[go: up one dir, main page]

WO2009044732A1 - 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 - Google Patents

接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 Download PDF

Info

Publication number
WO2009044732A1
WO2009044732A1 PCT/JP2008/067742 JP2008067742W WO2009044732A1 WO 2009044732 A1 WO2009044732 A1 WO 2009044732A1 JP 2008067742 W JP2008067742 W JP 2008067742W WO 2009044732 A1 WO2009044732 A1 WO 2009044732A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
adhesive composition
connection structure
same
members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/067742
Other languages
English (en)
French (fr)
Inventor
Masaru Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2009536053A priority Critical patent/JP5126233B2/ja
Priority to KR1020117012448A priority patent/KR101376002B1/ko
Priority to CN2008801101962A priority patent/CN101815769B/zh
Priority to KR1020127013159A priority patent/KR101403282B1/ko
Publication of WO2009044732A1 publication Critical patent/WO2009044732A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H10P72/74—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01044—Ruthenium [Ru]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01045—Rhodium [Rh]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H10W72/073—
    • H10W72/07331—
    • H10W72/074—
    • H10W72/354—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

本発明の接着剤組成物は、回路部材同士を接着するとともにそれぞれの回路部材が有する回路電極同士を電気的に接続するために用いられるものであって、エポキシ樹脂、エポキシ樹脂硬化剤、及び、架橋構造を有し且つ重量平均分子量が３００００～８００００であるアクリル系共重合体を含む接着剤成分を含有する。
PCT/JP2008/067742 2007-10-05 2008-09-30 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 Ceased WO2009044732A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009536053A JP5126233B2 (ja) 2007-10-05 2008-09-30 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法、回路接続体及び接着剤組成物の硬化物
KR1020117012448A KR101376002B1 (ko) 2007-10-05 2008-09-30 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체
CN2008801101962A CN101815769B (zh) 2007-10-05 2008-09-30 粘接剂组合物和使用该组合物的电路连接材料,以及电路部件的连接方法和电路连接体
KR1020127013159A KR101403282B1 (ko) 2007-10-05 2008-09-30 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-261995 2007-10-05
JP2007261995 2007-10-05
JP2008-009673 2008-01-18
JP2008009673 2008-01-18

Publications (1)

Publication Number Publication Date
WO2009044732A1 true WO2009044732A1 (ja) 2009-04-09

Family

ID=40526159

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067742 Ceased WO2009044732A1 (ja) 2007-10-05 2008-09-30 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体

Country Status (5)

Country Link
JP (2) JP5126233B2 (ja)
KR (3) KR101376002B1 (ja)
CN (3) CN101815769B (ja)
TW (2) TWI394810B (ja)
WO (1) WO2009044732A1 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011055588A1 (ja) * 2009-11-09 2011-05-12 ソニーケミカル＆インフォメーションデバイス株式会社 接着剤組成物
WO2011129372A1 (ja) * 2010-04-13 2011-10-20 ソニーケミカル＆インフォメーションデバイス株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、ダイボンド剤、非導電性ペースト、接着性エポキシ樹脂フィルム、非導電性エポキシ樹脂フィルム、異方性導電ペースト及び異方性導電フィルム
US20120043118A1 (en) * 2009-04-30 2012-02-23 Sumitomo Electric Printed Circuits, Inc. Adhesive resin composition, and laminate and flexible printed wiring board using the same
CN102549097A (zh) * 2009-10-07 2012-07-04 索尼化学&信息部件株式会社 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板
CN102533170A (zh) * 2010-12-27 2012-07-04 第一毛织株式会社 用于半导体的粘合剂组合物和包括该组合物的粘合剂膜
CN102702988A (zh) * 2011-03-25 2012-10-03 藤森工业株式会社 粘合剂组合物的制造方法、粘合剂组合物以及粘合带
WO2012165003A1 (ja) * 2011-05-27 2012-12-06 三洋電機株式会社 太陽電池モジュール及びその製造方法
JP2015005502A (ja) * 2013-05-23 2015-01-08 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
CN104403610A (zh) * 2014-11-24 2015-03-11 苏州斯迪克新材料科技股份有限公司 高阻燃性压敏胶黏剂及其制造工艺
JP2015052114A (ja) * 2014-09-10 2015-03-19 デクセリアルズ株式会社 異方性導電接着剤
CN104673111A (zh) * 2014-06-30 2015-06-03 广东丹邦科技有限公司 环氧树脂基各向异性导电胶膜的配方及制备方法
WO2015093362A1 (ja) * 2013-12-16 2015-06-25 デクセリアルズ株式会社 実装体の製造方法、及び異方性導電フィルム
WO2020096011A1 (ja) * 2018-11-09 2020-05-14 日立化成株式会社 半導体装置製造用仮保護フィルム、リール体、及び、半導体装置を製造する方法
WO2020110785A1 (ja) * 2018-11-29 2020-06-04 日立化成株式会社 半導体用フィルム状接着剤、半導体装置及びその製造方法
US12451367B2 (en) 2019-06-19 2025-10-21 Showa Denko Materials Co., Ltd. Temporary protective film for semiconductor encapsulation molding, lead frame with temporary protective film, encapsulation molded body with temporary protective film, and method for manufacturing semiconductor device

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9261182B2 (en) 2011-03-31 2016-02-16 Kubota Corporation Shift power transmission apparatus and travel power transmission device
JP5844588B2 (ja) * 2011-09-21 2016-01-20 デクセリアルズ株式会社 回路接続材料及びそれを用いた接続方法並びに接続構造体
JP6292808B2 (ja) * 2013-09-13 2018-03-14 デクセリアルズ株式会社 接着剤、及び発光装置
JP2017512239A (ja) * 2014-03-05 2017-05-18 スリーエム イノベイティブ プロパティズ カンパニー 皮膚に優しい（メタ）アクリレート感圧接着剤
KR102529562B1 (ko) * 2015-05-20 2023-05-09 세키스이가가쿠 고교가부시키가이샤 도전성 점착재 및 도전성 기재 부착 도전성 점착재
KR20180035926A (ko) 2015-08-31 2018-04-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 습윤 표면에 대한 접착력이 향상된 (메트)아크릴레이트 감압 접착제를 포함하는 물품
WO2017040074A1 (en) 2015-08-31 2017-03-09 3M Innovative Properties Company Negative pressure wound therapy dressings comprising (meth)acrylate pressure-sensitive adhesive with enhanced adhesion to wet surfaces
JP2017110128A (ja) * 2015-12-17 2017-06-22 Dic株式会社 熱硬化性接着シート、物品及び物品の製造方法
CN109735276B (zh) * 2019-01-11 2021-03-26 华玻视讯(珠海)科技有限公司 一种微米铜片-聚苯醚-环氧树脂导电胶及制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0249087A (ja) * 1988-08-11 1990-02-19 Toray Ind Inc 接着剤組成物
JP2000509425A (ja) * 1996-05-16 2000-07-25 ミネソタ マイニング アンド マニュファクチャリング カンパニー 接着剤組成物と使用方法
JP2002212525A (ja) * 2001-01-22 2002-07-31 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体チップ搭載用基板及び半導体装置
JP2003238925A (ja) * 2002-02-19 2003-08-27 Hitachi Chem Co Ltd 接着剤組成物、接着フィルム
JP2004247657A (ja) * 2003-02-17 2004-09-02 Hitachi Chem Co Ltd 接着シート及びそれを用いた半導体装置
JP2007112949A (ja) * 2005-10-24 2007-05-10 Sumitomo Electric Ind Ltd 異方導電性接着剤

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6487996A (en) * 1995-07-10 1997-02-10 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
JPH10178054A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置
US6812065B1 (en) * 1999-04-01 2004-11-02 Mitsui Chemicals, Inc. Anisotropic conductive paste
JP3617417B2 (ja) * 1999-06-18 2005-02-02 日立化成工業株式会社 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP2001212525A (ja) * 2000-02-01 2001-08-07 Kubota Corp 粉粒体検査装置
JP4747396B2 (ja) * 2000-05-17 2011-08-17 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP4869517B2 (ja) * 2001-08-21 2012-02-08 リンテック株式会社 粘接着テープ
JP4487473B2 (ja) * 2002-07-08 2010-06-23 日立化成工業株式会社 接着剤組成物、これを用いた接着フィルム、及びこの接着フィルムを用いた半導体装置
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
KR100850772B1 (ko) * 2003-07-08 2008-08-06 린텍 코포레이션 다이싱·다이 본딩용 점접착 시트 및 반도체 장치의 제조방법
JP4265397B2 (ja) * 2003-12-22 2009-05-20 日立化成工業株式会社 半導体装置および半導体装置の製造方法
JP4890063B2 (ja) * 2006-03-20 2012-03-07 新日鐵化学株式会社 樹脂組成物、並びにこの樹脂組成物を用いて得たワニス、フィルム状接着剤及びフィルム状接着剤付き銅箔

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0249087A (ja) * 1988-08-11 1990-02-19 Toray Ind Inc 接着剤組成物
JP2000509425A (ja) * 1996-05-16 2000-07-25 ミネソタ マイニング アンド マニュファクチャリング カンパニー 接着剤組成物と使用方法
JP2002212525A (ja) * 2001-01-22 2002-07-31 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体チップ搭載用基板及び半導体装置
JP2003238925A (ja) * 2002-02-19 2003-08-27 Hitachi Chem Co Ltd 接着剤組成物、接着フィルム
JP2004247657A (ja) * 2003-02-17 2004-09-02 Hitachi Chem Co Ltd 接着シート及びそれを用いた半導体装置
JP2007112949A (ja) * 2005-10-24 2007-05-10 Sumitomo Electric Ind Ltd 異方導電性接着剤

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120043118A1 (en) * 2009-04-30 2012-02-23 Sumitomo Electric Printed Circuits, Inc. Adhesive resin composition, and laminate and flexible printed wiring board using the same
CN102549097A (zh) * 2009-10-07 2012-07-04 索尼化学&信息部件株式会社 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板
CN102549097B (zh) * 2009-10-07 2015-12-02 迪睿合电子材料有限公司 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板
CN105331308A (zh) * 2009-10-07 2016-02-17 迪睿合电子材料有限公司 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板
US20120168814A1 (en) * 2009-11-09 2012-07-05 Sony Chemical & Information Device Corporation Adhesive composition
WO2011055588A1 (ja) * 2009-11-09 2011-05-12 ソニーケミカル＆インフォメーションデバイス株式会社 接着剤組成物
CN102598236A (zh) * 2009-11-09 2012-07-18 索尼化学&信息部件株式会社 粘合剂组合物
CN102598236B (zh) * 2009-11-09 2016-01-27 迪睿合电子材料有限公司 粘合剂组合物
JP2011100927A (ja) * 2009-11-09 2011-05-19 Sony Chemical & Information Device Corp 接着剤組成物
WO2011129372A1 (ja) * 2010-04-13 2011-10-20 ソニーケミカル＆インフォメーションデバイス株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、ダイボンド剤、非導電性ペースト、接着性エポキシ樹脂フィルム、非導電性エポキシ樹脂フィルム、異方性導電ペースト及び異方性導電フィルム
CN102533170A (zh) * 2010-12-27 2012-07-04 第一毛织株式会社 用于半导体的粘合剂组合物和包括该组合物的粘合剂膜
CN102702988A (zh) * 2011-03-25 2012-10-03 藤森工业株式会社 粘合剂组合物的制造方法、粘合剂组合物以及粘合带
CN102702988B (zh) * 2011-03-25 2014-02-26 藤森工业株式会社 粘合剂组合物的制造方法、粘合剂组合物以及粘合带
JP2012248654A (ja) * 2011-05-27 2012-12-13 Sanyo Electric Co Ltd 太陽電池モジュール及びその製造方法
WO2012165003A1 (ja) * 2011-05-27 2012-12-06 三洋電機株式会社 太陽電池モジュール及びその製造方法
JP2015005502A (ja) * 2013-05-23 2015-01-08 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
US10887999B2 (en) 2013-12-16 2021-01-05 Dexerials Corporation Mounting body manufacturing method and anisotropic conductive film
WO2015093362A1 (ja) * 2013-12-16 2015-06-25 デクセリアルズ株式会社 実装体の製造方法、及び異方性導電フィルム
JP2015135949A (ja) * 2013-12-16 2015-07-27 デクセリアルズ株式会社 実装体の製造方法、及び異方性導電フィルム
CN104673111A (zh) * 2014-06-30 2015-06-03 广东丹邦科技有限公司 环氧树脂基各向异性导电胶膜的配方及制备方法
JP2015052114A (ja) * 2014-09-10 2015-03-19 デクセリアルズ株式会社 異方性導電接着剤
CN104403610A (zh) * 2014-11-24 2015-03-11 苏州斯迪克新材料科技股份有限公司 高阻燃性压敏胶黏剂及其制造工艺
WO2020096011A1 (ja) * 2018-11-09 2020-05-14 日立化成株式会社 半導体装置製造用仮保護フィルム、リール体、及び、半導体装置を製造する方法
KR20210089191A (ko) * 2018-11-09 2021-07-15 쇼와덴코머티리얼즈가부시끼가이샤 반도체 장치 제조용 가보호 필름, 릴체, 및 반도체 장치를 제조하는 방법
JPWO2020096011A1 (ja) * 2018-11-09 2021-10-07 昭和電工マテリアルズ株式会社 半導体装置製造用仮保護フィルム、リール体、及び、半導体装置を製造する方法
JP7151782B2 (ja) 2018-11-09 2022-10-12 昭和電工マテリアルズ株式会社 半導体装置製造用仮保護フィルム、リール体、及び、半導体装置を製造する方法
KR102782809B1 (ko) * 2018-11-09 2025-03-17 가부시끼가이샤 레조낙 반도체 장치 제조용 가보호 필름, 릴체, 및 반도체 장치를 제조하는 방법
US12398298B2 (en) 2018-11-09 2025-08-26 Resonac Corporation Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor device
WO2020110785A1 (ja) * 2018-11-29 2020-06-04 日立化成株式会社 半導体用フィルム状接着剤、半導体装置及びその製造方法
US12451367B2 (en) 2019-06-19 2025-10-21 Showa Denko Materials Co., Ltd. Temporary protective film for semiconductor encapsulation molding, lead frame with temporary protective film, encapsulation molded body with temporary protective film, and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
KR101376002B1 (ko) 2014-03-19
TWI394810B (zh) 2013-05-01
JP2013058764A (ja) 2013-03-28
JP5126233B2 (ja) 2013-01-23
CN102876277A (zh) 2013-01-16
CN101815769A (zh) 2010-08-25
KR20120073354A (ko) 2012-07-04
KR20100009538A (ko) 2010-01-27
CN102876277B (zh) 2014-12-10
KR20110066235A (ko) 2011-06-16
TW200932860A (en) 2009-08-01
TW201309770A (zh) 2013-03-01
CN102850982A (zh) 2013-01-02
CN101815769B (zh) 2012-11-07
JPWO2009044732A1 (ja) 2011-02-10
KR101403282B1 (ko) 2014-06-02

Similar Documents

Publication Publication Date Title
WO2009044732A1 (ja) 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
WO2009051067A1 (ja) 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
AU2003296145A1 (en) Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body
ATE524533T1 (de) Anisotrope leitfähige klebstoffe
TW200624530A (en) Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom
WO2008127925A3 (en) Structural epoxy resins containing core-shell rubbers
WO2009031472A1 (ja) 接着剤及びそれを用いた接続構造体
EP0914027A4 (en) Film-like adhesive for connecting circuit and circuit board
WO2009038190A1 (ja) 接着剤組成物及び接合体
EP1193280A4 (en) POLYIMIDE RESIN, RESISTANCE COMPOSITION HAVING IMPROVED MOISTURE RESISTANCE COMPRISING SAME, ADHESIVE SOLUTION, ADHESIVE LAYERED ADHESIVE FILM AND METHODS OF PRODUCING THE SAME
EP1754762A4 (en) ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING CONSTRUCTION FOR CIRCUIT ELEMENT AND SEMICONDUCTOR DEVICE
WO2007149377A3 (en) Epoxy adhesive composition and use thereof
EP2048209A4 (en) ADHESIVE AND CONNECTING STRUCTURE FOR CIRCULAR MEMBER
TW200600562A (en) An anisotropic conductive adhesive and an adhesive film using the same
MY138566A (en) Dicing/die bonding sheet
EP1170346A3 (en) Die attach adhesives with epoxy resin having allyl or vinyl groups
AU2003280815A1 (en) Curing resin composition, cured film and antireflection film
WO2008157571A3 (en) Crash durable epoxy adhesives with very low sensitivity to temperature variations
AU2003202139A1 (en) Encapsulating epoxy resin composition, and electronic parts device using the same
TW200718766A (en) Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
WO2008143253A1 (ja) 接着剤組成物及びこれを用いた接着フィルム
AU2003202138A1 (en) Encapsulating epoxy resin composition, and electronic parts device using the same
WO2009052163A3 (en) Crosslinkable fluoropolymer composition and uses thereof
EP1698676A3 (en) Pressure-sensitive adhesive composition applicable to nail and adhesive agent for nail
PL401407A1 (pl) Wodna kompozycja klejowa do laczenia elastomerów

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880110196.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08834752

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009536053

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 1020097018997

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08834752

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020117012448

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 1020127013159

Country of ref document: KR