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TW200739612A - Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure - Google Patents

Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure

Info

Publication number
TW200739612A
TW200739612A TW096106861A TW96106861A TW200739612A TW 200739612 A TW200739612 A TW 200739612A TW 096106861 A TW096106861 A TW 096106861A TW 96106861 A TW96106861 A TW 96106861A TW 200739612 A TW200739612 A TW 200739612A
Authority
TW
Taiwan
Prior art keywords
circuit
connection structure
connecting material
producing
same
Prior art date
Application number
TW096106861A
Other languages
Chinese (zh)
Other versions
TWI348166B (en
Inventor
Tetsuyuki Shirakawa
Jun Taketatsu
Masaru Tanaka
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200739612A publication Critical patent/TW200739612A/en
Application granted granted Critical
Publication of TWI348166B publication Critical patent/TWI348166B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H10W72/073—
    • H10W72/074—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W72/931—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

Disclosed is a circuit connecting material for connecting a first circuit member wherein a plurality of first circuit electrodes are formed on a major surface of a first circuit board, and a second circuit member wherein a plurality of second circuit electrodes are formed on a major surface of a second circuit board in such a manner that the first and second circuit electrodes are opposite to each other. This circuit connecting material contains an adhesive composition, coated particles obtained by coating a part of conductive particles with insulating fine particles, and uncoated particles which are composed of conductive particles whose entire surfaces are in contact with the adhesive composition.
TW096106861A 2006-02-27 2007-02-27 Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure TW200739612A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006050307 2006-02-27
JP2006204937 2006-07-27

Publications (2)

Publication Number Publication Date
TW200739612A true TW200739612A (en) 2007-10-16
TWI348166B TWI348166B (en) 2011-09-01

Family

ID=38459070

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096106861A TW200739612A (en) 2006-02-27 2007-02-27 Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure

Country Status (4)

Country Link
JP (1) JP4605225B2 (en)
KR (1) KR20080106308A (en)
TW (1) TW200739612A (en)
WO (1) WO2007099965A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452577B (en) * 2007-10-22 2014-09-11 Nippon Chemical Ind Coated conductive powder, conductive adhesive and IC tag
TWI452110B (en) * 2009-11-17 2014-09-11 日立化成股份有限公司 A circuit-connecting material, a connecting structure using it, and a method of temporary pressing
TWI666657B (en) * 2015-05-28 2019-07-21 日商拓自達電線股份有限公司 Mounting conductive paste

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5304019B2 (en) * 2008-05-14 2013-10-02 日立化成株式会社 Circuit connection material
KR20110019392A (en) * 2008-07-01 2011-02-25 히다치 가세고교 가부시끼가이샤 Circuit connection material and circuit connection structure
JP5375374B2 (en) * 2009-07-02 2013-12-25 日立化成株式会社 Circuit connection material and circuit connection structure
JP7312109B2 (en) * 2018-04-04 2023-07-20 積水化学工業株式会社 Conductive Particles with Insulating Particles, Method for Producing Conductive Particles with Insulating Particles, Conductive Material, and Connection Structure
JP7312108B2 (en) * 2018-04-04 2023-07-20 積水化学工業株式会社 Conductive Particles with Insulating Particles, Method for Producing Conductive Particles with Insulating Particles, Conductive Material, and Connection Structure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2748705B2 (en) * 1991-02-14 1998-05-13 日立化成工業株式会社 Circuit connection members
JP2737647B2 (en) * 1994-03-10 1998-04-08 カシオ計算機株式会社 Anisotropic conductive adhesive and conductive connection structure using the same
JPH1077460A (en) * 1996-09-02 1998-03-24 Sony Corp Anisotropic conductive film
JP2000251536A (en) * 1999-03-04 2000-09-14 Toshiba Chem Corp Anisotropic conductive adhesive
JP4387175B2 (en) * 2003-07-07 2009-12-16 積水化学工業株式会社 Coated conductive particles, anisotropic conductive material, and conductive connection structure
JP4380327B2 (en) * 2004-01-07 2009-12-09 日立化成工業株式会社 Circuit connection material, film-like circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
JP4380328B2 (en) * 2004-01-07 2009-12-09 日立化成工業株式会社 Circuit connection material, film-like circuit connection material using the same, circuit member connection structure, and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452577B (en) * 2007-10-22 2014-09-11 Nippon Chemical Ind Coated conductive powder, conductive adhesive and IC tag
TWI452110B (en) * 2009-11-17 2014-09-11 日立化成股份有限公司 A circuit-connecting material, a connecting structure using it, and a method of temporary pressing
TWI666657B (en) * 2015-05-28 2019-07-21 日商拓自達電線股份有限公司 Mounting conductive paste

Also Published As

Publication number Publication date
JP4605225B2 (en) 2011-01-05
WO2007099965A1 (en) 2007-09-07
TWI348166B (en) 2011-09-01
KR20080106308A (en) 2008-12-04
JPWO2007099965A1 (en) 2009-07-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees