1374787 六、發明說明： 【發明所屬之技術領域】 *方校正雷射掃描偏移量之裝置 ”方法尤私一種可放大雷射光點偏移量，盔項 加工即可進行校正之裝置與方法，利用同輪視 制尋點方法提高校正精度、提昇校，二； (in—line)與離線（off-line)進行校正。 卫了於在線 【先前技術】 々以雷射蝕刻技術取代傳統高污染性的化學濕蝕刻一直 都义到矚.目但雷射搭配光罩式技術的加工速度往往令人 話病。針對上述問題’提出結合光罩技術和掃描振鏡的、新 技術。進行雷射掃描振鏡蝕刻或大面積縫合時，加工品質 仰賴加工位置與縫合精度的提昇，然而雷射掃描振鏡卻因 為長時間加工累積的熱量造成振鏡角度偏擺（熱飄-移現 象）.’根據雷射掃描器製造薇商（Scania)提供之數據約為 加工八小時誤差600//rad，亦即，掃描振鏡角度誤差投影 至加工面誤差約為1〇〇〜2〇〇 (隨著scan lens焦長而不 同）’造成的加工圖案或縫合誤差將嚴重影響加工品質。 針對習知專利而言’例如美國發明專利第5185676號 「Beam scanning apparatus and apparatus for writing image information」，該案揭露一種包含偵測單元 (Optical detecting means)及控制單元（Controlling part)之掃描系統，該偵測單元可以判斷通過掃描器之雷射 13747871374787 VI. Description of the invention: [Technical field of invention] The device for correcting the laser scanning offset is particularly a device and method for amplifying the laser spot offset and correcting the helmet item. Using the same-round visual point-finding method to improve the correction accuracy, improve the school, and the second; (in-line) and off-line (off-line) correction. Guard on the online [prior art] 々 replace the traditional high pollution with laser etching technology Sexual chemical wet etching has always been the right thing to do. The processing speed of the laser with the reticle technology is often ill. For the above problems, a new technology combining reticle technology and scanning galvanometer is proposed. When scanning galvanometer etching or large-area stitching, the processing quality depends on the processing position and the stitching precision. However, the laser scanning galvanometer causes the galvanometer angle yaw (heat drift-shift phenomenon) due to the accumulated heat accumulated for a long time. According to the laser scanner, the data provided by Scania is about 600//rad for processing eight hours, that is, the scanning galvanometer angle error is projected to the processing surface error of about 1〇〇~2. 〇 (different with the length of the scan lens) 'The resulting processing pattern or stitching error will seriously affect the processing quality. For the conventional patents', for example, US Patent No. 5185676 "Beam scanning apparatus and apparatus for writing image information" The case discloses a scanning system including an optical detecting means and a controlling part, and the detecting unit can judge the laser passing through the scanner 1374787
光偏移量，經由控制單元校正掃描角度或位置。其技術特 徵在於控制一個轉向板（deflector)改變掃描振鏡 (scanningmirror)之角度或位置’使加工位置偏移，利用 . 一個半反射鏡（half-mirror)將部分雷射反射光導進一 CCD .進行偵測，並使雷射光與該CCD之距離約等於雷射光與加 工件（workpiece)之距離，再根據偵測結果由控制單元校正 •知描振鏡之偏擺角度與偏擺位置；惟，該習知専利之侦測 位置受限於掃描鏡片（scan lens)之焦長及掃描特性，根據 • 公式：Ay=f * △ Θ，其中，Ay為位移變化量，△ 0為角 度變化量，假設焦長f為100〜300_，ΛΘ為5/zrad時， 其位移變化量Ay為0.5〜1.5/zm，由於位移變化量極小， 導致枝正精度低，.此外’一般加工雷射源電流瓦數高達 200〜300瓦（watt)，其加工雷射源直接投射於掃描系統之 偵測器（detector)，容易造成偵測器損壞，雖然可採用衰 減裔改變雷射光源之電流1以哀減雷射能量，卻又會造成 加工不穩定，而設置衰減器也會導致成本增加。 _ 又如美國發明專利第6501061號「Laser calibration apparatus and method」’該案係利用一偵測單元（detector) 偵測光束知描路徑’可付知雷射掃描器（laser scanner) 與來焦光斑之相對座標，再由控制模組（contro 1 modu 1 e) 決定雷射加工至加工件之時間或空間差，藉此校正該雷射 掃描器與雷射聚焦光斑錯位’達到精確加工之目的，並可 藉由.CCD光強度分佈決定光斑中心位置（interpolation techniques);惟’該案必須採用特殊設計的鏡臺（stage)， 導致設備成本提高，此外’一般加工雷射源電流瓦數高達 1374787 200〜300瓦（watt)，其加工雷射源直接投射於掃描系統之 偵測器（detector)，容易造成偵測器損壞，雖然可採用衰 減改變雷射光源之電流量以衰減雷射能量，卻又會造成加 工不穩定，而設置衰減器也會導致成本增加。 據此可知，習知雷射加工系統均必須進行雷射加工方 能達到即時校正效果，且因為偵測位置受限，導致校正精 度無法提升。 【發明内容】 有鑑於習知技術之缺失，本發明提出一種即時校正雷 射掃描偏移量之裝置與方法，可放大雷射光點偏移量，無 須透過雷射加工即可進行校正，利用同轴視覺處理與控制 尋點方法提高校正精度、提昇校正速度，並可於在線 (in-line)與離線（off-line)進行校正。 為達到上述目的，本發明提出一種校正雷射掃描偏移 量之裝置，包含： 一加工雷射輸出單元，用以輸出一加工雷射光束； 一掃描單元，包含一掃描振鏡； 一第一分光單元，係設置於該加工雷射輸出單元與該 掃描單元之間，前述該加工雷射光束係通過該第一分光單 元後進入該掃描單元，再由該掃描單元射出； 一第二分光單元，用以提供由該掃描單元射出之加工 雷射光束通過； 一指向雷射輸出單元，用以輸出一指向雷射光束，該 6 U74787 ==射向該第二分光單元，由該第二分光單元 分光單元軍元射出並射向該第一 ^弟一刀先早7C反射該指向雷射光 雷射:Γ:單二用:承接由該第-分光單元反射之指向 點…㈣ 每射光束於該偵測單元成像-指向光 :目標指向先點位置’該_單元具有 ml制單元’用以比對該指向光點位置與該目標光點 描振^轉=料量，錄據㈣騎朗是雜制該掃 量之==目的’本發明提出-種校正雷射掃描偏移 雷射光輸輪工雷射光束，該加工 f射先束通過—第—分光單元後進人-掃描單元，再由咳 掃描單元射出，該掃描單元包含—掃描振鏡； 由-指向雷射輸出單元輪出一指向雷射光束，該指向 雷射光束係射向該第二分光單S，由該第二分光單元反射 ，入該掃描單元’再由該掃描單元射出並射人該第一分光 單元，再由該第-分光單元反射該指向雷射光束，使該指 向雷射光束射入一偵測單元； 該指向雷射光束於該偵測單元成像一指向光點，由該 偵測單元偵測該指向光點位置，於該偵測單元定義有一目 標光點位置；以及 由一控制單元比對該指向光點位置與該目標光點位置 鏡轉動。烏私Μ亚根據比對結果判斷是否控制該掃描振 於本¥明之結構目的和功效有更 、同’灶配合圖示詳細說明如后。 【實施方式】 用的=:::之圖式來描述本發明為達成目的所使 助言兒明，以利下圖式所列舉之實施例僅為輔 於所列舉圖式。貝—委貝瞭解，但本案之技術手段並不限 量之裝置= 列所：之校正雷射掃插偏移 裴置ιοο#ώ一i 思圖，該校正雷射掃描偏移量之 〜第一分#|-二卫雷射輸出單元1G1、—掃描單元1〇2、 刀无单7〇1〇3、一篦-八止 出單元105、一光學元#‘刀一早凡1〇4、一指向雷射輸 元108構成，^泰牛 Γ偵測單元107及一控制單 光束L1，哕* °:〇工苺射輸出單元101可輸出-加工雷射 之範圍^ 光束U之波長係位於L〜lG_〇nm 振鏡1ί)9ΐ二田早几102包含—掃描振鏡102卜該掃描 出)，=連接至少-疑轉致動元件(圖中未示 該第:八一致動疋件係用以驅動該掃描振鏡1Q21轉動， 兮搞知刀光單兀1〇3係設置於該加工雷射輸出單元101與 补插單WG2之間，該第-分光單元1Q3及第二分光單 兀104可採用短波穿透（sh〇rt wave pass，swp)、長波穿 透（1 ong wave pass，LWP)，其形狀為平板狀、立方狀（cube) 或多邊形狀之分光鏡，該指向雷射輪出單元1〇5可輸出一 1374787 指向雷射光東L2，該指向雷射光束L2 驗—之範圍内’該光學元件106係由非 Usphenc len)與球面透鏡（sphencal h 由透鏡 組，該偵測單元1〇7可採用包含單點，;^焦鏡 之光偵測器’例如電荷偶合树⑽ 感測器 導體（CMOS)之偵測哭、 補式金屬氧化半 杜7nR b糾 制早元108電性連接料風- 件106及该掃描單元1〇2，該控制單元 3及先學凡 鏡控制程式與影像處理程式，用以控制該^ -掃描振 動，並對該掃描振鏡1〇21進行幾何 广振鏡1021轉 量蜂值座標、光斑大小之影像分析。/ ☆座標、光點能 β亥加工雷射光束u由該加卫雷 後，依序通過該第-分光單元103、 =^ 101射出 掃描振鏡1021、該第二分光單元1〇4，q田早70 102及該 300(圖示實線箭頭路徑），可對該加工取< 射向一加工件 工；該指向雷射光束L2 _指向雷進行雷射加 後，係射向該第二分光單元1〇4，由誃^ _早兀105射出 反射後通過該掃描振鏡1021進入該浐二⑽二分光單元104 掃描單元102射出並射向該第一 “V元單L102:再由該 —刀先早7G 103反射，使該指向雷射光 3再由該第 件106後射向該偵測單元1〇7(圖示 通過該光學元 偵測單元107定義有一目標光點位置則頭路徑），於該 位置座標作為基準，該指向雷射光束^2 ^ "亥目標光點 107成像一指向光點，由該偵測單元 可於5亥偵測單元 位置座標，再由該控制單元1〇8比對誃偵測該指向光點 與該目標光點位置座標是否具有偏移二，曰向光點位置座標 里’亚根據比對結果· 1374787 判斷是否控制該掃描振鏡1021轉動，亦即，當該控制單元 108比對該指向光點位置與該目標光點位置吻合時，表示 該掃描振鏡1021之角度正確’因此不會控制該掃描振鏡 1021轉動，當該控制單幻〇8比對該指向光點位置與該目 標光點位置具有-偏移量時，表示該掃描振鏡1021之角度 已產生偏擺，必須控制該掃描振鏡1〇21轉動一角度，以將 該掃描振鏡1021校正回正確角度，至於該控制單^ ι〇8控 制該掃描振鏡1G21轉動之角度，可先由理論公式估笞出二 由該指向雷射光束L2之偏移量除以該掃描鏡之 21之焦長仔出，例如，假設該掃描振鏡1〇21之隹長f ^ 25〇随’當該指向雷射光束L2之偏移量為200mm時'，則 ，動角度Θ為2_m/25m96mrad，當該指向雷射光 ”之偏移置為2〇〇 "時，則轉動角度θ為 鏡ϋ I &大角度轉動’當偏移量小時’則控制該掃描振 ^ 021小角度轉動，但必須說明的是，實際補正的方式仍 /、透過該偵測單元1()7及該控制單元⑽進行影像軟體 =位與尋點機制，以卻時且精確地找出實際需要補正的角 =該掃描振鏡1〇21轉動角度Θ與偏移量之關係，經 ί二。初始倘測光點座標（亦即該指向雷射光束L2於 ㈠89^ Γ9Γ4/〇1 ^像^指向光幻立置座標）為 ，·4) ’當驅動掃描振鏡轉動角度5以rad時，可 ·-先點座標為(-517.3，191.4)’其χ軸座標位移量為 ，當驅動掃描振鏡轉動角度10；c/rad時，可改變光 1374787 點座標為(-5復7，186.7)，與前述轉動_ 卜 對，其X軸座，位移量為23 4_;當驅動 角度變光點座料㈤u，18m 前述轉動10阳d之狀態相比對，其X軸座標位移量為5’/; ，’據此可知，振請u動角度= 乎成正比_’岐，可以判斷出不同角度時之位 作為控制該掃描振鏡1021轉動角度之依據。 里’The light offset is corrected by the control unit for the scan angle or position. The technical feature is to control a deflector to change the angle or position of the scanning mirror to shift the machining position, and use a half-mirror to guide part of the reflected light into a CCD. Detecting and making the distance between the laser light and the CCD approximately equal to the distance between the laser light and the workpiece, and then correcting by the control unit according to the detection result, and knowing the yaw angle