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TW200701528A - Enamel substrate for mounting light emitting element, light emitting element module, illumination apparatus, display apparatus, and traffic signal device - Google Patents

Enamel substrate for mounting light emitting element, light emitting element module, illumination apparatus, display apparatus, and traffic signal device

Info

Publication number
TW200701528A
TW200701528A TW095119866A TW95119866A TW200701528A TW 200701528 A TW200701528 A TW 200701528A TW 095119866 A TW095119866 A TW 095119866A TW 95119866 A TW95119866 A TW 95119866A TW 200701528 A TW200701528 A TW 200701528A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting element
traffic signal
signal device
display apparatus
Prior art date
Application number
TW095119866A
Other languages
Chinese (zh)
Other versions
TWI333285B (en
Inventor
Ryuji Suzuki
Kyosuke Takemoto
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of TW200701528A publication Critical patent/TW200701528A/en
Application granted granted Critical
Publication of TWI333285B publication Critical patent/TWI333285B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H10W72/5522—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

An enamel substrate for mounting a light emitting element includes a core metal; an enamel layer coated on a surface of said core metal; and one or more through-holes, in which said core metal is exposed within said through-holes.
TW095119866A 2005-06-07 2006-06-05 Enamel substrate for mounting light emitting element, light emitting element module, illumination apparatus, display apparatus, and traffic signal device TWI333285B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005167498 2005-06-07

Publications (2)

Publication Number Publication Date
TW200701528A true TW200701528A (en) 2007-01-01
TWI333285B TWI333285B (en) 2010-11-11

Family

ID=37498348

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119866A TWI333285B (en) 2005-06-07 2006-06-05 Enamel substrate for mounting light emitting element, light emitting element module, illumination apparatus, display apparatus, and traffic signal device

Country Status (6)

Country Link
US (1) US7997760B2 (en)
EP (1) EP1890341B1 (en)
KR (1) KR101002430B1 (en)
CN (1) CN101176216B (en)
TW (1) TWI333285B (en)
WO (1) WO2006132148A1 (en)

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JP5391767B2 (en) 2008-05-30 2014-01-15 東芝ライテック株式会社 Light emitting device and lighting apparatus
KR20110046440A (en) * 2008-08-21 2011-05-04 파나소닉 주식회사 Illumination light source
TWI407043B (en) * 2008-11-04 2013-09-01 Advanced Optoelectronic Tech Light-emitting diode light source module and optical engine thereof
KR101144146B1 (en) * 2009-04-15 2012-05-09 (주)웨이브닉스이에스피 Photonic Device Package Module and Process of The Same
CN201487668U (en) * 2009-09-09 2010-05-26 珠海晟源同泰电子有限公司 Bundling combined LED illuminated light source
DE102010026344A1 (en) 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh led
US20120188738A1 (en) * 2011-01-25 2012-07-26 Conexant Systems, Inc. Integrated led in system-in-package module
CN202613085U (en) * 2011-08-12 2012-12-19 惠州元晖光电股份有限公司 LED lighting device
CN103140036A (en) * 2011-11-24 2013-06-05 先丰通讯股份有限公司 Manufacturing method of heat dissipation circuit board
CN103582291B (en) * 2012-08-02 2017-07-14 中兴通讯股份有限公司 A kind of metal base printed circuit board and electronic equipment
KR20150014167A (en) * 2013-07-29 2015-02-06 삼성전기주식회사 Pcb having glass core
EP2928272B1 (en) * 2014-03-27 2016-09-21 OSRAM GmbH A lighting device and corresponding method
CN108167774A (en) * 2017-11-30 2018-06-15 安徽西马新能源技术有限公司 A kind of low-heat LED car lamp
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Also Published As

Publication number Publication date
EP1890341A1 (en) 2008-02-20
CN101176216A (en) 2008-05-07
EP1890341A4 (en) 2009-09-30
EP1890341B1 (en) 2012-07-11
WO2006132148A1 (en) 2006-12-14
CN101176216B (en) 2010-05-19
KR101002430B1 (en) 2010-12-21
TWI333285B (en) 2010-11-11
US20090225544A1 (en) 2009-09-10
US7997760B2 (en) 2011-08-16
KR20080005280A (en) 2008-01-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees