200808505 (1) 九、發明說明 【發明所屬之技術領域】 本發明係關於板片切斷裝置及切斷方法，具體而言， 係與將從板狀構件之外緣突出之大小之板片貼附於板狀構 件後，沿著板狀構件之外緣切斷該板片之板片切斷裝置及 '切斷方法相關。 Φ 【先前技術】 傳統上，係於半導體晶圓（以下，簡稱爲「晶圓」） 之表面之電路面貼附以保護爲目的之保護板片。 貼附著保護板片之晶圓因爲於後製程進行背面硏削（ 背面硏磨），貼附保護板片時，以不會從晶圓外緣突出之 方式進行切斷，並要求背面硏削時應防止板片捲入所導致 晶圓破損。因此，專利文獻1之方法，係配設旋轉中心位 於晶圓之上部之垂直線上之切割刀，而且，使該切割刀於 # 平面內進行旋轉，配合晶圓形狀切斷從晶圓之外緣突出之 貼附板片之板片切斷裝置及切斷方法。 . [專利文獻1]日本特開2005- 1 984 1號公報 【發明內容】 然而，專利文獻1所示之板片切斷裝置時，因爲切割 刀於晶圓上之旋轉中心軸周圍進行旋轉，用以實施晶圓中 心及前述旋轉中心之位置校準之校準裝置成爲板片切斷裝 置之必要構成要素。校準所需要之處理時間及至完成板片 -5- 200808505 (2) 切斷爲止之整體時間會變長，而有降低切斷效率之問題。 此外，校準裝置因某種因素而發生誤差時，該誤差會使晶 圓中心及切割刀之旋轉中心之間出現偏離，而有切割刀觸 及晶圓外緣而使該晶圓或切割刀受損之問題。 此外，板片之貼附對象物並未受限爲如晶圓之圓形之 物。而有無法對應於具有其他之多角形或橢圓形之平面形 狀之貼附對象貼附板片時之切斷之問題。 φ 本發明爲了解決上述問題，其目的在於提供，將從晶 圓等之外緣突出之大小之板片貼附於板狀構件狀態下，可 配合板狀構件之形狀切斷前述板片之板片切斷裝置及切斷 方法。 此外，本發明之其他目的係提供，無需以實施前述板 狀構件之正確定位爲目的之校準裝置，可提高板片切斷效 率，板狀構件之平面形狀也不受限制之板片切斷裝置及切 斷方法。 # 爲了達成前述目的，本發明係將從板狀構件之外緣突 出之大小之板片貼附於前述板狀構件後，介由切割刀沿著 _ 板狀構件之外緣切斷前述板片之板片切斷裝置，採用以下 之構成， 具有用以拍攝前述板狀構件之外緣形狀之攝影手段， 以可依據以前述攝影手段之拍攝資料爲基礎之移動軌 跡執行特定動作之方式配設前述切割刀，執行前述板片之 切斷。 本發明之構成上，前述板狀構件之平面形狀係略呈圓 -6- 200808505 (3) 形，以利用前述攝影手段所求取之板狀構件之中心做爲旋 轉中心來進行旋轉之方式配設前述切割刀。 此外，前述攝影手段應具備檢測前述切割刀之實際切 斷軌跡是否偏離前述移動軌跡之功能。 此外，前述切割刀係採用獲得數値控制之多關節型機 器人之支持之構成。 此外，前述切割刀係以可調整切斷時之內傾角、外傾 角、以及後傾角之方式配設。 此外，前述攝影手段更具有用以檢查前述切割刀之前 端側之刃尖檢查功能，於前述板片之切斷動作結束時及/ 或板片之切斷動作前，執行刃尖檢查。 此外，利用前述刃尖檢查功能檢測到切割刀之長度變 化時，對應該變化量來調整切割刀之插入深度。 此外，前述攝影手段係由紅外線攝影機所構成。 此外，具有用以支持前述板狀構件之工作台，亦可採 用可利用加熱手段對前述板狀構件進行加熱之構成。 此外，本發明係將從板狀構件之外緣突出之大小之板 片貼附於前述板狀構件後，介由切割刀沿著板狀構件之外 緣切斷前述板片之板片切斷方法， 採用利用攝影手段拍攝前述板狀構件之外緣形狀，依 據以該攝影手段之拍攝資料爲基礎之移動軌跡移動前述切 割刀來執行前述板片之切斷之方法。 前述切斷方法於前述板狀構件之平面形狀略呈圚形時 ，利用前述攝影手段求取板狀構件之中心，其次，以前述 200808505 (4) 中心爲旋轉中心使切割刀進行旋轉來實施前述切斷。 依據本發明，可依據拍攝資料來決定切割刀之移動軌 跡，利用依據該移動軌跡之切割刀之移動，可以配合板狀 構件之形狀以良好精度實施板片之切斷。而且，因爲無需 ' 使用校準裝置來執行板狀構件之定位，可減少裝置之必要 ' 構成且可節省校準之時間，此外，板狀構件之平面形狀不 受限制，而具有泛用性。 φ 此外，板狀構件之平面形狀略呈圓形時，求取該中心 ，很容易就可決定前述移動軌跡。 此外，若爲依據切割刀之切斷位置及拍攝資料利用攝 影手段來檢測移動軌跡之偏離之構成，切割刀因爲某種原 因而無法正確切斷時，可以採用停止切斷動作等之必要對 策，而可預先防範不良品之發生。 此外，切割刀之保持手段由數値控制之多關節型之機 器人所構成時，可使切割刀之移動軌跡更爲多樣性，可執 • 行複雜之平面形狀之板片之切斷。 此外，切割刀係以於切斷時可調整內傾角、外傾角、 以及後傾角之方式配設，可對應板片之厚度、剛性等來進 行調整，而以最適條件執行板片切斷。 此外，執行切割刀之刃尖檢查之構成，切割刀因爲折 斷或磨損而使耗長度產生變化時，利用其後之切割刀之插 入深度之調整，可以避免切斷不良。 此外，利用紅外線攝影機進行拍攝，亦可以對應將不 透明板片貼附於板狀構件時，此外，對支持工作台進行加 (5) (5)200808505 熱，可以拍攝到更鮮明之板狀構件。 【實施方式】 以下，參照圖面，針對本發明之實施形態進行說明。 第1圖係本實施形態之板片切斷裝置10及與該板片 切斷裝置1 〇倂設且以大致水平支持著平面形狀係略呈圓 形之板狀構件之晶圓W用以將保護用黏著性之板片S貼 附於該晶圓w之上面（電路面）之工作台τ之槪略正面 圖。該圖中，板片切斷裝置10係具備機器人11、保持於 該機器人1 1之切割刀1 2、以及裝設於前述機器人1 1之攝 影手段1 3之構成。 前述機器人1 1含有：基座部1 4 ;配置於該基座部14 之上面側之可於箭頭A〜F方向旋轉之第1臂15A〜第6 臂15F ;以及裝設於第6臂15F之前端側，亦即，配設於 機器人1 1之自由端側之工具保持夾頭19。第2、第3、以 及第5臂15B、15C、15E以可於第1圖中之YXZ面內進 行旋轉之方式配設，而且，第1、、第4、以及第6臂 15A、15D、15F以可於該軸周圍進行旋轉之方式配設。本 實施形態之機器人 11係利用數値控制（Numerical Control)來進行控制。亦即，以分別對應相對於加工物（ 晶圓W )之各關節之移動量之數値資訊來執行控制，所有 移動量係由程式所控制，係利用與傳統切斷裝置之每次變 更晶圓尺寸時以人工作業變更切割刀之位置之方式完全不 同之方式。此外，傳統之切斷裝置時，每次改變切割刀之 -9- 200808505 (6) 姿勢（後述之內傾角al、外傾角a2、後傾角a3 )時，都 必須重新調整切斷深度，本實施形態之機器人〗】不管切 割刀變更成何種姿勢，皆可保持高精度之切斷深度設定値 〇 前述工具保持夾頭1 9，如第2圖所示，係具備：略圓 * 筒狀之切割刀裝設體20 ;及可自由裝卸地保持配置於裝設 體20之圓周方向之大致間隔120度之位置配置之切割刀 φ 1 2之三個夾頭爪2 1 ;之構成。各夾頭爪2 1係內方端爲銳 角之前尖形狀部2 1 A，可利用空壓相對於切割刀裝設體20 之中心於徑方向進行進退。 即述切割刀1 2 ’如弟3圖所不’係由用以形成基部區 域之刃座12A、及可自由地裝卸於該刃座12A之前端側之 固定刃12B所構成。刃座12A係略呈圓柱狀，於其外緣面 之圓周方向以略呈1 20度間隔位置之基端側，沿著軸方方 形成著溝22，前述夾頭爪21之前尖形狀部21A卡合於該 Φ 等溝22，可使切割刀1 2保持於相對於工具保持夾頭1 9之 一定位置° 前述攝影手段1 3係由影像攝影機3 0所構成，該影像 攝影機3 0之拍攝資料被輸出至圖上未標示之控制器。影 像攝影機3 0，如第1圖所示，於特定位置，位於切割刀 1 2之更上方之位置，板片S及晶圓W則位於該切割刀1 2 之下方之位置，獲得裝設於前述工具保持夾頭1 9之外緣 之托架3 1的支持。本實施形態之板片S係使用透明或半 透明之物，即使晶圓W位於板片S之下面側，亦可對該 •10- 200808505 (7)200808505 (1) IX. Description of the Invention [Technical Field] The present invention relates to a sheet cutting device and a cutting method, and more particularly to a sheet which is protruded from the outer edge of the plate member. After being attached to the plate-like member, the sheet cutting device for cutting the sheet along the outer edge of the plate member is related to the cutting method. Φ [Prior Art] Conventionally, a protective sheet for the purpose of protection is attached to a circuit surface of a surface of a semiconductor wafer (hereinafter, simply referred to as "wafer"). The wafer to which the protective sheet is attached is subjected to back boring (back honing) in the post-process, and when the protective sheet is attached, it is cut so as not to protrude from the outer edge of the wafer, and the back boring is required. The wafer should be prevented from being damaged due to the entrapment of the sheet. Therefore, in the method of Patent Document 1, a cutter having a center of rotation on a vertical line on the upper portion of the wafer is disposed, and the cutter is rotated in the # plane, and the wafer shape is cut from the outer edge of the wafer. The protruding sheet cutting device and the cutting method for the attached sheet. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. 2005- 1 984. [Invention] However, in the sheet cutting device shown in Patent Document 1, since the cutter rotates around the central axis of rotation on the wafer, A calibration device for performing position calibration of the wafer center and the rotating center is an essential component of the sheet cutting device. Processing time required for calibration and completion of the plate -5- 200808505 (2) The overall time until cutting is longer, and there is a problem of lowering the cutting efficiency. In addition, when the calibration device is in error due to a certain factor, the error will cause a deviation between the center of the wafer and the center of rotation of the cutting blade, and the cutting blade touches the outer edge of the wafer to damage the wafer or the cutting blade. The problem. Further, the attached object of the sheet is not limited to a circular object such as a wafer. On the other hand, there is a problem in that it cannot be cut when the attached object has a flat shape having other polygonal shapes or elliptical shapes. φ In order to solve the above problems, an object of the present invention is to provide a sheet having a size protruding from the outer edge of a wafer or the like in a state in which a sheet member is attached, and the sheet of the sheet can be cut in accordance with the shape of the sheet member. Sheet cutting device and cutting method. Further, another object of the present invention is to provide a plate cutting device which can improve the cutting efficiency of the sheet and the planar shape of the plate member without requiring a calibration device for the purpose of performing the correct positioning of the above-mentioned plate member. And cutting method. In order to achieve the above object, the present invention attaches a sheet of a size protruding from the outer edge of the plate member to the sheet member, and cuts the sheet along the outer edge of the sheet member via a cutting blade. The sheet cutting device has the following configuration, and has a photographing means for photographing the outer edge shape of the sheet-like member, and is configured to perform a specific motion according to the movement trajectory based on the photographing data of the photographing means. The cutting blade performs the cutting of the aforementioned sheet. In the configuration of the present invention, the planar shape of the plate-like member is slightly round--6-200808505 (3), and the center of the plate-shaped member obtained by the above-mentioned imaging means is rotated as a center of rotation. The aforementioned cutting blade is provided. Further, the photographing means should have a function of detecting whether or not the actual cutting locus of the cutter is deviated from the movement locus. Further, the aforementioned cutting blade is constructed by the support of a multi-joint type robot which is controlled by several turns. Further, the cutting blade is disposed such that the inner inclination angle, the camber angle, and the backward inclination angle at the time of cutting can be adjusted. Further, the photographing means further has a cutting edge inspection function for inspecting the front end side of the cutting blade, and performs a cutting edge inspection when the cutting operation of the sheet is completed and/or before the cutting operation of the sheet. Further, when the length of the cutter is detected by the aforementioned tip inspection function, the insertion depth of the cutter is adjusted in accordance with the amount of change. Further, the aforementioned photographing means is constituted by an infrared camera. Further, a table for supporting the plate-like member may be used, and the plate member may be heated by a heating means. Further, in the present invention, after the sheet having a size protruding from the outer edge of the plate member is attached to the sheet member, the sheet is cut by cutting the sheet along the outer edge of the sheet member. In the method, a method of photographing the outer edge shape of the plate-shaped member by means of a photographing means, and moving the dicing blade according to a movement trajectory based on the photographing data of the photographing means to perform the cutting of the sheet is employed. In the cutting method, when the planar shape of the plate-like member is slightly deformed, the center of the plate-shaped member is obtained by the above-described imaging means, and then the cutting blade is rotated at the center of the center of 200808505 (4) to perform the aforementioned Cut off. According to the present invention, the moving track of the cutting blade can be determined based on the photographing data, and the cutting of the sheet can be performed with good precision in accordance with the shape of the plate member by the movement of the cutting blade according to the moving path. Moreover, since it is not necessary to 'use the aligning means to perform positioning of the plate member, the necessity of the device can be reduced and the time for calibration can be saved. Further, the planar shape of the plate member is not limited, and it is versatile. φ In addition, when the planar shape of the plate member is slightly rounded, the center can be determined, and the aforementioned movement trajectory can be easily determined. In addition, in the case where the cutting position of the cutting blade and the photographing data are used to detect the deviation of the movement trajectory by the photographing means, if the cutting blade cannot be cut off correctly for some reason, it is necessary to take measures necessary to stop the cutting operation and the like. It is possible to prevent the occurrence of defective products in advance. Further, when the holding means of the cutting blade is constituted by a multi-joint type robot controlled by a number of turns, the moving path of the cutting blade can be made more diverse, and the cutting of the complicated planar shape can be performed. Further, the cutting blade is disposed so as to adjust the camber angle, the camber angle, and the back tilt angle at the time of cutting, and can be adjusted in accordance with the thickness and rigidity of the sheet, and the sheet cutting can be performed under optimum conditions. Further, when the cutting edge inspection of the cutting blade is performed, and the cutting length of the cutting blade is changed due to breakage or wear, the cutting depth of the cutting blade can be adjusted to avoid the cutting failure. In addition, when shooting with an infrared camera, it is also possible to attach a opaque sheet to a plate member, and add (5) (5)200808505 heat to the support table to capture a more distinct plate-like member. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a sheet cutting device 10 of the present embodiment, and a wafer W which is provided with the sheet cutting device 1 and which supports a substantially circular plate-like member in a substantially horizontal shape. A front view of the table τ to which the protective adhesive sheet S is attached to the upper surface (circuit surface) of the wafer w. In the figure, the sheet cutting device 10 includes a robot 11, a cutter 1 held by the robot 11, and a photographing means 13 attached to the robot 11. The robot 1 1 includes a base portion 14 , a first arm 15A to a sixth arm 15F that are disposed on the upper surface side of the base portion 14 and rotatable in directions of arrows A to F, and a sixth arm 15F. The front end side, that is, the tool holding chuck 19 disposed on the free end side of the robot 1 1 . The second, third, and fifth arms 15B, 15C, and 15E are disposed to be rotatable in the YXZ plane in Fig. 1, and the first, fourth, and sixth arms 15A, 15D, The 15F is arranged to be rotatable around the shaft. The robot 11 of the present embodiment is controlled by a numerical control (Numerical Control). That is, the control is performed by the number information corresponding to the movement amount of each joint with respect to the workpiece (wafer W), and all the movement amount is controlled by the program, and the crystal is changed every time with the conventional cutting device. In the case of a round size, the way in which the position of the cutting blade is changed manually is completely different. In addition, in the case of the conventional cutting device, the cutting depth must be re-adjusted each time the -9-200808505 (6) posture of the cutting blade (the inner inclination angle a1, the camber angle a2, and the rear inclination angle a3) is changed. The robot of the form 〗: The cutting depth setting can be maintained with high precision regardless of the posture of the cutting blade. The tool holding chuck 1 is as follows: as shown in Fig. 2, it has a slightly rounded shape* cylindrical shape. The cutter blade assembly 20 and the three chuck claws 2 1 of the cutter blades φ 1 2 disposed at positions substantially spaced apart by 120 degrees in the circumferential direction of the mounting body 20 are detachably held. The inner end of each of the chuck jaws 2 1 is an acute-angled tip-shaped portion 2 1 A, and the air pressure can be advanced and retracted with respect to the center of the cutter blade assembly 20 in the radial direction. The dicing blade 1 2 ′ is formed by a blade holder 12A for forming a base region and a fixed blade 12B detachably attachable to the front end side of the blade holder 12A. The blade holder 12A has a substantially cylindrical shape, and a groove 22 is formed along the axial direction at a base end side at a position slightly spaced by 120 degrees in the circumferential direction of the outer peripheral surface thereof, and the tip end portion 21A of the chucking claw 21 is formed. Engaging in the groove 22 of the Φ, the cutting blade 12 can be held at a certain position relative to the tool holding chuck 19. The imaging device 13 is composed of a video camera 30, and the image camera 30 is photographed. The data is output to a controller not shown on the diagram. The image camera 30, as shown in Fig. 1, is located at a position higher than the dicing blade 12 at a specific position, and the sheet S and the wafer W are located below the dicing blade 12, and are mounted at a position The aforementioned tool maintains the support of the bracket 31 of the outer edge of the collet 19. The sheet S of the present embodiment uses a transparent or semi-transparent material, and even if the wafer W is located on the lower side of the sheet S, the 10-10 200808505 (7)
晶圓W之外緣位置進行拍攝。影像攝影機3 0如第4圖所 示，針對刃12B之前端區域、及位於更爲下方之位置之板 片S及晶圓W之部份區域之拍攝區域進行拍攝，並將該 拍攝資料輸出至控制器。其次，利用控制器對拍攝資料進 _ 行之影像處理，來特定晶圓W之外緣位置並決定刃12B * 之移動軌跡，藉此，控制器針對機器人1 1執行特定控制 ，切割刀12可對應該移動軌跡進行移動。 φ 此外，用以處理影像攝影機3 0之拍攝資料之控制器 ，如第4圖（B )所示，含有：分別求取二弦A、B之垂 直平分線a、b之交點做爲晶圓W之中心C，將該中心C 視爲刃1 2B之旋轉中心，並輸出用以驅動機器人1 1之信 號；之功能。 此外，攝影手段1 3之構成上，具備：檢測刃I2B之 實際切斷軌跡相對於前述影像處理所決定之移動軌跡是否 有偏離（參照第4圖（C ))，檢測到其偏離時，停止裝 • 置全體之動作、或發出特定之警報；之功能。 其構成上，也如第1圖及第2圖所示，於切割刀12 結束切斷動作後、或執行切斷動作前，利用前述攝影手段 13之刃尖檢查功能檢查刃12B之前端側。影像攝影機30 拍攝刃12B之前端區域並將該拍攝資料輸出至前述控制器 ，該控制器則利用影像處理檢測相對於基準長度之刃1 2B 之長度變化、及相對於刃緣基準形狀之刃緣形狀之變化。 其次，檢測到刃1 2B之前端因爲折斷或摩耗而變短之變化 時，前述機器人1 1，以補足該變化量之方式來調查下一次 -11 - 200808505 (8) 切斷時之插入深度，藉此，不會有切割刀12之插入深度 不足的情形。此外，於前述檢查，判斷刃12B變短時，因 爲先前進行切斷之板片S可能未完全切斷，檢查該板片S 並對外部輸出信號。此外，檢測到刃緣受損時，改變插入 ' 深度並以正常刃緣區域進行切斷、或使機器人11換持其 * 他新的切割刀1 2。 前述工作台T，如第1圖所示，係從.平面觀看時，略 φ 呈方形之外側工作台41、及平面略呈圓形之內側工作台 42所構成。外側工作台4 1係以與內側工作台42之外緣之 間形成間隙之狀態收容著該內側工作台42之凹狀來配設 ，而且，介由單軸機器人44以可相對於基座45進行昇降 之方式配設。另一方面，內側工作台42係介由單軸機器 人46以可相對於外側工作台4 1進行昇降之方式配設。因 此，外側工作台4 1及內側工作台42可以一體地昇降，而 且，可以相互獨立地昇降，藉此，可對應板片S之厚度、 φ 晶圓W之厚度而調整於特定高度之位置。 於前述工作台T之上部側，配置著對晶圓W上送出 板片S之圖上未標示之板片送出單元，從該板片送出單元 送出至晶圓W上之板片S，利用圖上未標示之貼合滾筒在 板片S上旋轉並於板片送出方向移動，而將該板片S貼附 於晶圓W之上面。 其次，參照第5圖至第7圖，針對本實施形態之板片 S之切斷方法進行說明。此外，依據，日本特願2005- 1 98 806號所示之要領將板片S貼附於晶圓W。 -12- 200808505 (9) 啓始設定係由控制器分別輸入，如第5圖 斷方向之上面觀看時，切割刀1 2之中心線相 圓W之外緣之切斷方向，係呈傾斜之內傾角 圖所示，從切斷方向之正面觀看時，切割刀1 係呈傾斜之外傾角a2，如第7圖所示，從切斷 ' 觀看時，切割刀12之中心線係相對於切斷方 後傾角a3。設定如上所示之內傾角a 1 '外傾） φ 後傾角a3之理由，係爲了對應板片S之厚度 以最佳條件來進行切斷。 首先，板片切斷裝置10應具有暫時移載 ，執行從工具保持夾頭1 9拆除切割刀1 2並換 標示之吸附臂之動作，從圖上未標示之晶圓卡 W並載置於工作台T上。該晶圓W之載置時 卡匣具有特定之尺寸精度，可以使晶圓W位 介於外側工作台41及內側工作台42之間隙之彳 • 接著，將板片S貼附於該晶圓W之上面 貼附動作之期間，板片切斷裝置1 0執行從吸 . 割刀12之動作。其次，於板片S完成貼附後 所示，使切割刀1 2及影像攝影機3 0位於工作 之特定位置。此時之影像攝影機30之影像資 (A)所示。此外，切割刀1 2之下降量由啓始 ’而且’利用刃12B切斷板片S之點被設定於 之影像攝影機3 0所設定之基準線LX及LY之 ’以使晶圓W之外緣與基準線LX及LY之交 所示，從切 對於沿著晶 a 1，如第6 2之中心線 方向之側面 向呈傾斜之 % a2 、以及 、剛性等而 裝置之作用 持至圖上未 匣取出晶圓 ’因爲晶Η 於外緣大致 ί立置。 側。執行該 附臂取得切 ，如第1圖 台τ之上方 碎如第4圖 設定來決定 第4圖所示 交點。因此 點成爲一'致 -13- (10) (10)200808505 之方式，使切割刀12進行下降，而如第4圖（B )所示， 成爲刃1 2B對板片S插入特定量之狀態。 其次，如第4圖（B)所示之狀態，利用前述弦A、B 求取切割刀12之旋轉中心C及晶圓W之直徑，藉此，決 定切斷時之刃12B之移動軌跡。 如此，在決定移動軌跡之狀態，前述切割刀1 2依據 以前述旋轉中心C做爲切割刀1 2之旋轉中心之移動軌跡 ，沿著晶圓W之外緣實施板片S之切斷。執行該切斷動 作之期間，前述影像攝影機3 0如第4圖（C )所示，連續 檢測前述切割刀1 2之實際切斷軌跡是否偏離前述移動軌 跡，檢測到偏離時，輸出特定信號並停止切斷動作、或發 出警報，以便進行必要之點檢作業。 此外，針對用以表示晶圓W之晶軸向之V缺口區域 ，取得影像攝影機3 0之即時拍攝資料來建立補正資料， 控制器則對機器人1 1輸出該補正資料來對應。此時，刃 1 2B之插入深度會進行相對較淺之位移，藉此，於如v缺 口之極小區域也可進行精度良好之切斷。 結束板片S之切斷後，切割刀1 2回到特定之待機位 置並接受刃尖檢查。其次，與前述相同，板片切斷裝置10 將其暫時換持於圖上未標示之吸附臂，並吸附保持晶圓W 且收容於圖上未標示之晶圓卡匣。另一方面，利用圖上未 標示之捲取裝置捲取前述切斷所產生之外側之不要板片部 份。之後，再利用板片切斷裝置1 0所保持之吸附臂將下 一晶圓W移載至工作台T上，以後，依同樣要領執行切 -14- 200808505 (11) 斷動作。 因此，依據上述實施形態，具有無需實施晶圓W之 校準，可以配合該晶圓W之外緣形狀來實施板片s之切 斷的效果。 以上，係用以實施本發明之最佳構成、方法等，然而 ，本發明並未受限於此。 亦即，針對本發明之主要特定實施形態進行圖示、說 明，然而，只要未背離本發明之技術思想及目的之範圍， 以上說明之實施形態之形狀、位置或配置等可配合需要， 由相關業者實施各種變更。 例如，前述實施形態時，係針對板片S爲透明或半透 明時進行說明，然而，若爲可透射特定波長之板片時，只 要使用可辨識該波長之影像攝影機即可。亦即，板片S若 爲紅外線透射性，則影像攝影機3 0採用紅外線攝影機， 即使板片s並非透明，亦可拍攝位於板片s之下面側之晶 圓W之外緣位置，可執行實質相同之切斷。 此外，亦可以爲於用以支持晶圓W之工作台τ之內 側工作台4 2內建線圈做爲加熱手段之構成。該構成時， 利用上述紅外線攝影機進行拍攝時，可以拍攝到更鮮明之 晶圓w。 此外，板狀構件並未限制爲半導體晶圓W，亦可以玻 璃、鋼板、或樹脂板等之其他板狀構件爲對象，半導體晶 圓也可以爲矽晶圓或化合物晶圓。此外，板狀構件之平面 形狀並未限制爲略呈圓形，亦可以爲具有橢圓、多角形等 -15- (12) (12)200808505 之各種平面形狀之物。 此外，前述實施形態時，係對略呈圓形之晶圓w貼 附板片s並沿著晶圓w之外緣進行切斷時，然而，亦可 以具有圓形以外之平面形狀之板狀構件。此時’除了即時 持續取得影像攝影機3 0之拍攝資料來決定移動軌跡並進 行切斷之方法以外，當然也可以採用以下之方法’亦即， 依據涵蓋板狀構件全體區域之拍攝資料，來預先決定移動 軌跡並進行切斷。 【圖式簡單說明】 第1圖係本實施形態之板片切斷裝置及工作台之槪略 正面圖。 第2圖係機器人之前端側區域之放大斜視圖。 第3圖係切割刀之放大斜視圖。 第4圖（A )係切割刀及影像攝影機位於工作台T之 上方之特定位置時之影像攝影機所拍攝之槪略平面圖，（ B)係使刃插入特定量狀態之槪略平面圖，（C )係以切割 刀切斷板片之狀態之槪略平面圖。 第5圖係保持內傾角來切斷板片之動作之說明圖。 第6圖係保持外傾角來切斷板片之動作之說明圖。 第7圖係保持後傾角來切斷板片之動作之說明圖。 【主要元件符號說明】 1 0 :板片切斷裝置 -16- 200808505 (13) 11 :機器人（保持手段） 12 :切割刀 12B ：刃 30 :影像攝影機（攝影手段） S :板片 W :半導體晶圓（板狀構件）Photographing the outer edge of the wafer W. As shown in FIG. 4, the image camera 30 captures the image of the front end region of the blade 12B and the portion S of the wafer and the portion of the wafer W, and outputs the photographed data to the photographing region. Controller. Secondly, the image processing of the captured data is performed by the controller to specify the outer edge position of the wafer W and determine the movement trajectory of the blade 12B*, whereby the controller performs specific control for the robot 11 and the cutting blade 12 can be