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TW200802924A - Enamel substrate for mounting light emitting element and light source apparatus - Google Patents

Enamel substrate for mounting light emitting element and light source apparatus

Info

Publication number
TW200802924A
TW200802924A TW095119608A TW95119608A TW200802924A TW 200802924 A TW200802924 A TW 200802924A TW 095119608 A TW095119608 A TW 095119608A TW 95119608 A TW95119608 A TW 95119608A TW 200802924 A TW200802924 A TW 200802924A
Authority
TW
Taiwan
Prior art keywords
emitting element
light emitting
enamel substrate
mounting
source apparatus
Prior art date
Application number
TW095119608A
Other languages
Chinese (zh)
Inventor
Ryuji Suzuki
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of TW200802924A publication Critical patent/TW200802924A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Led Device Packages (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

An enamel substrate for mounting a light emitting element includes a core metal; an enamel layer coated on a surface of said core metal; and a light emitting element mounted in a concave portion provided on the both sides of the enamel substrate. Furthermore, a light source apparatus includes an enamel substrate for mounting a light emitting element includes a core metal, an enamel layer coated on a surface of said core metal, and reflecting concave portions provided on the both sides of the enamel substrate; and a light emitting element mounted in a concave portion.
TW095119608A 2005-04-28 2006-06-02 Enamel substrate for mounting light emitting element and light source apparatus TW200802924A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005131854A JP2006310584A (en) 2005-04-28 2005-04-28 Light-emitting device mounting enamel substrate and light source device

Publications (1)

Publication Number Publication Date
TW200802924A true TW200802924A (en) 2008-01-01

Family

ID=37477133

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119608A TW200802924A (en) 2005-04-28 2006-06-02 Enamel substrate for mounting light emitting element and light source apparatus

Country Status (2)

Country Link
JP (1) JP2006310584A (en)
TW (1) TW200802924A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469395B (en) * 2012-02-03 2015-01-11 恆日光電股份有限公司 Light module

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101365625B1 (en) * 2007-06-21 2014-02-25 서울반도체 주식회사 Bidirectional light emitting diode
JPWO2009038072A1 (en) * 2007-09-21 2011-01-06 昭和電工株式会社 Light emitting device, display device, and method of manufacturing light emitting device
TWI353053B (en) * 2007-11-28 2011-11-21 Ind Tech Res Inst Lighting device
JP2009182026A (en) * 2008-01-29 2009-08-13 Toshiba Corp Semiconductor light emitting device and method for manufacturing semiconductor light emitting device
KR100998010B1 (en) * 2008-04-28 2010-12-03 삼성엘이디 주식회사 Light emitting device package and its manufacturing method
JP5515587B2 (en) * 2009-10-05 2014-06-11 大日本印刷株式会社 LED element mounting member and manufacturing method thereof, and LED element package and manufacturing method thereof
JP5553722B2 (en) * 2010-10-15 2014-07-16 スタンレー電気株式会社 Light emitting device
WO2012137757A1 (en) * 2011-04-06 2012-10-11 シャープ株式会社 Illumination device, display device, and television receiver device
WO2013115379A1 (en) 2012-02-02 2013-08-08 シチズンホールディングス株式会社 Semiconductor light emitting device and fabrication method for same
TWI509842B (en) * 2013-09-02 2015-11-21 Lextar Electronics Corp Light-emitting diode package structure and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469395B (en) * 2012-02-03 2015-01-11 恆日光電股份有限公司 Light module

Also Published As

Publication number Publication date
JP2006310584A (en) 2006-11-09

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