200804021 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種書ij自丨太、、土 種幻°彳方法、劃割裝置及使用該方法或 衮置而切割之切割基板。f ,, 败更5乎細而言，係關於一種在切割 "反、陶瓷板、晶圓等脆性材料(被切割基板)時，在切 害广之前’沿脆性材料之預定切割線形成劃割線的方 法、裝置及使用該等而切割之切割基板。 【先前技術】 劃割方法係在切割脆性材料時，在切割步驟之前，沿脆 性材料之預m線形成連續的微小龜裂，即劃割線二 法。作為代表性之劃割方法，有使鑽石刀等超硬土具一面 壓緊脆性材料-面沿敎切割線相對移動之機械劃割法 (例如專利文獻1、2)和使雷射光沿脆性材料之預定切割線 相對移動，同時跟隨此喷射冷卻劑之雷射劃割法（例如專 利文獻3、4)。 [專利文獻1]曰本特開平6-102480 [專利文獻2]曰本特開平〗^22355 [專利文獻3]再公佈專利W02003/008352 [專利文獻4]日本特開2003-117921 【發明内容】 [發明所欲解決之問題] 在機械劃割法中，因使超硬工具一面壓緊脆性材料一面 相對移動，故有，產生切屑或微小碎片等之問 错由降低 此壓緊力，可減少切屑或微小4片等之產生， 1一灰小則劃 H9964.doc 200804021 割線會變淺，於切^ 、…“ 割。因此，期望-種以 I’、 ’、可形成足夠深度之劃割線的方法。 另-在雷射劃割法中，雖不產生切屑或微 荨，但劃副％使用之雷射光 之炉旦么―P 亢口下述之理由，而以儘可能低 為且p ’在此種基板切割技術中，生産性之" 性較為重要，作為A手段之_叮斑 生産陡之優良 ^ v ^ /、又之一，可舉出提高劃割線之形成 速度。例如藉由提高雷M #I + 取 一 、子於玻璃板κ之相對速度，可 提咼劃割線之形成丄亲声。仏老 i …A 速度此處，因為對每單位面積施加之 斟、Φ, 相對速度成反比，若過於提高相 對速度，則預定切割線接受 <田射先此置變小，在切割步 驟％有蚪不能完全切割。因 在美尚雷射光相對速度之 f月形’必須隨之提高雷射光 9 存在χ PP 士 。但疋，雷射光之輸出 存在界限，同時以高輸出連續用 命之要因。 、使用成為縮短雷射振盪器壽 如：，在機械劃割法中，期望以較小之厂堅緊力亦可形成 之劃割線；在雷射劃割法中’期望以較小之雷 射此夏亦可形成可切割之劃割線。 本發明係鑒於上述情況而6 士 ,、/u> . 乩㈡况而凡成者，其目的係提供一種可 以比較小之超硬工且壓賢六七 赤用P 緊力或㈣能量於被㈣i基板上形 成用以侍到切割基板之劃割線的劃割 [解決問題之技術手段] 裝置 為達成上述目的，本發明之劃 方法係在切割被切割 土板K之切割步驟之前，沿被 .^ 暴板κ之預疋切割線J形 成^』線s者，其特徵在於··首 目元，猎由使弟1雷射光“沿 119964.doc 200804021 被切割基板κ之預定切割線蝴對移動’於被切割基板κ之 内科成被切割基板κ之預定切割線】的内部變質層.Ν ; 其-人’於破切割基板Κ之表面形成沿被切割基板κ之預定 切割線J的劃割線s。 、 ' 此外，杨明之劃割裳置1，係在切割被切割基板Κ之切 • 1 乂驟之蚋/σ被切割基板Κ之預定切割線J形成劃割線s 者，、特欲在於·具備藉由使第1雷射光L1沿被切割基板 • K之預定切割線J相對移動，於被切割基板]^之内部形成沿 被切d基板κ之預定切割線J的内部變質層N的内部變質層 幵y成機構8、4，及於被切割基板κ之表面形成沿被切割基 板之+預定切割線了的劃割線S的劃割線形成機構6、7、4。 若藉由本發明，則首先，、藉由第i雷射光u於被切割基 板K之内4形成沿預定切割線J之内部變質層N ;其次，於 被切割基板Κ之表面形成沿預定切割線丨之劃割線s。劃割 線S與内部變質㈣在同_垂直平面内大致平行。如此，若 瞻在形成劃割線8之前，藉由第i雷射光於被切割基板Κ之内 邛預先形成内部變質層N，則與不預先形成内部變質層N v比較’可以更低之能量形成足以可切割被切割基板 八又的s彳割線s。即’在機械劃割法中，可以比較小之 超硬工具壓緊力於被切割基板K上形成用以得到切割基板 之劃剎線S。此外，在雷射劃割法中，可以比較小之雷射 月b里於被切割基板κ上形成用以得到切割基板之劃割線s。 作為第1雷射光L1，宜使用透過被切割基板Κ之振盪波 長勺田射光。具體而言，宜使用振盪波長500 nm〜550 119964.doc 200804021 nm、最好是523〜532 nm糾、;f々姓， 咖附近之綠光雷射， 過被切割基板K之波長特性的雷射光即可。本發明中= :内：變質層」，係指龜裂或破裂等裂痕層、擴： 料之應力起作用的層、折射率與變質層周圍不同之層等 此外’藉由使第2雷射光咖被切割基板κ之預定 線靖被㈣基板κ相對移動，形成沿被切割基板κ之料 切割線J的劃割線S，可適用於雷射劃割法。此情形，第2 雷射光L2宜為不透過被㈣基板Κ之聽波長的雷射光。 此外，被切割基板κ宜為脆性材料。 在被切割基板〖為透明玻璃板之情形，藉由掃描第！雷射 ^，亦可於透明玻璃板r内部進行標示。標示係指以 才示不加工製作光折射率不同之區域。 即使在被切割基板Kr g忠# & 土极垃對了見先線為不透明基板的情形， 若該基板對於特定波長係由透過該波長之物質構成，則藉 由掃描該波長之第1雷射光L1 ’亦可於被切割基板κ之内 部進行標示。 例如，在被切割基板為石夕晶圓之情形，藉由掃描具有近 紅外線波長之力雷射光L1，亦可於被切割基板κ之内部 進行標示。 於内部施有標示之基板，可實施切割後之追蹤。 再者，本發明中所言「透明」’係指無色透明及有色透 明都包含，不吸收特定波長。 、即，即使基板對可見光線為不透明，若對於特定波長由 透過該波長之物質構成，則視為透明。 H9964.doc 200804021 、,：’透過不僅係完全透過，亦包含部分透過，無論透 過里夕少，亦包含特定波長被部分吸收之情形，均視為透 過。 標示之識別裝置，不僅係人以目視進行確認，亦包含照 才目機等之光學辨識裝置，不僅係可見區域、亦包含紫外、 • 紅外等不可見區域之辨識裝置。 [發明之效果] • :精由本發明’可用比較小之超硬工具壓緊力或雷射能 里:被切割基板上形成用以得到切割基板之劃割線。 【實施方式】 以下，—面照附圖一面說明實施本發明之最佳形態。 圖係表不本發明相關之雷射劃割裝置概略的正視圖、 =係圖1之“線箭視圖、圖3係表示本發明相關之雷射劃 d哀置之構成主要部分的立體圖、圖4係表示第丨雷射光單 兀之光學系統的圖式、圖5係表示第2雷射光單元之光學系 _ '统的圖式。在各圖中，以正交χ、γ轴表示 :安裝面為基準之固定座標系，以正交x、y轴表示= 至為基準之移動座標系。此外，以Θ表示與X、y軸正交之2 軸的繞軸方向。 表士圖1、2、3所示，本發明相關之雷射劃割裝置〗具備基 :工作$ 3、王作臺驅動裝置4、基才反定位裝置5、初期 龜。裂形成機構】0、第】雷射光單元8、第2雷射光單元6、冷 部皁兀7及控制裝置9等。 基臺2係安裝雷射劃割裝置】之各構成要素的基本框體， U9964.doc -10- 200804021 固定設置於地面等安裝面G上。 、工作臺3具備俯視呈方形之載置面31。載置面^係加工 為具有足夠之平面度，同時具備用以真空吸附所放置之玻 离板的夕數吸附孔。再者，成為對象之玻璃板κ係透明 玻璃板。於沿载置面31上之四邊中互相鄰接之兩邊的部分 分別安裝有長限制構件321x、321y。兩根限制構件3化、 32ly安裝成對雷射扣士相對於載置面3ι之相對移動方 向Y可選擇正交、俯視互相正交。 工作臺驅動裝置4安裝於卫作臺3之下方，具傷χ方向驅 動部^'y方向驅動部42及0方向驅動部43。乂方向驅動部 4曰1係错由可向X方向直線驅動碍臺3之線性馬達或滾珠螺 桿式直動機構等而實頻。 ’' y方向驅動部42係藉由可向y方向 直線驅動工作臺3之n地 之線性馬達或滾珠螺桿式直動機構等而 貝 方向驅動部43係藉由可向Θ方向旋轉驅動工作臺3 之伺服馬達式旋轉機構等而實現。 =定位裝置5配置於载置面以四個頂點中不包含限 制構件32 1 X、32 1 y的頂點桐丨 璃板κ雨、蠢、 ，…。而且，具備可分別推碰到玻 、c、d之推碰構件51與向對 構件5!之氣缸52。對角線方向D1驅動推碰 不刀期龜裂形成機構1〇具 成為可於载置並保持在工：:3上上下，^200804021 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a book ij self-twisting method, a soil illusion method, a dicing device, and a dicing substrate cut using the method or the raft. f , , 败 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 A method and apparatus for secant cutting and a dicing substrate cut using the same. [Prior Art] The scribing method is to form a continuous micro-crack along the pre-m line of the brittle material, i.e., the scribe line method, before cutting the brittle material. As a representative scribing method, there is a mechanical scribing method in which a superhard soil such as a diamond knife is pressed against a brittle material on one side and a surface is relatively moved along a crucible cutting line (for example, Patent Documents 1 and 2) and laser light is applied along a brittle material. The predetermined cutting line is relatively moved while following the laser scribing method of the jet coolant (for example, Patent Documents 3 and 4). [Patent Document 1] 曰本特开平6-102480 [Patent Document 2] 曰本特开平〗 ^22355 [Patent Document 3] Republished Patent W02003/008352 [Patent Document 4] Japanese Patent Laid-Open No. 2003-117921 [Summary of the Invention] [Problems to be Solved by the Invention] In the mechanical scribing method, since the superhard tool is relatively moved while pressing the brittle material on one side, there is a problem that chipping or micro-chips are generated, and the pressing force is reduced, which can be reduced. Chips or tiny 4 pieces, etc., 1 ash is small, H9964.doc 200804021 The secant will become shallower, cut and ..., "cut. Therefore, it is expected that I', ', can form a sufficient depth of the scribe line In addition, in the laser scribing method, although no chips or micro-cracks are generated, the laser light used by the deputy % is used for the reason of the following, and the reason is as low as possible and p 'In this kind of substrate cutting technology, the productivity is more important, and as a means of A, the excellent production of the freckle is ^ v ^ /, one of which can increase the formation speed of the scribe line. For example, By increasing the relative speed of Ray M #I + and the sub-glass plate κ, The formation of the scribe line is 丄 仏. 仏老 i ... A speed here, because the relative speed is inversely proportional to the 斟, Φ applied per unit area, if the relative speed is too high, the predetermined cutting line accepts < field shot first The setting becomes small, and there is a flaw in the cutting step that cannot be completely cut. Because the relative velocity of the light in the Meishanglei's light must be increased by the presence of the laser light. However, the output of the laser light has a limit, and at the same time The reason for the high output continuous use of life. The use of the shortened laser oscillator life: in the mechanical cutting method, it is expected to be formed by a small factory tight force; in the laser cutting method 'It is expected that a smaller laser can also form a slashable scribe line this summer. The present invention is based on the above situation, and 6 士, /u> 乩 (2), the purpose is to provide a relatively small The super-hard work and the pressure of the sage or the (4) energy on the (four) i substrate to form a scribe line for the cutting of the substrate. [Technical means to solve the problem] device to achieve the above object, the present invention The method of drawing is based on cutting Before cutting the cutting blade K, the cutting line along the ^ 暴 κ κ 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成Doc 200804021 The internal cutting layer of the predetermined cutting line of the cut substrate κ is moved to the inside of the cut substrate κ into the predetermined cutting line of the cut substrate κ. 其; the human-formed on the surface of the broken cutting substrate A scribe line s along a predetermined cutting line J of the substrate κ to be cut. , ' In addition, Yang Mingzhi's slashing set is set to cut the cut substrate • 1 1 1 1 σ σ 被 被 被 被 被 被 被 被 被 被 被 被 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定 预定By causing the first laser light L1 to move relatively along the predetermined cutting line J of the substrate to be cut, K, the internal deterioration layer N along the predetermined cutting line J of the cut substrate κ is formed inside the substrate to be cut. The layers y are formed into the mechanisms 8, 4, and the scribe line forming mechanisms 6, 7, 4 which form the scribe line S along the + predetermined cutting line of the substrate to be cut on the surface of the substrate κ to be cut. According to the present invention, first, the inner metamorphic layer N along the predetermined cutting line J is formed by the ith laser light u in the inside of the substrate K to be cut 4; secondly, along the predetermined cutting line on the surface of the substrate to be cut The slash line s. The scribe line S and the internal metamorphism (4) are substantially parallel in the same vertical plane. In this way, if the internal metamorphic layer N is formed in advance by the i-th laser light in the inside of the substrate to be cut before the formation of the scribe line 8, the energy can be formed lower than the internal metamorphic layer N v is not formed in advance. Sufficient to cut the scutted line s of the cut substrate. Namely, in the mechanical dicing method, the squeezing line S for forming the dicing substrate can be formed on the substrate K to be cut by a relatively small superhard tool pressing force. Further, in the laser scribing method, the scribe line s for forming the dicing substrate can be formed on the cut substrate κ in a relatively small laser ray b. As the first laser light L1, it is preferable to use an oscillating wave that passes through the substrate Κ to emit light. Specifically, it is preferable to use an oscillation wavelength of 500 nm to 550 119964.doc 200804021 nm, preferably 523 to 532 nm, and a green light laser near the coffee, a wavelength characteristic of the substrate K being cut. Just shoot it. In the present invention, the term "inner: metamorphic layer" refers to a crack layer such as crack or crack, a layer in which the stress of the material acts, a layer having a refractive index different from that around the altered layer, and the like, by making the second laser light The predetermined line of the cut substrate κ is moved by the (four) substrate κ to form a scribe line S along the material cutting line J of the cut substrate κ, which is applicable to the laser scribing method. In this case, the second laser light L2 is preferably laser light that does not transmit through the listening wavelength of the (four) substrate. Further, the substrate to be cut κ is preferably a brittle material. In the case where the substrate to be cut is a transparent glass plate, by scanning the first! Laser ^ can also be marked inside the transparent glass plate r. Marking means that the area where the refractive index is different is not processed. Even in the case where the substrate to be cut Kr gzhong # & dirt is the opposite of the first line is an opaque substrate, if the substrate is composed of a substance that transmits the wavelength for a specific wavelength, the first thunder is scanned by the wavelength. The light L1' can also be marked inside the substrate κ to be cut. For example, in the case where the substrate to be cut is a stone wafer, the laser light L1 having a near-infrared wavelength can be scanned, and the inside of the substrate κ can be marked. The substrate is marked internally and can be traced after cutting. Further, the term "transparent" as used in the present invention means that both colorless and transparent are included, and no specific wavelength is absorbed. That is, even if the substrate is opaque to visible light, it is considered to be transparent if it is composed of a substance that transmits the wavelength for a specific wavelength. H9964.doc 200804021 , , : 'The transmission is not only fully transmitted, but also partially transmitted, and it is considered to be transparent, including the fact that the specific wavelength is partially absorbed. The identification device for marking is not only visually confirmed by a person, but also includes an optical identification device such as a camera, which is not only a visible region but also an identification device for an invisible region such as ultraviolet light or infrared light. [Effects of the Invention]: The fine-grained superhard tool pressing force or laser energy can be used in the present invention: a scribe line for forming a cut substrate is formed on the cut substrate. [Embodiment] Hereinafter, the best mode for carrying out the invention will be described with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic front view of a laser scribing device according to the present invention, FIG. 1 is a “line arrow view”, and FIG. 3 is a perspective view showing a main part of a laser beam dapping device according to the present invention. 4 is a diagram showing an optical system of a second laser beam unit, and FIG. 5 is a diagram showing an optical system of a second laser beam unit. In each figure, it is represented by orthogonal χ and γ axes: The fixed coordinate system with the surface as the reference is the moving coordinate system with the orthogonal x and y axes as the reference. The y indicates the direction around the axis of the two axes orthogonal to the X and y axes. 2, 3, the laser cutting device according to the present invention has a base: work $3, Wang Zuotai drive device 4, base reverse positioning device 5, initial turtle splitting mechanism] 0, the first laser light unit 8 The second laser light unit 6, the cold saponite 7 and the control device 9, etc. The basic frame of each component of the base 2 system is equipped with a laser cutting device, U9964.doc -10- 200804021 is fixedly installed on the ground. The mounting surface 3 is provided on the mounting surface G. The table 3 has a mounting surface 31 that is square in plan view. The mounting surface is processed to have sufficient In addition, it has a radiant adsorption hole for vacuum-adsorbing the placed release plate. Further, the target glass plate κ-based transparent glass plate is adjacent to each other on the four sides along the mounting surface 31. The long restricting members 321x and 321y are respectively attached to the respective portions. The two restricting members 3 and 32ly are mounted so that the relative moving directions Y of the laser locks with respect to the mounting surface 3 can be orthogonal and orthogonal to each other in plan view. The device 4 is mounted below the guarding table 3, and has a scar direction driving unit ^'y direction driving unit 42 and a 0 direction driving unit 43. The 乂 direction driving unit 4曰1 is linearly driven by the X direction. The linear motor or the ball screw type linear motion mechanism is used for real frequency. The '' y direction drive unit 42 is a linear motor or a ball screw type linear motion mechanism that linearly drives the table 3 in the y direction. The direction drive unit 43 is realized by a servo motor type rotation mechanism that can rotationally drive the table 3 in the x direction. The positioning device 5 is disposed on the placement surface and does not include the restriction member 32 1 X, 32 1 among the four vertices. y's apex paul glass plate κ rain, stupid, Further, the cylinder 52 having the push member 51 and the facing member 5! which can be pushed to the glass, c, and d respectively is provided. The diagonal direction D1 drives the push-non-crack formation mechanism 1 Placed and kept on the work::3 up and down, ^
的起始端J s > , 至之破璃板之預定切割線JT WJS形成極微小之初期龜裂C。 第1雷射光單元8係由基臺2尋加 並如圖4所示，呈播帝A 〜、木 '於工作臺3之上方， /、田#振盪器8】和照射光學系統82。作 119964.doc 200804021 為雷射振盪器81，可使用使用時之振盪波長為523〜532 的綠光雷射。此外，亦可使用使用時之振盪波長為78〇 附近的飛秒雷射。此外，亦可使用振盪波長為351〜355 nm附近之紅外雷 附近之紫外雷射、振盈波長為〜1〇64 射#作為紅外錡射可舉出YLF雷射、yag雷射、γν〇4 雷射或Yb雷射等。綠光雷射中可舉出使用紅外雷射之第2 f次諧波成分者。作為紫外雷射，可舉出使用紅外雷射之The starting end J s > , to the predetermined cutting line JT WJS of the glass plate, forms a very small initial crack C. The first laser light unit 8 is picked up by the base 2 and, as shown in Fig. 4, is broadcasted on the top of the table 3, /, the field #oscillator 8 and the illumination optical system 82. For the laser oscillator 81, a green laser with an oscillation wavelength of 523 to 532 in use can be used. In addition, a femtosecond laser with an oscillation wavelength of 78 使用 in use can also be used. In addition, an ultraviolet laser near the infrared ray with an oscillation wavelength of 351 to 355 nm and an oscillation wavelength of ~1 〇 64 can be used. As the infrared ray, YLF laser, yag laser, γν〇4 can be cited. Laser or Yb laser. Among the green lasers, the second f-th harmonic component using the infrared laser can be cited. As an ultraviolet laser, an infrared laser can be used.
弟3南次譜波成分者。 上述雷射以外之氣體激發雷射等亦可使用，在被切割基 板為於顯示器等上使用之玻璃的情形，對大致 nm〜2700 nm之波長透過率為8〇%以上，故視為透過或部分 透過，可作為本發明之第丨雷射光u使用。在被切割基板 為玻璃以外之情形，可適當選定對該材料透過或部分透過 之波長的雷射光。作為雷射光之振盪形態，可舉出可連續 振盪之CW雷射、可間歇振盪之脈衝雷射。作為脈衝雷 射，可以毫秒、奈秒、皮秒、飛秒等振盪時間表現，但若 為了形成内部變質層N，則使用何種均可。此外，亦可使 用可瞬間照射較大能量之Q開關方式。 照射光學系統82具備光閘86、偏轉鏡83&、8扑、—對電 流鏡84a、祕及fe透鏡85。光閘86藉由控制信號而自由開 閉地配置於雷_器81之光轴上。偏轉鏡.…使其反射 面偏斜而配置於從雷射振盪器81射出之雷射光u的光軸 上。偏轉鏡83b使其反射面與偏轉鏡…之反射面相對而配 置於偏轉鏡83a之垂直下方。—對電流鏡84&、糾分別構 I19964.doc -12- 200804021 成為安裝於驅動馬達之驅動軸上並隨驅動軸之轉勣而可改 、交各反射面之角度，並以將在偏轉鏡83b上反射後之雷射 光L1導向fe透鏡85之方式配置。fe透鏡85配置成可令在電 流鏡841>上反射之雷射光L1在放置於載置面31上之玻璃板 K内部成像。Brother 3 South sub-wave component. It is also possible to use a gas excited laser or the like other than the above-described laser. When the substrate to be cut is a glass used for a display or the like, the transmittance of a wavelength of about nm to 2700 nm is 8% or more, and it is considered to be transmitted or Partial transmission can be used as the first laser light u of the present invention. In the case where the substrate to be cut is other than glass, laser light having a wavelength that is transmitted or partially transmitted through the material can be appropriately selected. Examples of the oscillation form of the laser light include a CW laser that can continuously oscillate and a pulse laser that can intermittently oscillate. As the pulsed laser, it can be expressed in oscillation time such as milliseconds, nanoseconds, picoseconds, femtoseconds, etc., but any of them can be used in order to form the internal metamorphic layer N. In addition, a Q-switching method that can illuminate a large amount of energy instantaneously can also be used. The illuminating optical system 82 includes a shutter 86, a deflection mirror 83&, a slap, a pair of current mirror 84a, and a fe lens 85. The shutter 86 is arbitrarily opened and closed by the control signal and disposed on the optical axis of the lightning finder 81. The deflecting mirror ... is deflected so as to be disposed on the optical axis of the laser beam u emitted from the laser oscillator 81. The deflecting mirror 83b has its reflecting surface opposed to the reflecting surface of the deflecting mirror, and is disposed vertically below the deflecting mirror 83a. - The current mirror 84& and the correction unit I19964.doc -12- 200804021 are mounted on the drive shaft of the drive motor and can be changed with the rotation of the drive shaft to change the angle of each reflection surface, and to be used in the deflection mirror The laser light L1 reflected on the 83b is guided to the fe lens 85. The fe lens 85 is disposed such that the laser light L1 reflected on the current mirror 841> is imaged inside the glass sheet K placed on the mounting surface 31.
第2雷射光單元6以對於玻璃板κ之雷射光L1之相對移動 時的行進方向γ2為基準，以跟隨雷射光L1之方式，由基 室2懸架支撐在切透鏡85後方位置。而且如圖$所示，具備 雷射振靈器61與照射光學系統62。作為雷射振盪器61，可 舉出使用時之振盪波長為8 Pm〜12 μπι的碳酸氣体雷射。在 被切割基板為用於顯示器等之玻璃的情形，對大致3 μιη& 上之波長的光顯示出吸收特性，8 μηι〜i 2 之波長的雷射 光主要在材料表面被吸收。在被切割基板為玻璃以外之情 ^ 了適^選疋對該材料吸收之波長的雷射光。 照射光學系統62具備光閘65、偏轉鏡63a、63b、63c 聚光透鏡64a及放大透鏡64b。光閘65藉由控制信號而自1 ’閉地配置於雷射振盪Ig 61之光軸上。偏轉鏡63續其^ 射面偏斜而配置於從雷射振1器61射出之雷射光L1的光库 上。偏轉鏡63b使其反射面與偏轉鏡63a之反射面相對而酉 置於偏轉鏡…之垂直下方。偏轉㈣e使其反射面與偏奉 鏡63b之反射面相對而配置於偏轉鏡63b之水平方向。聚并 透鏡⑷係以將在偏轉鏡63c上反射之雷射 配置。放大透鏡64b配設為可將從变氺.类 肝攸髹先透鏡64a射出之雷射 適#成形並照射到放置於载置面3!之玻璃板尺上。 U9964.doc 200804021 θ到圖卜冷卻褒置7具備冷卻劑喷射管71、_闕取 冷卻劑貯藏部73。冷卻劑噴射管71以對於玻璃板κ之雷射 光L2之相對移動時的行進方向γ2為基準，以跟隨雷射光 L2之方式叹置於放大透鏡6处之後方部。開閉閥72係設置 . &冷卻劑噴射管71與冷卻劑貯藏部73之間，並構成為藉由 • 自由開閉。冷卻劑貯藏部73係貯藏純水、液體 氮或液體氦等冷卻劑（霧）Μ的容器。 • 控制裝置9具備用以輸入雷射劃割裝置!之雷射劃割動作 的=命令等各命令或各條件的輸入部。而且，根據輪入 之叩々或條件，按照預定順序控制工作臺驅動装置卜 板疋位^置5、初期龜裂形成機構1Q、第$ 土 =2雷射光單元6及冷卻單元7等各機器、，藉此使雷射書㈣ I置1進行功能動作。 ^ 其次，對如上述構成的雷射劃割裝置】之動作、， 明。圖6係表示玻璃板之預定切割線的圖式、圖7係: 圖8係用以說明本發明相關之雷射劃割方法之主要： 圖式、圖9係形成有内部變質層、劃割線及玻璃内禪：的 玻璃板的平面圖。 7不之 如圖6所示，以於玻璃板冗上具有相互平行之兩條預定士 割線JW2及與此等預定切割線心；2正交之 刀 割線J3者進行説明。此外，以初期狀態下工作臺3之:切 :轴分別與安裝面之又轴、γ轴一致，雷射振逢器Ο、:: 為開啓狀態，光祕、86均為關閉狀態者進行説明。1均 119964.doc -14· 200804021 /先，㈣者用手持起玻璃板κ，以其預定切割線；1沿 著y軸之方式放置於載置面31上。再者，亦可使機器人進 行將玻璃板K放置於載置面31上之操作（步驟100)。其次， 操作者從控制裝置9之輸入部輸入對此玻璃板反之雷射劃割 動作的開始命令（步驟11G)。隨此，基板定位裝置5使氣缸 52伸長，使推碰構件51推碰到玻璃板κ之邊c、d並將玻璃 板K推入對角線方向⑴。其結果，玻璃板尺向對角線方向 D1移動，在邊a、b分別與限制板321χ、32iy抵接時停止並 定位。玻璃板κ一定位，真空壓力就作用於載置面31之吸 附孔，將玻璃板κ吸附並保持於载置面31上（步驟12〇)。 其次，X方向驅動部41及y方，向驅動部42驅動工作臺3， 使其向預定切割線n之劃割開始位置移動。劃割開始位置 係指玻璃板κ之預定切割線η的起始端JS來到旋轉刀丨i下 月il方之位置（步驟13〇)。在此狀態下，初期龜裂形成機構i〇 使旋轉刀11下降，配置於其刀尖比基板尺之表面更低的位 置其认’ y方向驅動部42以預定之速度♦向y 1 (γ 1 )方向驅 動工作臺3(步驟135)。 藉由工作臺3向yi方向移動，旋轉刀11碰到基板κ上之預 定切割線J的起始端JS。之後初期龜裂形成機構10立即使 旋轉刀11上升。藉此，於預定切割線J之起始>端Js形成預 疋床度及長度之極微小的初期龜裂c。再者，初期龜裂c 之形成，亦可不藉由旋轉刀1 1而以雷射光進行。 其次’光閘86開啓，從雷射振盪器8 1射出之雷射光按 偏轉鏡83a、83b之順序，在其等各個反射面上反射並每次 U9964.doc -15- 200804021 令行進方向改變90度地前進，並在電流鏡84&、8仆上反 射，導向fe透鏡85。此時，電流鏡⑷、84b為不藉由各自 之驅動馬達轉動，而在預定位置保持停止狀態（步驟140)。 藉由對玻璃板K之雷射光L1的相對移動，雷射光幻於玻 璃板K之内部以起始端NS為起點，形成由沿預定切割線；1 在Y方向連續之變質層構成的内部變質層N。 繼光閘86之後光閘65開啓，從雷射振盪器61射出之雷射 光L2按偏轉鏡63a、63b、63c之順序，在其等各個反射面 上反射並每次令行進方向改變90度地前進。在偏轉鏡Me 上反射之雷射光L2經由聚光透鏡64a導向放大透鏡64b。雷 射光L2藉由放大透鏡64b，適當成型並照射到玻璃板κΙ (步驟145)。 繼光閘65之開啓動作之後開閉閥72開啓，冷卻劑喷射管 71將從冷卻劑貯藏部73導出之冷卻劑M喷出（步驟15〇)。籍 由對玻璃板K之雷射光L2及冷卻劑Μ的相對移動，以起如 端JS為起點，雷射光L2將預定切割線j急速加熱，使其局 部熱膨脹而產生壓縮應力，之後冷卻劑“立即將加熱部分 急速冷卻，藉此使其局部收縮而產生拉伸應力。藉此，以 初期龜裂C為龜裂進展之開始點，於玻璃板κ之表面使沿 玻璃板Κ之預定切割線J之微小裂痕連續成長而形成劃割線 S。 ，、 參照圖8，對步驟135至步驟150之動作進行具體説明。 首先，藉由雷射光L1於玻璃板Κ之内部形成沿預定切割線） 之内邛、交質層Ν，其次，藉由雷射光L2於破璃板κ之表面 119964.doc -16· 200804021 形成沿預定切割線J之劃割線S。劃割線s與内部變質層N在 同一垂直平面内大致平行。如此，若在藉由雷射光£2形成 劃割線S之前，藉由第1雷射光於玻璃板κ之内部預先形成 内部變質層N ’則與不預先形成内部變質層n之情形比 . ^田射光L2可以更低之能量形成足以可切割玻璃板K之 。 深度的劃割線S。對於作為其證據之實施例後述。 玻璃板K到達末端JE、内部變質層N及劃割線8之形成結 _ 束日才（步驟1 60枯YES)，則關閉光閘86、光閘65及開閉閥 M，停止雷射光Ll之照射、雷射光^之照射及冷卻劑乂之 噴出（#驟170)。而且，y方向驅動部42向叫¥2)方向驅動 工作室3，使其返回初始位置（步驟〗8〇)。 ’、 X方向驅動部4 1向x 1方向驅動工作臺3 (步驟 210) ’藉此使其向職切割線D之劃割開始位置移動，之 =以與形成沿預心割線；1之内部變質層财劃割線8時 • 成沿預定切割線；2之内部變質層及劃割線 籲 （步驟130〜步驟180)。 Θ方6㈣幻⑷2之内部變f層及劃割線的形成結束時， Θ方向驅動部43向θ方向 • 德 又疋轉驅動工作臺3(步驟220)。 二割一内部變質層― 變質層及劃割線時與形成成沿預定切割糾之、内部 層及劃割線時不同，在步勒5疋切剔線n、J2之内部變質 臺3,使其向Yi方向移動。 x方向驅動部41驅動工作 119964.doc 200804021 ^ ^成有内部變質層N及劃割線S之玻璃板κ進行 ρ払不處理（步驟23〇)。内部標示處理如下進行。首先， 工：堂驅動裝置4使工作臺3移動，以便玻璃板Κ上之標示 、疋^置來到第1雷射光單元8之f0透鏡85的下方。其次， & 口光閘86同時以與應標示之文字20相應之動作驅動電 '見4a 84b掃描雷射光u，藉此於玻璃板κ之内部標示 文字20 〇再去，—r _ y 亦可於开》成内部變質層N及劃割線S之前進The second laser light unit 6 is supported by the base 2 in a position behind the cut lens 85 so as to follow the laser light L1 with reference to the traveling direction γ2 when the relative movement of the laser light κ of the glass plate κ is followed. Further, as shown in Fig. $, a laser shaker 61 and an illumination optical system 62 are provided. As the laser oscillator 61, a carbon dioxide gas laser having an oscillation wavelength of 8 Pm to 12 μm in use can be cited. In the case where the substrate to be cut is a glass for a display or the like, light having a wavelength of approximately 3 μm & shows absorption characteristics, and laser light having a wavelength of 8 μηι to i 2 is mainly absorbed on the surface of the material. In addition to the glass to be cut, the laser light of the wavelength absorbed by the material is appropriately selected. The illumination optical system 62 includes a shutter 65, deflection mirrors 63a, 63b, and 63c, a condenser lens 64a, and a magnifying lens 64b. The shutter 65 is disposed on the optical axis of the laser oscillation Ig 61 from 1 ′ by a control signal. The deflecting mirror 63 is disposed on the optical library of the laser light L1 emitted from the laser oscillator 61 while being deflected. The deflecting mirror 63b has its reflecting surface opposed to the reflecting surface of the deflecting mirror 63a and placed vertically below the deflecting mirror. The deflection (four) e is disposed such that its reflection surface faces the reflection surface of the deflecting mirror 63b and is disposed in the horizontal direction of the deflection mirror 63b. The focusing lens (4) is arranged to reflect the laser reflected on the deflecting mirror 63c. The magnifying lens 64b is disposed so as to be capable of forming a laser beam that is emitted from the sputum-like hemispherical lens 64a and irradiated onto the glass plate placed on the mounting surface 3! U9964.doc 200804021 The θ to Tubu cooling unit 7 is provided with a coolant injection pipe 71 and a coolant storage unit 73. The coolant injection pipe 71 is placed at the side after the magnifying lens 6 so as to follow the laser light L2 with reference to the traveling direction γ2 at the time of relative movement of the laser light L2 of the glass plate κ. The opening and closing valve 72 is provided between the coolant injection pipe 71 and the coolant storage portion 73, and is configured to be freely opened and closed. The coolant storage unit 73 is a container for storing a coolant (mist) such as pure water, liquid nitrogen or liquid helium. • The control unit 9 is provided with an input unit for inputting each command or each condition such as a command for the laser cutting operation of the laser scribing device! Further, according to the enthalpy or condition of the wheel, the machine such as the table driving device, the initial crack forming mechanism 1Q, the first earth=2 laser light unit 6, and the cooling unit 7 are controlled in a predetermined order. Then, the laser book (4) I is set to 1 to perform a functional operation. ^ Next, the action of the laser scribing device constructed as described above. 6 is a view showing a predetermined cutting line of the glass sheet, and FIG. 7 is a view showing the main method of the laser cutting method according to the present invention: FIG. 9 and FIG. 9 are formed with an internal metamorphic layer and a scribe line. And the glass inside the Zen: the plan of the glass plate. 7: As shown in Fig. 6, the glass plate is redundantly described with two predetermined tangential lines JW2 parallel to each other and the secant line J3 orthogonal to the predetermined cutting line center; In addition, in the initial state, the table 3: cutting: the axis is consistent with the axis of the mounting surface, the γ axis, the laser oscillator Ο, ::: is the open state, the light secret, 86 are closed state . 1 119964.doc -14· 200804021 / First, (4) The hand-held glass plate κ is placed on the mounting surface 31 along the y-axis with its predetermined cutting line; Further, the robot may be caused to perform the operation of placing the glass sheet K on the mounting surface 31 (step 100). Next, the operator inputs a start command for the glass plate and the laser cutting operation from the input portion of the control device 9 (step 11G). Accordingly, the substrate positioning device 5 elongates the air cylinder 52, causing the pushing member 51 to push against the sides c and d of the glass sheet κ and push the glass sheet K in the diagonal direction (1). As a result, the glass ruler moves in the diagonal direction D1, and stops and positions when the sides a and b abut against the restriction plates 321A and 32iy, respectively. When the glass plate κ is positioned, the vacuum pressure acts on the adsorption holes of the mounting surface 31, and the glass plate κ is adsorbed and held on the mounting surface 31 (step 12). Next, the X-direction driving unit 41 and the y-direction drive the table 3 to the driving unit 42 to move to the cutting start position of the predetermined cutting line n. The starting position of the cutting means that the starting end JS of the predetermined cutting line η of the glass sheet κ comes to the position of the rotating knife 下i next to the il il (step 13〇). In this state, the initial crack forming mechanism i lowers the rotary blade 11 and is disposed at a position where the cutting edge is lower than the surface of the substrate scale, and the y-direction driving portion 42 is at a predetermined speed ♦ toward y 1 (γ). 1) The drive table 3 is driven in the direction (step 135). By the table 3 moving in the yi direction, the rotary blade 11 hits the start end JS of the predetermined cutting line J on the substrate κ. Then, the initial crack forming mechanism 10 immediately raises the rotary blade 11. Thereby, the initial cracks c of the pre-bed length and the length are formed at the end > end Js of the predetermined cutting line J. Further, the formation of the initial crack c may be performed by laser light without using the rotary blade 11. Secondly, the shutter 86 is turned on, and the laser light emitted from the laser oscillator 81 is reflected on the respective reflecting surfaces in the order of the deflecting mirrors 83a and 83b, and the traveling direction is changed 90 times each time U9964.doc -15-200804021 It advances and is reflected on the current mirrors 84 & 8 and directed to the fe lens 85. At this time, the current mirrors (4) and 84b are kept in a stopped state at a predetermined position without being rotated by the respective drive motors (step 140). By the relative movement of the laser light L1 of the glass plate K, the laser light is fascinated from the inside of the glass plate K with the starting end NS as a starting point, forming an internal metamorphic layer composed of a metamorphic layer continuous along the predetermined cutting line; 1 in the Y direction. N. After the shutter 86 is opened, the shutter 65 is turned on, and the laser light L2 emitted from the laser oscillator 61 is reflected on the respective reflecting surfaces in the order of the deflecting mirrors 63a, 63b, and 63c, and the traveling direction is changed by 90 degrees each time. go ahead. The laser light L2 reflected on the deflection mirror Me is guided to the magnifying lens 64b via the collecting lens 64a. The laser light L2 is appropriately molded and irradiated to the glass plate κ by the magnifying lens 64b (step 145). The opening and closing valve 72 is opened after the opening operation of the shutter 65, and the coolant injection pipe 71 ejects the coolant M led out from the coolant storage portion 73 (step 15A). By the relative movement of the laser light L2 and the coolant 玻璃 of the glass plate K, starting from the end JS, the laser light L2 rapidly heats the predetermined cutting line j to locally expand it to generate compressive stress, and then the coolant " Immediately, the heated portion is rapidly cooled, thereby locally contracting to generate tensile stress. Thereby, the initial crack C is the starting point of the crack progress, and the predetermined cutting line along the glass sheet is made on the surface of the glass sheet κ. The micro cracks of J are continuously grown to form a scribe line S. The operation of steps 135 to 150 will be specifically described with reference to Fig. 8. First, the laser beam L1 is formed along the predetermined cutting line by the laser light L1. The inner sputum and the stratified layer Ν, and secondly, the slash line S along the predetermined cutting line J is formed on the surface 119964.doc -16· 200804021 of the glass κ by the laser light L2. The scribe line s is identical to the inner metamorphic layer N The vertical plane is substantially parallel. Thus, before the scribe line S is formed by the laser light £2, the internal metamorphic layer N' is formed in advance by the first laser light inside the glass sheet κ, and the internal metamorphic layer n is not formed in advance. Situation ^ Field light L2 can be formed with a lower energy to cut the glass sheet K. The depth of the scribe line S. As will be described later as an example of the evidence. The glass sheet K reaches the end JE, the internal metamorphic layer N and the scribe line 8 When the formation of the junction _ bundle day (step 1 60 YES), the shutter 86, the shutter 65 and the opening and closing valve M are closed, and the irradiation of the laser light L1, the irradiation of the laser light, and the ejection of the coolant 停止 are stopped (#Step 170) Further, the y-direction driving unit 42 drives the working chamber 3 in the direction of ¥2) to return to the initial position (step 8). ', the X-direction driving unit 4 1 drives the table 3 in the x 1 direction (step 210) 'Through this, the cutting start position of the in-service cutting line D is moved, which is formed along the predetermined cutting line when forming the cutting line 8 along the internal metamorphic layer; The layer and the scribe line are called (steps 130 to 180). When the formation of the internal f-layer and the scribe line of the 66 (4) illusion (4) 2 is completed, the Θ direction drive unit 43 turns the drive table 3 toward the θ direction. 220). Two cuts of an internal metamorphic layer - when the metamorphic layer and the scribe line are formed and formed along a predetermined cut When the inner layer and the scribe line are different, the internal modification table 3 of the splicing lines n and J2 is moved in the direction of Yi. The x-direction driving unit 41 drives the work 119964.doc 200804021 ^ ^ The inner metamorphic layer N and the glass plate κ of the scribe line S are not processed (step 23 〇). The internal marking process is performed as follows. First, the work drive mechanism 4 moves the table 3 so that the glass plate is marked on the slab , 疋 ^ is placed below the f0 lens 85 of the first laser light unit 8. Secondly, the & port shutter 86 is simultaneously driven by the action corresponding to the character 20 to be marked 'see 4a 84b scanning laser light u, borrow This marks the inside of the glass plate κ 20 〇 and then, —r _ y can also be opened before the internal metamorphic layer N and the slash line S
行内部標示處理。 在不而内邛表不處理之裝置的情形，亦可省略偏轉鏡 請或電流鏡84卜m，使在偏轉鏡83a上反射之雷射光直 接射入fe透鏡85(未圖不）。此情形，毫無疑問應重新適當 配置偏轉鏡83b之位置。 對如以上形成有内部變質層N、劃割線8及玻璃内標示 之玻璃板K(筝妝圖9) ’使用手或專用加壓器施加機械應 力’例如繞劃割線彎曲力矩，以歡切割線】為界進行 切割。 [實施例] 以下’藉由實施例及比較例對本發明進行進—步説明。 圖1〇係用以説明本發明之實施例的圖式、圖1〇㈧表示不 使用雷射光L1而僅以雷射光L2形成劃割線s之狀態、圖 10(B)、H)(C)表示使心射光L1及雷射扣形錢割線§ 之狀態。 [實施例1] 之雷射劃割裝置1，令雷射·振 使用上述實施形態中記述 119964.doc -18- 200804021 盪器81之輸出固定，將雷射振盪器61之輸出變為3階段， 形成内部變質層N及劃割線S，並測定了對於各自輸出之劃 割線S的深度。測定條件如下所示，於表1中表示測定結 果。 測定條件：Line internal marking processing. In the case where the device is not processed, the deflection mirror or the current mirror 84 m may be omitted, and the laser light reflected on the deflection mirror 83a may be directly incident on the fe lens 85 (not shown). In this case, there is no doubt that the position of the deflection mirror 83b should be properly configured. For the glass plate K (the kite figure 9) which is formed with the internal metamorphic layer N, the scribe line 8 and the glass inside, the mechanical stress is applied by using a hand or a special presser, for example, a bending moment around the scribe line, to cut the line 】 Cut for the boundary. [Examples] Hereinafter, the present invention will be further described by way of examples and comparative examples. 1(a) is a diagram for explaining an embodiment of the present invention, and FIG. 1(b) shows a state in which the scribe line s is formed only by the laser light L2 without using the laser light L1, and FIG. 10(B), H)(C) Indicates the state of the eclipse L1 and the laser secant line §. [Embodiment 1] The laser scribing device 1 is configured to fix the output of the laser oscillator 61 using the output of the 119964.doc -18-200804021 oscillator 81 in the above embodiment, and to change the output of the laser oscillator 61 into three stages. The inner metamorphic layer N and the scribe line S are formed, and the depths of the scribe lines S for the respective outputs are measured. The measurement conditions are as follows, and the measurement results are shown in Table 1. Determination conditions:
(1) 玻璃板K 製品名：康寧株式會社製1737板厚：0.7mm材質：無 驗玻璃形恶·素玻璃 (2) 内部變質層形成用雷射振盪器8 1 振盪波長：527 nm設定能量：0.5 mJ/脈衝 (3) 劃割線形成用雷射振盪器61 振盪波長：10.6 μπι (4) 工作臺3移動速度：400 mm/s [表1] 模式1 模式2 模式3 雷射光L1之輸出 0.5 mJ/脈衝 0.5 mJ/脈衝 0.5 mJ7脈衝 雷射光L2之輸出 150 W 130 W 100 W 劃割線S之深度d2 130 μπι 120 μπι 不可測量 [比較例1 ] 使用上述實施形態中記述之雷射劃割裝置1，藉由不照 射雷射光L1，不形成内部變質層N而僅形成劃割線S，並 測定了其深度。於表2中表示測定結果。 119964.doc -19- 200804021 [表2] 雷射光L1之輸出 ~^^L2之輸出— 之深度dl [考察](1) Glass plate K Product name: 1737 plate thickness: 0.7mm made by Corning Co., Ltd. Material: non-inspective glass-shaped malignant glass (2) Laser oscillator for internal metamorphic layer formation 8 1 Oscillation wavelength: 527 nm set energy : 0.5 mJ/pulse (3) Laser oscillator for scribe line formation 61 Oscillation wavelength: 10.6 μπι (4) Table 3 movement speed: 400 mm/s [Table 1] Mode 1 Mode 2 Mode 3 Output of laser light L1 0.5 mJ/pulse 0.5 mJ/pulse 0.5 mJ7 pulse laser light L2 output 150 W 130 W 100 W the depth of the scribe line S d2 130 μπι 120 μπι Unmeasurable [Comparative Example 1] The laser scribing described in the above embodiment is used. The apparatus 1 forms only the scribe line S by not irradiating the laser light L1 without forming the internal metamorphic layer N, and measures the depth thereof. The measurement results are shown in Table 2. 119964.doc -19- 200804021 [Table 2] Output of laser light L1 ~^^L2 output - depth dl [INVESTIGATION]
右將幵/成有内口p變質層N之模式j與未形成内部變質層N 之模式4比較，則雖然用以形成劃割線s之雷射振盈器61的 輸出相同’但模式1可形成比模式4更深之劃割線8。換言 之藉由雷射光U預先形成内部變質❹，藉此雷射光L2 可用較低之能量形成切割所需之劃割線s。 二對本發明之實施形態進行了説明，但上面揭示之實 $也僅為例不’本發明之範圍並不限於此實施形能。對 :示之機構或構件可適當省略或追加。本發明之範圍係由 :睛專利範圍之揭示所表示’並意圖進而包含與申請專利 軏圍均等之含義及範圍内的所有變更。 【圖式簡單說明】 圖1係表示本發明相關之雷射劃割裝置概略的正視圖。 圖2係圖1之I-Ι線箭視圖。 圖3係表示本發明相關之雷射劃割裝置之構成主 的立體圖。 ^件 圖4係表示第1雷ϋ光單元之光學系統的圖式。 圖5係表示第2雷射光單元之光學系統的圖式。 圖6係表示玻璃板之預定切割線的圖式。 圖7係表示本發明相關之雷射劃割裝置的雷射劃割動作 119964.doc -20- 200804021 流程的流程圖。 的主要部分 圖8係用以說明本發明相關之雷射劃割方法 之圖式。 ' 示之玻璃 圖9係形成有内部變質層、劃割線及玻璃内標 板的平面圖。 圖10係用以説明本發明之實施例的圖式。 【主要元件符號之說明】The right mode j/the mode j having the inner port p metamorphic layer N is compared with the mode 4 in which the inner metamorphic layer N is not formed, although the output of the laser oscillating device 61 for forming the scribe line s is the same 'but the mode 1 can be A scribe line 8 deeper than mode 4 is formed. In other words, the internal metamorphic flaw is preliminarily formed by the laser light U, whereby the laser light L2 can form the scribe line s required for cutting with a lower energy. The embodiments of the present invention have been described, but the above-described disclosures are merely examples. The scope of the present invention is not limited to the embodiments. Yes: The mechanism or component shown may be omitted or added as appropriate. The scope of the present invention is defined by the scope of the invention, and is intended to include all modifications within the meaning and scope of the application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing the outline of a laser cutting device according to the present invention. Figure 2 is a view of the I-Ι arrow of Figure 1. Fig. 3 is a perspective view showing the main configuration of a laser scribing device according to the present invention. Figure 4 is a diagram showing the optical system of the first Thunder light unit. Fig. 5 is a view showing an optical system of a second laser light unit. Figure 6 is a diagram showing a predetermined cutting line of a glass sheet. Fig. 7 is a flow chart showing the flow of the laser cutting operation 119964.doc -20- 200804021 of the laser scribing device according to the present invention. Main part of Fig. 8 is a view for explaining a laser scribing method related to the present invention. 'Illustrated glass Fig. 9 is a plan view in which an internal metamorphic layer, a scribe line, and a glass internal standard plate are formed. Figure 10 is a diagram for explaining an embodiment of the present invention. [Description of main component symbols]
1 雷射劃割裝置（劃割裝置） 4 工作臺驅動裝置(劃割線形成機構、内 部變質層形成機構） 6 第2雷射光單元（劃割線形成機構） 7 冷卻單元（劃割線形成機構） 8 弟1雷射光單元（内部變質； 貝層形成機構） 84 電流鏡（第1雷射光掃描機構） J 預定切割線 K 玻璃板(被切割基板） L1 雷射光（第1雷射光） L2 雷射光（第2雷射光） N 内部變質層 S 劃割線 119964.doc1 Laser scribing device (scraping device) 4 Table driving device (scraping line forming mechanism, internal metamorphic layer forming mechanism) 6 Second laser light unit (scraping line forming mechanism) 7 Cooling unit (scraping line forming mechanism) 8 Brother 1 laser light unit (internal deterioration; shell layer forming mechanism) 84 Current mirror (1st laser scanning mechanism) J Predetermined cutting line K Glass plate (cut substrate) L1 Laser light (1st laser light) L2 Laser light ( 2nd laser light) N internal metamorphic layer S scribe line 119964.doc