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TW200806805A - Evaporation method of organic film and organic film evaporation apparatus - Google Patents

Evaporation method of organic film and organic film evaporation apparatus Download PDF

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Publication number
TW200806805A
TW200806805A TW96106866A TW96106866A TW200806805A TW 200806805 A TW200806805 A TW 200806805A TW 96106866 A TW96106866 A TW 96106866A TW 96106866 A TW96106866 A TW 96106866A TW 200806805 A TW200806805 A TW 200806805A
Authority
TW
Taiwan
Prior art keywords
substrate
mask
evaporation
thin film
vacuum chamber
Prior art date
Application number
TW96106866A
Other languages
English (en)
Chinese (zh)
Inventor
Toshio Negishi
Koji Hane
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW200806805A publication Critical patent/TW200806805A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW96106866A 2006-02-28 2007-02-27 Evaporation method of organic film and organic film evaporation apparatus TW200806805A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006052961 2006-02-28

Publications (1)

Publication Number Publication Date
TW200806805A true TW200806805A (en) 2008-02-01

Family

ID=38459034

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96106866A TW200806805A (en) 2006-02-28 2007-02-27 Evaporation method of organic film and organic film evaporation apparatus

Country Status (2)

Country Link
TW (1) TW200806805A (fr)
WO (1) WO2007099929A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5260212B2 (ja) * 2008-09-25 2013-08-14 株式会社日立ハイテクノロジーズ 成膜装置
JP5634522B2 (ja) * 2010-09-22 2014-12-03 株式会社アルバック 真空処理装置及び有機薄膜形成方法
JP6025591B2 (ja) * 2012-02-17 2016-11-16 株式会社半導体エネルギー研究所 成膜装置
KR102015872B1 (ko) * 2012-06-22 2019-10-22 삼성디스플레이 주식회사 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR20140010303A (ko) * 2012-07-16 2014-01-24 삼성디스플레이 주식회사 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR102052069B1 (ko) * 2012-11-09 2019-12-05 삼성디스플레이 주식회사 유기층 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR102075527B1 (ko) * 2013-05-16 2020-02-11 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
WO2015063103A1 (fr) * 2013-10-29 2015-05-07 Leybold Optics Gmbh Chambre à vide et procédé pour faire fonctionner une chambre à vide
CN108411249B (zh) * 2018-03-28 2024-02-09 江苏集萃有机光电技术研究所有限公司 一种基片样品架、掩模板及基片更换方法及蒸镀设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3909888B2 (ja) * 1996-04-17 2007-04-25 キヤノンアネルバ株式会社 トレイ搬送式インライン成膜装置
JP4417019B2 (ja) * 2003-03-26 2010-02-17 株式会社アルバック マスク装置及び真空成膜装置
JP2005056673A (ja) * 2003-08-04 2005-03-03 Nec Plasma Display Corp プラズマディスプレイパネルの成膜装置、該パネルの製造方法及びプラズマ表示装置の製造方法
JP4450589B2 (ja) * 2003-09-09 2010-04-14 株式会社アルバック 成膜装置

Also Published As

Publication number Publication date
WO2007099929A1 (fr) 2007-09-07

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