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TW200708219A - Circuit board structure and fabricating method thereof - Google Patents

Circuit board structure and fabricating method thereof

Info

Publication number
TW200708219A
TW200708219A TW094126907A TW94126907A TW200708219A TW 200708219 A TW200708219 A TW 200708219A TW 094126907 A TW094126907 A TW 094126907A TW 94126907 A TW94126907 A TW 94126907A TW 200708219 A TW200708219 A TW 200708219A
Authority
TW
Taiwan
Prior art keywords
electrically connecting
circuit board
fabricating method
board structure
metal bump
Prior art date
Application number
TW094126907A
Other languages
Chinese (zh)
Other versions
TWI287419B (en
Inventor
Shih-Ping Hsu
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW94126907A priority Critical patent/TWI287419B/en
Publication of TW200708219A publication Critical patent/TW200708219A/en
Application granted granted Critical
Publication of TWI287419B publication Critical patent/TWI287419B/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)

Abstract

A circuit board structure and a fabricating method thereof are proposed. A carrier board with a plurality of cavities formed thereon is provided and a conductive structure is formed corresponding to the cavities. The conductive structure includes a metal bump in the cavity and an electrically connecting pad on the metal pad, wherein the metal bump and the electrically connecting pad are formed as a unity. Therefore, the connection strength of the metal bump and the electrically connecting pad is reinforced. Furthermore, the electrically connecting quality and reliability between the circuit structure formed thereafter and other devices are guaranteed.
TW94126907A 2005-08-09 2005-08-09 Circuit board structure and fabricating method thereof TWI287419B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94126907A TWI287419B (en) 2005-08-09 2005-08-09 Circuit board structure and fabricating method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94126907A TWI287419B (en) 2005-08-09 2005-08-09 Circuit board structure and fabricating method thereof

Publications (2)

Publication Number Publication Date
TW200708219A true TW200708219A (en) 2007-02-16
TWI287419B TWI287419B (en) 2007-09-21

Family

ID=39460320

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94126907A TWI287419B (en) 2005-08-09 2005-08-09 Circuit board structure and fabricating method thereof

Country Status (1)

Country Link
TW (1) TWI287419B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104254197A (en) * 2013-06-27 2014-12-31 宏启胜精密电子(秦皇岛)有限公司 Circuit board and manufacturing method thereof
TWI769459B (en) * 2020-05-22 2022-07-01 矽品精密工業股份有限公司 Substrate structure and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI440419B (en) 2012-09-14 2014-06-01 威盛電子股份有限公司 Circuit substrate and process for fabricating the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104254197A (en) * 2013-06-27 2014-12-31 宏启胜精密电子(秦皇岛)有限公司 Circuit board and manufacturing method thereof
TWI594675B (en) * 2013-06-27 2017-08-01 碁鼎科技秦皇島有限公司 Printed circuit board and method for manufacturing same
CN104254197B (en) * 2013-06-27 2017-10-27 碁鼎科技秦皇岛有限公司 Circuit board and preparation method thereof
TWI769459B (en) * 2020-05-22 2022-07-01 矽品精密工業股份有限公司 Substrate structure and manufacturing method thereof

Also Published As

Publication number Publication date
TWI287419B (en) 2007-09-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees