TW200800792A - Method and apparatus for micromachining a material - Google Patents

Abstract

A method for micromachining a material, including configuring an optical system to provide illumination of an illumination wavelength to a site via a given element of the optical system, the illumination generating returning radiation from the site. The method further includes configuring the optical system to receive the returning radiation via the given element, and to form an image of the site therefrom, calculating an actual position of a location at the site from the image and outputting a signal indicative of the actual position of the location, generating a beam of micromachining radiation having a micromachining wavelength different from the illumination wavelength, positioning the beam to form an aligned beam with respect to the location in response to the signal, and conveying the aligned beam to the location via at least the given element of the optical system so as to perform a micromachining operation at the location.

Description

200800792 IX. DESCRIPTION OF THE INVENTION: FIELD OF THE INVENTION The present invention relates generally to optical alignment and, in particular, to optical alignment of objects to be processed in a printed circuit board. [Prior Art] Laser micromachining is particularly useful for forming holes in a printed circuit board (pCB). As the component size of pcB shrinks, the requirements for the positioning and accuracy of laser processing continue to increase. SUMMARY OF THE INVENTION In one embodiment of the present invention, there is provided a micro-drawing device for micro-machining a position at a portion, the portion generally comprising an object in a circuit board of a printed circuit board (p(8) For example, (4) Section. The device contains an optical system, and the line is illuminated by the source, because (4) is connected from the location and a micromachined beam is transmitted from the beam source to the location. Household trr - a common component 'for example - a steerable mirror for two kinds of Wei. The source of the beam and the source of the beam is usually a laser. The lucky J (wavelength work) Can also be::: two _' although in some implementations: =::== imaging, and - at TM. The processor produces - the center of the H * solder pad) the actual processing beam relative to the Through:: set the signal, and use the signal to be micro, the processing is often performed by (4) the steerable mirror. However, the first beam source is used to align the positioning using the aligned beam. The 5 200800792 : Micro-machining a hole of substantially arbitrary shape in positioning. By imaging the position And the beam transfer function uses at least one ugly. Enough: the part provides local high-intensity illumination, thereby forming a gradual and precise alignment of the micromachined beam to the location. Typically, the device is used in the PCB. The parts are micromachined and the same position in the basin. For each part, the processor can calculate the nominal coordinates of the positioning of the micromachining by the computer aided manufacturing (CAM) (4) of the heart path. For the wire m, the (four) part is nominally associated with the beam and the section. At each position, the position of the beam is determined as above. For at least some of the parts, by only operating the control The mirror is used to implement the beam at each location m to be precise, and the rate of the micro-machining of the pcB is increased by the same (4) that the beam is precisely aligned for all parts. In the disclosed embodiment, the image sensor obtains the beam image. The image of the local area on the location is typically performed by the processor operating the beam source at a low power below the burnout threshold of the location. The processor is based on the image and beam of the location. Bureau The image of the domain is determined to be offset by the beam to perform the beam alignment described above. In some embodiments, the light source can generate a camping light shot as a returning to the Han, and image sensing According to the fluorescing shot, the image of the part and/or the calibration target is formed. The processor can be itf_ the part of the # pureness (4) riding the material ^ or and the power can be implemented to make the _ source f | Shooting through the money / or around the area, borrowing money from the fluorescing shot (four) is the best image. Using glory radiation will eliminate the problem of spots if the radiation source is a laser. 200800792 in this In an alternative embodiment, the light source has a radiant polarization and can perform polarization analysis on the return light. For a portion containing (10) a person's conductive object, the surface roughness of the object is returned from the object. Usually at least partially depolarized. Thus, image sensing benefits can form an image with good contrast of the object relative to its surroundings, where the return radiation is typically not depolarized. In still another alternative embodiment of the invention, the light source comprises a laser that produces an associated beam of light having a short coherence length to substantially eliminate speckle effects.

Alternatively-selected or otherwise, the light source comprises other components that are reduced and/or eliminated, such as a plurality of fibers having different wavelengths of light. "In another disclosed embodiment, the source of radiation is used to illuminate the portion using structured illumination (e.g., by forming an -object-centered ring at the location), and the substrate is diffusive. The combination of circular illumination and a diffusing substrate effectively "backlit" the object. Accordingly, in accordance with an embodiment of the present invention, a method for micromachining a material is provided, comprising: configuring an optical system to provide an illumination of a portion of the material by a given component of the optical system Illumination of the wavelength, the illumination is generated from the portion to return light; the stomach is configured to receive an image of the portion by the given component; and calculating the actual position of the location at the location according to the image, a signal that locates the actual position; generates a micro-added X-ray beam that has (iv) a micro-addition of one of the illumination wavelengths, and accordingly outputs a signal indicating the wavelength of the 2008 7792; Determining the position of the beam at the location to form an alignment pupil is transmitted to the location by at least the given component of the 4 optical system to perform a _micro-lift operation at the location ^

Typically, the portion includes an object embedded in one or more of the insulative substrates, and providing (4) to the portion can include providing structured illumination that illuminates only the area surrounding the object. The conformation (4) can be formed by a diffractive element. In one embodiment, providing illumination to the portion includes selecting the illumination wavelength to - and independently emit a wavelength of the camping light, and the return radiation comprises a firefly shot generated at the location in response to the provided indication. The method may include a (four) fluorescent light shot to optimize the image of the portion. In an alternate embodiment, providing illumination to the portion includes providing illumination to the portion and forming an image of the portion includes performing a polarization analysis of the return radiation from the portion. In some embodiments, the given element includes a steerable mirror, the portion can include a plurality of different sub-portions in which micromachining is to be performed, and determining the position of the beam can include by only manipulating the mirror The beam is directed to the plurality of different sub-portions. In yet another alternative embodiment, the given element includes a string of optical elements for focusing the beam and illumination to the location. The portion can include a - site region, and providing illumination to the portion can include providing illumination to the region region and to another region that is no greater than the portion region and adjacent thereto. Typically, forming an image can include forming an image on an image sensor, and the illumination can have an intensity that produces an image on the image sensor in less than 3 milliseconds or less. Forming an image can include forming an image on an image sensor having a pixel array and selecting pixels from the array to analyze the image in response to the region and the other region. The method also includes determining a nominal location of the location prior to providing illumination to the location and providing illumination in response to the nominal location. In still another alternative embodiment, generating the micromachined radiation beam comprises: generating a low power beam having a power below an ablation threshold of the portion; transmitting the low power beam to the portion; The low power beam is imaged at that location to determine the offset of the beam. Typically, determining the position of the beam includes determining the position 々 of the beam due to the amount of offset, and transmitting the beam of the determined position to the location includes setting the beam to have a value equal to or greater than the ablation threshold. One power. The method can include configuring the illumination wavelength to have the portion non-absorbent

In an alternative embodiment disclosed, the portion includes an outer surface and the illumination is provided to include the imaging radiation perpendicular to the outer surface to the portion (four). The part field care is included in the lightly providing coherent shot, the coherent imaging wheel having a coherence length equal to or less than two L of the size of the part. In the disclosed embodiment of the re-alternative, calculating the actual position comprises: providing a theoretical system based on the expected image of the portion; 3 determining an actual relationship based on the image; and fitting the actual tether to the theoretical relationship . 9 200800792 Forming an image of the portion can include adjusting at least one of an illumination wavelength and a power of illumination to change the penetration depth of the illumination at the location. In a consistent embodiment, the portion includes an object embedded in a diffusing layer, and the method includes offsetting the image caused by the image formed by the object embedded in the diffusing layer. According to an embodiment of the present invention, there is provided a method for micromachining a material, comprising: operating a source to provide a light beam to a portion of the material that includes a location of the radiation beam The material emits a working wavelength of fluorescence and is insufficient to micro-process one of the beam powers to generate fluorescent radiation from the portion; an image of the portion is formed due to the fluorescent incident; the image is relative to the image Positioning determines the position of the beam; and operating the source to provide the light beam to the location, the light beam being at the operating wavelength and at a level sufficient to contribute to the "micromachining power" of the m. Operating the source at a beam power of a beam comprising providing the radiation beam to the portion via a beam directing optical system, and forming the image includes transmitting the camping radiation to at least the element via the beam directing optical system - Image sensor. The method can include filtering the fluorescent radiation to optimize the image of the portion. According to the consistent application of this month, a device for micromachining a material is provided, which comprises: ^Sumoda's original 丨 used to supply the material to a part by a given component of an optical system At the illumination of the illumination wavelength, the 产生 produces a return _ from that location. Like a sense of heart's use to receive the returning light shot by the given element and hitting to form an image of the portion; 10 200800792 beam source 'which is used to generate a micromachined radiation beam, the micro-assisted Korean beam Having a micromachining wavelength different from the illumination wavelength; and a processor for calculating a real position of the location at the location based on the image, and outputting a signal indicating the actual location of the location, corresponding to the signal And determining a position of the filament relative to the positioning to form an alignment beam, and operating the beam source to deliver the alignment beam to the location via the optical system at least the given element to thereby perform a micro at the location Processing operations. And this handles the image. The device can include a set of phosphors for use in the fluorescent light emitter to select one of the groups such that optimal illumination of the image of the portion can include polarized illumination, and the device can include A polarizing element sensor is capable of performing polarization analysis on the return radiation from the portion. The δ my given component can include a steerable mirror. Alternatively, the given element can include a string of optical elements for focusing the beam and illumination to the location. Material Packing According to an embodiment of the present invention, there is further provided a micromachining apparatus comprising: a beam source for providing a radiation beam to a portion of the material comprising a _zhong>3 , position, The radiation beam is at a beam power that causes the material to emit a certain amount of light, and is insufficient for micromachining, thereby generating a fluorescent light from the positioning. - Image sensor, which is used for glory Shooting to form a two image; and ~ - a processor for locating the beam relative to the position of the beam in response to the image, and operating the beam source to determine the operating wavelength and the micro-force rate of 200800792 The bit provides the radiation beam, the micromachining power being sufficient to facilitate micromachining of the location. The apparatus can include a beam directing optical system, and operating the beam source at the beam power can include providing the radiation beam to the portion by the beam directing optical system, and forming the image can include directing the optical system by the beam At least one component transmits the fluorescent radiation to the image sensor. The device can include a set of filters for filtering the fluorescent radiation, and the processor can be used to select one of the groups to optimize the image of the portion. The invention will be more fully understood from the following detailed description of embodiments of the invention, [Embodiment] Referring now to Figure 1, there is shown a schematic diagram of a beam aligning device 20 in accordance with one embodiment of the present invention. The device 20 is used to micromachine a portion 43, hereinafter, for example, the dummy portion 43 is contained in a printed circuit board (PCB) 24. The portion 43 typically comprises an insulating substrate material (e.g., epoxy with glass beads and/or fibers) and/or a conductive φ material (e.g., a copper pad or trace). Typically, although not necessarily, the portion 43 comprises a conductive material embedded in the insulating substrate material. Apparatus 20 includes a beam source 22 that projects a beam of radiation 26 via a collimator 27. Beam 26 is used to micromachine a hole in the location in location 43. In one embodiment, source 22 includes an ultraviolet (UV) laser that operates at a beam wavelength of about 350 nm. The UV laser can operate as a short pulse laser that uses a nonlinear interaction of short pulses to cause ablation, the length of which is on the order of femtoseconds. In an alternate embodiment, source 22 includes a carbon dioxide laser that operates at a beam wavelength of about 10 microns. However, device 20 can use any source of appropriate radiation 12 200800792 that can be configured to provide radiant energy that can be absorbed by site 43, which can be used for micromachining. In the following, as an example, it is assumed that the source 22 comprises a laser, and thus the beam 26 is a laser beam of radiation. A set of 31 optical components includes a beam splitter 28, an optical element string 30, and a mirror 34 that acts as a beam steering system to deliver the beam to the PCB. Typically, mirror 34 is a front mirror and beam splitter 28 is a narrow band dichroic solid angle beam splitter that transmits the beam wavelength and reflects other wavelengths. The optical element string 30 and the PCB 24 are mounted on respective shifting platforms 33,45. The mirror 34 is mounted on a beam steering platform 35, which is typically based on a galvanometer control platform or a two-axis fast beam steering platform as described in U.S. Patent Application Serial No. 11/472,325. U.S. Patent Application Serial No. Ser. The laser beam 26 is transmitted to the string of optical elements by a beam splitter, which is directed by the string of optical elements to focus the beam. Device 20 is configured as a "post-scan" system in which no optical components are present between mirror 34 and PCB 24. In this configuration, the field of view of the mirror is typically about ±3°. Unless otherwise indicated, the following description focuses on micromachining the PCB 24 using a laser beam. However, it should be understood that embodiments of the present invention can operate with substantially more than one laser beam simultaneously. The operator 23 operates the device 20 using a workstation 21 that includes a memory 25 and a processing unit (PU) 32. The PU 32 uses the instructions stored in the memory 25 to control various components of the device 20, such as the laser 22 and the translation and beam steering platforms. In addition to the operating platforms 33, 35, the PU 32 can also change the focus of the string of optical elements 30 when a particular hole is being machined in the portion 43. The holes are micromachined in selected regions 42 on top surface 36 of PCB 24. The inset 44 shows the portion 13 in more detail. 200800792 43 'There is an area 42 and an area surrounding the area.

In some embodiments of the invention, an object 46 is located below the area 42 and the object is embedded in the PCB 24 such that there is a layer 38 on the substrate and a layer 40 below the object. In general, there are other inlaid objects that are close to the object 46, and other layers may be included in the PCB 24, but for the sake of clarity, such other embedded objects and layers are not shown in FIG. Object 46 is typically part of a circuit and layers 38 and 40 are used as substrates on which the circuitry is formed. In one embodiment, object 46 is a generally circular metal pad having a diameter of approximately 1 micron. Typically, layers 38 and 40 are dielectric and are made of filled epoxy. In certain disclosed embodiments, layers 38 and 40 are assumed to be manufactured by various companies manufactured by Ajin, Inc. of NJ. coffee. One of the cumulative films (A) is well known in the art and will be described below with reference to Figures 2 and 3. In the embodiment, the layers 38 and 4 are constructed of which type abf and have a thickness of approximately 35 microns. However, it should be understood that layers % and 4 can be made of any material suitable for constructing a printed circuit board. For example, layer % can comprise an ABF material and layer 40 can comprise an FR4 material. In order to align the PU 32 to the illumination of the field, the radiation source 50 is typically a laser diode that provides imaging radiation in the imaging ray. In some embodiments, the 'source, 5' includes a light-emitting diode (usually a high-brightness LED. If the source 5〇 contains a laser diode, the source typically includes a point-cancellation system, such as a beam of fiber. - Alternatively, or in addition, the source can be selected to have a short coherence length as described herein. The device Μ includes a second directional beam splitter 52 that is transparent to the beam wavelength and used as the imaging light wavelength 200800792 A 50/50 splitter mirror. In some embodiments of the invention as described below, the beam splitter mirror 52 includes a polarizing beam splitter mirror. The imaging radiation is passed through a focusing lens system 49 by a beam splitter 52. The imaging is generally coaxial with the beam 26. The imaging radiation is reflected from the mirror 34 such that the imaging radiation at the PCB 24 is substantially perpendicular to the surface 36. The imaging radiation reaching the surface 36 is configured to illuminate a surround and adjacent to the region 42. A relatively small area, rather than an extended area on the surface, which is typically about four times the area of the portion being micromachined. For example, for the 100 micron exemplary pad described above, focus Lens system 49 can be equipped Providing imaging radiation in a circle having a diameter of approximately 200 microns. By arranging the imaging radiation to illuminate a relatively small area surrounding the positioning where micromachining is to be performed, high intensity illumination radiation can be efficiently supplied to the area Thereby, a high quality image of the area can be produced. By directing the imaging radiation via elements of the device 20 that are also used to direct the micromachined beam 26 to the area being micromachined, when the device 20 is realigned, In the new area of micromachining, the high intensity illumination radiation is automatically realigned to the new area. Furthermore, as described below, the return radiation for imaging is also shared via the device 20 for directing the beam 26 and the illuminating radiation. The component returns so that when the device 20 is realigned to micromachine the new region, the new region is also automatically imaged. As explained in more detail below, the combination of features enables the embodiment of the present invention to substantially instantaneously beam the beam 26 is aligned with its location, thereby providing an overall micromachining rate of PCB 24. The return radiation from portion 43 is reflected by mirror 34 via beam splitter 52 to the optical element String 30, as indicated by arrow 54, is transmitted from the optical element string to beam splitter 28. String 30 is passed through beam splitter 28 and focusing lens 55 and optionally via a filter system 15 200800792, The return radiation is directed to an optical sensor 56, which typically includes a set of optional filters, including band pass filters and long pass filters. As described below, if portion 43 is produced (d) (d) In the case of an object (such as object 46) present in the portion 43, the sensor 56 is configured to provide a signal to the PU 32 based on the location of the object, and the processing unit uses the signal to cause the beam to be % The alignment and orientation of the sensing 56 will be described in more detail with respect to the pCB 24 and the object. The operation of the sensing 56 will be described in more detail with reference to Figures 5, 56 and 5.

In some embodiments, the source 5G is used to generate fluorescence from the portion 43 back to the Korean shot, in particular such that the image formed from the return radiation is inherently free of spots. The production of fluorescent images is described in U.S. Patent Application Serial No. 10/793,224, the disclosure of which is incorporated herein by reference. In such cases, the source 50 may preferably comprise a laser diode of approximately 405 Å, and generally does not require a speckle removal system. In addition, the beam splitter 52 can preferably be configured as a dichroic beam splitter that reflects light from the source and transmits the beam 26 and the fluorescent return radiation. Preferably, the PU 32 can be used to adjust the wavelength (or wavelength) and/or power power of the imaging (4) generated by the source 5, and can change the effective depth of the penetration into the human portion 43 so that the glory is generated by Koda ; like the best. If the portion 43 contains - an object that does not emit fluorescence, such as a metal ray, the image will increase the contrast of the image. As explained below, the 'site 43 usually contains layers having different fluorescent characteristics' and thus P U 3 2 and/or Optima, 2 ώ, and Tai are optimized. Alternatively, the filter may be selected from the self-considered light film group 53 to convert to a wavelength having a working wave substantially transparent to the pcB, or a skin length #, for example, hereinafter referred to in Fig. 2. In the case of such a 16 200800792, generally for at least partially mirrored objects 46, the relatively dark background can be contrasted to image the object as a bright object. This type can be produced when a relatively long source wavelength (as given hereinafter in Figure 2) is used with materials that are relatively transparent to such wavelengths, such as SH9KABF resin, GX3 ABF resin or GX13 ABF resin. "Light field" imaging. Typically, the PU 32 performs a coarse alignment of the PCB 24 using the translation stage 45 and performs fine alignment using the stages 33 and 35 such that the area 42 is at the desired location on the surface 36 and the beam 26 is in a position relative to the surface. Need to be oriented. However, the beam 26 can also be positioned and oriented using any other convenient combination of translational stages 33, 45 and operation of the beam steering platform 35. To micromachine a hole in the PCB 24 using the beam 26, the material being processed needs to be at least partially absorbed effectively to absorb the energy of the beam. Such effective absorption can be absorbed by the PCB resin at the beam wavelength, or absorbed by an object contained in the resin (such as glass particles or fibers), or by an object embedded in the PCB (such as object 46). achieve. Alternatively, or in addition, in the case of the short pulse lasers mentioned above, the effective absorption of the beam can be achieved by a short pulse with a nonlinear interaction of the PCB resin or the embedded object. In general, since microprocessing works by ablating certain portions of the PCB, the efficiency of micromachining increases as the effective absorption of the beam increases. A number of other factors can affect the ability of device 20 to efficiently perform micromachining in PCB 24: • The portion of the PCB to be micromachined needs to have effective absorption at the beam wavelength to limit the object below surface 36 at the wavelength of the beam. (eg object 46) 17 200800792 Effective imaging. • Certain optical components of device 20 simultaneously transmit beam radiation from source 22 and imaging radiation from source 50. In addition, if fluorescent radiation is generated, the optical elements can also transmit fluorescent radiation. The three types of radiation have different wavelengths, and some of the wavelengths can be different from each other. In such cases, the optical elements of device 20 may preferably be selected to include reflective elements, refractive elements, or combinations of the two types of elements, and/or other elements such as diffractive elements, to properly transmit different wavelengths. Component selection will be apparent to those of ordinary skill in the art. • There are practical limits for the wavelengths that can be selected for the beam, and for wavelengths or wavelength ranges that can be selected for imaging and fluorescent emissions (if used). The choice of beam and imaging radiation wavelengths will vary depending on these and other factors, including the components of the PCB 24 and the optical properties of the object 46. Thus, in some embodiments of the invention, the beam wavelength is selected to be substantially the same as the imaging radiation wavelength. For these embodiments, the imaging radiation wavelength is separated from the beam wavelength by about 50 nanometers or less. In other embodiments, the two wavelengths are selected to be different from one another such that the imaging radiation wavelength is about 100 nanometers or more from the beam wavelength. In the case of fluorescent imaging, the imaging radiation wavelength is selected to produce fluorescence, and the PCB resin inherently has local absorption for imaging radiation. Device 20 can be used to micromachine a plurality of holes in PCB 24, which are typically used for microvias and/or blind vias. The steps involved in micromachining a plurality of holes are to align beam 26 with region 42, through which the holes are micromachined and the beam realigned to a new portion of the region having the desired micromachining. Repeat the process over and over again. In order for this process to proceed efficiently, the alignment and realignment of the beam should be performed as quickly as possible. Alternatively, another 2008 200800792 may be selected to configure a plurality of sets of devices 20 to micromachine a plurality of holes substantially simultaneously. In one embodiment of the invention, 18 sets of devices 20 are simultaneously operated on a PCB. In some embodiments of the invention, device 20 includes an element 51. The function of the element 51 will be described below with reference to Fig. 8. Figure 2 is a schematic plot of the percent transmission of different types of ABF resins at different wavelengths and with a resin thickness of 45 microns. By examining the graph, it is found that at a wavelength of about 350 nm, which corresponds to the wavelength provided by the laser 22, the laser is a UV laser, and the SH9K ABF resin transmits about 20%, while the GX3 ABF resin has high absorbency. Thus, if layer 38 is a SH9KABF resin, source 50 can have substantially the same wavelength as laser 22 and produce return radiation from object 46. If layer 38 comprises a GX3ABF resin, the source wavelength should be about 430 nm or more in order to obtain the same or more return radiation as in the case of SH9K. In addition to the transmission factors given in the graph of Figure 2, other factors that affect the imaging of the PCB and object 46 include the diffusion of illumination radiation due to the glass beads used to fill the epoxy of the layers 38 and 40. The size and density vary. The inventors of the present invention have found that both types of resins are substantially transparent at near infrared wavelengths of about 800 nm or more. The inventors of the present invention have also discovered that if source 50 operates at these wavelengths, a good image of the embedded object (e.g., object 46) will be formed regardless of the diffusion caused by the beads embedded in layers 38 and 40. . Figure 3 is a schematic plot of fluorescence for different resin types. The curves corresponding to the ABF resins GX3, SH9K, GX13, and FR4 materials show the relationship between the normalized fluorescence intensity and the fluorescence wavelength of each of the resin materials. These curves are generated at an excitation wavelength of 19 200800792 of approximately 300 nm, but the inventors have confirmed that at other excitation wavelengths (including the 350 nm wavelength of the UV lasers exemplified above), A roughly similar curve. Some embodiments of the present invention operate the device 20 using the fluorescent characteristics shown in the graph of Figure 3. For example, if layer 40 (Fig. 1) contains FR4 resin and layer 38 comprises GX3 resin, a working band pass filter having a wavelength of about 450 nm or a long pass filter having a cutoff wavelength of about the same wavelength can be used. The film is a good part of the second layer. When observing the fluorescent light of the second layer, a shorter band pass or long pass filter or a light sheet can be used. Figure 4 is a flow chart 60 showing the steps performed in operating device 20 in accordance with an embodiment of the present invention. Prior to micromachining using device 20, the device is first calibrated relative to PCB 24. The initial calibration can be labeled with a panel, such as a dedicated calibration panel (different from PCB 24), which is imaged using device 20 and determines the calibration offset of the device based on the imaged mark. In some embodiments, a portion of the PCB 24 can be marked and calibrated using the markers. Alternatively, or in addition, as will be explained in more detail below, the device 20 can be aligned using the fluorescent characteristics shown by the curves in Figure 3. The following description of the various steps in flowchart 60 describes a calibration process and a micromachining process. In a first calibration step 62, the operator 23 positions a dedicated calibration panel or PCB 24 (to be calibrated using the PCB) on the platform 45. The operator provides the device 20 with a calibration target coordinate (typically a coordinate of 2 to 4 calibration targets) and a shape corresponding to the targets in the calibration panel or in the PCB 24. The operator can self-power 20 200800792 The target coordinates and shape are provided in the brain assisted manufacturing (CAM) file or can be entered directly by the operator. As noted above, such targets can be configured to be non-destructive or lossy. Alternatively, the calibration panel or PCB 24 can be mechanically positioned, typically using a reference pin, a corner, or other mechanical reference zone in the panel or PCB. In a second calibration step 64, the operator operates the alignment system of device 20 to illuminate and position the calibration target. Illumination can be from source 50, and as described above, the wavelength of the imaging radiation of source 50 can be preferably selected such that the return radiation is fluorescent radiation. As also described above, the PU 32 can adjust the wavelength and/or power of the source 50 to optimize the resulting image. Alternatively, or in addition, if fluorescence of the calibration target is used, the region containing the targets can be illuminated by operating the laser 22 at a power below the ablation threshold power of the PCB. In such a case, the region can be illuminated typically by defocusing the beam 26 with the optical element string 30 and operating the laser 22 in a "area illumination" mode. Alternatively, the area illumination mode can be performed by scanning the mirror 34 using the beam steering platform 35 and thereby scanning the laser beam. The calibration target is imaged on sensor 56 and PU 32 calibrates device 20 using the target image formed on the sensor. If fluorescence is used, the PU 32 and/or the operator 23 may select one of the filters 53 to optimize the formed image. Typically, the layers 38 and 40 comprise, for example, the above. In the case of different resins, and as illustrated in the description of Figure 3. The following steps assume that the PCB 24 has been calibrated and that the PCB is in place in the device 20. In the following steps, by way of example, object 46 is assumed to be an isolated, approximately circular pad, and a hole is micromachined perpendicular to surface 36 through the center of the pad. Those of ordinary skill in the art will be able to detail the steps in the flow chart for other types of objects 46 (e.g., 21 200800792 connected to a rectangular conductor or a circular pad connected to an array of connected circular pads). The description is made as necessary. In a first micromachining step 65, the operator 23 loads the CAM files corresponding to the circuits built in the PCB 24 into the memory 25. In a second micromachining step 66, the PU 32 uses the CAM archive to determine the shape and the nominal coordinates of the shape in which a hole is to be micromachined. In the following description, it is assumed that a hole is to be micromachined at the center of the object 46, and thus the nominal coordinates may be the nominal coordinates of the object 46 or the portion 43 containing the object. Alternatively, the nominal coordinates and shape of the object 46 can be obtained by analyzing the image of the circuit, which is performed by the operator 23 and/or the PU 32. In a third micromachining step 68, the PU 32 provides a coarse adjustment control signal to each of the fixed PCB 24, optical element string 30, and/or mirror 34 motion stages using signals corresponding to one of the nominal coordinates to cause the object 46 to move in. Within the field of view of sensor 56. This positioning can be performed completely automatically by the processing unit. Alternatively, operator 23 can generally perform such positioning at least in part by providing nominal coordinates to PU 32. Beginning at step 68, PU 32 follows one of the two possible paths. The first path 69 reaches the object illumination step 74 via beam alignment steps 70 and 72. The second path 71 then directly reaches the object illumination step 74. When the flowchart 60 is first operated and then the flowchart 60 is periodically operated, the PU 32 follows the first path 69, and thus the beam alignment performed in steps 70 and 72 is not performed for each object being micromachined. Rather, beam alignment is performed intermittently every t seconds, where t is the parameter selected by operator 23 and is typically about 10. In path 69, in the first beam alignment step 70, the laser 22 is operated at a low force rate below the ablation threshold 22 200800792 and onto the location 43. The laser beam typically excites the phosphor at its location on the site 43 (here assumed to be ϋ 42), in which case the returning light beam is focused on the sensor 56 and formed on the sensor. Image of area 42. Alternatively, instead of using pCB phosphor, an ablation calibration plate has been previously attached to portion 43. In path 69, in a second beam alignment step 72, PU 32 records the position of the laser beam on sensor 56.

In the object illumination step 74, the pU 32 turns off the laser 22 and operates the source 5 〇 | object 46 for knowledge. Alternatively, or in addition, in step %, field shot $22 can be maintained at low power and/or the area illumination mode described above. The image as described in step 76 is typically formed using the return fluorescent radiation generated from pcB near object 46. Fluorescent radiation can be generated by the laser 22 and/or source 5 幸. The button image can be formed by returning the filament (four), or with the returning ray at the source wavelength. Typically, for example, for the examples of layers 38 and 4, including the types of resins (e.g., ABF and FR4) described above, in the case of reversing fluorescent radiation, pU32 self-filtering, light sheet set 53 Medium selection—filter image optimization. In the object recording step 76, the PU 32 records the object image generated in the sensor %. The PU 32 analyzes the signal level from the sensor 56 to determine the signal corresponding to the middle < I coordinate. An example of such an analysis will be referred to in paragraphs 56 & 5 (the figure states that if the path 69 has been followed, the processing unit records and determines the position of the beam obtained in step 72 by the solid cough of the center of the circular pad. Offset. (d) The offsets obtained in the latest execution of path 69 have been followed. 23 200800792 In motion step 78, PU 32 uses the offset determined in step 76, relative The beam position is adjusted at the center of the object 46. Typically, this adjustment is accomplished by operating the beam steering platform 35 to properly align the mirror 34. In operating the laser step 80, the PU 32 switches the power of the source 22 above. The ablation threshold is such that the beam ablate layer 38 and object 46, and thereby a hole is micromachined at the actual coordinate of the center of object 46. In some embodiments, during micromachining, the processing unit also The focus of beam 26 can be varied using optical element string 30 as the micromachining proceeds. In a first decision step 82, PU 32 checks if further micromachining operations are to be performed on other portions of the PCB on PCB 24. There are no other operations, then Flowchart 60 ends. If there are other operations - it is assumed here that the hole is to be machined at the center of the object substantially similar to object 46, flow chart 60 proceeds to second decision step 84. In a second decision step 84 , the PU 32 determines whether the distance of the object 46 from the nominal position of an object to be processed is greater than a predetermined distance (usually about 10 mm). If the distance is greater than the preset distance, the counter N is set to 0, and the The flow returns to step 66 to process the next object. If the distance is less than or equal to the preset distance, then in a third decision step 86, the PU 32 checks if the offset recorded in step 76 is less than a predetermined value. If the offset is less than the preset value, then in step 88, the PU 32 operates the device 20 by performing steps 78 and 80 on the following N objects, where N is the counter mentioned above, and wherein N is set to Typically, it is a predetermined value of about 10. The operator 23 can set the predetermined value N when loading the CAM file in step 65. 24 200800792 While performing step 88, the PU 32 checks each object after each processing operation. Distance is Exceeding the preset distance, in this case, the flow returns to step 66, as indicated by the broken line 67 in the flowchart. If the predetermined distance is not exceeded when the N objects are processed, the PU 32 completes the N The processing of the object increments N and then returns the flow to step 66. If the offset is greater than or equal to the preset value in decision step 86, PU 32 decrements N to a minimum value of zero. In step 90, PU 32 operates the device by performing steps 78 and 80 on the following N (decreasing values) objects. While performing step 90, PU 32 checks whether the distance between objects exceeds each processing operation. The preset distance, in this case, the flow returns to step 66 as indicated by the dashed line 73 in the flow chart. If the predetermined distance is not exceeded when the N objects are processed, the PU 32 completes processing of the N objects and then returns the flow to step 66. Decision step 84 enables operator 23 to configure device 20 to process objects within a predetermined distance of an object that has been subjected to alignment steps 66-76 without performing a alignment step. In other words, the beam position is determined using a set of objects determined for a given object as a group of objects near the given object. Decision step 86 enables the operator to configure the device such that the magnitude of the offset obtained in step 76 determines how many objects are in the group described above. Therefore, if the determined offset is lower than the preset offset, the value of N (the number of objects in the group) is incremented for a group of objects to be processed. And if the determined offset is greater than the preset offset, the value of N is decremented for the group of objects to be processed. The operator typically enters a preset distance and a preset offset value in step 65. The above description applies to micromachining a circle 25 200800792 shaped holes through the center of the circular pad perpendicular to the surface 36. Device 20 can also perform other micromachining operations, such as non-perpendicular micromachining of a hole, and/or micromachining of a non-circular hole, such as a slit-shaped hole, and/or different from flow chart 60. Determine the micro-machining at the position corresponding to the actual coordinate _ . It should also be appreciated that micromachining may be used to form a hole that completely penetrates the PCB, or that does not penetrate the hole of the PCB. The general practitioner of this technology will be able to modify the above description for these other micro-manipulation operations, usually by having the processing unit in step and rib

This is accomplished by performing a further operation on the translation stage 33, the translation stage 45, and/or the beam steering platform %. Typically, if the coarse alignment corresponding to step 68 is performed automatically, it takes approximately 1-3 milliseconds from the previous micromachined hole. If the beam steering platform 35 (Figure )) is based on galvanic flow =, then a shorter time is usually applied, and if the platform is a two-axis scanning system, ¥ is applicable for a longer period of time. Preferably, the fine alignment procedure described above in step 78 takes less than about a few milliseconds. The reason for achieving this (4) is mainly due to the high intensity of the imaging radiation directed at each part of the micromachining. The key person has found that such time does not use the steps in Process 6〇 to perform such a force. ^ · Compared with the technical system of the first time, when there is a process 6Q to process pCB, there is virtually no time. loss. In addition, steps such as decision steps 84 and 86 may be performed during the addition of the pCB. Therefore, the process 6 can be implemented to operate substantially in real time. By operating at the stated time, relatively long-term adverse effects such as thermal drift can be eliminated. Moreover, by merely performing the alignment steps 7A and 72 intermittently as described above, the total operation time is shortened without affecting the precision of the micromachining. Figure 5A shows a schematic diagram of one surface of an optical sensing person 56 that can be used in a device, in accordance with an embodiment of the present invention. Typically, the sensor 56 uses complementary metal oxide semiconductor (CMOS) technology to produce the alignment signal for the alignment time given above. Alternatively, sensor 56 can include one or more CCDs (charge-coupled devices), or other suitable sensing devices. A diagram 164 illustrates the surface of the sensor 56. The sensor 56 typically includes a rectangular array of detection elements. Some examples of suitable image sensors are described below. Micron Technology, Inc. of Boise, Idaho, provided an MTM001 CMOS BO megapixel rectangular array sensor, and the inventors of the present invention found that such sensing is suitable. A programmable region of interest (Λ0Ι) can be used to limit the number of components addressed in the sensor, thereby enabling the array to be used for short acquisition times of around 1-3 milliseconds. R · Japan's Hamamatsu Photonics Κ·Κ·Company provides a Array of 256X256 Detecting Elements S9132 that can be used as two one-dimensional arrays, and gives a total output I will be described in more detail below. Those of ordinary skill in the art will be familiar with other arrays suitable for use as sensor 56. The PU 32 can advantageously use signals from the component 170 to accurately determine a particular location with respect to the object 46. Figures 5 and 5C show examples of images of object 46. For example, it is assumed that the object 46 includes a circular pad and that the circular pad is to be micromachined. "In the fifth diagram, the object shame contains an isolated approximately circular pad which produces an image 166. In Figure 5C, object 46 includes a solder fillet attached to one of the rectangular conductors approximately circular, which produces an image 176 formed by the connection of the circular portion 178 to the rectangular portion 180. If the sensor 56 is comprised of A rectangular array of individual pixels (such as the MlCIOn array mentioned above), for the image (10), the PU 32 can reduce the number of pixels to be analyzed to a rectangular pixel set 168 of one of the images 166, reducing the number of pixels. 200800792 Shorten the acquisition time for images. PU 32 can then fit all of the imaging pixels to a circle, usually using an edge detection algorithm to identify the center of image 166 with sub-pixel precision. For example, by using 130 100x100 pixels in megapixels, compared with the nominal frame rate of 30 Hz, can improve the image acquisition time by nearly 100 times, so as to provide sub-millisecond acquisition time. With high image illumination intensity, this is provided by illumination of the directional portion from source 50 via mirror 34 (Fig. 1). For image 176, PU 32 can reduce the number of pixels to be analyzed to a rectangular pixel of surrounding portion 178. Set 179 (possibly removing some of the pixels in rectangular portion 180.) With an edge detection algorithm, PU 32 can then fit the imaging pixels that form a non-linear edge to a circle to identify the circle with sub-pixel precision. The center of section 178. Alternatively, PU 32 can fit all pixels to an expected theoretical edge using an edge detection algorithm that intersects a circle with two parallel lines on one side of the circle. In general, the pixels selected by the PU 32 for analysis need not be a simple rectangular array. For example, the imaged portion may comprise a small circular pad attached to a large circular pad, in which case The pixels selected by PU 32 can be configured to include exactly the set of generally irregular pixels selected for that portion. Sensor 56 can include an array that does not give an output for each pixel in the array. For example, the Hamamatsu array mentioned above. In this case, the PU 32 can apply a curve fit to the sum output of the array to find the center of the images 166 and 178. Figure 6 is an alternative to the present invention. 28 of the embodiment of the beam alignment device 320 200800792. The operation of the device 320 is substantially similar to the operation of the device 20 (Fig. 1) except for the differences described below, and the devices 20 and 320 are referenced by the same reference numerals. The elements shown are generally similar in construction and operation. Device 320 includes a beam splitter 326 and has a beam splitter 52 removed. Beam splitter 326 is used to transmit imaging radiation from source 50 and return radiation from portion 43. Reflected to sensor 56. If the return radiation has the same wavelength as the source 50, the beam splitter can be a 50/50 beam splitter. If the radiant radiation is returned, the beam splitter 326^ can be configured as a dichroic beam splitter. Alternatively, as described below, the beam splitter 326 can be a polarizing beam splitter. In device 320, optical element string 30 is separated into two sets of optical elements. The first set 324 typically includes movable optical elements that can be used to vary the magnification of the beam from source 22. The second set 322 typically includes a fixed optical component. By dividing the optical element string 30 into the two groups, the magnification of the beam from the source 22 can be adjusted without affecting the illumination and the imaging path between the beam splitter 28 and the mirror 34. Elements 323 and 325 in device 320 will be described below. If the normal imaging illumination provided in device 320 is substantially uniform over portion 43, i.e., if the illumination has little or no structure at all, the image obtained by specular object 46 is typically surrounded by a bright image of the object. A dark background image of the area of the object, and the two images have a good contrast. After consideration of the devices 20 and 320, optical elements such as the steerable mirror 34 and the optical element string 30 can transmit at least two different wavelengths, i.e., the beam wavelength of the beam 26 and the imaging radiation wavelength of the source 50. If fluorescent is used, the optical components can deliver three different wavelengths, namely the beam wavelength, the imaging radiation wavelength, and the fluorescence 29 200800792 wavelength. Configuring the same components to deliver two or three different wavelengths significantly reduces the number of optical components that may be required if a separate set of components are used for different wavelengths. Figure 7 is a schematic illustration of a beam alignment device 330 in accordance with yet another alternative embodiment of the present invention. The operation of device 330 is generally similar to the operation of device 20 (Fig. 1) and device 320 (Fig. 7), except for the differences described below, and the components represented by the same reference numerals in devices 20, 320 and 330 are The construction and operation are generally similar. Device 330 includes a lens system 336 between mirror 34 and portion 43. Lens system 336 typically includes a telecentric lens that enables mirror 34 to have an FOV of about ±20°. Adding the lens system will configure device 330 as a "pre-scan" system. The larger the FOV of the mirror, as compared to the scanning system described above, enables the mirror to project the beam 26 onto the larger area of the PCB 24 and image the area. Optical component sets 324 and 322 are typically reconfigured to include a first set 334 of movable elements and a second set 332 comprising fixed elements, groups 334 and 332 being selected to accommodate lens system 336. The above description of devices 20, 320, and 330 assumes that the imaging illumination is generally perpendicular to surface 36 and is generally unstructured. In some embodiments of the invention described below, the imaging illumination can also be configured to have the illumination structured as described below. Figure 8 illustrates an imaging radiation configuration 344 provided by source 50 in accordance with an embodiment of the present invention. The figure shows a cross-sectional view 340 and a top view 342 of the PCB 24 in the case of a radiation configuration 344. In configuration 344, the imaging radiation on surface 36 is structured into imaging radiation, for example, in the shape of a generally circular ring 346. The imaging radiation penetrates layers 38 and 40 and is also locally scattered within the layers due to diffusion within the layers, such as primarily due to the inclusion material contained in the layers. The combination of penetration and local scattering effectively "self-backlighting" the object 4-6, as indicated by the arrow 344, thereby forming a high contrast image on the sensor 56. High-contrast images are produced regardless of whether the object is shaved or not. In addition, high contrast images formed by back illumination effectively compensate for image blurring that may be caused by (d) diffusion in the layers. If you do not use the backlight, the image can cause a deviation in the position of the image. It is possible to place an element 51 (a ten-way stop) between the lens 49 and the beam splitter 52 to advantageously provide a light-emitting configuration 344 in the device 2A. Although not shown in the figures for clarity 'However, it is also possible to provide a configuration 344 in the device by placing the stop device between the lens and the beam splitter 28. Others are used to form annular radiation in the devices 320 and 330. The method (e.g., used to obtain a structured illumination braided diffractive element) will be apparent to those of ordinary skill in the art and is believed to be included in the material I of the present invention, e.g., element 5] · Source material _ his shape red structuring (four), the lighting is structured according to the imaged part. For example, you can use - rectangular: bright = to the area around the linear trace. All these forms Structure;; = Baijiling is still included in the scope of the present invention. In order to obtain the configuration 344, the source 5G can be selected to have a polar emitter, so that it is a laser processing object of the Dingcheng The inventors have found that the coherence length is about this inch (for example, the diameter of the 81-mass) A multiple of the laser is suitable for re-see Figure 6, an alternative radiation configuration using polarized illumination radiation. As in the 6th 31 200800792 winter polarization state 323 placed after the source 50, and an analyzer placed in the sensor Before 56, the probe contains ^ 5. Another alternative is that since the source 50 generally provides polarized radiation, the polarizer 323 can be used without any. Orientation of the polarizer 323, or source 5G (if the basin is lightly polarized) The orientation of the analyzer and the orientation of the analyzer 325 can be controlled by the Pu 32. Alternatively, the material direction can be preset by the operator 23 to be a large surface 36 and a PCB 94. (For example, the interface between layer 38 and layer 40, the reflection has the same polarization as the incident polarized radiation of low human angle. The acoustic backscattered radiation is relatively weak, and is mainly the same as human polarized radiation. The cover is still static. 