[go: up one dir, main page]

TW200801232A - Method for manufacturing diodes metallic film - Google Patents

Method for manufacturing diodes metallic film

Info

Publication number
TW200801232A
TW200801232A TW95122845A TW95122845A TW200801232A TW 200801232 A TW200801232 A TW 200801232A TW 95122845 A TW95122845 A TW 95122845A TW 95122845 A TW95122845 A TW 95122845A TW 200801232 A TW200801232 A TW 200801232A
Authority
TW
Taiwan
Prior art keywords
metal
metallic film
diodes
replacement
electrolytic plating
Prior art date
Application number
TW95122845A
Other languages
Chinese (zh)
Other versions
TWI310411B (en
Inventor
Chun-Pin Chen
Original Assignee
Yaki Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaki Ind Co Ltd filed Critical Yaki Ind Co Ltd
Priority to TW95122845A priority Critical patent/TW200801232A/en
Publication of TW200801232A publication Critical patent/TW200801232A/en
Application granted granted Critical
Publication of TWI310411B publication Critical patent/TWI310411B/zh

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention relates to a method for manufacturing diodes metallic film wherein on an diode wafer or chip area which is intended to form metallic layer forms a metal, metal oxide or alloy substrate which could be used for non-electrolytic plating replacement or reduction of the wet metal processing; then have a certain metal precipitate on the metal substrate by replacement or reduction reaction of non-cyanide containing non-electrolytic plating to produce the metal layer with the thickness as need. Therefore, the diodes metallic film manufactured by the method of this invention may reduce the production cost dramatically and improve the quality and reliability of the product.
TW95122845A 2006-06-23 2006-06-23 Method for manufacturing diodes metallic film TW200801232A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95122845A TW200801232A (en) 2006-06-23 2006-06-23 Method for manufacturing diodes metallic film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95122845A TW200801232A (en) 2006-06-23 2006-06-23 Method for manufacturing diodes metallic film

Publications (2)

Publication Number Publication Date
TW200801232A true TW200801232A (en) 2008-01-01
TWI310411B TWI310411B (en) 2009-06-01

Family

ID=44764983

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95122845A TW200801232A (en) 2006-06-23 2006-06-23 Method for manufacturing diodes metallic film

Country Status (1)

Country Link
TW (1) TW200801232A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8039279B2 (en) 2006-08-07 2011-10-18 Epistar Corporation Method for making a light emitting diode by electroless plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8039279B2 (en) 2006-08-07 2011-10-18 Epistar Corporation Method for making a light emitting diode by electroless plating

Also Published As

Publication number Publication date
TWI310411B (en) 2009-06-01

Similar Documents

Publication Publication Date Title
WO2009148634A3 (en) Conversion of just-continuous metallic films to large particulate substrates for metal-enhanced fluorescence
WO2007147605A3 (en) Tripyridinium compounds used as additives in aqueous alkaline baths, devoid of cyanide, for the deposition of electroplated zinc and zinc alloy coatings
WO2010011009A9 (en) Metal substrate for an electronic component module, module comprising same, and method for manufacturing a metal substrate for an electronic component module
MX374052B (en) Flat steel product and method for producing a flat steel product
TW200707799A (en) Bonded intermediate substrate and method of making same
TW200639269A (en) Plating method
WO2010036051A3 (en) Structure and manufacture method for multi-row lead frame and semiconductor package
WO2005094394A3 (en) Non-chrome plating on plastic
MX348385B (en) Sliding element, in particular piston ring, having a coating and process for producing a sliding element.
WO2012083100A8 (en) Electroplated lead-free bump deposition
DE602008005748D1 (en) Voltage-reduced Ni-P / Pd stacks for wafer surface
GB201216405D0 (en) Multilayer coated wear-resistant member and method for making the same
TW200802985A (en) Radiation-emitting semiconductor body with carrier substrate and the method for fabricating the same
TW200717624A (en) Method for integrating a ruthenium layer with bulk copper in copper metallization
ATE487812T1 (en) LAYER SEQUENCE CONTAINING PRECIOUS METALS FOR DECORATIVE ARTICLES
MY144995A (en) Copper alloy for electronic machinery and tools and method of producing the same
TW200717658A (en) Metal duplex and method
WO2012148104A3 (en) Silver coating pigment, and method for producing same
PH12011000072A1 (en) Semiconductor package substrate and manufacturing method of the same
EP2458036A3 (en) Gold plating solution
AR062527A1 (en) METHOD TO PRODUCE COMPOSITIONS OF OXIDES OF METALS AND COATED SUBSTRATES
MX2007009397A (en) Component with a coating for reducing the wettability of the surfaces and method for production thereof.
IN2014DN03070A (en)
IN2014CN02464A (en)
WO2009080642A3 (en) Process for manufacturing conductive tracks

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees