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TW200801156A - Adhesive composition for circuit connection - Google Patents

Adhesive composition for circuit connection

Info

Publication number
TW200801156A
TW200801156A TW096120749A TW96120749A TW200801156A TW 200801156 A TW200801156 A TW 200801156A TW 096120749 A TW096120749 A TW 096120749A TW 96120749 A TW96120749 A TW 96120749A TW 200801156 A TW200801156 A TW 200801156A
Authority
TW
Taiwan
Prior art keywords
adhesive composition
circuit connection
radical
photoirradiation
meth
Prior art date
Application number
TW096120749A
Other languages
English (en)
Inventor
Shigeki Katogi
Hoko Suto
Masami Yusa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200801156A publication Critical patent/TW200801156A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H10W74/012—
    • H10W74/15—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H10W72/073—
    • H10W72/07331—
    • H10W72/325—
    • H10W72/351—
    • H10W72/354—
    • H10W72/856—
    • H10W72/90—
    • H10W72/9415—
    • H10W90/724—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2887—Adhesive compositions including addition polymer from unsaturated monomer including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW096120749A 2002-11-29 2003-12-01 Adhesive composition for circuit connection TW200801156A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002348026 2002-11-29

Publications (1)

Publication Number Publication Date
TW200801156A true TW200801156A (en) 2008-01-01

Family

ID=32462901

Family Applications (5)

Application Number Title Priority Date Filing Date
TW095147925A TW200718766A (en) 2002-11-29 2003-12-01 Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
TW096120749A TW200801156A (en) 2002-11-29 2003-12-01 Adhesive composition for circuit connection
TW095147924A TW200718769A (en) 2002-11-29 2003-12-01 Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
TW096120755A TW200745301A (en) 2002-11-29 2003-12-01 Adhesive composition for circuit connection
TW092133727A TWI288170B (en) 2002-11-29 2003-12-01 Adhesive composition, adhesive composition for circuit connection, connected circuit structure, and semiconductor devices

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW095147925A TW200718766A (en) 2002-11-29 2003-12-01 Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW095147924A TW200718769A (en) 2002-11-29 2003-12-01 Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
TW096120755A TW200745301A (en) 2002-11-29 2003-12-01 Adhesive composition for circuit connection
TW092133727A TWI288170B (en) 2002-11-29 2003-12-01 Adhesive composition, adhesive composition for circuit connection, connected circuit structure, and semiconductor devices

Country Status (7)

Country Link
US (2) US7576141B2 (zh)
JP (1) JP4304508B2 (zh)
KR (3) KR100780136B1 (zh)
CN (2) CN1288219C (zh)
AU (1) AU2003284508A1 (zh)
TW (5) TW200718766A (zh)
WO (1) WO2004050779A1 (zh)

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JPWO2007046189A1 (ja) * 2005-10-18 2009-04-23 日立化成工業株式会社 接着剤組成物、回路接続材料、回路接続部材の接続構造及び半導体装置
JP5066451B2 (ja) * 2005-12-09 2012-11-07 電気化学工業株式会社 接着性組成物およびこれを用いた接着剤
KR100727741B1 (ko) * 2005-12-30 2007-06-13 제일모직주식회사 초속경화용 이방도전성 접착제 및 이를 이용한 이방도전성필름상 접속 부재
CN102176482B (zh) * 2006-04-26 2013-06-05 日立化成株式会社 粘接带及使用其的太阳能电池模块
CN101432861B (zh) * 2006-04-27 2011-02-09 松下电器产业株式会社 连接构造体及其制造方法
JPWO2008015759A1 (ja) 2006-08-04 2009-12-17 日立化成工業株式会社 フィルム状接着剤、接着シート及びこれを使用した半導体装置
WO2008023670A1 (fr) * 2006-08-22 2008-02-28 Hitachi Chemical Company, Ltd. matériau de connexion de circuits, structure de connexion d'un élément de circuit et procédés de fabrication de ladite structure
JP2008111091A (ja) * 2006-10-06 2008-05-15 Hitachi Chem Co Ltd 接着剤フィルム及び回路接続材料
JP2008159819A (ja) * 2006-12-22 2008-07-10 Tdk Corp 電子部品の実装方法、電子部品内蔵基板の製造方法、及び電子部品内蔵基板
US20080275326A1 (en) * 2007-05-01 2008-11-06 Joachim Kasielke Sensor for monitoring a condition of a patient
US20100295190A1 (en) * 2007-06-06 2010-11-25 Kazuyuki Mitsukura Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device
KR20100020029A (ko) * 2007-06-13 2010-02-19 히다치 가세고교 가부시끼가이샤 회로 접속용 필름상 접착제
CN102171306B (zh) * 2008-09-30 2014-08-13 迪睿合电子材料有限公司 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法
JP4360446B1 (ja) * 2008-10-16 2009-11-11 住友ベークライト株式会社 半導体装置の製造方法及び半導体装置
KR20100058359A (ko) * 2008-11-24 2010-06-03 삼성전자주식회사 다층 반도체 패키지, 그것을 포함하는 반도체 모듈 및 전자신호 처리 시스템 및 다층 반도체 패키지의 제조 방법
JP5490089B2 (ja) * 2009-02-20 2014-05-14 ヘンケル コーポレイション 電極の接続方法およびそれに使用される接続組成物
CN102326239B (zh) * 2009-03-10 2013-12-11 积水化学工业株式会社 半导体芯片层叠体的制造方法及半导体装置
WO2010125965A1 (ja) * 2009-04-28 2010-11-04 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及び回路部材の接続方法
JPWO2011132658A1 (ja) * 2010-04-22 2013-07-18 積水化学工業株式会社 異方性導電材料及び接続構造体
TWI430426B (zh) * 2010-10-19 2014-03-11 國立交通大學 使用共用傳導層傳送晶片間多重信號之系統
EP2484700B1 (de) * 2011-02-04 2013-10-09 LANXESS Deutschland GmbH Funktionalisierte Nitrilkautschuke und ihre Herstellung
JP5750937B2 (ja) 2011-02-25 2015-07-22 富士通株式会社 半導体装置及びその製造方法
KR101508761B1 (ko) * 2011-12-12 2015-04-06 제일모직주식회사 광학 필름용 조성물 및 이로부터 제조된 광학 필름
JP6454580B2 (ja) * 2015-03-30 2019-01-16 デクセリアルズ株式会社 熱硬化性接着シート、及び半導体装置の製造方法
JP6781382B2 (ja) * 2015-11-26 2020-11-04 株式会社スリーボンド 熱硬化性組成物およびそれを用いた導電性接着剤
CN106842647A (zh) * 2017-03-20 2017-06-13 武汉华星光电技术有限公司 一种显示装置、绑定结构及其制备方法
JP6718183B1 (ja) * 2019-06-24 2020-07-08 株式会社アイ・メデックス 電子回路基板を備えた生体電極
CN110600163B (zh) * 2019-09-19 2021-04-20 云谷（固安）科技有限公司 导电薄膜及其制备方法、显示装置
US11510864B2 (en) * 2019-11-11 2022-11-29 Melissa Joy Crew Removable hair coloring composition and methods of use thereof

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JP2002012738A (ja) 2000-06-28 2002-01-15 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2002012637A (ja) * 2000-06-28 2002-01-15 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP4599666B2 (ja) * 2000-06-29 2010-12-15 日立化成工業株式会社 導電性樹脂ペースト組成物及びこれを用いた半導体装置
JP4852785B2 (ja) 2000-11-29 2012-01-11 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
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JP2002363218A (ja) * 2001-06-07 2002-12-18 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2003321508A (ja) * 2002-04-26 2003-11-14 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2004018715A (ja) * 2002-06-18 2004-01-22 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置。
CN1914666B (zh) 2004-01-27 2012-04-04 松下电器产业株式会社 声音合成装置

Also Published As

Publication number Publication date
TWI288170B (en) 2007-10-11
TW200422372A (en) 2004-11-01
KR20060130268A (ko) 2006-12-18
US20050282924A1 (en) 2005-12-22
JP4304508B2 (ja) 2009-07-29
US7795325B2 (en) 2010-09-14
US20090261483A1 (en) 2009-10-22
JPWO2004050779A1 (ja) 2006-03-30
TW200718766A (en) 2007-05-16
CN1692149A (zh) 2005-11-02
CN1931947A (zh) 2007-03-21
TW200718769A (en) 2007-05-16
KR20050044767A (ko) 2005-05-12
US7576141B2 (en) 2009-08-18
KR100780135B1 (ko) 2007-11-28
TWI342327B (zh) 2011-05-21
TWI328602B (zh) 2010-08-11
WO2004050779A1 (ja) 2004-06-17
CN1288219C (zh) 2006-12-06
CN1931947B (zh) 2013-05-22
AU2003284508A1 (en) 2004-06-23
KR100780136B1 (ko) 2007-11-28
TW200745301A (en) 2007-12-16
KR20060133112A (ko) 2006-12-22
KR100730629B1 (ko) 2007-06-20

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