and the yaw position of the oscillating mirror; The detection position of the conventional profit is limited by the focal length and scanning characteristics of the scan lens, according to the formula: Ay=f * Δ Θ, where Ay is the displacement change amount, and Δ 0 is the angle change amount. Suppose the focal length f is 100~300_, and when the ΛΘ is 5/zrad, the displacement change Ay is 0.5~1.5/zm. Because the displacement variation is very small, the branch precision is low. In addition, the general processing laser source current tile The number is up to 200~300 watts, and the processing laser source is directly projected on the detector of the scanning system, which is easy to cause damage to the detector. Although the attenuation current can be used to change the current of the laser source 1 Laser energy, However, it will cause unstable processing, and setting the attenuator will also lead to increased costs. _ Another example is the "Laser calibration apparatus and method" of the US Patent No. 6501061. The case uses a detector to detect the beam path of the 'laser scanner' and the focal spot. Relative coordinate, the control module (contro 1 modu 1 e) determines the time or space difference between the laser processing and the workpiece, thereby correcting the laser scanner and the laser focusing spot misalignment to achieve precise processing, and The CCD light intensity distribution can be used to determine the spotting techniques of the spot; only the case must use a specially designed stage, which leads to an increase in equipment cost. In addition, the general processing laser source current wattage is as high as 1374787 200~ 300 watts (watt), its processing laser source is directly projected to the detector of the scanning system, which is easy to cause damage to the detector. Although the attenuation can be used to change the amount of current of the laser source to attenuate the laser energy, It can cause processing instability, and setting the attenuator can also lead to increased costs. According to this, it is known that the conventional laser processing system must perform laser processing to achieve an immediate correction effect, and the correction accuracy cannot be improved because the detection position is limited. SUMMARY OF THE INVENTION In view of the lack of the prior art, the present invention provides an apparatus and method for instantly correcting the laser scanning offset, which can amplify the laser spot offset, and can be corrected without laser processing. The axis vision processing and control point finding method improves the correction accuracy, improves the correction speed, and can be corrected in-line and off-line. In order to achieve the above object, the present invention provides a device for correcting a laser scanning offset, comprising: a processing laser output unit for outputting a processed laser beam; a scanning unit comprising a scanning galvanometer; a beam splitting unit is disposed between the processing laser output unit and the scanning unit, wherein the processed laser beam passes through the first beam splitting unit and enters the scanning unit, and is then emitted by the scanning unit; a second beam splitting unit Providing a processed laser beam emitted by the scanning unit; a pointing laser output unit for outputting a pointing laser beam, the 6 U74787 == toward the second beam splitting unit, the second beam splitting The unit splitting unit military element shoots and shoots the first ^ brother one knife first 7C reflection the pointing laser light laser: Γ: single two use: to receive the pointing point reflected by the first splitting unit... (4) each beam is in the Detection unit imaging-pointing light: the target points to the first point position 'The unit has a ml unit' to compare the position of the pointing spot with the target spot, and the amount of the material is recorded. (4) Riding is miscellaneous The sweeping amount == purpose 'The present invention proposes a kind of correcting laser scanning offset laser light beaming laser beam, the processing f beam first beam passing through - the first beam splitting unit and then entering the human-scanning unit, and then by cough scanning The unit emits, the scanning unit includes a scanning galvanometer; a pointing laser beam is directed to the laser output unit, and the pointing laser beam is directed to the second beam splitting unit S, and is reflected by the second beam splitting unit. And the scanning unit is further emitted by the scanning unit and incident on the first beam splitting unit, and the pointing light beam is reflected by the first light splitting unit, so that the pointing laser beam is incident on a detecting unit; The light beam is imaged by the detecting unit to a pointing spot, and the detecting unit detects the pointing spot position, wherein the detecting unit defines a target spot position; and a control unit compares the pointing spot position Rotate with the target spot position mirror. According to the results of the comparison, Wu's private organization judges whether or not to control the scanning vibration. The purpose and function of the structure are more detailed. [Embodiment] The following is a description of the present invention in order to achieve the object of the present invention, and the embodiments illustrated in the following drawings are merely supplementary to the illustrated drawings. Bei-Beibei understands, but the technical means of this case is not limited to the device = column: the corrected laser sweep offset set ιοο#ώ一i think, the corrected laser scan offset ~ first分#|-Secondary laser output unit 1G1, scanning unit 1〇2, knife without single 7〇1〇3, one-eight-out unit 105, one optical element#' knife one early 1〇4, one Pointing to the laser transmission unit 108, the ^Taiwan detection unit 107 and a control single beam L1, 哕* °: the completion raspberry output unit 101 can output - the range of the processing laser ^ the wavelength of the beam U is located at L ~lG_〇nm galvanometer 1 )) 9 ΐ 田 早 early 102 contains - scan oscillating mirror 102 该 scan out), = connect at least - suspected to actuate components (not shown in the figure: eight unanimous components It is used to drive the scanning galvanometer 1Q21 to rotate, and the knives are arranged between the processing laser output unit 101 and the patching WG2, the first beam splitting unit 1Q3 and the second beam splitting list.