Move the trajectory as it should. φ In addition, the controller for processing the image data of the video camera 30, as shown in FIG. 4(B), includes: obtaining the intersection of the vertical bisectors a and b of the two strings A and B as the wafer respectively. The center C of W is regarded as the center of rotation of the blade 1 2B, and outputs a function for driving the signal of the robot 11; Further, the imaging means 13 has a configuration in which the actual cutting trajectory of the detecting edge I2B is deviated from the movement trajectory determined by the image processing (see FIG. 4(C)), and when the deviation is detected, the imaging is stopped. Installation • The function of setting all actions or issuing specific alarms. In the configuration, as shown in Figs. 1 and 2, before the cutting operation is completed by the cutting blade 12 or before the cutting operation is performed, the front end side of the blade 12B is inspected by the blade edge inspection function of the imaging means 13. The video camera 30 captures the front end region of the blade 12B and outputs the photographed data to the controller, which uses image processing to detect the length change of the edge 1 2B with respect to the reference length and the edge of the edge reference shape. The change in shape. Next, when it is detected that the front end of the blade 1 2B is shortened due to breakage or wear, the robot 1 1 checks the insertion depth of the next -11 - 200808505 (8) when the amount of change is compensated. Thereby, there is no case where the insertion depth of the cutter 12 is insufficient. Further, in the above-described inspection, when it is judged that the blade 12B is shortened, the sheet S which has been previously cut may not be completely cut, and the sheet S is inspected and a signal is output to the outside. In addition, when it is detected that the edge is damaged, the insertion 'depth is changed and the cutting is performed with the normal edge area, or the robot 11 is replaced with its * new cutting blade 1 2 . As shown in Fig. 1, the table T is formed of a square outer working table 41 and a slightly circular inner working table 42 when viewed from a plane. The outer table 4 1 is disposed in a concave shape in a state in which a gap is formed between the outer surface of the inner table 42 and a recessed shape of the inner table 42 , and is affinable with respect to the base 45 via the single-axis robot 44 . It is equipped with lifting method. On the other hand, the inner table 42 is disposed by the uniaxial robot 46 so as to be movable up and down with respect to the outer table 41. Therefore, the outer table 41 and the inner table 42 can be integrally moved up and down, and can be raised and lowered independently of each other, whereby the thickness of the sheet S and the thickness of the wafer W can be adjusted to a specific height. On the upper side of the stage T, a sheet feeding unit not shown on the sheet S on which the sheet S is fed is disposed, and the sheet S sent from the sheet feeding unit to the wafer W is used. The unattached bonding roller is rotated on the sheet S and moved in the sheet feeding direction, and the sheet S is attached to the wafer W. Next, a method of cutting the sheet S of the present embodiment will be described with reference to Figs. 5 to 7 . Further, according to the method shown in Japanese Patent Application No. 2005-1 98 806, the sheet S is attached to the wafer W. -12- 200808505 (9) The start setting is input by the controller separately. When viewed from the top of the broken direction in Figure 5, the cutting direction of the outer edge of the center line of the cutting blade 1 2 is inclined. As shown in the internal inclination angle diagram, when viewed from the front side of the cutting direction, the cutting blade 1 is inclined at an inclination angle a2, as shown in Fig. 7, when viewed from the cutting, the center line of the cutting blade 12 is relatively cut. The back angle of the break is a3. The reason why the inner inclination angle a 1 'external inclination φ and the backward inclination angle a3 are set as described above is to perform the cutting under the optimum conditions in accordance with the thickness of the sheet S. First, the sheet cutting device 10 should have a temporary transfer, perform the action of removing the cutting blade 1 from the tool holding chuck 19 and replacing the labeled suction arm, from the unlabeled wafer card W and placed thereon. Workbench T. When the wafer W is placed, the cassette has a specific dimensional accuracy, and the wafer W can be placed between the outer table 41 and the inner table 42. Then, the sheet S is attached to the wafer. During the attachment operation of the upper surface of W, the sheet cutting device 10 performs the operation of the suction cutter 12. Next, after the sheet S is attached, the cutter 1 2 and the image camera 30 are placed at a specific position for operation. At this time, the image of the video camera 30 is shown in (A). Further, the amount of descent of the cutter 1 2 is set by the reference line LX and LY set by the image camera 30 from the start 'and the point at which the blade S is cut by the blade 12B to make the wafer W The relationship between the edge and the reference line LX and LY is shown by the action of the device on the side along the direction of the center line of the crystal a 1, such as the center line direction of the sixth direction, and the rigidity of the device. The wafer was not removed because the wafer was substantially erected on the outer edge. side. Execute the arm to obtain the cut, as shown in the top of the first stage τ as shown in Figure 4 to determine the intersection shown in Figure 4. Therefore, the point becomes a pattern of '-13-(10)(10)200808505, and the cutter 12 is lowered, and as shown in FIG. 4(B), the blade 1 2B is inserted into the plate S by a certain amount. . Next, in the state shown in Fig. 4(B), the trajectories A and B are used to obtain the rotation center C of the dicing blade 12 and the diameter of the wafer W, thereby determining the movement trajectory of the blade 12B at the time of cutting. As described above, in the state in which the movement trajectory is determined, the dicing blade 1 2 performs the cutting of the sheet S along the outer edge of the wafer W in accordance with the movement trajectory of the rotation center C as the rotation center of the dicing blade 12. While the cutting operation is being performed, the video camera 30 continuously detects whether or not the actual cutting trajectory of the cutting blade 12 deviates from the movement trajectory as shown in Fig. 4(C), and outputs a specific signal when a deviation is detected. Stop the cutting action or issue an alarm to perform the necessary inspection. Further, for the V-notch region indicating the crystal axis of the wafer W, the real-time imaging data of the video camera 30 is acquired to establish the correction data, and the controller outputs the correction data to the robot 11 to correspond. At this time, the insertion depth of the blade 1 2B is relatively shallowly displaced, whereby the cutting with high precision can be performed in a very small area such as a v-opening. After the cutting of the sheet S is completed, the cutter 12 returns to a specific standby position and receives the cutting edge inspection. Next, in the same manner as described above, the sheet cutting device 10 temporarily exchanges the suction arm, which is not shown on the drawing, and sucks and holds the wafer W and is accommodated in a wafer cassette not shown. On the other hand, the unnecessary sheet portion on the outer side of the cutting is taken up by a winding device not shown on the drawing. Thereafter, the next wafer W is transferred to the table T by the adsorption arm held by the sheet cutting device 10, and thereafter, the cutting operation is performed in the same manner as in the same manner. Therefore, according to the above embodiment, it is possible to perform the effect of cutting the wafer s in accordance with the shape of the outer edge of the wafer W without performing calibration of the wafer W. The above is the best configuration, method and the like for carrying out the invention, however, the invention is not limited thereto. That is, the main specific embodiments of the present invention are illustrated and described. However, the shapes, positions, configurations, and the like of the embodiments described above may be adapted as needed without departing from the scope of the technical spirit and the scope of the present invention. The company implements various changes. For example, in the above embodiment, the sheet S is transparent or semi-transparent. However, in the case of a sheet that can transmit a specific wavelength, it is only necessary to use a video camera that can recognize the wavelength. That is, if the sheet S is infrared-transmitting, the image camera 30 uses an infrared camera, and even if the sheet s is not transparent, the outer edge of the wafer W located on the lower side of the sheet s can be photographed, and the essence can be performed. The same cut. Further, it is also possible to use a built-in coil as a heating means for the inner table 4 2 for supporting the table τ of the wafer W. In this configuration, when the image is taken by the infrared camera described above, a more vivid wafer w can be captured. Further, the plate member is not limited to the semiconductor wafer W, and may be a glass plate, a steel plate, or another plate member such as a resin plate, and the semiconductor wafer may be a tantalum wafer or a compound wafer. Further, the planar shape of the plate member is not limited to a slightly circular shape, and may be various planar shapes of -15-(12) (12)200808505 having an ellipse, a polygon, or the like. Further, in the above-described embodiment, the sheet s is attached to the wafer 104 having a substantially circular shape and cut along the outer edge of the wafer w. However, it may have a flat shape other than a circular shape. member. At this time, in addition to the method of continuously obtaining the photographing data of the video camera 30 to determine the movement trajectory and cutting the same, it is of course possible to adopt the following method, that is, according to the photographing data covering the entire area of the plate-shaped member. Decide to move the track and cut it off. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic front view of a sheet cutting device and a table of the present embodiment. Fig. 2 is an enlarged perspective view of the front end side region of the robot. Figure 3 is an enlarged perspective view of the cutting blade. Fig. 4(A) is a schematic plan view of the image camera taken by the photographic cutter and the image camera at a specific position above the table T, and (B) is a schematic plan view of inserting the blade into a certain amount of state, (C) A schematic plan view of the state in which the blade is cut by a cutter. Fig. 5 is an explanatory view showing an operation of cutting the sheet by maintaining the camber angle. Fig. 6 is an explanatory view showing the action of maintaining the camber angle to cut the sheet. Fig. 7 is an explanatory view showing the action of maintaining the caster angle to cut the sheet. [Main component symbol description] 1 0 : Plate cutting device-16- 200808505 (13) 11 : Robot (holding means) 12 : Cutting blade 12B: Blade 30: Image camera (photographic means) S: Plate W: Semiconductor Wafer (plate member)
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