TW200800606A - Multi-layered composite capable of conducting heat and absorbing electromagnetic wave and manufacturing method thereof - Google Patents
Multi-layered composite capable of conducting heat and absorbing electromagnetic wave and manufacturing method thereof Download PDFInfo
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- TW200800606A TW200800606A TW95123681A TW95123681A TW200800606A TW 200800606 A TW200800606 A TW 200800606A TW 95123681 A TW95123681 A TW 95123681A TW 95123681 A TW95123681 A TW 95123681A TW 200800606 A TW200800606 A TW 200800606A
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Abstract
Description
200800606 " 九、發明課明: 【發明所屬之技術領域】 本發明係有關於一種具導熱暨吸收電磁波的多層複合材料及 其製造方法,特別是一種適用於配置在電子元件表面與散熱器之 間’用以傳導排除電子元件的發熱,以及吸收或隔離電子元件的 電磁波之多層複合材料及其製造方法。 【先前技術】 .按’許多電子零件’尤其是大型的積體電路、微處理器等, 在運作中通常無可避免地會伴隨著產生高熱,而這種高熱若無法 及時排除,不僅會減損電子零件的運作效率及使用壽命,更甚者 將會導致電子元件的故障而喪失功能,特別是現今電子產品為了 符合輕薄短巧的時代趨勢,相關微處理器大都逐漸採用高積合度 (degree of integration)的設計方式,使元件之每單位面積所釋放的 熱量倍增,因此不足的冷卻所導致的不良影響或損害,也將益形 • 嚴重。 又如所知者,——般的電器元件係藉由電流的驅動而運作,而 私流的流動作功因為阻抗匹配未達完美境界,以至於產生了電磁 輻射,而電流的流動作功會伴隨著產生電磁輻射,所以運作中的 電器元件都會產生強弱不等的電磁波,這些電磁波不僅會影響到 自身或干擾其他電子元件之運作,特別是對於一些精密的積體電 路或微處理器而言,外來的電磁干擾(Electr〇 Magnetic Interference,簡稱EMI)可能導致錯誤的運算、衍生無法預測的後 5 200800606 ·; 果·,另外,電器元件運作時大量溢散到觀巾的電磁姉,也可 能會傷害人體健康,因此,如何維護精密的電子元件運作時不為 外界電磁干擾,以及阻絕那些電子元件運作時對外界環境:射; 磁波,以維持人體健康,均屬業界當前積極尋求解決的課題。200800606 " IX. Invention: [Technical Field] The present invention relates to a multilayer composite material having heat conduction and absorbing electromagnetic waves and a manufacturing method thereof, and particularly, a method suitable for being disposed on a surface of an electronic component and a heat sink A multilayer composite material for conducting heat generation for excluding electronic components, and electromagnetic waves for absorbing or isolating electronic components, and a method of manufacturing the same. [Prior Art] According to 'many electronic parts', especially large integrated circuits, microprocessors, etc., it is inevitably accompanied by high heat in operation, and this high heat can not only be degraded if it is not eliminated in time. The operating efficiency and service life of electronic components, even more so will lead to the failure of electronic components and loss of function, especially in today's electronic products in order to meet the trend of light and thin, the relevant microprocessors are gradually adopting a high degree of integration (degree of Integration) is designed to double the amount of heat released per unit area of the component, so the adverse effects or damage caused by insufficient cooling will also be severe. As is known, the general electrical components are driven by the current, and the flow of the private flow is not perfect because of impedance matching, so that electromagnetic radiation is generated, and the current flow is Along with the generation of electromagnetic radiation, the electrical components in operation generate electromagnetic waves of varying strengths, which not only affect themselves or interfere with the operation of other electronic components, especially for some sophisticated integrated circuits or microprocessors. External electromagnetic interference (Electr〇Magnetic Interference (EMI)) may lead to erroneous calculations, derivation of unpredictable after 5 200800606 ·; In addition, when electrical components operate, a large amount of electromagnetic spills into the towel, may also It will harm human health. Therefore, how to maintain the operation of precision electronic components without external electromagnetic interference and to prevent those electronic components from operating in the external environment: shooting; magnetic waves to maintain human health are all actively sought after in the industry. .
不能有效雜電魏或抑财波雜,所以並無法避免前述電磁 波引致的故障或異常的問題。 習知用以促進電n產品賴魏的手段,通f域由在會發 熱的電器元件與散熱n之間配置散熱介質,例如導熱f及相變= 材等之導熱材,以便有效地將熱自電子元件轉移至散熱器上,達 冷卻電器設備之目的;但這種雜技術無論其齡#或散熱器皆 另外’習知用以吸收電磁波或抑制雜訊的手段中,最廣泛常 見的是_在電器產品的_殼體中添加人各種導電物質,例如 銅、錄、鋅及其他金屬化合物製成的金屬片、金屬粉或金屬絲, 有些則是在塑膠殼體上塗佈—層導電塗料或触金屬板、金屬網 等以作為反射阻隔電磁波的結構;然而這些手段不僅使加工流程 衣le成本’在Λ貝的效能上也只是消極性地阻隔遮蔽電磁 輻射’降低相至厢魏中的程度㈣,真正對於電磁波所產 生的輕射能量’並未因該等__除,因此當補有電磁輻射 外洩時,所引致的危害依舊存在。 有些更先進的吸收電磁波或抑制雜訊手段,則是利用在阻隔 獅的基材中添加電磁波魏素材,例如日本專跡AH』· 係猎由在有基材巾添域_鋅麵鹽输鋅賴鹽等電磁波吸 6 200800606 "收材料,它雖可以魏或_電磁波,但有時候僅佩於低頻區 的範圍’又_酸歸料料引起生__,細使用及材料 安定性都會造成_;又例如我國專利公告第·69號係揭露以 鈦酸鋇(脇03)粉末為電磁波吸收劑,但自於鈦酸鎖與阻隔材 料的基材(通常是瓣或轉補)比動目錢殊,峨於難以均句 分佈成型’常造成局部性的電磁輕射外沒,而且實務上欽酸鎖的 加添«比也_超過52%以上才能獲致較佳㈣磁波吸收效 果,不僅成本所費不贅,沉重㈣量亦不符合現今產品輕量化的 潮此外,鈦酸鋇(BaTi03)粉末雖然具有電磁波吸收效果, 但疋在熱傳材料上,卻不具有好的熱傳效果,所以並不適合拿來 做為導熱暨吸收電磁波的複合材料。 【發明内容】 、本發明目的在於解決上述問題、提供—種「具導熱暨吸收電 _磁波的夕層複合材料及其製造方法」,可同時革除電器元件運作時 產生的熱與電磁波所衍生的不良影響。 為了解決上述課題,本發騎提供之料紐吸收電磁波的 多層複合材料,其至少包含—導熱層及—電磁波吸收層,且各材 料層之間彼此豐置祕在—妙形成—多層複合材料;而在合宜 $應財’本發日聽可藉由聰性地將—或若干導歸以及一或 右干電磁波吸收層彼此之間以交互層疊組成多層複合材料,據以 =得具備所欲導熱及電磁波吸收性能的材料;又本發_多層複 。材财有冑㈣喊可撓的材料雛,因此可健貼地包覆於 7 200800606 會產生電磁波的電子元件外關’以有效阻絕電磁輻射源,避免 磁輕射外茂,且該材料的電魏吸收層會將滋生的電磁輻射加以 吸收轉換成微量的熱能,同時也_該多層複合材料的導熱層服 貼地配置在發航料面’便可植率轉树上齡導 到熱器上,避免在電子元件上累積熱量,造成故障;從而一舉解 決電器it件運作時的散熱朗除電磁韓㈣魄。 根據本發明’該多層複合材料巾的導熱層係包含有熱傳導性 粉體以及聽結合前述熱料性粉體微粒子的膠材,並利用混練 製程使該鱗雜粉體均自分佈於雜巾,然後較細(如第一 圖及參考圖一所示)。 其中,該熱傳導性粉體可選用如:氧化銘、氮化銘、氮化删、 石墨、鱗、銅粉…等,該熱傳導性粉體可能是前述材料之一或 是由二種以上材料混合而成者;導熱粉體材料為不規則型之顆 粒,選用適宜的平均粒度約在〇丨〜⑴^❿。 而該膠材貞]可_如·環氧樹脂、壓克力旨、紛酸樹脂、 聚酯樹脂、聚醋酸乙議旨(PVAC)、⑽)難或合成橡 缪…等,X,該膠材可以是前述材料之一或是由二種以上材料混 合而成。 前述導熱層通常被製成aG2〜15mm厚度之面_層,且由 於該導熱層之材料質地_,具備可撓性及龍變形的特性,因 此可緊密、服貼的配置在發熱電子元件的表面,以降低界面之接 觸熱阻,㈣迅速將電子元件所產生的熱料排除。It is not possible to effectively use the Wei or Wei Cai, so it is impossible to avoid the malfunction or abnormality caused by the aforementioned electromagnetic waves. Conventionally, a means for promoting the electric product, Lai Wei, is provided with a heat dissipating medium between the electric component that generates heat and the heat dissipating n, such as a heat conducting material such as heat conduction f and phase change = material, so as to effectively heat The transfer of electronic components to the heat sink for the purpose of cooling electrical equipment; however, this hybrid technology, whether its age or radiator, is otherwise known to absorb electromagnetic waves or suppress noise, the most common _In the housing of electrical products, various conductive materials, such as metal sheets, metal powders or wires made of copper, copper, zinc and other metal compounds, some are coated on the plastic casing - conductive Paint or metal plate, metal mesh, etc. as a structure to reflect electromagnetic waves; however, these methods not only make the cost of the process flow 'in the performance of mussels but also negatively block the electromagnetic radiation'. The degree (4), the true light energy generated by electromagnetic waves is not removed by these __, so the damage caused by the electromagnetic radiation is still present. Some of the more advanced methods of absorbing electromagnetic waves or suppressing noise are to use electromagnetic waves in the substrate of the barrier lion, such as the Japanese special AH 』 系 由 由 有 有 有 有 有 有 有 有 有 有 有 有Lai salt and other electromagnetic wave absorption 6 200800606 " Receiving materials, although it can be Wei or _ electromagnetic waves, but sometimes only the range of the low frequency zone 'also _ acid grading material caused by raw __, fine use and material stability will cause _; For example, China Patent Announcement No. 69 discloses the use of barium titanate (threat 03) powder as an electromagnetic wave absorber, but the substrate (usually flap or tow) from titanate lock and barrier material Qian Shu, 峨 难以 难以 难以 难以 难以 难以 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The cost is not too high, and the heavy (four) quantity is not in line with the current lightweight of the product. In addition, the barium titanate (BaTi03) powder has electromagnetic wave absorption effect, but the heat transfer material does not have a good heat transfer effect, so Not suitable for use as thermal cum A composite material that absorbs electromagnetic waves. SUMMARY OF THE INVENTION The present invention aims to solve the above problems and provide a "thermal composite and absorbing electric _ magnetic wave eve layer composite material and a manufacturing method thereof", which can simultaneously remove heat and electromagnetic waves generated by the operation of electrical components. Bad effects. In order to solve the above problems, the multilayer composite material for absorbing electromagnetic waves provided by the present invention comprises at least a heat conducting layer and an electromagnetic wave absorbing layer, and each material layer is densely formed with each other to form a multi-layer composite material; In the case of the appropriate $ 财 财 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , And electromagnetic wave absorption properties of the material; There are 材 材 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四The Wei absorption layer will absorb and absorb the electromagnetic radiation into a small amount of heat energy. At the same time, the thermal conductivity layer of the multilayer composite material is placed on the surface of the launching material, and the planting rate can be transferred to the tree. To avoid the accumulation of heat on the electronic components, causing malfunctions; thus solving the heat dissipation of the electrical components during operation. According to the present invention, the heat conductive layer of the multilayer composite material towel comprises a heat conductive powder and a rubber material which is combined with the hot material powder fine particles, and the scaly powder is self-distributed to the rags by a kneading process. Then it is finer (as shown in the first figure and Figure 1). Wherein, the heat conductive powder may be selected, for example, oxidized, nitrided, nitrided, graphite, scale, copper powder, etc., the thermally conductive powder may be one of the foregoing materials or may be mixed by two or more materials. The thermal conductive powder material is an irregular type of granule, and a suitable average particle size is selected to be about (~(1)^❿. And the glue 贞] can be _ _ _ epoxy resin, acrylic, acid resin, polyester resin, polyacetic acid B (PVAC), (10)) difficult or synthetic rubber ..., etc., X, the glue The material may be one of the foregoing materials or a mixture of two or more materials. The heat conducting layer is usually made into a surface layer of aG2~15mm thickness, and because of the material texture of the heat conducting layer, it has the characteristics of flexibility and deformation of the dragon, so that it can be closely and conformally disposed on the surface of the heat-generating electronic component. In order to reduce the contact thermal resistance of the interface, (4) quickly remove the hot material generated by the electronic components.
S 200800606S 200800606
再者’該導熱層可藉由膠材與熱傳導粉體的不同比例混合, 以獲得所欲的熱傳性及其他材料物性;一般性的原則,當混合材 料中的熱傳導粉體佔有比例越高,其傳熱效能齡,然而材料的 撓性與塑性等物性職差,反之,當騎佔有的_越多,傳熱 效能較差,而材料的撓性與塑性等物性則較佳。通常係選用 10%〜70%之間的膠材與90%〜30%之間的熱傳導粉體搭配,以便獲 得約0.5W/mk〜7W/mk熱傳系數的導熱材料層(請參閱第二圖)。 再根據本發明,該多層複合材料中的電磁波吸收層乃包含有 屯磁波吸收粉體以及用來結合前述電磁波吸收粉體微粒子的膠 材,並利用混練製程使該電磁波吸收粉體均勻分佈於膠材中,然 後固定成型(如第三圖及參考圖二所示)。 該電磁波吸收粉體可選用下列種類的材料之一或是由二種以 上材料混合而成者: (一)介電吸收材料··係在高分子介質中添加電損耗性物質,如 碳纖維、導電碳黑、碳化矽、奈米級的碳管、碳纖維、 導電碳黑、碳化矽等,其係藉由電抗以損耗入射的電磁 波能量;最好,這種介電吸收材料的電阻率(7是在1〇_3 s/cm〜1 s/cm 之間。 (二)電磁吸收材料:係由磁性合金材料製成之粉體材料,例如 多晶鐵氧體、六角形鐵氧體、奈米級鐵氧體、金屬粉末(羥 基鐵粉、幾基鐵粉、羰基鐵-鎳合金)、磁性超細粉末等, 其係利用磁性材料在高頻電磁場作用下產生電磁損耗原 9 200800606 理,使該材料具有吸收電磁波能量的效果。 (三)複合吸收材料:其係一種同時具有介電和電磁吸收性質的 複合粉體材料,如:(鐵鎳>銀合金(Fe Ni-Ag Alloy)、銀 鎳合金(Ni-Ag Alloy)、銀鐵合金(fre_ Ag Alloy)、鐵鎳銦_ 銀合金(FeNiMo-Ag Alloy)或鐵鎳鈷_銀合金(FeNiC〇-AgFurthermore, the heat conducting layer can be mixed by different ratios of the rubber material and the heat conducting powder to obtain the desired heat transfer property and other material properties. The general principle is that the proportion of the heat conducting powder in the mixed material is higher. The heat transfer performance is younger. However, the flexibility and plasticity of the material are poor. On the contrary, the more the _ is occupied by the ride, the better the heat transfer performance, and the physical properties such as flexibility and plasticity of the material are better. Usually, between 10% and 70% of the rubber material is used in combination with 90% to 30% of the heat conductive powder to obtain a heat conductive material layer having a heat transfer coefficient of about 0.5 W/mk to 7 W/mk (see the second Figure). According to the present invention, the electromagnetic wave absorbing layer in the multilayer composite material comprises a ytterbium magnetic wave absorbing powder and a rubber material for combining the electromagnetic wave absorbing powder particles, and the electromagnetic wave absorbing powder is uniformly distributed in the rubber by a kneading process. In the material, then fixed molding (as shown in Figure 3 and Figure 2). The electromagnetic wave absorbing powder may be one of the following types of materials or a mixture of two or more materials: (1) Dielectric absorbing material · Adding an electrically lossy substance such as carbon fiber and conductive in a polymer medium Carbon black, tantalum carbide, carbon nanotubes of carbon grade, carbon fiber, conductive carbon black, tantalum carbide, etc., which are used to reduce the incident electromagnetic wave energy by reactance; preferably, the resistivity of the dielectric absorbent material (7 is Between 1〇_3 s/cm~1 s/cm (2) Electromagnetic absorption material: a powder material made of a magnetic alloy material, such as polycrystalline ferrite, hexagonal ferrite, nano Grade ferrite, metal powder (hydroxy iron powder, several base iron powder, carbonyl iron-nickel alloy), magnetic ultrafine powder, etc., which use magnetic material to generate electromagnetic loss under the action of high frequency electromagnetic field. The material has the effect of absorbing electromagnetic wave energy. (3) Composite absorbing material: it is a composite powder material having both dielectric and electromagnetic absorption properties, such as: (iron nickel) silver alloy (Fe Ni-Ag Alloy), Silver-nickel alloy (Ni-Ag Alloy), silver-iron alloy ( Fre_Ag Alloy), iron-nickel indium _ silver alloy (FeNiMo-Ag Alloy) or iron-nickel-cobalt _ silver alloy (FeNiC〇-Ag
Alloy)、鐵基碳化矽(Fe-Sic)等;此種複合吸收材料具有 較前述介電吸收材料或電磁吸收材料更高之電磁波吸收 性能以及更寬廣的電磁波吸收頻寬。 前述電磁波吸收粉體材料為不規則型之顆粒,最好,其平均 粒度約在0.03〜150μιη。 再者,前述膠材則可選用如··環氧樹脂、壓克力樹脂、_ 樹脂、丙__脂、聚醋酸乙稀樹脂(pVAC)、石夕素(Silic〇n)樹脂或 合成橡膠·.·等,且娜材可以是前述材料之―或是由二種以上材 料混合而成。 該電磁波吸收層通常被配置於前述導熱層之一表面上,形成 〇·〇2〜15mm厚度之面狀薄層,由於其係與前述導熱層併同層疊配 置,且二層材料質地均屬柔_,具備可撓性及塑性變形的特性, 匕便於圍覆在會產生電磁波的電子元件外周圍,對電磁輕射源 作出有效賴,即軸將滋生的電磁輻射純魏抑制,同時亦 可防止敏感的電子元件遭受(外界)㈣磁雜訊干擾。 μ電磁波及收層可藉由膠材與電磁波吸收粉體的不同比 例混合,以獲得所欲的電磁輻射衰減量及其他材料物性;-般而 200800606 言,混合材料中的電磁波吸收粉體佔有的比例越多,吸收電磁輻 射的政能就越佳,然而材料的撓性與塑性等物性則較差,反之, 當膠材佔有的比例越多,吸收電磁_效能較差,而材料的挽性 與塑性等物性則較佳。最好,選用1G%〜7G%之間的膠材與 90%〜30%之_電磁波吸收粉體搭配,以便獲得約6_〜2此電 磁輻射衰減值的電磁波吸收層(請參閱第四圖所示)Alloy), Fe-Sic, etc.; such composite absorbing material has higher electromagnetic wave absorption performance and wider electromagnetic wave absorption bandwidth than the above-mentioned dielectric absorbing material or electromagnetic absorbing material. The electromagnetic wave absorbing powder material is irregular particles, and preferably has an average particle size of about 0.03 to 150 μm. Furthermore, the aforementioned rubber materials may be selected from epoxy resin, acrylic resin, _ resin, propylene glycol, polyvinyl acetate resin (pVAC), silicone resin or synthetic rubber. ···etc., and Na Na may be the above-mentioned materials - or a mixture of two or more materials. The electromagnetic wave absorbing layer is usually disposed on one surface of the heat conductive layer to form a planar thin layer having a thickness of 2 to 15 mm, which is laminated with the heat conductive layer, and the texture of the two layers is soft. _, with flexible and plastic deformation characteristics, 匕 easy to cover the periphery of electronic components that generate electromagnetic waves, effective for electromagnetic light source, that is, the shaft will stimulate the electromagnetic radiation pure Wei, and also prevent Sensitive electronic components are subject to (external) (four) magnetic noise interference. μ electromagnetic wave and layer can be mixed by different ratios of glue and electromagnetic wave absorbing powder to obtain the desired amount of electromagnetic radiation attenuation and other material properties; generally, 200800606, electromagnetic wave absorbing powder in mixed materials occupies The more the proportion, the better the political energy to absorb electromagnetic radiation, but the physical properties such as flexibility and plasticity of the material are worse. Conversely, the more the proportion of the rubber material is occupied, the lower the electromagnetic absorption efficiency, and the plasticity and plasticity of the material. The physical properties are preferred. Preferably, a glue between 1G% and 7G% is used in combination with 90% to 30% of the electromagnetic wave absorbing powder to obtain an electromagnetic wave absorbing layer of about 6 to 2 electromagnetic radiation attenuation values (see the fourth figure). Show)
此外’該電磁波吸收層亦可藉由翻前述不囉類的電磁波Further, the electromagnetic wave absorbing layer can also be turned over by the aforementioned electromagnetic waves
吸收粉體材料或娜崎域得的所需的電磁補衰減量及其他 材料物性,例如:_介電魏材料之粉酸騎轉後:當基 體,脂是電絕緣體,體積阻抗率在,〜1〇16ω ·咖之間,碳二 維是電的良導體,體積阻抗率在H _·3Ω ·咖之間由它 ^組成的複合材财-定的導電能力,介於導體和絕緣體之間; 當然’並不是所有的碳纖維品種都可被選作吸波材料,而只有經 L特殊處理的n维製成的複合材料才具有較高的吸收特性;當 不同的介電吸收材料與膠材混練後,其體積阻抗率阻抗值: 1〇3〜ω66Ω .em之間,可獲得卿咖電磁輻射衰減犯值。 又例如:_電磁吸收材料之粉體與膠材混練後:一般體積 阻抗率在⑽〜咖,之間,根據電磁場理論一般用複介电常數 ❿複數導磁率"來描述吸波材料的電磁性能;當使用的谬材保 持稷數介電常數和使用㈣磁吸收粉體的複數磁導率實部和虛部 分別相等的條件下,並錄料與自由如阻抗匹配或接近匹配 時,入射電磁波能量才能透人材料或較多地透讀射傳播,就 200800606 可以降低入射波的反射係數和提高材料的吸波性能;當成型之厚 度越厚吸波的電磁輕射衰減dB值性能越高及頻寬越寬。 再例如:選用該種兼具介電吸收性質和電磁吸收性質的複合 粉體材料與膠材混練後:由於此種粉體具有良好的電導率及電磁 特性,因此該種粉體與膠材混練後可獲的體積阻抗率約1〇_3〜1〇6 Ω · cm,厚度在o.oimm以上時,頻寬在1麵2〜12(}出具有 6dB〜70dB的電磁輻射的衰減值。 基於前述揭露說明可知,藉由將本發明之具導熱暨吸收電磁 波的多層複合材料配置在電磁波發射源上,確可達同時改善電器 元件運作時產生的熱與電磁波所衍生的不良影響。 另外,根據本發明所提供的「具導熱暨吸收電磁波的多層複 合材料之製造方法」,其包含: (一)形成第一導熱層的操作: A、將具有熱傳導性粉體與膠材依照所需的比例置入一混合 槽中’依照選用不同的膠材種類而設定在不同的操作溫 度條件下,對該等混合材料實施15〜30分鐘的混練操 作’使該等材料均勻混合後備用。 B'以、塗佈或喷塗或網版印刷或熱壓成型的技術手段施作,使 前述混合材料固定成型為一厚度約0.03〜12mm的面狀 薄層,且如第二圖所示,藉由該膠材的分子結構可將該 等均勻分佈的熱傳導性粉體微粒子結合(bind)定位,使該 導熱層具有穩定的導熱效能。 12 200800606 ^ (二)形成第一電磁波吸收層的操作: A、 將電磁波吸收粉體與膠材依照所需的比例置入一混合槽 中,依照選用不同的膠材種類而設定在不同的操作溫度 條件下’對該專混合材料實施I5〜3〇分鐘的混練操作, 使該等材料均勻混合後備用。 B、 當前述膠材與該第一導熱層所採用之膠材為相同材質時, 乃可將該混合材料以塗佈或喷塗或網版印刷或熱壓成型 > 的技術手段直接施作在該第一導熱層之一表面上,使該 混合材料固定成型為一厚度約〇〇2〜15mm的面狀薄 層,由於該電磁波吸收層與前述第一導熱層的膠材具有 相同的性質,因此二層疊接非常密合穩固。 然而當如述膠材與該第一導熱層所採用之膠材為不 相同材質時,則須先將前述混合材料以塗佈或噴塗或網 版印刷或熱壓成型的技術手段施作以固定成型為一厚度 約0·02〜15mm的面狀薄層後,然後再將該電磁波吸收薄 層疊置貼合到該第一導熱層之一表面上。 同理,在接續的複數疊層製造時,仍係依照前述之薄層之固 定成型的操作方法,而依序而將導熱層與電磁波吸收層以交互層 4:配置’據以獲得所需的多層複合材料。 又前述製程中,為了促進混合材料的固定成型效率,可在材 料的此練過程中添加適量的有機過氧化物,例如:⑦素(腿隱)樹 脂可採用二烷基有機過氧化物,作為架橋劑(cmsslinker,或稱熟化 13 200800606 ,·劑);而該有機過氧化物的掺混量比例以在αι〜5%之間較為適宜; 又,掺混有機過氧化物的混合材料,在導熱層賴定成型操作中, 可藉由溫度高低的雛綠偷導歸定型練度快慢,當調整 到約250〇C高溫時定型速度最快。 田正 *本發賴非舰於社所述形式,㈣顯地,就熟習此項技 藝人士而言,在參考上述說明後,能有更多的改良與變化,是以, /L有在相同之創作精神下所作有關本發明之任何修飾或變更,皆 仍應包括在本發明意圖保護之範嘴,併予陳明。而緊接於後將以 -具體實補_,錢—步_本發明之鑛特徵。 【實施方式】 以下_舉二種多層式的導吸收電磁波材料作為本發明 實施例,以作進一步說明。 第-實施_-種雙層複合的導酸吸收電磁波材料,如第 籲五圖所示,該導熱暨吸收電磁波材料包含有第一導熱層ι及電磁 波吸收層2,其中’該電磁波吸收層2以—表面疊合貼接第一導熱 層i的表面上,以組成-多層複合的面狀薄片材料。該雙層雙層 複合的導紐魏電雜材料,聽由錢製紗紐得: (一)首先形成第一導熱層: A將約Wo的氧化粉體(翻的轉導性粉體)與約遍 的石夕素(Si—樹脂(選用的膠材)’並搭配約1%的二烧 基有機過氧化物作為架__的熟侧),置入混練槽 中於‘凰下(約25 〇對該等混合材料實施3〇分鐘的混 200800606 練插作’使該專材料均勻混合備用。 B、以熱壓成翻技射段施作,轉魏合材制定成型 為-厚度約0.02〜15mm的面狀薄層,且藉由該膠材的分 子結構可將該等均勻分佈的熱傳導性粉體結合(bind)s 位’使該導熱層具有穩定的導熱效能。 (二)再次,將電磁波吸收層形成在前述第一導熱層之一表面上· A、 將約70%的鐵H銀合金粉體(選用的電磁波吸收粉體) 與約罵的石夕素(Silicon)樹脂(選用的膠材)並搭配約1% 的二烷基有機過氧化物作為架橋劑(選用的熟化劑),置入 混練槽中’於常溫下(約25。〇對該等混合材料實施3〇分 鐘的混練操作,使該等材料均勻混合備用。 B、 當前述雜與該第-導歸丨所採狀騎為相同或不相 同材貝日守’乃可將該混合材料以噴塗或網版印刷或熱壓 成型的技術手段直接施作在該第一導熱層之一表面上, 使該混合材料固定成型為一厚度約〇〇2〜15画的面狀 薄層,由於該電磁波吸收層2與前述第一導熱層丨的膠材 具有相同的性質,因此可直接成型非常密合穩固。 然而當刖述膠材與該第—導熱層i所採用之膠材為 不相同性質或相同性Ϊ時,_先將前述混合材料以塗 佈或噴塗或網版印刷或熱壓成型的技術手段施作以固定 成型為-厚度約0.02〜15mm的面狀薄層後,然後再將該 电磁波吸收層2疊接貼合或直接成型到該第一導熱層ι 15 200800606 之一表面上。 而第二實施娜-種三層複合式的導紐吸收電磁波材料, 該導熱暨吸收電磁波材料包含有第—導熱層卜電磁波吸收層2 以及第二導熱層3 ’其中’該電磁波吸收層2以其上、下表面分別 豐合貼接第-導熱層1及第二導熱層3,以組成—多層複合的面狀 薄片材料。該多層式的導熱暨吸收電磁波材料的製造方法如后述: (一) 首先,形成第一導熱層1 : A、 將約70%的氧化鋁粉體(選用的熱傳導性粉體)與約3〇% 的壓克力樹脂(選用的膠材),並搭配約1%的架橋劑(選 用的熟化劑),置入混練槽中,於常溫下(約25。〇對該等 混合材料實施30分鐘的混練操作,使該等材料均勻混合。 B、 將該經混練的材料以塗佈的技術塗佈於離型紙p上,在 約80_200°C的溫度下,使該混合材料逐漸地固定成型為 厚度約0·02〜0.5mm面狀薄層,據此獲得一熱傳系數約為 UW/mk的導熱層。 (二) 其次,形成電磁波吸收層2 : A、 將約70%的鐵鎳銀合金粉體(選用的電磁波吸收粉體) 與約30%的壓克力樹脂(選用的膠材)並搭配約1%的_ 橋劑(選用的熟化劑),置入混練槽中,於常溫下(約25。〇 對該等混合材料實施30分鐘的混練操作,使該等材料均 勻混合。 B、 將該經混練的材料以塗佈的技術塗佈於離型紙P上,在 200800606 、力80 200 C的溫度下,使該混合材料逐漸地固定成型為 厚度約0Ό2〜0.5mm面狀薄層,並且形成具有約25db的 電磁波吸收衰減值。 (三) 然後,形成第二導熱層2 : A、 將約70%的氧化鋁粉體(選用的熱傳導性粉體)與約30〇/〇 的壓克力樹脂(選用的膠材),並搭配約1%的架橋劑(選 用的熟化劑),置入混練槽中,於常溫下(約25°C)對該等 混合材料實施30分鐘的混練操作,使該等材料均勻混合。 B、 將該經混練的材料以塗佈的技術塗佈於離型紙p上,在 約80-20(TC的溫度下,使該混合材料逐漸地固定成型為 厚度約0.02〜〇·5ιηιη面狀薄層,據此獲得一熱傳系數約為 1.8W/mk的導熱層。 (四) 最後,將前述各導熱層與電磁波吸收層相互疊接貼合成一體: 先將第一導熱層1與電磁波吸收層2以疊接貼合後,再撕去電 磁波吸收層2上的離型紙p之後與第二導熱層3疊接貼合,成 為具導熱暨吸收電磁波的多層複合材料(參閱第六圖所示)。 通吊本發明之多層複合材料係被配置於電子元件與散熱片 或金屬機構件之間,其中,如第七圖所示之雙層複合式的導熱暨 吸收電磁波材料,係使第—導熱層〗之下表面緊密觸貼於該電子 元件5的表面,而電磁波吸收層2之上表_緊密觸貼於該散熱 片或金屬機構件6上,再如第八圖所示之三層複合式的導熱暨吸 17 200800606 -收電磁波材料,係使第-導熱層1之下表面緊密觸貼於該電子元 件5的表面’而第二導熱層3之上表面則緊密觸貼於該散熱片或 金屬機構件6上,據此可將該電子元件運作時的發熱,透過各導 熱層及電磁波吸收層的傳導而迅速地將熱量傳送到該散熱片或金 屬機構件上加輯除,而亦藉由該多層複合材料的電磁波吸收層 來吸收抑制該電子元件自身產生的電磁輻射並阻絕外來電磁; 擾。 【圖式簡單說明】 第-圖係本發_導熱層剖面的示意圖,顯示在材料中該膠 材與該等熱傳導性粉體的結合態樣; /第二_本發明之導熱騎與熱傳導粉體混合比例與熱 傳系數的變化表; 第三圖係本發_電磁吸收層勤的示:t®,齡在材料中 • 郷材與該等電磁吸收粉體的結合態樣; 弟四圖係本發明之電磁吸收層的膠材與電磁吸收粉體混合比 例與磁^射衰減值的變化表; 第五圖係本發明第一實施例的侧視剖面示意圖; 第、圖係本發明第二實施例的侧視刮面示意圖; ^七圖係本發明第一實施例之雙層複合材料被配置於電子元 ^散熱片之間的結構示意圖;以及 株* K圖係本發日㈣二實施例層複合材料被配置於電子元 散熱片之間的結構示意圖。 18 200800606 參考圖一,係本發明之導熱層剖面的電子顯微鏡圖片及分子 結構不意圖。 參考圖二,係本發明之電磁波吸收層剖面的電子顯微鏡圖片 及分子結構示意圖。 【主要元件符號說明】 第一導熱層1 電磁波吸收層2 第二導熱層3 離型紙P 電子元件5 散熱片或金屬機構件6The amount of electromagnetic compensation required to absorb the powder material or Nasaki domain and other material properties, such as: _ dielectric Wei material after the powder acid ride: when the substrate, the grease is an electrical insulator, the volume resistivity is in, ~ 1〇16ω ·Between coffee, carbon two-dimensional is a good conductor of electricity, the volume resistivity is between H _·3Ω · the composite material composed of it ^ is a constant conductivity, between the conductor and the insulator Of course, not all carbon fiber varieties can be selected as absorbing materials, and only n-dimensional composites treated with L have higher absorption characteristics; when different dielectric absorbing materials and rubber materials After the mixing, the impedance value of the volume resistivity is between 1〇3~ω66Ω.em, and the electromagnetic radiation attenuation value can be obtained. For example: _ electromagnetic absorption material powder and rubber material after mixing: general volume resistivity between (10) ~ coffee, according to the electromagnetic field theory generally use complex dielectric constant ❿ complex permeability "to describe the electromagnetic material of the absorbing material Performance; when the coffin used maintains the dielectric constant of the turns and uses (iv) the real and imaginary parts of the complex magnetic permeability of the magnetically absorptive powder are respectively equal, and the recording and the free are as impedance matching or close matching, the incident The electromagnetic wave energy can be transmitted through the material or more through the reading radiation. In 200800606, the reflection coefficient of the incident wave can be reduced and the absorbing property of the material can be improved. When the thickness of the molding is thicker, the electromagnetic light attenuation of the absorbing wave is higher. And the wider the bandwidth. For example, after the composite powder material having both dielectric absorption properties and electromagnetic absorption properties is mixed with the rubber material, the powder has a good electrical conductivity and electromagnetic properties, so that the powder is mixed with the rubber material. The volume resistivity obtained afterwards is about 1〇_3~1〇6 Ω·cm. When the thickness is above o.oimm, the bandwidth is on the 1st side of 2~12 (} with the attenuation value of electromagnetic radiation of 6dB~70dB. Based on the foregoing disclosure, it can be seen that by arranging the multilayer composite material with heat conduction and electromagnetic wave absorption of the present invention on an electromagnetic wave emitting source, it is possible to simultaneously improve the adverse effects of heat and electromagnetic waves generated when the electrical components operate. According to the present invention, there is provided a method for manufacturing a multilayer composite material having heat conduction and absorbing electromagnetic waves, which comprises: (1) an operation of forming a first heat conduction layer: A, a heat conductive powder and a rubber material are required as required The ratio is placed in a mixing tank. 'Set the mixing conditions according to different types of rubber materials, and perform 15~30 minutes of mixing operation on the mixed materials' to make the materials uniform. B' is applied by means of coating, spraying or spraying or screen printing or hot press forming, and the mixed material is fixedly formed into a planar thin layer having a thickness of about 0.03 to 12 mm, and as a second As shown in the figure, the uniform distribution of the thermally conductive powder microparticles can be positioned by the molecular structure of the rubber material, so that the thermal conductive layer has stable thermal conductivity. 12 200800606 ^ (2) Forming the first electromagnetic wave Operation of the absorption layer: A. The electromagnetic wave absorbing powder and the rubber material are placed in a mixing tank according to the required ratio, and the different mixing materials are set according to different types of rubber materials. I5~3 minutes of mixing operation, so that the materials are uniformly mixed and used. B. When the rubber material and the first heat conductive layer are made of the same material, the mixed material may be coated or The technical means of spraying or screen printing or hot press forming is directly applied to one surface of the first heat conducting layer, and the mixed material is fixedly formed into a planar thin layer having a thickness of about 2 to 15 mm. Due to the electromagnetic The absorbing layer has the same properties as the rubber material of the first heat conducting layer, so that the two layers are very tight and stable. However, when the rubber material used in the first heat conducting layer is different from the material, First, the above-mentioned mixed material is applied by a coating or spray coating or screen printing or hot press forming technique to be fixedly formed into a planar thin layer having a thickness of about 0. 02 to 15 mm, and then the electromagnetic wave is absorbed and thinly laminated. The same is applied to one surface of the first heat conducting layer. Similarly, in the subsequent manufacture of the plurality of laminated layers, the heat conducting layer and the electromagnetic wave are sequentially absorbed according to the operation method of the above-mentioned thin layer fixed forming. The layer is in the interactive layer 4: configuration 'according to obtain the desired multilayer composite material. In the foregoing process, in order to promote the fixed molding efficiency of the mixed material, an appropriate amount of organic peroxide may be added during the process of the material, for example: 7 (leg hidden) resin can use dialkyl organic peroxide as a bridging agent (cmsslinker, or aging 13 200800606, agent); and the ratio of the organic peroxide blended in α 1 ~ 5% It It is more suitable; in addition, the mixed material of organic peroxide mixed in the heat-conducting layer sizing operation, can be tempered by the high temperature and low green color, and the speed is adjusted when the temperature is adjusted to about 250 〇C. The fastest. Tian Zheng* was born in the form of the non-ship Yushe, (4) Explicitly, as far as the skilled person is concerned, after referring to the above description, there can be more improvements and changes, so that /L is the same. Any modifications or variations of the present invention made in the spirit of the present invention should still be included in the scope of the present invention. Immediately afterwards, the characteristics of the mine of the present invention will be determined by - specific compensation _, money - step. [Embodiment] Hereinafter, two types of multilayer absorbing electromagnetic wave materials will be described as an embodiment of the present invention. The first-implementation--two-layer composite acid-adsorbing electromagnetic wave material, as shown in the fifth drawing, the heat-conducting and absorbing electromagnetic wave material comprises a first heat-conducting layer ι and an electromagnetic wave absorbing layer 2, wherein the electromagnetic wave absorbing layer 2 The surface of the first heat conductive layer i is attached to the surface by lamination to form a multi-layer composite planar sheet material. The double-layer double-layer composite guide material Wei-electric hybrid material is heard by the money-making yarn: (1) First, the first heat-conducting layer is formed: A is about oxidized powder of Wo (turning transmissive powder) and About Shi Xisu (Si-resin (optional rubber)' and with about 1% of the dialkyl-based organic peroxide as the cooked side of the shelf __), placed in the mixing tank under the phoenix (about 25 实施The mixed materials are mixed for 3 minutes. 200800606 is inserted into the 'mixing materials.' B. The hot material is turned into a turning target. The forming is made into a thickness of about 0.02~15mm. The planar thin layer, and by the molecular structure of the rubber material, the uniformly distributed thermal conductive powder can be bonded to the s-position to make the thermally conductive layer have stable thermal conductivity. (2) Again, the electromagnetic wave is The absorbing layer is formed on one surface of the first heat conducting layer · A, about 70% of the iron H silver alloy powder (optional electromagnetic wave absorbing powder) and about 骂 骂 ) ) (Silicon resin) (optional glue) Material) with about 1% dialkyl organic peroxide as a bridging agent (optional curing agent), placed in the mixing tank 'At normal temperature (about 25. 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 The same material can be directly applied to one surface of the first heat conducting layer by spraying or screen printing or hot press forming, and the mixed material is fixedly formed into a thickness of about 〇. The planar thin layer of 〇2~15 is formed by the electromagnetic wave absorbing layer 2 having the same properties as the rubber material of the first heat conducting layer ,, so that the direct molding can be very tightly formed and stabilized. - When the rubber material used in the heat conductive layer i is of different nature or the same property, the above-mentioned mixed material is first applied by means of coating or spraying or screen printing or hot press forming to be fixedly formed into a thickness of about After a planar thin layer of 0.02 to 15 mm, the electromagnetic wave absorbing layer 2 is then laminated or directly formed on one surface of the first thermal conductive layer ι 15 200800606. The second embodiment is a three-layer composite Guide wire absorbing electromagnetic wave material, the guide The absorbing electromagnetic wave material comprises a first heat conductive layer electromagnetic wave absorbing layer 2 and a second heat conductive layer 3 'where the electromagnetic wave absorbing layer 2 is ablatedly bonded to the first heat conductive layer 1 and the second heat conductive layer by the upper and lower surfaces thereof 3, to form a multi-layer composite planar sheet material. The method for manufacturing the multilayer heat conduction and absorption electromagnetic wave material is as follows: (1) First, the first heat conduction layer 1 is formed: A, about 70% of alumina Powder (optional heat-conducting powder) and about 3% of acrylic resin (optional rubber), with about 1% bridging agent (optional curing agent), placed in the mixing tank, at room temperature The lower (about 25. 〇) the mixing materials were subjected to a 30-minute mixing operation to uniformly mix the materials. B. The kneaded material is coated on the release paper p by a coating technique, and the mixed material is gradually fixed to a thickness of about 0·02 to 0.5 mm at a temperature of about 80 to 200 ° C. The layer, according to which a heat transfer layer having a heat transfer coefficient of about UW/mk is obtained. (2) Secondly, the electromagnetic wave absorbing layer 2 is formed: A. About 70% of the iron-nickel-silver alloy powder (the selected electromagnetic wave absorbing powder) is mixed with about 30% of the acrylic resin (the selected rubber material). 1% of the aging agent (the selected curing agent) is placed in the mixing tank, and the mixture is subjected to a 30-minute mixing operation at room temperature (about 25. 均匀 to uniformly mix the materials. B. The kneaded material is coated on the release paper P by a coating technique, and the mixed material is gradually fixed into a planar thin layer having a thickness of about 0Ό2 to 0.5 mm at a temperature of 200800606 and a force of 80 200 C, and is formed. It has an electromagnetic wave absorption attenuation value of about 25 db. (3) Then, a second heat conduction layer 2 is formed: A, about 70% of the alumina powder (optional heat conductive powder) and an acrylic force of about 30 〇/〇. Resin (optional rubber), with about 1% bridging agent (optional curing agent), placed in the mixing tank, and subjected to 30 minutes of mixing operation at room temperature (about 25 ° C). The materials are uniformly mixed. B. The kneaded material is coated by a coating technique. On the paper p, at a temperature of about 80-20 (TC), the mixed material is gradually fixed into a thin layer having a thickness of about 0.02 to 5·5ιηιη, thereby obtaining a heat transfer coefficient of about 1.8 W/mk. (4) Finally, the heat conducting layer and the electromagnetic wave absorbing layer are laminated and integrated with each other: firstly, the first heat conducting layer 1 and the electromagnetic wave absorbing layer 2 are laminated and bonded, and then the electromagnetic wave absorbing layer 2 is peeled off. The release paper p on the top and the second heat conduction layer 3 are laminated and bonded to form a multilayer composite material having heat conduction and absorbing electromagnetic waves (refer to the sixth figure). The multilayer composite material of the present invention is disposed on the electronic component. Between the heat sink or the metal machine member, wherein the double-layer composite heat-conducting and absorbing electromagnetic wave material as shown in FIG. 7 is such that the surface under the first heat-conducting layer is in close contact with the surface of the electronic component 5. And the surface of the electromagnetic wave absorbing layer 2 is closely attached to the heat sink or the metal machine member 6, and the three-layer composite heat conduction and absorption as shown in the eighth figure is transmitted. - the lower surface of the heat conducting layer 1 is in close contact with the The surface of the electronic component 5 and the upper surface of the second heat conducting layer 3 are in close contact with the heat sink or the metal member 6, whereby the heat generated during operation of the electronic component can be transmitted through the heat conducting layer and the electromagnetic wave absorbing layer. Conducting and rapidly transferring heat to the heat sink or metal machine component, and absorbing and suppressing electromagnetic radiation generated by the electronic component itself by the electromagnetic wave absorbing layer of the multilayer composite material and blocking external electromagnetic interference; BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a cross section of a thermally conductive layer showing the bonding state of the rubber and the thermally conductive powder in the material; /Second_thermal conduction riding and heat conduction of the present invention The table shows the variation of the powder mixing ratio and the heat transfer coefficient; the third figure is the indication of the electromagnetic absorption layer: t®, the age in the material • the combination of the coffin and the electromagnetically absorbing powder; Figure 5 is a side view of a first embodiment of the present invention; Second reality Schematic diagram of the side view of the embodiment; ^7 is a schematic diagram of the structure of the double-layer composite material of the first embodiment of the present invention disposed between the electron elements and the heat sink; and the *K diagram of the strain is implemented in the fourth day (four) The structural layer of the layer composite material is disposed between the electron element fins. 18 200800606 Referring to Figure 1, the electron micrograph and molecular structure of the cross section of the thermally conductive layer of the present invention are not intended. Referring to Fig. 2, there is shown an electron microscope image and a molecular structure diagram of a cross section of an electromagnetic wave absorbing layer of the present invention. [Description of main component symbols] First heat conducting layer 1 Electromagnetic wave absorbing layer 2 Second heat conducting layer 3 Release paper P Electronic component 5 Heat sink or metal machine member 6
1919
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95123681A TW200800606A (en) | 2006-06-29 | 2006-06-29 | Multi-layered composite capable of conducting heat and absorbing electromagnetic wave and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95123681A TW200800606A (en) | 2006-06-29 | 2006-06-29 | Multi-layered composite capable of conducting heat and absorbing electromagnetic wave and manufacturing method thereof |
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| Publication Number | Publication Date |
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| TW200800606A true TW200800606A (en) | 2008-01-01 |
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| TW95123681A TW200800606A (en) | 2006-06-29 | 2006-06-29 | Multi-layered composite capable of conducting heat and absorbing electromagnetic wave and manufacturing method thereof |
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| TW (1) | TW200800606A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI401701B (en) * | 2008-05-02 | 2013-07-11 | ||
| TWI415884B (en) * | 2011-03-31 | 2013-11-21 | The creeping wave absorber materials | |
| TWI726963B (en) * | 2015-12-25 | 2021-05-11 | 日商日本瑞翁股份有限公司 | Electromagnetic wave absorbing material and electromagnetic wave absorber |
| CN113199837A (en) * | 2021-05-12 | 2021-08-03 | 深圳和畅电磁材料有限公司 | Preparation method of high-performance heat-conducting wave-absorbing composite material |
| CN115746362A (en) * | 2022-09-09 | 2023-03-07 | 东莞市零度导热材料有限公司 | Wave-absorbing heat-conducting fin and preparation method thereof |
| CN116387846A (en) * | 2021-12-30 | 2023-07-04 | 财团法人工业技术研究院 | Electromagnetic wave absorbing material and composite structure for suppressing electromagnetic interference |
-
2006
- 2006-06-29 TW TW95123681A patent/TW200800606A/en unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI401701B (en) * | 2008-05-02 | 2013-07-11 | ||
| TWI415884B (en) * | 2011-03-31 | 2013-11-21 | The creeping wave absorber materials | |
| TWI726963B (en) * | 2015-12-25 | 2021-05-11 | 日商日本瑞翁股份有限公司 | Electromagnetic wave absorbing material and electromagnetic wave absorber |
| CN113199837A (en) * | 2021-05-12 | 2021-08-03 | 深圳和畅电磁材料有限公司 | Preparation method of high-performance heat-conducting wave-absorbing composite material |
| CN116387846A (en) * | 2021-12-30 | 2023-07-04 | 财团法人工业技术研究院 | Electromagnetic wave absorbing material and composite structure for suppressing electromagnetic interference |
| CN115746362A (en) * | 2022-09-09 | 2023-03-07 | 东莞市零度导热材料有限公司 | Wave-absorbing heat-conducting fin and preparation method thereof |
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