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TW200735197A - Laser machining device - Google Patents

Laser machining device

Info

Publication number
TW200735197A
TW200735197A TW096100684A TW96100684A TW200735197A TW 200735197 A TW200735197 A TW 200735197A TW 096100684 A TW096100684 A TW 096100684A TW 96100684 A TW96100684 A TW 96100684A TW 200735197 A TW200735197 A TW 200735197A
Authority
TW
Taiwan
Prior art keywords
workpiece
machining
carrying
laser machining
laser
Prior art date
Application number
TW096100684A
Other languages
Chinese (zh)
Other versions
TWI392002B (en
Inventor
Naoki Ohmiya
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW200735197A publication Critical patent/TW200735197A/en
Application granted granted Critical
Publication of TWI392002B publication Critical patent/TWI392002B/en

Links

Landscapes

  • Laser Beam Processing (AREA)
  • Dicing (AREA)

Abstract

To provide a laser machining device having a function of coating the machining surface of a workpiece with a protective film and a function of washing the protective film after a laser machining, and is improved in the efficiency of the machining. The laser machining device has a chuck table 3, a laser-beam irradiating means 4, a work housing cassette placing table, and a carrying in and out means 14 for carrying the workpiece from and to a cassette 13 on the cassette placing table. The laser machining device further has a temporarily placing table 15 for the carried-out workpiece, and a carrier means for carrying the workpiece to the chuck table. Such a laser machining device has: a protective-film forming means 7 disposed in a first carrier path for carrying the workpiece carried out to the temporarily placing table for machining, to the chuck table, and coating the workpiece before machining with the protective film; and a washing means 8 which is disposed in a second carrier path for carrying the workpiece after machining held to the chuck table, to the temporarily placing table, and washes and removes the protective film coated on the workpiece after machining.
TW096100684A 2006-01-26 2007-01-08 Laser processing device TWI392002B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006018025A JP4777783B2 (en) 2006-01-26 2006-01-26 Laser processing equipment

Publications (2)

Publication Number Publication Date
TW200735197A true TW200735197A (en) 2007-09-16
TWI392002B TWI392002B (en) 2013-04-01

Family

ID=38455455

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096100684A TWI392002B (en) 2006-01-26 2007-01-08 Laser processing device

Country Status (2)

Country Link
JP (1) JP4777783B2 (en)
TW (1) TWI392002B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104241143A (en) * 2013-06-18 2014-12-24 株式会社迪思科 Cutting device

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009148793A (en) * 2007-12-20 2009-07-09 Disco Abrasive Syst Ltd Protective film coating apparatus and laser processing machine
JP2010012508A (en) * 2008-07-07 2010-01-21 Disco Abrasive Syst Ltd Protective film covering device and laser beam machining device
JP2010267653A (en) * 2009-05-12 2010-11-25 Disco Abrasive Syst Ltd Wafer processing method
JP5356914B2 (en) * 2009-05-28 2013-12-04 株式会社ディスコ Wafer processing method
JP5385060B2 (en) 2009-09-07 2014-01-08 株式会社ディスコ Protective film coating method and protective film coating apparatus
JP5967985B2 (en) * 2012-03-12 2016-08-10 株式会社ディスコ Laser processing method
JP6137798B2 (en) * 2012-09-26 2017-05-31 株式会社ディスコ Laser processing apparatus and protective film coating method
JP6261967B2 (en) * 2013-12-03 2018-01-17 株式会社ディスコ Processing equipment
JP2015115592A (en) * 2013-12-16 2015-06-22 株式会社ディスコ Processing device
JP6393583B2 (en) 2014-10-30 2018-09-19 株式会社ディスコ Protective film detection apparatus and protective film detection method
JP6478728B2 (en) 2015-03-11 2019-03-06 株式会社ディスコ Protective film detection method
JP7064887B2 (en) 2018-01-12 2022-05-11 株式会社ディスコ Processing equipment management method and processing equipment
JP2023120010A (en) 2022-02-17 2023-08-29 株式会社ディスコ processing equipment
JP2023161729A (en) 2022-04-26 2023-11-08 株式会社ディスコ How to process frame units
CN115257037B (en) * 2022-09-28 2022-12-20 山东豪迈数控机床有限公司 Machine tool rotating tool and laser cleaning machine tool

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10305420A (en) * 1997-03-04 1998-11-17 Ngk Insulators Ltd Processing method of base material composed of oxide single crystal and method of manufacturing functional device
JPH11320385A (en) * 1998-05-14 1999-11-24 Matsushita Electric Ind Co Ltd Polishing method and apparatus
JP3464388B2 (en) * 1998-07-01 2003-11-10 株式会社東芝 Semiconductor wafer splitting method
JP2004188475A (en) * 2002-12-13 2004-07-08 Disco Abrasive Syst Ltd Laser processing method
JP2004322168A (en) * 2003-04-25 2004-11-18 Disco Abrasive Syst Ltd Laser processing equipment
JP4381121B2 (en) * 2003-12-11 2009-12-09 大日本スクリーン製造株式会社 Substrate processing equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104241143A (en) * 2013-06-18 2014-12-24 株式会社迪思科 Cutting device
TWI609419B (en) * 2013-06-18 2017-12-21 迪思科股份有限公司 Cutting device
CN104241143B (en) * 2013-06-18 2018-07-31 株式会社迪思科 Cutting apparatus

Also Published As

Publication number Publication date
JP2007201178A (en) 2007-08-09
JP4777783B2 (en) 2011-09-21
TWI392002B (en) 2013-04-01

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