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TW200739165A - Lens module of camera and its fabricating method - Google Patents

Lens module of camera and its fabricating method

Info

Publication number
TW200739165A
TW200739165A TW095112761A TW95112761A TW200739165A TW 200739165 A TW200739165 A TW 200739165A TW 095112761 A TW095112761 A TW 095112761A TW 95112761 A TW95112761 A TW 95112761A TW 200739165 A TW200739165 A TW 200739165A
Authority
TW
Taiwan
Prior art keywords
camera
lens
fabricating method
lens module
substrate
Prior art date
Application number
TW095112761A
Other languages
Chinese (zh)
Inventor
Zheng-Hun Yang
Guang-Yang Chen
sen-fa Yang
zhen-hong Tu
Original Assignee
Chicony Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chicony Electronic Co Ltd filed Critical Chicony Electronic Co Ltd
Priority to TW095112761A priority Critical patent/TW200739165A/en
Priority to JP2007042616A priority patent/JP2007282195A/en
Priority to KR1020070030659A priority patent/KR20070101125A/en
Publication of TW200739165A publication Critical patent/TW200739165A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)

Abstract

A kind of lens module of camera, which contains a lens set with a cavity room; a lens set is used to link up the lens; a sheet glass is located underneath the cavity room of the lens set; a substrate with a hole having an alignment to the lens cavity of room and the substrate is located in the bottom surface of the lens set; and an image sensing chip to link with the bottom surface for aligning the hole of substrate. The fabricating method for camera module is provided in this invention.
TW095112761A 2006-04-11 2006-04-11 Lens module of camera and its fabricating method TW200739165A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW095112761A TW200739165A (en) 2006-04-11 2006-04-11 Lens module of camera and its fabricating method
JP2007042616A JP2007282195A (en) 2006-04-11 2007-02-22 Camera lens module and manufacturing method thereof
KR1020070030659A KR20070101125A (en) 2006-04-11 2007-03-29 Camera lens module and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095112761A TW200739165A (en) 2006-04-11 2006-04-11 Lens module of camera and its fabricating method

Publications (1)

Publication Number Publication Date
TW200739165A true TW200739165A (en) 2007-10-16

Family

ID=38683140

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112761A TW200739165A (en) 2006-04-11 2006-04-11 Lens module of camera and its fabricating method

Country Status (3)

Country Link
JP (1) JP2007282195A (en)
KR (1) KR20070101125A (en)
TW (1) TW200739165A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102313959A (en) * 2007-11-21 2012-01-11 Lg伊诺特有限公司 Camera module

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416193B (en) * 2007-12-31 2013-11-21 Hon Hai Prec Ind Co Ltd Method for testing elements assembly of lens module
TWI512961B (en) * 2013-08-16 2015-12-11 Azurewave Technologies Inc Image sensing module for reducing overall thickness and manufacturing method thereof
CN106817522A (en) * 2015-12-01 2017-06-09 安徽昌硕光电子科技有限公司 The structure of photographing module
KR102033313B1 (en) * 2016-03-02 2019-10-18 주식회사 탑 엔지니어링 Equipment for manufacturing camera module
TWI677745B (en) * 2018-12-05 2019-11-21 海華科技股份有限公司 Image capturing module and portable electronic device
WO2021128178A1 (en) * 2019-12-26 2021-07-01 诚瑞光学(常州)股份有限公司 Lens module and terminal device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3127584B2 (en) * 1992-06-23 2001-01-29 ソニー株式会社 Semiconductor device using resin hollow package
JP2001250889A (en) * 2000-03-06 2001-09-14 Matsushita Electric Ind Co Ltd Optical element mounting structure and method of manufacturing the same
JP3600147B2 (en) * 2000-10-12 2004-12-08 三洋電機株式会社 Mounting method of solid-state image sensor
JP2003059952A (en) * 2001-08-16 2003-02-28 Sony Corp Semiconductor device, semiconductor element chip and method of manufacturing the same
JP2004080704A (en) * 2002-08-22 2004-03-11 Toshiba Corp Imaging device and method of manufacturing the same
JP2004173028A (en) * 2002-11-21 2004-06-17 Olympus Corp Solid-state image pickup device
JP4174664B2 (en) * 2003-01-14 2008-11-05 セイコーエプソン株式会社 OPTICAL MODULE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE
JP2004274165A (en) * 2003-03-05 2004-09-30 Seiko Epson Corp Optical module, method of manufacturing the same, and electronic device
JP2005316127A (en) * 2004-04-28 2005-11-10 Matsushita Electric Ind Co Ltd The camera module
JP2005353810A (en) * 2004-06-10 2005-12-22 Seiko Precision Inc Light receiving device, distance measuring device, camera module, and manufacturing method thereof
JP2006074464A (en) * 2004-09-02 2006-03-16 Seiko Epson Corp Optical module and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102313959A (en) * 2007-11-21 2012-01-11 Lg伊诺特有限公司 Camera module

Also Published As

Publication number Publication date
KR20070101125A (en) 2007-10-16
JP2007282195A (en) 2007-10-25

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