兀104 can use short wave penetration (swp), long wave pass (LWP), and its shape is flat, cubic or polygonal. Mirror, the pointing laser wheeling unit 1〇5 can output a 1374787 pointing laser light east L2, which points to the range of the laser beam L2 - the optical element 106 is non-Usphenc len) and the spherical lens (sphencal h By the lens group, the detecting unit 1〇7 can adopt a photodetector including a focal point, such as a charge coupling tree (10) sensor conductor (CMOS) for detecting crying, supplemental metal oxide semi-du 7nR b rectifies the early 108 electrical connection material wind-piece 106 and the scanning unit 1〇2, the control unit 3 and the first learning mirror control program and image processing program for controlling the ^-scanning vibration, and The scanning galvanometer 1〇21 performs image analysis of the geometrical wide-mirror mirror 1021 transposition bee value coordinate and spot size. / ☆ coordinates, light point energy β Hai processing laser beam u is passed by the Guardian The first-light splitting unit 103, =^101 emits the scanning galvanometer 1021, the second beam splitting unit 1〇4, q Tianzao 70 102 and the 300 (the solid arrow path is shown), and the processing can be taken < a machining piece; the pointing laser beam L2 _ pointing to the mine for laser addition, is directed to the first The light splitting unit 1〇4 is reflected by the 誃^_ early 兀105 and passes through the scanning galvanometer 1021. and enters the second (10) dichotomy unit 104. The scanning unit 102 emits and emits the light to the first “V-element L102: The knife is reflected by 7G 103 early, so that the pointing laser light 3 is then directed by the first piece 106 to the detecting unit 1〇7 (the figure is defined by the optical element detecting unit 107 to have a target spot position and then the head path) ), at the position coordinate as a reference, the pointing laser beam ^2 ^ "Hai target spot 107 is imaged as a pointing spot, and the detecting unit can detect the unit position coordinate at 5 Hz, and then the control unit 1〇8 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃 誃That is, when the control unit 108 matches the position of the pointing spot with the position of the target spot, it indicates that the angle of the scanning galvanometer 1021 is correct. Therefore, the scanning galvanometer 1021 is not controlled to rotate. 〇8 is compared to the pointing spot position and the mesh When the position of the target spot has an offset, it means that the angle of the scanning galvanometer 1021 has been yawed, and the scanning galvanometer 1〇21 must be controlled to rotate by an angle to correct the scanning galvanometer 1021 to the correct angle. The control unit ^ 〇 〇 8 controls the angle of rotation of the scanning galvanometer 1G21, which can be estimated by a theoretical formula, and the offset of the pointing laser beam L2 is divided by the focal length of the scanning mirror 21 For example, assume that the scanning galvanometer 1〇21 has a length f ^ 25〇 with 'when the offset to the laser beam L2 is 200 mm', then the moving angle Θ is 2_m/25m96mrad, when the pointing laser light When the offset is set to 2〇〇", the rotation angle θ is the mirror ϋ I & the large angle rotation 'when the offset is small' controls the scanning vibration 021 to rotate at a small angle, but it must be stated that The actual correction mode is still /, through the detection unit 1 () 7 and the control unit (10) to perform image software = bit and locating mechanism, to find the angle that needs to be corrected regularly and accurately = the scanning galvanometer 1 〇21 The relationship between the angle of rotation Θ and the offset is ί2. Initially, if the photometric point coordinates (that is, the pointing laser beam L2 is at (1) 89^ Γ9Γ4/〇1 ^^^ pointing to the phantom standing coordinate), 4) 'When driving the scanning galvanometer rotation angle 5 to rad, ·- The first point coordinates are (-517.3, 191.4)' The displacement of the axis coordinate is: when driving the scanning galvanometer rotation angle 10; c/rad, the light can be changed to 1374787 point coordinates (-5 complex 7, 186.7) , with the above-mentioned rotation _ 卜 pair, its X-axis seat, the displacement amount is 23 4 _; when the driving angle is changed to the spot material (5) u, 18m, the above-mentioned rotation 10 is d, the X-axis coordinate displacement is 5' /; , 'According to this, the vibration angle of the vibration is proportional to _'岐, and the position at different angles can be judged as the basis for controlling the rotation angle of the scanning galvanometer 1021. in'
請，弟-圖:斤示’必須說明的是，該第一分光 1〇3之乂的在於將該掃描振鏡刪偏擺的角度利用該第一 分光單兀，材料^射率變化，提高該指向雷射光束。反 射角角度’藉此提高偏移量，即可提升判斷精度，而气光 學元件⑽之仙在於可加人放大該指向雷射光束L2=折 角度設計，以提高位置偏移量，提昇判斷精度，換言之， 僅設置該第一分光單元103即可達到提高偏移量之目的， 若是同時設置有該光學元件106(如第一圖所示），則可放 大該指向雷射光束L2偏折角度，如第一圖所示，該指向雷 射光束L21代表未經過光學元件1〇6作用，另一指向雷射 光束L2則代表經過光學元件106作用，由於偏移量二放 大，因此可以提昇判斷精度，據實驗驗證，該光學元件1〇6 採用非球面透鏡（aspheric len)與球面透鏡(spherical 1en)、组合之聚焦鏡組時’透過s亥非球面透鏡（aspher i c 1 en) 提供指向光點（該指向雷射光束L2於該偵測單元i〇7成像 之光點）邊緣之光線快速收斂，不僅可聚焦’同時可提供放 大位移量八倍作用。此外’該偵測單元107之設置位置無 依定限制，可依實際環境空間而設計擺放位置，以第一圖 11 1374787 分光單元103之距 為例’若是將該偵測單元107與該第一 離加大時，可進一步放大偏移量。 根據第一圖及以上所述本發明所提供之校正雷射掃描 祕量之裝置⑽實_及其作動原理，可歸納出校^雷 射知描偏移量之方法包含以下步驟： 田 步驟1 ··由一加工雷射輸出單元1〇1輸出一加工雷射光束 U ’該加工雷射光束L1通過一第一分光單元 後進入一掃描單元102，再由該掃描單元102 出；Please, brother-图: 斤示' It must be stated that the first splitting light 1〇3 is based on the angle of the scanning galvanometer declining pendulum using the first spectroscopic unit, the material ^ rate change, improve This points to the laser beam. The angle of reflection angle 'by increasing the offset can improve the judgment accuracy, and the essence of the gas optical component (10) is that the pointing laser beam L2 = folding angle can be enlarged to improve the position offset and improve the judgment accuracy. In other words, only setting the first beam splitting unit 103 can achieve the purpose of increasing the offset. If the optical component 106 is disposed at the same time (as shown in the first figure), the pointing laser beam L2 can be enlarged. As shown in the first figure, the pointing laser beam L21 represents the function of the optical element 1〇6, and the other pointing laser beam L2 represents the action of the optical element 106. Accuracy, experimentally verified, the optical element 1〇6 uses an aspheric len and a spherical lens, when combined with a focusing lens group, provides a pointing light through an aspherical lens (aspher ic 1 en) The light at the edge of the point (which points to the spot where the laser beam L2 is imaged by the detecting unit i〇7) converges rapidly, not only focusing but also providing an eight-fold effect of the amplification displacement. In addition, the setting position of the detecting unit 107 is not limited, and the positioning position can be designed according to the actual environmental space. For example, the distance of the light splitting unit 103 of the first figure 11 1374787 is taken as an example. When the distance is increased, the offset can be further enlarged. According to the first figure and the above-mentioned apparatus for correcting laser scanning secrets provided by the present invention (10) and the principle of its operation, the method for summing up the laser deflection can be summarized as follows: Field Step 1 · outputting a processing laser beam U' from a processing laser output unit 1〇1, the processing laser beam L1 passes through a first beam splitting unit, enters a scanning unit 102, and is output by the scanning unit 102;
步驟2:由一指向雷射輸出單元1〇5輸出一指向雷射光束 L2，3亥指向雷射光束係射向該第二分光單元 104’由該第二分光單^ 104反射通過該掃描振鏡 1021再進入邊掃描單元1〇2,再由該掃描單元 射f並射入該第一分光單元103,再由該第一分 光早几103反射該指向雷射光束L2，使該指向雷 射光束L2通過一光學元件1〇6後射入一偵測單元Step 2: a pointing laser light source L2 is outputted by a pointing laser output unit 1〇5, and a laser beam directed toward the second beam splitting unit 104' is reflected by the second beam splitting unit 104. The mirror 1021 then enters the side scanning unit 1〇2, and then the fractal unit shoots f and enters the first beam splitting unit 103, and then the first beam splitting light 103 reflects the pointing laser beam L2 to make the pointing laser The light beam L2 passes through an optical element 1〇6 and is incident on a detecting unit
107 ’若不叹置该光學元件1 ，則該指向雷射光 束L2係由該第-分光單元1()3反射後直接射入該 偵測單元1〇7; 步驟3 :該指向雷射光束L2於·測單元107成像-指向 光點，由该偵測單元i〇7偵測該指向光點位置， .於該谓測單S 107定義有一目標光點位置； y驟4自控制單儿⑽比對該指向光點位置與該目標 ，點位置是否具有偏移量，並根據比對結果判斷 疋否控制該掃描振鏡1021轉動。 12 13/4/»/ 示意圖，:二—圖所示本發明提供之裝置第二實施例架構 射輸出單=雷射?描偏移量之裝置则由-加4 -第二分光單_、*描早70 202、-第-分光單元203、 件206、1二〇4、:指向雷射輸出單元205、一光學元 單元202包括〜:兀及一控制單元108構成，該掃描 圖該校正雷射掃以上各構件之作用與第- 第二描振鏡1Q21、第，單元‘ 偵測單元二Γ輸出單幻〇5、光學元件1〇6、 施例之特點在於Γ:=8:斤能f揮之作用相同，本實 、 孩第一为光早几204得母菩认分b 元202與該掃描振鏡_之間，使該加工雷射光m :!加=射輸出單元20r射出後，係依序通過該第 早兀203、該掃描單元⑽、該第二分光單元咖、= 振鏡202卜最後射向該加工件3〇〇(圖示實線箭頭路徑田 可對該加工件3GG進行雷射加工；該指向f射工’ 指向雷射輸出單元205射出後，係射向該第二由該 204，由該第二分光單元m反射後直接進人 = 202，再由該掃描單元2〇2射出並射向該第—八 203，再由該第一分光單元2〇3反射，使該指向:光單凡 L2通過該光學元件206後射向該偵測單元2〇7(；圖:射光士 頭路徑）。 Θ示虛線箭 綜上所述，本發明提供之即時校正雷射掃插 曰 裝置與方法，藉由一指向雷射輸出單元，配合二第之 單元、一第二分光單元，以及光學元件及偵蜊單元—分光 13 1374787 單元，可放大雷射光點偏移量，無須透過雷射加工即可進 行校正，利用同軸視覺處理與控制尋點方法提高校正精 度、提昇校正速度，並可於在線（in-1 ine)與離線（off-1 ine) 進行校正。 惟以上所述者，僅為本發明之實施例而已，當不能以 之限定本發明所實施之範圍。即大凡依本發明申請專利範 圍所作之均等變化與修飾，皆應仍屬於本發明專利涵蓋之 範圍内，謹請貴審查委員明鑑，並祈惠准，是所至禱。 1374787 【圖式簡單說明】 第一圖係本發明提供之裝置第一實施例架構示意圖。 第二圖係本發明提供之裝置第二實施例架構示意圖。 【主要元件符號說明】 100、 200-校正雷射掃描偏移量之裝置 101、 201-加工雷射輸出單元 102、 202-掃描單元 1021、2021-掃描振鏡 103、 203-第一分光單元 104、 204-第二分光單元 105、 205-指向雷射輸出單元 106、 206-光學元件 107、 207-偵測單元 108、 208-控制單元 300-加工件 L1-加工雷射光束 L2、L21-指向雷射光束 15107 'If the optical element 1 is not sighed, the pointing laser beam L2 is reflected by the first beam splitting unit 1 () 3 and directly enters the detecting unit 1 〇 7; Step 3: the pointing laser beam The L2 is measured by the measuring unit 107 and directed to the spot, and the detecting unit i〇7 detects the pointing spot position. The predetermined list S 107 defines a target spot position; y4 is controlled by the control unit. (10) Whether or not the position of the pointing spot is offset from the target, the position of the point, and whether or not the scanning galvanometer 1021 is controlled to be rotated according to the result of the comparison. 12 13/4/»/ schematic diagram: two-illustration of the apparatus provided by the present invention, the second embodiment of the frame output output unit = laser scanning offset device by - plus 4 - second beam splitter _, * Description 70 202, - the first - splitting unit 203, the piece 206, 1 〇 4, the pointing laser output unit 205, an optical element unit 202 comprising ~: 兀 and a control unit 108, the scan chart the correction The function of the laser sweeping the above components and the first-second oscillating mirror 1Q21, the second unit, the detecting unit, the output unit, the illusion 5, and the optical element 1〇6, the characteristics of the embodiment are: 8:=8: The function of f can be the same, the actual child, the first child of the light is a couple of 204, and the mother is recognized by the b-202 and the scanning galvanometer _, so that the processed laser light m:! plus = the output unit 20r is emitted , the first scanning unit 203, the scanning unit (10), the second beam splitting unit, and the galvanometer 202 are finally directed to the workpiece 3 (the solid arrow path is shown in the figure) 3GG performs laser processing; the pointing f-shooter's pointing to the laser output unit 205 is emitted to the second by the 204, and is reflected by the second beam splitting unit m Into the person = 202, and then the scanning unit 2〇2 is emitted and directed to the eighth-eighth 203, and then reflected by the first beam splitting unit 2〇3, so that the pointing: the light single L2 passes through the optical element 206 and then shoots To the detecting unit 2〇7(;Fig.: 射光士头). The dotted arrow is shown in the above, the present invention provides an instant correction laser sweeping device and method, by a pointing laser output unit With the second unit, a second beam splitter unit, and the optical component and the detector unit-splitting 13 1374787 unit, the laser spot offset can be amplified without correction by laser processing, using coaxial vision processing and The control locating method improves the correction accuracy, improves the correction speed, and can be corrected in online (in-1 ine) and off-line (off-1 ine). However, the above is only an embodiment of the present invention, when not The scope of the invention is defined by the scope of the invention, that is, the equivalent changes and modifications of the scope of the patent application of the present invention should still fall within the scope of the patent of the present invention. Prayer. 1374787 BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic diagram of the first embodiment of the apparatus provided by the present invention. The second figure is a schematic diagram of the second embodiment of the apparatus provided by the present invention. [Description of main components] 100, 200-correction Laser scanning offset device 101, 201 - processing laser output unit 102, 202 - scanning unit 1021, 2021 - scanning galvanometer 103, 203 - first beam splitting unit 104, 204 - second beam splitting unit 105, 205- Pointing to the laser output unit 106, 206 - optical element 107, 207 - detecting unit 108, 208 - control unit 300 - processing member L1 - processing laser beam L2, L21 - pointing to laser beam 15