緊結單元Fasteners on the one-to-one-one-one-one-one-one-one-one-------- 13 200803704 lower joint hole through-slot - tight unit
4 2 下置槽 開放區 0 突延彎折部 6 上沖壓件 7 下沖壓件 7 2 環突壁----3 3 2 4 缺 π ——— --3 1 2 、4 1 2 壓片一341、342、441、442 弧突壁 4 壓部 7 模突部 7 壓突部 7 2 2 144 2 Lower groove open area 0 Extended bending part 6 Upper stamping part 7 Lower stamping part 7 2 Ring protruding wall----3 3 2 4 Missing π ——— --3 1 2 , 4 1 2 Tableting A 341, 342, 441, 442 arcuate wall 4 pressing portion 7 die projection 7 pressure projection 7 2 2 14