JP2005001264A - Dividing device and dividing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a parting device which is simple in constitution and excellent in maintenance properties by being used as a scribe mechanism, a transportation mechanism, and a break mechanism by using high pressure gas 3 ejected from a pressure nozzle 2 and evacuation force 10 by a suction nozzle 9. <P>SOLUTION: The parting device has a hard tool 4 as a channel forming means for forming a channel 5 in the surface of a substrate 1 as a plate-like member, a pressure nozzle 2 having functions not only as a parting means which parts the substrate 1 by making a crack 7 progress in the thickness direction of the substrate 1 from the channel 5 but also as a conveyance means, and a suction nozzle 9. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cutting apparatus and a cutting method, and more particularly, to a cutting apparatus and a cutting method for a brittle nonmetallic material substrate (plate member) such as a glass substrate, a ceramic substrate, and a semiconductor wafer used in the electronics industry.
[0002]
[Prior art]
In recent years, in the field of the electronic industry using a glass substrate such as a liquid crystal display, a plasma display panel, and a solar cell, a large and flat glass substrate is used to reduce the manufacturing cost. There is a need for a substrate cutting process in which a plurality of patterns are formed so that a large number can be obtained and then separated into individual small panels.
[0003]
As a conventional technique for dividing the substrate, for example, Japanese Patent Laid-Open No. 2001-347497 may be cited.
[0004]
In Japanese Patent Laid-Open No. 2001-347497, for example, a process of forming a scribe groove on the surface of a substrate by a laser beam or the like is performed, and thereafter, pressurized air is grooved from the back surface of the scribe groove using a pressurized jet nozzle. Spray on the back of the position and pressurize. At this time, in order to prevent the substrate from being lifted, air that is pressed from the pressure nozzle is blown onto the surface of the substrate to be opposed to both ends of the scribe groove on the surface side of the substrate. Thereby, the substrate to be divided is separated and cut along the scribe grooves.
[0005]
[Patent Document 1]
JP-A-2001-347497 [0006]
[Problems to be solved by the invention]
However, in Japanese Patent Laid-Open No. 2001-347497, a scribe mechanism for forming a groove in a substrate to be divided, a break mechanism for pressing and dividing the substrate on which the groove is formed, and further, A transport mechanism for connecting the two is necessary, and as a result, the apparatus configuration is complicated.
[0007]
For example, in order to cut off a large substrate such as a glass substrate having a diagonal length of about 1 m, a drive mechanism for scanning a hard tool, a laser irradiation unit, or the like is required. In addition, when a laser is used, peripheral equipment such as a laser cooling device is required, and the maintainability of the device configuration is lowered.
[0008]
The present invention has been made in view of such circumstances, and an object of the present invention is to perform a cutting apparatus and a cutting process of a plate-shaped member that have a simple configuration and excellent maintainability more smoothly than before. It is to provide a dividing method.
[0009]
[Means for Solving the Problems]
The cutting apparatus according to the present invention, in one aspect, has a groove forming means for forming a groove (concave portion) on the surface of the plate-like member, and a crack is propagated from the groove in the thickness direction of the plate-like member. A dividing means for dividing.
[0010]
Thereby, the apparatus used for the process of forming a groove | channel and the apparatus used for the cutting process of a plate-shaped member can be integrated, it is not necessary to provide a conveyance mechanism separately, and an apparatus structure becomes simple.
[0011]
Here, the cutting device preferably includes nozzles periodically arranged on the front and back of the plate-like member, and the nozzles preferably include a pressure nozzle and a vacuum suction nozzle.
[0012]
As a result, it is possible to perform the step of forming the groove while the plate-like member is held in the air by the nozzle, so that it is not necessary to provide a mechanism for fixing the substrate to the cutting device, and the device configuration is simpler. Become.
[0013]
Moreover, it is preferable that said nozzle can tilt in the biaxial direction orthogonal to the same plane as a plate-shaped member.
[0014]
Thereby, since the said nozzle can apply the force which moves a board | substrate to the extension direction of a groove | channel, it can serve as the conveyance mechanism in the process of forming a groove | channel.
[0015]
Preferably, all the nozzles have the same shape, and the same nozzle serves both as a pressure nozzle and a vacuum suction nozzle.
[0016]
Thereby, a pressurization nozzle and a vacuum suction nozzle can be switched, As a result, in a parting process of a plate-shaped member, force can be made to act in various variations.
[0017]
Moreover, it is preferable to provide said groove | channel formation means on both the front and back of a plate-shaped member.
Thereby, a groove | channel can be provided from both front and back of a plate-shaped member, and the division | segmentation of the member which bonded together two plate-shaped members with the adhesive agent can be performed without using the inversion apparatus of a plate-shaped member.
[0018]
In another aspect, the above-described cutting apparatus includes a conveying unit disposed on the front and back of the plate-like member, a pre-crack forming unit that forms a pre-crack on the surface of the plate-like member, and a thickness of the plate-like member. It is equipped with the dividing means which advances in the direction and separates.
[0019]
Thereby, the process of forming the pre-crack in the division | segmentation of a plate-shaped member, a conveyance process, and a division | segmentation process can be performed with one apparatus. As a result, the apparatus configuration can be made simpler.
[0020]
The dividing method according to the present invention is a method of dividing a plate-like member in the same apparatus, and a step of moving the plate-like member toward a tool for forming a groove on the surface of the plate-like member, and a tool A step of forming a groove on the surface of the plate-like member, and a dividing step of dividing the plate-like member by causing a crack to propagate in the thickness direction of the plate-like member from the groove.
[0021]
Thereby, each process to parting can be performed in the same apparatus, and the parting process in which a plate-shaped part exists can be performed smoothly.
[0022]
Moreover, it is preferable to implement said parting process by adjustment of the pressure increase / decrease of a pressure nozzle and a vacuum suction nozzle.
[0023]
Since the pressurizing nozzle and the vacuum suction nozzle can be used also in the step of forming the groove, the groove forming means and the dividing means can be used together. As a result, since the step of dividing the plate-like member can be performed immediately after the step of forming the groove on the surface of the plate-like member, the division step of the plate-like member can be performed more smoothly.
[0024]
Here, in the step of forming the groove, it is preferable that the plate-like member is conveyed by adjusting the pressure of the pressure nozzle and the vacuum suction nozzle.
[0025]
Thereby, for example, in the step of forming the groove, a transport mechanism other than the nozzle becomes unnecessary.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the cutting device and the cutting method according to the present invention will be described below.
[0027]
(Embodiment 1)
1 to 5 are cross-sectional views of each step of the cutting method using the cutting device according to the first embodiment.
[0028]
As shown in FIGS. 1 to 5, the cutting apparatus according to the present embodiment includes a hard tool 4 that is a groove forming means for forming a groove 5 or a precrack on the surface of a substrate 1 as a plate-like member, and a groove 5. There are provided nozzles 2 and 9 as dividing means for dividing the substrate 1 by extending the crack 7 in the thickness direction of the substrate 1.
[0029]
Here, the hard tool 4 is comprised, for example with a wheel cutter, a diamond cutter, etc., and has a disk shape. The hard tool 4 is arranged on the front and back of the substrate 1. The nozzles 2 and 9 are arranged on the front and back of the substrate 1 and also function as a transport unit.
[0030]
Further, the nozzles 2 and 9 are periodically arranged on the front and back of the substrate 1, and have a pressure nozzle 2 and a suction nozzle 9. Thereby, the scribing process can be performed with the substrate 1 levitated in the air, and the apparatus used for the scribing process can be further simplified.
[0031]
Next, the dividing method in the present embodiment is a method of dividing the substrate 1 as a plate-like member in the same apparatus, and is directed toward the hard tool 4 for forming a groove on the surface of the substrate 1. , A scribing step as a step of forming a groove 5 on the surface of the substrate 1 by the hard tool 4, and a dividing step of dividing the substrate 1 by developing a crack 7 from the groove 5 in the thickness direction of the substrate 1. As a break process.
[0032]
Hereinafter, each step of the substrate cutting method according to the present embodiment will be described in more detail. In this embodiment, it is assumed that a single substrate is divided.
[0033]
As shown in FIG. 1, pressure nozzles 2 and suction nozzles 9 are regularly arranged on the top and bottom of the substrate 1 in a plane. A high-pressure gas 3 is sprayed from the pressurizing nozzle 2 to the substrate 1, while a vacuum suction force 10 acts by the suction nozzle 9. As a result, the substrate 1 floats in the air without contacting the nozzle and is held at a specified height.
[0034]
Here, the type used as the high-pressure gas 3 is preferably dry air, nitrogen gas, or an inert gas such as helium, neon, or argon.
[0035]
Next, the scribing process in this Embodiment is demonstrated using FIG.
In the above apparatus configuration, for example, by making the gas pressure on the lower surface of the substrate 1 higher than the upper surface, the substrate 1 is transported in the direction of rising from the stationary position (upward direction in FIG. 2). The cutting edge contacts the surface of the substrate 1. In this state, the substrate 1 is transported in the dividing line direction (perpendicular to the paper surface in FIG. 2), so that the groove 5 is formed at the planned dividing position on the surface of the substrate 1.
[0036]
Here, the conveyance method of the direction of the parting line of the board | substrate 1 is demonstrated using FIG. FIG. 3 is a cross-sectional view taken along the parting line of the substrate 1 in the present embodiment.
[0037]
The nozzles 2 and 9 can be tilted not only in the direction perpendicular to the paper surface but also in the left-right direction in FIG. That is, it is preferable that the nozzles 2 and 9 can be tilted in two axial directions orthogonal to each other on the same plane as the substrate 1. Thereby, the nozzles 2 and 9 can also serve as a transport mechanism in the scribing process.
[0038]
In the scribing step, the substrate 1 is transported in the extending direction of the dividing line (transport direction 8) by adjusting the pressure increase / decrease of the pressure nozzle 2 and the suction nozzle 9. Therefore, a transport mechanism other than the nozzles 2 and 9 is not required in the scribe process.
[0039]
In the example of FIG. 3, the high pressure gas 3 is obtained by inclining the angles of all the pressure nozzles 2 in the direction of the conveyance direction 8 with the cutting edge of the hard tool 4 above the substrate 1 in contact with the surface of the substrate 1. The component of the pressure in the conveyance direction 8 acts on the substrate 1, and the substrate 1 is conveyed in the direction of the dividing line. As a result, the groove 5 is formed after the hard tool 4 passes.
[0040]
Next, the breaking process in the present embodiment will be described with reference to FIG. The breaking step is preferably performed by adjusting the pressure increase / decrease of the pressure nozzle 2 and the suction nozzle 9. Thereby, the nozzles 2 and 9 used for the scribing process can be used also in the breaking process.
[0041]
Preferably, the nozzles 2 and 9 have the same shape, and the pressure nozzle 2 and the suction nozzle 9 are shared by the same nozzle.
[0042]
Thereby, the pressurizing nozzle 2 and the suction nozzle 9 can be switched, and as a result, a force can be applied in various variations in the breaking process.
[0043]
In the example of FIG. 4, the pressure of the pressurizing nozzle 2 on both sides of the hard tool 4 below the substrate 1 is inclined in the direction of the groove 5 to increase the pressure of the high-pressure gas 3 to be injected. Further, the pressure of the high-pressure gas 3 injected from the pressurizing nozzles 2 on both sides of the hard tool 4 above the substrate 1 is increased. As a result, a bending moment 6 acts on the substrate 1 and stress concentrates on the tip of the groove 5. As a result, a crack 7 is formed along the groove 5 and the substrate 1 is divided.
[0044]
Here, the pressurizing nozzle 2 and the suction nozzle 9 are connected to a high pressure gas supply means (not shown) and a vacuum supply means (not shown), and by switching the connection valve of the piping, the injection of the high pressure gas 3 and the vacuum suction force 10 are performed. Can be switched dynamically. Therefore, the embodiment of FIG. 5 is possible in addition to the variations of FIG. 4 in the breaking process. That is, the suction force of the vacuum suction force 10 is increased by inclining the angle of the suction nozzles 9 on both sides of the hard tool 4 above the substrate 1 in the direction of the planned cutting position. Further, the suction force of the vacuum suction force 10 from the suction nozzles 9 at both ends below the substrate 1 is increased. As a result, a bending moment 6 acts on the substrate 1 and stress concentrates on the tip of the groove 5. As a result, a crack 7 is formed along the groove 5 and the substrate 1 is divided.
[0045]
In the present embodiment, since no solid is in contact with the parting line of the substrate 1 except that the hard tool 4 is in contact, the thin film on the surface of the substrate 1 and the wiring pattern are not damaged. Further, a mechanism for driving the hard tool 4 or the like is unnecessary, and since no laser device is used, peripheral devices such as a laser cooling device are not required. Furthermore, by arranging the pressure nozzle 2 and the suction nozzle 9 in a regular two-dimensional arrangement, the nozzles 2 and 9 can also serve as a scribe mechanism, a break mechanism, and a transport mechanism, and the configuration is simple and excellent in maintainability. A cutting device and a cutting method can be provided.
[0046]
(Embodiment 2)
6 to 10 are cross-sectional views of each step of the cutting method using the cutting device according to the second embodiment.
[0047]
In this embodiment, it is assumed that the two substrates are bonded together, but the basic apparatus configuration is the same as that of the first embodiment. FIG. 6 shows an apparatus configuration in the present embodiment.
[0048]
The bonded substrate is formed by dispersing resinous spacers 13 between the upper substrate 11 and the lower substrate 12 and bonding the periphery thereof with a thermosetting resin seal 14. The bonded substrate is stationary in the air without contact by the high-pressure gas 3 ejected from the pressurizing nozzles 2 regularly arranged above and below and the vacuum suction force 10 by the suction nozzle 9.
[0049]
Next, the scribing process of the upper substrate 11 will be described with reference to FIG.
For example, the surface of the upper substrate 11 is brought into contact with the cutting edge of the upper hard tool 4 by increasing the gas pressure of the pressure nozzle 2 below the lower substrate 12. In this state, by transferring the bonded substrate in the direction of the dividing line (perpendicular to the paper surface in FIG. 7), the groove 5 is formed at the planned dividing position on the surface of the upper substrate 11. The method for transporting the bonded substrate in the direction of the dividing line is the same as in the first embodiment.
[0050]
Next, the breaking process of the upper substrate 11 will be described with reference to FIG.
For example, the high pressure gas to be injected by inclining the angle of the pressure nozzles 2 on both sides of the hard tool 4 below the lower substrate 12 toward the groove 5 with respect to the upper substrate 11 provided with the grooves 5. Increase the pressure of 3. Further, the pressure of the high-pressure gas 3 injected from the pressurizing nozzles 2 on both sides of the hard tool 4 above the upper substrate 11 is increased. As a result, a bending moment 6 acts on the upper substrate 11 and the lower substrate 12, and stress concentrates on the tip of the groove 5. As a result, a crack 7 is formed along the groove 5, and the upper substrate 11 is divided. The
[0051]
Here, in the above break process, as in the first embodiment, for example, the suction nozzles 9 on both sides of the hard tool 4 above the upper substrate 11 are tilted in the direction of the planned cutting position to perform vacuum suction. The bending moment 6 is applied to the upper substrate 11 and the lower substrate 12 by increasing the force 10 and increasing the vacuum suction force 10 acting from the suction nozzles 9 at the lower ends of the lower substrate 12. Thus, it is possible to concentrate the stress on the tip of the groove 5 and divide the upper substrate 11.
[0052]
Next, the scribing process of the lower substrate 12 will be described with reference to FIG.
Here, the hard tool 4 as the groove forming means is provided on both the upper side of the upper substrate 11 and the lower side of the lower substrate 12 as shown in FIGS. The groove 5 can be provided from both sides, and the substrate obtained by bonding the two substrates 11 and 12 with an adhesive can be divided without using a substrate reversing device.
[0053]
In FIG. 9, for example, the surface of the lower substrate 12 is brought into contact with the cutting edge of the lower hard tool 4 by increasing the gas pressure of the pressure nozzle 2 above the upper substrate 11. In this state, by transferring the bonded substrate in the direction of the dividing line (perpendicular to the paper surface in FIG. 9), the groove 5 is formed at the planned dividing position on the surface of the lower substrate 12. Note that the transport method in the direction of the dividing line of the bonded substrate is the same as that in the first embodiment.
[0054]
Next, the breaking process of the lower substrate 12 will be described with reference to FIG.
For example, the high pressure is sprayed on the lower substrate 12 provided with the grooves 5 by inclining the angles of the pressure nozzles 2 on both sides of the hard tool 4 above the upper substrate 11 in the direction of the position to be divided. Increase gas 3 pressure. Further, the pressure of the high-pressure gas 3 injected from the pressurizing nozzles 2 on both sides of the hard tool 4 below the lower substrate 12 is increased. As a result, a bending moment 6 acts on the upper substrate 11 and the lower substrate 12, and stress concentrates on the tip of the groove 5. As a result, a crack 7 is formed along the groove 5, and the lower substrate 12 is divided. Is done.
[0055]
In this break process, as in the first embodiment, for example, the suction nozzles 9 on both sides of the hard tool 4 below the lower substrate 12 are tilted in the direction of the planned cutting position, and the vacuum suction force 10 is increased. By increasing the suction force and by increasing the suction force of the vacuum suction force 10 from the suction nozzles 9 at the upper ends of the upper substrate 11, a bending moment 6 is applied to the upper substrate 11 and the lower substrate 12. It is also possible to divide the lower substrate 12 by acting and concentrating stress on the tip of the groove 5.
[0056]
In this embodiment, the above configuration eliminates the need for a reversing device for reversing the bonded substrate in dividing the bonded substrate. Therefore, in addition to the effects in the first embodiment, it is possible to provide a cutting device and a cutting method that can omit the reversing device.
[0057]
Although the embodiments of the present invention have been described above, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
[0058]
【The invention's effect】
According to the cutting apparatus and the cutting method of the present invention, since the groove forming means on the substrate surface, the substrate cutting means and the transport mechanism can be included in the same apparatus, the structure of the apparatus becomes simple and maintenance is easy. It is possible to provide a cutting method that can implement a high cutting device and a plate-like member cutting step more smoothly than in the past.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a configuration of a cutting apparatus according to Embodiment 1 of the present invention.
FIG. 2 is a cross-sectional view showing a scribe process in the cutting method according to Embodiment 1 of the present invention.
FIG. 3 is a cross-sectional view showing a conveyance mechanism in a direction in which a dividing line of a substrate extends in the cutting apparatus according to Embodiment 1 of the present invention.
FIG. 4 is a cross-sectional view showing a breaking step in the cutting method according to Embodiment 1 of the present invention.
FIG. 5 is a cross-sectional view showing a modification of the breaking process in the cutting method according to Embodiment 1 of the present invention.
FIG. 6 is a cross-sectional view showing a configuration of a cutting apparatus according to Embodiment 2 of the present invention.
FIG. 7 is a cross-sectional view showing an upper substrate scribing step in the cutting method according to the second embodiment of the present invention.
FIG. 8 is a cross-sectional view showing a breaking process of the upper substrate in the cutting method according to Embodiment 2 of the present invention.
FIG. 9 is a cross-sectional view showing a scribe process of a lower substrate in the cutting method according to Embodiment 2 of the present invention.
FIG. 10 is a cross-sectional view showing a breaking process of a lower substrate in a cutting method according to Embodiment 2 of the present invention.
[Explanation of symbols]
1 substrate, 2 pressure nozzle, 3 high pressure gas, 4 hard tool, 5 groove, 6 bending moment, 7 crack, 8 transport direction, 9 suction nozzle, 10 vacuum suction force, 11 upper substrate, 12 lower substrate, 13 Spacer, 14 Seal.

Claims (9)

Groove forming means for forming grooves on the surface of the plate-like member;
A dividing means for dividing the plate-like member by extending a crack in the thickness direction of the plate-like member from the groove;
Cutting device equipped with. The cutting device is
Including nozzles periodically arranged on the front and back of the plate-like member,
The cutting apparatus according to claim 1, wherein the nozzle includes a pressure nozzle and a vacuum suction nozzle. The cutting apparatus according to claim 2, wherein the nozzle is tiltable in two axial directions orthogonal to each other on the same plane as the plate-like member. All the nozzles have the same shape,
The cutting apparatus according to claim 2 or 3, wherein the same nozzle is used as a pressure nozzle and a vacuum suction nozzle. The cutting device according to any one of claims 1 to 4, wherein the groove forming means is provided on both front and back surfaces of the plate-like member. Conveying means arranged on the front and back of the plate-like member;
Pre-crack forming means for forming a pre-crack on the plate-shaped member surface;
A dividing means for extending the pre-crack in the thickness direction of the plate member and separating the plate member;
Cutting device equipped with. A method of dividing a plate-like member in the same device,
Moving the plate member toward a tool for forming a groove on the surface of the plate member;
Forming a groove on the surface of the plate-like member by the tool;
A dividing step of dividing the plate-like member by extending a crack in the thickness direction of the plate-like member from the groove;
Cutting method with The dividing method according to claim 7, wherein the dividing step is performed by adjusting the pressure of a pressure nozzle and a vacuum suction nozzle. In the step of forming the groove,
The dividing method according to claim 7 or 8, wherein the plate-like member is conveyed by adjusting pressure increase / decrease of a pressure nozzle and a vacuum suction nozzle.

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