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TW200700523A - Adhesive and luminescent element - Google Patents

Adhesive and luminescent element

Info

Publication number
TW200700523A
TW200700523A TW095103775A TW95103775A TW200700523A TW 200700523 A TW200700523 A TW 200700523A TW 095103775 A TW095103775 A TW 095103775A TW 95103775 A TW95103775 A TW 95103775A TW 200700523 A TW200700523 A TW 200700523A
Authority
TW
Taiwan
Prior art keywords
adhesive
diene polymer
conjugated
luminescent
base
Prior art date
Application number
TW095103775A
Other languages
Chinese (zh)
Inventor
Akira Tanaka
Original Assignee
Zeon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corp filed Critical Zeon Corp
Publication of TW200700523A publication Critical patent/TW200700523A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L15/00—Compositions of rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J115/00—Adhesives based on rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
    • C08C19/00—Chemical modification of rubber
    • C08C19/02—Hydrogenation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
    • C08C19/00—Chemical modification of rubber
    • C08C19/08—Depolymerisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Die Bonding (AREA)

Abstract

An adhesive with which an inorganic material, e.g., a glass or metal, and an organic material, e.g., a plastic, are bonded and which has the function of absorbing oxygen through the surfaces to be in contact therewith, and an electronic material such as a luminescent material, obtained using the adhesive. The adhesive has such an oxygen-absorbing function that the oxygen absorption is 0.5 mL/g or more and comprises a cyclized conjugated-diene polymer having a percentage decrease in unsaturated-bond amount of 10% or higher, the percentage decrease indicating the proportion of the number of unsaturated bonds present in the cyclized conjugated-diene polymer to the number of unsaturated bonds in a conjugated-diene polymer in the case where the cyclized conjugated-diene polymer is obtained by cyclizing the conjugated-diene polymer. The luminescent element is characterized by comprising a base, a luminescent-element main body disposed on the base, an encapsulation vessel disposed so as to cover the luminescent element, and an adhesive with which the base is bonded to the encapsulation vessel, the adhesive being that adhesive.
TW095103775A 2005-01-31 2006-02-03 Adhesive and luminescent element TW200700523A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005022973 2005-01-31

Publications (1)

Publication Number Publication Date
TW200700523A true TW200700523A (en) 2007-01-01

Family

ID=36740517

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103775A TW200700523A (en) 2005-01-31 2006-02-03 Adhesive and luminescent element

Country Status (3)

Country Link
JP (1) JP5029959B2 (en)
TW (1) TW200700523A (en)
WO (1) WO2006080500A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5365891B2 (en) * 2006-10-13 2013-12-11 日本ゼオン株式会社 RESIN COMPOSITION FOR LIGHT EMITTING ELEMENT, LAMINATE FOR LIGHT EMITTING ELEMENT, LIGHT EMITTING ELEMENT
WO2010101290A1 (en) 2009-03-06 2010-09-10 東洋製罐株式会社 Oxygen-absorbable solvent-soluble resin and oxygen-absorbable adhesive resin composition
KR101796716B1 (en) 2010-08-19 2017-11-10 도요세이칸 그룹 홀딩스 가부시키가이샤 Resin for oxygen-absorbing adhesive and oxygen-absorbing adhesive
JP5920591B2 (en) 2010-12-28 2016-05-18 東洋製罐株式会社 Two-component curable oxygen-absorbing resin composition and oxygen-absorbing adhesive
JP2013168381A (en) * 2013-04-26 2013-08-29 Pioneer Electronic Corp Organic el panel and method for manufacturing the same
WO2024204744A1 (en) * 2023-03-30 2024-10-03 リンテック株式会社 Adhesive, adhesive sheet, optical component, and display

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4210849B2 (en) * 2001-10-22 2009-01-21 日本ゼオン株式会社 Vulcanized adhesive and composite molded body
JP3966162B2 (en) * 2001-12-07 2007-08-29 日本ゼオン株式会社 Composite molded body
JP3865056B2 (en) * 2002-01-22 2007-01-10 セイコーエプソン株式会社 Manufacturing method of sealing substrate
JP2004002766A (en) * 2002-03-27 2004-01-08 Nippon Zeon Co Ltd Adhesive composition comprising modified conjugated diene polymer and composite molded article
JP2004001457A (en) * 2002-04-09 2004-01-08 Nippon Zeon Co Ltd Composite molded body of hydrocarbon polymer
JP4389150B2 (en) * 2003-06-20 2009-12-24 東洋製罐株式会社 Oxygen-absorbing resin composition and multilayer structure using the same

Also Published As

Publication number Publication date
WO2006080500A1 (en) 2006-08-03
JP5029959B2 (en) 2012-09-19
JPWO2006080500A1 (en) 2008-06-19

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