[go: up one dir, main page]

TW200727382A - Relay station and substrate processing system using relay station - Google Patents

Relay station and substrate processing system using relay station

Info

Publication number
TW200727382A
TW200727382A TW095106905A TW95106905A TW200727382A TW 200727382 A TW200727382 A TW 200727382A TW 095106905 A TW095106905 A TW 095106905A TW 95106905 A TW95106905 A TW 95106905A TW 200727382 A TW200727382 A TW 200727382A
Authority
TW
Taiwan
Prior art keywords
relay station
substrate processing
side opening
apparatus side
processing system
Prior art date
Application number
TW095106905A
Other languages
English (en)
Other versions
TWI306641B (zh
Inventor
Wataru Karasawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200727382A publication Critical patent/TW200727382A/zh
Application granted granted Critical
Publication of TWI306641B publication Critical patent/TWI306641B/zh

Links

Classifications

    • H10P72/1918—
    • H10P72/3406—
    • H10P72/3408—
    • H10P72/3411—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095106905A 2005-03-01 2006-03-01 Relay station and substrate processing system using relay station TW200727382A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005056362A JP4563219B2 (ja) 2005-03-01 2005-03-01 中継ステーション及び中継ステーションを用いた基板処理システム

Publications (2)

Publication Number Publication Date
TW200727382A true TW200727382A (en) 2007-07-16
TWI306641B TWI306641B (zh) 2009-02-21

Family

ID=36941149

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106905A TW200727382A (en) 2005-03-01 2006-03-01 Relay station and substrate processing system using relay station

Country Status (6)

Country Link
US (1) US20080124192A1 (zh)
JP (1) JP4563219B2 (zh)
KR (1) KR100840959B1 (zh)
CN (1) CN1957456A (zh)
TW (1) TW200727382A (zh)
WO (1) WO2006093120A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5921371B2 (ja) * 2012-07-13 2016-05-24 信越ポリマー株式会社 基板収納容器
WO2015170972A1 (en) * 2014-05-07 2015-11-12 Mapper Lithography Ip B.V. Enclosure for a target processing machine
JP7090469B2 (ja) * 2018-05-15 2022-06-24 東京エレクトロン株式会社 基板処理装置
US12394652B2 (en) 2021-03-10 2025-08-19 Entegris, Inc. Semiconductor substrate carrying container with front and rear openings

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US513954A (en) * 1894-01-30 Metal-working tool
JPS6155930A (ja) * 1984-08-27 1986-03-20 Mitsubishi Electric Corp 工程間リ−ドフレ−ム搬送装置
JP2502661B2 (ja) * 1988-03-04 1996-05-29 松下電器産業株式会社 気相成長装置
JP2525284B2 (ja) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
US5277579A (en) * 1991-03-15 1994-01-11 Tokyo Electron Sagami Limited Wafers transferring method in vertical type heat treatment apparatus and the vertical type heat treatment apparatus provided with a wafers transferring system
US5256204A (en) * 1991-12-13 1993-10-26 United Microelectronics Corporation Single semiconductor water transfer method and manufacturing system
JPH05166917A (ja) * 1991-12-18 1993-07-02 Kawasaki Steel Corp バッファ・カセット
JP3632812B2 (ja) * 1997-10-24 2005-03-23 シャープ株式会社 基板搬送移載装置
JP2951628B2 (ja) * 1998-01-22 1999-09-20 アプライド マテリアルズ インコーポレイテッド ウェハ保管用カセット
JP2000286318A (ja) * 1999-01-27 2000-10-13 Shinko Electric Co Ltd 搬送システム
US6641349B1 (en) * 1999-04-30 2003-11-04 Tdk Corporation Clean box, clean transfer method and system
KR100729986B1 (ko) * 1999-12-20 2007-06-20 아시스트 신꼬, 인코포레이티드 자동반송시스템
JP2003031641A (ja) * 2001-07-19 2003-01-31 Mitsubishi Electric Corp 製品保管方法および製品保管装置
JP4194262B2 (ja) * 2001-09-27 2008-12-10 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2003188229A (ja) * 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
JP2003321102A (ja) * 2002-05-02 2003-11-11 Tokyo Electron Ltd 無人搬送車システム
JP2004281474A (ja) * 2003-03-12 2004-10-07 Seiko Epson Corp 製造対象物の受け渡し装置および製造対象物の受け渡し装置を有する搬送システム
JP4065997B2 (ja) * 2003-05-23 2008-03-26 株式会社ダイフク 台車式搬送装置

Also Published As

Publication number Publication date
US20080124192A1 (en) 2008-05-29
KR20070029172A (ko) 2007-03-13
JP4563219B2 (ja) 2010-10-13
WO2006093120A1 (ja) 2006-09-08
KR100840959B1 (ko) 2008-06-24
CN1957456A (zh) 2007-05-02
JP2006245130A (ja) 2006-09-14
TWI306641B (zh) 2009-02-21

Similar Documents

Publication Publication Date Title
EP1345256A3 (en) Method and apparatus for batch processing of wafers in a furnace
TW200631119A (en) Enclosed container lid opening/closing system and enclosed container lid opening/closing method
TW200729390A (en) Method for making semiconductor wafer
TW200519012A (en) Glass substrate transporting facility
IL148872A (en) Module containing controlled minienvironment for atmospheric wafer transport
TWI629744B (zh) Surrounding gas replacement device, substrate transfer device, substrate transfer system, and EFEM
WO2008002780A3 (en) Batch processing platform for ald and cvd
SG120907A1 (en) Process for transferring thin semiconductor layersand process for obtaining a donor wafer for such a transfer process
CN100403509C (zh) 立式热处理装置及其使用方法
TW200733293A (en) Extended mainframe designs for semiconductor device manufacturing equipment
JP2007533167A5 (zh)
MY161955A (en) Systems and methods for handling wafers
TW200717695A (en) Substrate loading mechanism and substrate processing apparatus
WO2007150039A3 (en) Method and apparatus for transporting substrates
WO2007107983A3 (en) Storage and purge system for semiconductor wafers
TW200706464A (en) Transformation station for a packaging production machine
AU6802200A (en) Atmospheric wafer transfer module with nest for wafer transport robot and methodof implementing same
JP2003124284A5 (zh)
WO2005022602A3 (en) A method and apparatus for semiconductor processing
TWI371073B (en) Wafer inspection system and a method for translating wafers
TW200508126A (en) Substrate transporting device and substrate transfer method, and vacuum processing device
JP5190279B2 (ja) 基板処理装置
TW200727382A (en) Relay station and substrate processing system using relay station
FR2896912B1 (fr) Enceinte etanche pour le transport et le stockage de substrats semi-conducteurs
TW200834097A (en) Tray transfer apparatus and electronic component testing apparatus provided with the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees