TW200801807A - Negative-type photosensitive fluorinated aromatic resin composition - Google Patents
Negative-type photosensitive fluorinated aromatic resin compositionInfo
- Publication number
- TW200801807A TW200801807A TW096109181A TW96109181A TW200801807A TW 200801807 A TW200801807 A TW 200801807A TW 096109181 A TW096109181 A TW 096109181A TW 96109181 A TW96109181 A TW 96109181A TW 200801807 A TW200801807 A TW 200801807A
- Authority
- TW
- Taiwan
- Prior art keywords
- fluorinated aromatic
- compound
- fluorinated
- aromatic
- functional group
- Prior art date
Links
- 125000003118 aryl group Chemical group 0.000 title abstract 8
- 239000011342 resin composition Substances 0.000 title abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 3
- 125000000524 functional group Chemical group 0.000 abstract 3
- 125000001153 fluoro group Chemical group F* 0.000 abstract 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 150000001491 aromatic compounds Chemical class 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000003504 photosensitizing agent Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/025—Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/117—Free radical
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polyethers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006072412 | 2006-03-16 | ||
| JP2006291396 | 2006-10-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200801807A true TW200801807A (en) | 2008-01-01 |
| TWI390348B TWI390348B (zh) | 2013-03-21 |
Family
ID=38609179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096109181A TWI390348B (zh) | 2006-03-16 | 2007-03-16 | Negative photosensitive fluorinated aromatic resin composition |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7892720B2 (zh) |
| EP (1) | EP1995635A4 (zh) |
| JP (1) | JP4730436B2 (zh) |
| KR (2) | KR20140009592A (zh) |
| CN (1) | CN101405655B (zh) |
| TW (1) | TWI390348B (zh) |
| WO (1) | WO2007119384A1 (zh) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101250108B1 (ko) | 2005-06-24 | 2013-04-03 | 아사히 가라스 가부시키가이샤 | 가교성 함불소 방향족 프레폴리머 및 그 용도 |
| KR20140009592A (ko) * | 2006-03-16 | 2014-01-22 | 아사히 가라스 가부시키가이샤 | 네거티브형 감광성 함불소 방향족계 수지 조성물 |
| ATE518901T1 (de) | 2006-06-02 | 2011-08-15 | Asahi Glass Co Ltd | Vernetzbares prepolymer, herstellungsverfahren dafür und verwendung davon |
| JP5051133B2 (ja) | 2006-09-28 | 2012-10-17 | Jsr株式会社 | レジスト下層膜形成方法及びそれに用いるレジスト下層膜用組成物並びにパターン形成方法 |
| JP5003415B2 (ja) * | 2006-11-22 | 2012-08-15 | 旭硝子株式会社 | ネガ型感光性組成物ならびにこれを用いた硬化膜およびその製造方法 |
| JP4918909B2 (ja) * | 2007-11-09 | 2012-04-18 | 旭硝子株式会社 | 剥離用組成物および剥離方法 |
| CN102066443B (zh) * | 2008-06-19 | 2014-01-15 | 旭硝子株式会社 | 固化性组合物及使用了该组合物的固化膜 |
| JP2010044273A (ja) * | 2008-08-14 | 2010-02-25 | Fujifilm Corp | カラーフィルタ及びその形成方法、並びに固体撮像素子 |
| US8492507B2 (en) | 2008-09-23 | 2013-07-23 | Nexam Chemical Ab | Acetylenic polyamide |
| JP5187247B2 (ja) * | 2009-03-17 | 2013-04-24 | 旭硝子株式会社 | フォトリソグラフィ方法および現像液組成物 |
| EP2410359B1 (en) | 2009-03-18 | 2017-12-13 | Asahi Glass Company, Limited | Optical waveguide |
| WO2011049142A1 (ja) * | 2009-10-22 | 2011-04-28 | 旭硝子株式会社 | 硬化性組成物およびそれを用いた硬化膜 |
| JPWO2011086981A1 (ja) * | 2010-01-12 | 2013-05-20 | 旭硝子株式会社 | ネガ型感光性樹脂組成物ならびにこれを用いた硬化膜および基板の製造方法 |
| EP2569343B1 (en) | 2010-05-14 | 2015-07-08 | Nexam Chemical AB | Catalysis of cross-linking |
| CN102947359B (zh) | 2010-06-23 | 2014-12-24 | 旭硝子株式会社 | 固化性组合物和固化膜的制造方法 |
| CN103034048B (zh) * | 2011-09-29 | 2015-04-22 | 中芯国际集成电路制造(北京)有限公司 | 光刻方法 |
| CN103034059B (zh) * | 2011-09-29 | 2015-02-04 | 中芯国际集成电路制造(北京)有限公司 | 光致抗蚀剂和光刻方法 |
| KR101426236B1 (ko) * | 2011-11-30 | 2014-08-06 | 엘지디스플레이 주식회사 | 유기절연막 조성물 및 그를 이용한 박막 트랜지스터 기판 및 디스플레이 장치 |
| JP6108765B2 (ja) * | 2011-12-19 | 2017-04-05 | キヤノン株式会社 | 光硬化性組成物およびパターン形成方法 |
| JP6304960B2 (ja) * | 2012-07-30 | 2018-04-04 | キヤノン株式会社 | (メタ)アクリレート化合物、光学用組成物、成形体および光学素子 |
| KR20150047476A (ko) * | 2012-08-22 | 2015-05-04 | 아사히 가라스 가부시키가이샤 | 프레폴리머, 경화성 재료, 도포용 조성물, 비선형 광학 재료, 광 도파로 및 광 제어 디바이스 |
| US9541829B2 (en) | 2013-07-24 | 2017-01-10 | Orthogonal, Inc. | Cross-linkable fluorinated photopolymer |
| US9298088B2 (en) | 2013-07-24 | 2016-03-29 | Orthogonal, Inc. | Fluorinated photopolymer with fluorinated sensitizer |
| TWI632185B (zh) * | 2013-08-07 | 2018-08-11 | 旭硝子股份有限公司 | Crosslinkable fluoroelastomer composition and crosslinked product thereof |
| US9958778B2 (en) | 2014-02-07 | 2018-05-01 | Orthogonal, Inc. | Cross-linkable fluorinated photopolymer |
| KR102113659B1 (ko) * | 2017-11-28 | 2020-05-21 | 삼성에스디아이 주식회사 | 하드마스크 조성물 및 패턴 형성 방법 |
| CN108586748B (zh) * | 2018-04-23 | 2021-09-17 | 复旦大学 | 一种苯并环丁烯官能化有机硅聚合物及其制备方法和应用 |
| JP7210978B2 (ja) * | 2018-09-28 | 2023-01-24 | 住友ベークライト株式会社 | ネガ型感光性樹脂組成物および半導体装置 |
| WO2020110793A1 (ja) * | 2018-11-26 | 2020-06-04 | セントラル硝子株式会社 | 感光性樹脂組成物、含フッ素樹脂硬化物の製造方法、含フッ素樹脂、含フッ素樹脂膜、バンク及び表示素子 |
| JP7259317B2 (ja) * | 2018-12-21 | 2023-04-18 | 住友ベークライト株式会社 | ネガ型感光性樹脂組成物、それを用いた半導体装置および電子機器 |
| TWI867181B (zh) * | 2020-03-30 | 2024-12-21 | 日商東京威力科創股份有限公司 | 基板處理方法、基板處理裝置及記錄媒體 |
| CN115702387A (zh) * | 2020-05-22 | 2023-02-14 | 中央硝子株式会社 | 发光元件的制造方法 |
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| JP2003342411A (ja) | 2002-05-29 | 2003-12-03 | Asahi Glass Co Ltd | 多孔質ナノコンポジット薄膜及びその形成方法 |
| US7019093B2 (en) | 2002-10-18 | 2006-03-28 | Dow Global Technologies Inc. | Aqueous developable, photosensitive benzocyclobutene-based oligomers and polymers with high moisture resistance |
| JP4110401B2 (ja) * | 2003-06-13 | 2008-07-02 | 信越化学工業株式会社 | 感光性シリコーン樹脂組成物及びその硬化物並びにネガ型微細パターンの形成方法 |
| JP4501391B2 (ja) * | 2003-09-30 | 2010-07-14 | 旭硝子株式会社 | 架橋性含フッ素芳香族プレポリマー及びその用途 |
| JP2006072412A (ja) | 2004-08-31 | 2006-03-16 | Yokogawa Electric Corp | イベント収集ブロックおよびそれを内蔵したコントローラ |
| JP2006291396A (ja) | 2005-04-12 | 2006-10-26 | Toray Ind Inc | エアバッグ用基布およびエアバッグおよびその製造方法 |
| KR101250108B1 (ko) | 2005-06-24 | 2013-04-03 | 아사히 가라스 가부시키가이샤 | 가교성 함불소 방향족 프레폴리머 및 그 용도 |
| KR20140009592A (ko) * | 2006-03-16 | 2014-01-22 | 아사히 가라스 가부시키가이샤 | 네거티브형 감광성 함불소 방향족계 수지 조성물 |
| ATE518901T1 (de) * | 2006-06-02 | 2011-08-15 | Asahi Glass Co Ltd | Vernetzbares prepolymer, herstellungsverfahren dafür und verwendung davon |
| US7691104B2 (en) | 2007-07-25 | 2010-04-06 | Olympus Medical Systems Corporation | Endoscopic treatment tool |
-
2007
- 2007-03-15 KR KR1020137035024A patent/KR20140009592A/ko not_active Ceased
- 2007-03-15 CN CN200780009349XA patent/CN101405655B/zh not_active Expired - Fee Related
- 2007-03-15 WO PCT/JP2007/055288 patent/WO2007119384A1/ja not_active Ceased
- 2007-03-15 KR KR1020087022282A patent/KR20080104308A/ko not_active Ceased
- 2007-03-15 EP EP07738738A patent/EP1995635A4/en not_active Withdrawn
- 2007-03-15 JP JP2008510792A patent/JP4730436B2/ja active Active
- 2007-03-16 TW TW096109181A patent/TWI390348B/zh not_active IP Right Cessation
-
2008
- 2008-09-15 US US12/210,375 patent/US7892720B2/en active Active
-
2010
- 2010-12-22 US US12/976,583 patent/US20110117496A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN101405655A (zh) | 2009-04-08 |
| TWI390348B (zh) | 2013-03-21 |
| US7892720B2 (en) | 2011-02-22 |
| US20090017265A1 (en) | 2009-01-15 |
| KR20140009592A (ko) | 2014-01-22 |
| CN101405655B (zh) | 2013-02-06 |
| US20110117496A1 (en) | 2011-05-19 |
| JPWO2007119384A1 (ja) | 2009-08-27 |
| EP1995635A4 (en) | 2011-03-30 |
| EP1995635A1 (en) | 2008-11-26 |
| JP4730436B2 (ja) | 2011-07-20 |
| WO2007119384A1 (ja) | 2007-10-25 |
| KR20080104308A (ko) | 2008-12-02 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |