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TW200738815A - Thermosetting resin compositions, resin films in B-stage and build-up multi-layer board - Google Patents

Thermosetting resin compositions, resin films in B-stage and build-up multi-layer board

Info

Publication number
TW200738815A
TW200738815A TW096102297A TW96102297A TW200738815A TW 200738815 A TW200738815 A TW 200738815A TW 096102297 A TW096102297 A TW 096102297A TW 96102297 A TW96102297 A TW 96102297A TW 200738815 A TW200738815 A TW 200738815A
Authority
TW
Taiwan
Prior art keywords
resin
build
stage
layer board
epoxy resin
Prior art date
Application number
TW096102297A
Other languages
English (en)
Inventor
Tetsuaki Suzuki
Naoya Kakiuchi
Yusuke Tanahashi
Original Assignee
Tamura Kaken Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Kaken Corp filed Critical Tamura Kaken Corp
Publication of TW200738815A publication Critical patent/TW200738815A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/02—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/44—Sample treatment involving radiation, e.g. heat

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW096102297A 2006-02-27 2007-01-22 Thermosetting resin compositions, resin films in B-stage and build-up multi-layer board TW200738815A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006050087A JP2007224242A (ja) 2006-02-27 2006-02-27 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルムおよび多層ビルドアップ基板

Publications (1)

Publication Number Publication Date
TW200738815A true TW200738815A (en) 2007-10-16

Family

ID=38546338

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102297A TW200738815A (en) 2006-02-27 2007-01-22 Thermosetting resin compositions, resin films in B-stage and build-up multi-layer board

Country Status (4)

Country Link
JP (1) JP2007224242A (zh)
KR (1) KR20070089053A (zh)
CN (1) CN101029166A (zh)
TW (1) TW200738815A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI774674B (zh) * 2016-05-24 2022-08-21 日商味之素股份有限公司 接著薄膜、樹脂組成物、預浸體、印刷配線板及半導體裝置

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5047024B2 (ja) * 2008-03-25 2012-10-10 三菱電機株式会社 熱伝導性樹脂組成物、熱伝導性樹脂シート及びパワーモジュール
TW200948888A (en) * 2008-04-16 2009-12-01 Henkel Corp Flow controllable B-stageable composition
JP2010083966A (ja) * 2008-09-30 2010-04-15 Sekisui Chem Co Ltd 樹脂組成物、硬化体及び積層体
WO2010071107A1 (ja) * 2008-12-15 2010-06-24 宇部興産株式会社 熱硬化性変性ポリイミド樹脂組成物
WO2011111847A1 (ja) 2010-03-08 2011-09-15 味の素株式会社 樹脂組成物
KR20130140798A (ko) * 2011-02-01 2013-12-24 디아이씨 가부시끼가이샤 열경화형 수지 조성물, 그 경화물 및 프린트 배선판용 층간 접착 필름
JP2013077590A (ja) * 2011-09-29 2013-04-25 Tamura Seisakusho Co Ltd 層間絶縁用の樹脂フィルムおよびビルドアップ配線基板
CN103819870B (zh) * 2012-11-16 2016-06-15 株式会社田村制作所 热固性树脂组合物、b阶化的树脂膜、金属箔、覆铜板及多层积层基板
JP6258770B2 (ja) * 2014-04-24 2018-01-10 Ｊｆｅケミカル株式会社 電子基板およびカバーレイフィルム
KR101943698B1 (ko) * 2016-01-29 2019-01-29 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
CN106773215A (zh) * 2017-01-06 2017-05-31 京东方科技集团股份有限公司 一种彩膜基板、其制作方法、液晶显示器及显示装置
TWI773745B (zh) * 2017-04-24 2022-08-11 日商味之素股份有限公司 樹脂組成物
JP7347931B2 (ja) * 2018-12-26 2023-09-20 スリーエム イノベイティブ プロパティズ カンパニー マイクロ流体デバイス用フィルム、マイクロ流体デバイス及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI774674B (zh) * 2016-05-24 2022-08-21 日商味之素股份有限公司 接著薄膜、樹脂組成物、預浸體、印刷配線板及半導體裝置

Also Published As

Publication number Publication date
JP2007224242A (ja) 2007-09-06
CN101029166A (zh) 2007-09-05
KR20070089053A (ko) 2007-08-30

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