'If the object 46 has even a partially rough metal surface" the adhesion between it and the resin embedded in it, it is usually the case), and the reflection of the Koda field κ is depolarized and thus has an incident polarization. Light shot is (10). f. In the alternative configuration described herein, '卩(四) sets the polarizer milk and the analyzer milk to have a polarization, or manipulates the orientation of the 23 strands so that the surfaces and layers 38 The specular reflection on the inside of the 4G is absorbed, and the radiation from which the object is depolarized is transmitted. The polarization of the intersection thus provides a good image of the object 46 having a high contrast with the material surrounding the object. In an alternative embodiment of polarization, neither polarizer 323' nor analyzer 325 is used. Instead, source 5A is constructed to provide polarized illumination, and beam splitter 326 is configured to transmit transmissive A reduced-polarization beam splitter mirror is used to reflect the depolarized (four) (including the light from the object 46) to the sensor 56' thereby forming a good image of the object as described above. Referring again to Figure 1, the beam splitter mirror 52 can be configured as a polarizing beam splitter at the wavelength of the source 5G to cause the object formed by the device to be imaged 32 200800792. The quality is similar to that in the device 320. The resulting image. The polarization embodiment described above enables the sensor 56 to perform polarization analysis of the return radiation from the object 46 and its surrounding environment. In each polarization embodiment, to reduce speckle, the source 5〇 may comprise a laser emitter having a *isocoherent length that is less than the size of the object being processed. For example, for 'B' shaped pads, the coherence length can be significantly less than the diameter of the pad. Other methods can also be used to reduce the spots, such as using the methods exemplified above. The various embodiments described above relate to the use of pCB 24 and/or optical images of objects 46 to adjust the actual micromachining position of the PCB. However, it should be understood that pu 32 may also use PCBs and/or other types of images of embedded objects to determine the actual location required. Moreover, it should be understood that embodiments of the present invention can also be used to image objects embedded in or on materials other than pCB, such as ceramic I or glass. The general practitioner of this technology can modify the above descriptions to adapt to the changes required for other types of images without undue experimentation. It is to be understood that the above-described embodiments are cited by way of example, and the invention is not intended to Rather, the scope of the present invention is intended to be inclusive of the combinations and sub-combinations of the various features described above, and the changes which are apparent to those skilled in the art Modifications. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram of a beam aligning device according to an embodiment of the present invention; Fig. 2 is a graph showing a percentage transmission curve of different types of Ajinomoto Build-up Him 'ABF resin Fig. 33 200800792 Fig. 3 is a graph of the verticality of the different types of Nashu and the resin of the resin - 踅 之 对 ^ ^ 罢 罢 罢 罢 罢 罢 流程图 流程图 流程图 流程图 流程图 流程图 流程图 流程图 流程图 流程图 流程图Invention - Embodiments, the steps of operating the light beam to align the garment; Figure 5A shows a surface intent of the optical sensor in accordance with an embodiment of the invention; /x 5B and 5C are shown in accordance with the present invention - an embodiment Figure 6 is a schematic view of the image of the sensor on the sensor; Figure 6 is a sound diagram of a beam aligning device according to an alternative embodiment of the present invention; Figure 7 is a further alternative embodiment of the present invention. For example, a schematic diagram of a beam alignment device; and FIG. 8 illustrates an imaging illumination configuration provided by a source in the device of Figures 1, 6, and/or 7 in accordance with an embodiment of the present invention. [Main component symbol description] 2〇: Beam alignment device 21: Workstation 22: Beam source 23: Operator 24: Printed circuit board (PCB) 25: Memory 26: Radiation beam 27: Collimator 28: Beam splitter 30: optical element string 31 ·· - group optical element 32 : processing unit (pu) 33 : translation stage 34 ·• mirror 35 : beam manipulation platform 36 : top surface 34

200800792 38 : Layer 40 42 : Selected area 43 : 44 : Illustration 45 : 46 : Object 49 : 50 : Radiation source 51 : 52 : Second dichroic beam splitter 53 : 54 : Arrow 55 : 56 · Optical sensing 164 166: image 168 170: rectangular array of detection elements 176 178 : circular portion 179 180 : rectangular portion 320 322 : second set of optical elements 323 324 : first set of optical elements 325 326 : beam splitter 330 332 : Second set of optical elements 334 336 ·•Lens system 340 342 ··Top view 344 346 : Imaging radiation 348 of generally toroidal shape ••Transformation of layer parts Platform focusing lens system component Filter system Focusing lens: Schema: Rectangular pixel set : Image: Rectangular Pixel Set: Beam Alignment Device: Component: Component: Beam Alignment Device: First Group of Optical Components: Sectional View: Radiation Configuration: Arrow 35

Claims (1)

200800792 X. Patent Application Range: 1. A method for micromachining a material, comprising: - a light-splitting subsystem, by providing a component of the material with illumination at an illumination wavelength via a given component of the optical system, Illumination also generates return radiation from the portion; and, the wire m is arranged to receive the ride back light through the given component, and form an image of the portion according to the image; and calculate the actual position of the portion at the location according to the image, And outputting a signal indicative of the actual position of the positioning; generating a micromachined light beam having a wavelength different from the wavelength of the illumination; the signal is determined by the position of the beam (four) for the positioning An alignment beam; and transmitting the alignment beam to the location via at least the given component of the optical system to perform a micromachining operation at the location. The method of U.S. Patent No. 1, wherein the portion contains at least one object in an insulating substrate. 3. As recited in claim 2, the provision (4) includes providing structured illumination that illuminates only the area surrounding the object. The method of clause 3, wherein providing the structured illumination comprises forming the structured illumination with a diffractive element. The method of claim 1, wherein the providing illumination to the portion comprises selecting the illumination wavelength to be a wavelength at which the portion emits fluorescence, and wherein the return radiation comprises generating at the portion due to illumination provided The camp light is light. 36 200800792 6. The method of claim 5, which comprises calling the fluorescent screen to optimize the image of the portion. 7. The method of claim 1, wherein providing illumination to the portion comprises providing polarized illumination to the portion and wherein the image forming the portion comprises polarization analysis of the returned radiation from the portion. 8. The method of claim 1 wherein the given component comprises a steerable mirror. 9. The method of claim 8, wherein the portion comprises a plurality of different sub-portions in which the micro-addition is to be performed, wherein determining the position of the beam comprises directing the beam to the lens by manipulating only the mirror The plurality of different sub-portions. The method of claim 1, wherein the given element comprises a string of optical elements for focusing the beam and the illumination to the location. U. The method of claim 1, wherein the portion comprises a-site region, and wherein the portion of the portion (1) provides illumination for the portion of the region and for another region that is no greater than and adjacent to the region. 12. The method of claim n, wherein the image is included in the image sensing $ to form an image 'J', wherein the photo (4) has - on the image sensor in 3 milliseconds or less The intensity of the image is produced. 13. The method of claim 11, wherein forming the image comprises forming the image on an image sensor comprising an array of pixels, and selecting pixels from the array for the region and the other region The image is analyzed. 14. The method of claim 1, comprising the nominal position of the clamp prior to providing the illumination to the location and providing the illumination in response to a nominal location. • The method of claimant, wherein generating the micromachined radiation beam comprises: 37 200800792 generating a low power beam, one of the beams having a power below an ablation threshold of the portion; transmitting the low power beam to The portion; and determining an offset of the beam due to an image of the low power beam at one of the locations. 16. The method of claim 15 wherein determining the position of the beam comprises determining the position of the beam due to the amount of offset. 17. The method of claim 15 wherein the passing of the beam of the determined position to the location comprises setting the tow to (or) greater than or equal to the power limit. 1 δ. The method of claim 1, comprising arranging the illumination wavelength to have a value that renders the portion non-absorbent. 19. The method of claim 1, wherein the towel comprises a silk surface, and the == illumination comprises a portion perpendicular to the outer surface. The method of claim 1, wherein the providing the position provides a coherent ensemble having a coherence length equal to: - twice the size of the = portion. The method of claim 1, wherein calculating the actual position comprises: providing a theoretical relationship based on an expected image of the portion; determining an actual relationship based on the image; and fitting the actual relationship to The theoretical relationship. 22. The method of claim 1, wherein the image of the portion comprises adjusting the illumination wavelength of at least 2008 200800 to at least one of the illumination wavelengths to change a penetration of the illumination at the location depth. 23. As requested! The method wherein the portion comprises an object embedded in a diffusing layer and comprising compensating for a deviation caused by the image formed by the object embedded in the diffusing layer. 24. A method for micromachining a material, comprising: operating a light source to provide a radiation beam to a portion of the material that includes a location, the radiation beam being at an operating wavelength that causes the material to emit fluorescence And being insufficient to micro-process one of the beam powers to generate fluorescent radiation from the portion; forming an image of the portion due to the fluorescent radiation; determining the position of the beam relative to the positioning due to the image; The source is operated to provide the radiation beam to the location, the radiation beam being at the operating wavelength and at a micromachining power sufficient to facilitate micromachining of the location. The method of claim 24, wherein operating the light source at the beam power comprises providing the radiation beam to the portion via a beam steering optical system, and wherein forming the image comprises at least one of the beam directing optical system The component transmits the fluorescent radiation to an image sensor. 26. The method of claim 24, comprising filtering the fluorescent radiation to optimize the image of the portion. 27. A device for micromachining a material, comprising: a source of radiation, which is used to provide a component via a given element of an optical system 39 200800792. The illumination is provided from a portion of the material of the portion. The illumination of the μ wavelength is returned to the radiation; an image sensor is configured to receive the return light by the given component and thereby form an image of the portion; a beam source for generating a micromachining a light-emitting beam having a micro-machining wavelength different from the illumination wavelength; and a processor for calculating a position of the portion based on the image and outputting a +咕-仏> ^... Signaling the intervening position of the clamp, determining the position of the beam relative to the position in response to the signal to form an alignment - beam 'and operating the beam source to at least be given via the optical system The alignment beam is delivered to the location whereby a micromachining operation is performed at the location. The device of claim 28, wherein the portion of the crucible comprises an object embedded in at least one of the insulating substrates. ' The device of claim 28, wherein providing illumination to the portion comprises providing structured illumination that only illuminates an area surrounding the object. The device of claim 29, comprising forming one of the structured illumination elements. 31. The device of claim W, wherein the illumination wavelength comprises a wavelength-wavelength that causes the portion to emit fluorescence and wherein the return radiation comprises a fluorescent light shot at the portion that is due to illumination provided. 32. The device of claim 31, comprising: a filter for filtering the fluorescent light, and wherein the processor is configured to select one of the set of filters, 俾200800792 Image optimization. 33. The device of claim 27, wherein the illumination comprises polarized illumination and comprises a polarization element that enables the image sensing 进行 to polarize the return radiation from the portion. The device of claim 27, wherein the given component comprises a steerable mirror. For example, in the device 1 of claim 34, the portion includes a reduced sub-portion in which micromachining is to be performed, and the towel determines that the optical weight position comprises: directing the beam to the mirror by Multiple different sub-parts. The device of claim 27, wherein the given component comprises an optical component string for focusing the beam and the illumination to the location. 37. The device of claim 27, wherein the portion comprises a site region, and wherein providing illumination to the portion comprises a dragon site region and providing illumination to another region no greater than the portion region and adjacent thereto. The device of claim 27, wherein the illumination has an intensity of the image produced on the image sensor within 3 milliseconds or less. 39. The device of claim 27, wherein the image sensor comprises a pixel array' and wherein the processor selects pixels from the array for analyzing the image in response to the region and the additional region. The device of claim 27, wherein the processor is configured to determine the location-nominal location of the location before the light source provides the portion, and wherein the processing is to command the nominal location The light source provides this illumination. The apparatus of claim 27, wherein generating the micromachined radiation beam comprises generating a low power beam having a power below the portion of the burn-in threshold 200800792 value and wherein the processor is to The low power beam is delivered to the location and an offset of the beam is determined based on the image of the low power beam at the location on the image m. 42. The device of claim 41, wherein the towel determines that the position of the beam comprises determining the position of the beam due to the amount of offset. The apparatus of claim 42, wherein the directing the alignment beam to the location comprises setting the beam to have a power equal to or greater than a limit of the firing vessel. φ 44. The device of claim 27, which comprises configuring the illumination wavelength to have a value that renders the portion non-absorbent. 45. The device of claim 27, wherein the portion of the crucible comprises an outer surface, and wherein the portion of the basin is provided with (iv) comprising imaging (4) perpendicular to the outer surface to illuminate the portion. 46. The device of claim 27, wherein the light source is to provide coherent imaging radiation at the location. The coherent imaging radiation has a coherence length that is once equal to or less than twice the size of the portion. The device of claim 27, wherein the processor is configured to: receive a theoretical relationship based on one of the expected images of the location; determine an actual relationship based on the image; and fit the continuous relationship to the theoretical relationship . 48. The device of claim 27, wherein the processor is operative to adjust at least one of the illumination wavelength and the illumination-to-power to change a penetration depth of the illumination at the location. 49. The device of claim 27, wherein the portion comprises a 42 200800792 object embedded in a diffusing layer, and wherein the processor is configured to compensate for the "image" (de) deviation formed by the embedded body. ...the object in the cross-beam layer. A device for micromachining a material, comprising: a Han beam 2 beam source, provided by a part of the material contained in the material - the forest beam is at a working wavelength that causes the material to emit fluorescence, and i; for micromachining - beam power to produce fluorescent radiation; a house-image sensor for forming an image of the portion in response to the fluorescent radiation; and a processor for responding to the image The beam source is operated relative to the position of the position to provide the beam of radiation at the operating wavelength and the micromachining power, the micromachining power being sufficient to facilitate micromachining of the location. The device of claim 50, comprising a beam directing optical system, wherein operating the beam source with the beam power comprises providing the radiation beam to the portion by the beam guiding optical system, and wherein the image is formed The fluorescent radiation is transmitted to the image sensor by at least one component of the beam directing optical system. 52. The device of claim 50, comprising a filter for filtering the fluorescent radiation, and wherein the processor is configured to select one of the set of filters, the image of the portion being the most Jiahua. 43