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TW200737456A - Flip chip substrate structure and method for fabricating the same - Google Patents

Flip chip substrate structure and method for fabricating the same

Info

Publication number
TW200737456A
TW200737456A TW095110361A TW95110361A TW200737456A TW 200737456 A TW200737456 A TW 200737456A TW 095110361 A TW095110361 A TW 095110361A TW 95110361 A TW95110361 A TW 95110361A TW 200737456 A TW200737456 A TW 200737456A
Authority
TW
Taiwan
Prior art keywords
solder mask
flip chip
chip substrate
substrate structure
fabricating
Prior art date
Application number
TW095110361A
Other languages
Chinese (zh)
Other versions
TWI317163B (en
Inventor
Bo-Wei Chen
Hsien-Shou Wang
Shih-Ping Hsu
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW095110361A priority Critical patent/TW200737456A/en
Publication of TW200737456A publication Critical patent/TW200737456A/en
Application granted granted Critical
Publication of TWI317163B publication Critical patent/TWI317163B/zh

Links

Landscapes

  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present invention relates to a flip chip substrate structure, which comprises at least one circuit build-up structure having two sides respectively formed thereon a first solder mask and a second solder mask, wherein plural openings are formed in the first solder mask and the second solder mask in order to expose the portions of the circuit build-up structure on both sides for use as the electrical contact pads; and plural solder bumps, which are formed on the electrical contact pads on both sides of the circuit build-up structure. The present invention also provides a method to fabricate the structure. The structure increases the integration and achieves the purpose of miniaturization. The method solves the problem of layer multiplicity and process complexity.
TW095110361A 2006-03-24 2006-03-24 Flip chip substrate structure and method for fabricating the same TW200737456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095110361A TW200737456A (en) 2006-03-24 2006-03-24 Flip chip substrate structure and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095110361A TW200737456A (en) 2006-03-24 2006-03-24 Flip chip substrate structure and method for fabricating the same

Publications (2)

Publication Number Publication Date
TW200737456A true TW200737456A (en) 2007-10-01
TWI317163B TWI317163B (en) 2009-11-11

Family

ID=45073328

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110361A TW200737456A (en) 2006-03-24 2006-03-24 Flip chip substrate structure and method for fabricating the same

Country Status (1)

Country Link
TW (1) TW200737456A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI423410B (en) * 2010-12-31 2014-01-11 友達光電股份有限公司 Metal conductive structure and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471073B (en) 2009-12-31 2015-01-21 Unimicron Technology Corp Circuit substrate and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI423410B (en) * 2010-12-31 2014-01-11 友達光電股份有限公司 Metal conductive structure and manufacturing method thereof

Also Published As

Publication number Publication date
TWI317163B (en) 2009-11-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees