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TW200730287A - Laser cutting device, laser cutting system, and laser cutting method for brittle material - Google Patents

Laser cutting device, laser cutting system, and laser cutting method for brittle material

Info

Publication number
TW200730287A
TW200730287A TW095134831A TW95134831A TW200730287A TW 200730287 A TW200730287 A TW 200730287A TW 095134831 A TW095134831 A TW 095134831A TW 95134831 A TW95134831 A TW 95134831A TW 200730287 A TW200730287 A TW 200730287A
Authority
TW
Taiwan
Prior art keywords
substrate
laser cutting
holding table
relative
cutting line
Prior art date
Application number
TW095134831A
Other languages
Chinese (zh)
Inventor
Hirotaka Koyama
Masakazu Hayashi
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200730287A publication Critical patent/TW200730287A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

The present invention provides a laser cutting device for a brittle material capable of realizing the high quality and high speed cutting of a brittle substrate irrespective of the size of the substrate to be cut. In the laser cutting device, the substrate is positioned on the holding table of a substrate holding mechanism while its lower end part is supported by rollers. The holding table is kept in a titled state by a predetermined angle (theta) relative to a vertical direction (P) so that the substrate can be held on the holding table in such a state that a planned cutting line for the substrate is tilted by the predetermined angle (theta) relative to the vertical direction (P). The substrate is held in a floated state by pressure air jetted from the pressure air holes of the holding table. When a laser illuminating unit and a cooling unit are moved, by a moving unit, from the upper side to the lower side of the substrate along the planned cutting line for the substrate relative to the substrate positioned by the substrate holding mechanism, a crack advances from the upper side to the lower side of the substrate along the planned cutting line.
TW095134831A 2005-09-28 2006-09-20 Laser cutting device, laser cutting system, and laser cutting method for brittle material TW200730287A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005281612 2005-09-28
JP2006076917 2006-03-20

Publications (1)

Publication Number Publication Date
TW200730287A true TW200730287A (en) 2007-08-16

Family

ID=37899548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134831A TW200730287A (en) 2005-09-28 2006-09-20 Laser cutting device, laser cutting system, and laser cutting method for brittle material

Country Status (2)

Country Link
TW (1) TW200730287A (en)
WO (1) WO2007037118A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5171186B2 (en) * 2007-09-27 2013-03-27 三星ダイヤモンド工業株式会社 Brittle material substrate cleaving apparatus and cleaving method
KR101142290B1 (en) 2007-12-21 2012-05-07 미쓰보시 다이야몬도 고교 가부시키가이샤 Laser processing apparatus and laser processing method
ATE531083T1 (en) * 2008-06-25 2011-11-15 Atec Holding Ag DEVICE FOR STRUCTURING A SOLAR MODULE
US8528886B2 (en) * 2009-02-02 2013-09-10 Corning Incorporated Material sheet handling system and processing methods
JP2011131229A (en) * 2009-12-24 2011-07-07 Hitachi High-Technologies Corp Laser beam machining method, laser beam machining apparatus, and solar panel manufacturing method
JP6255595B2 (en) * 2012-10-12 2018-01-10 株式会社Ihi Cleaving device
CN104091914B (en) * 2014-03-07 2016-02-17 深圳市信宇人科技有限公司 Battery pole piece impulse-free robustness hypervelocity cutting method and hypervelocity slicing machine
JP6269876B2 (en) * 2017-03-16 2018-01-31 株式会社Ihi Cleaving device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997007927A1 (en) * 1995-08-31 1997-03-06 Corning Incorporated Method and apparatus for breaking brittle materials
JP2003025323A (en) * 2001-07-18 2003-01-29 Seiko Epson Corp Laser cleaving apparatus and method, and electro-optic panel cleaving method
JP2003034545A (en) * 2001-07-18 2003-02-07 Seiko Epson Corp Laser cleaving apparatus and method, and electro-optic panel cleaving method
EP1350769A1 (en) * 2002-04-04 2003-10-08 Bystronic Maschinen AG Apparatus and method to cut vertical glass sheets
JP2004130342A (en) * 2002-10-09 2004-04-30 Seishin Shoji Kk Double-side machining device for blank
JP3929393B2 (en) * 2002-12-03 2007-06-13 株式会社日本エミック Cutting device
JP2005001264A (en) * 2003-06-12 2005-01-06 Sharp Corp Dividing device and dividing method

Also Published As

Publication number Publication date
WO2007037118A1 (en) 2007-04-05

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