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TW200642004A - Chip-packaging structure and its manufacturing process - Google Patents

Chip-packaging structure and its manufacturing process

Info

Publication number
TW200642004A
TW200642004A TW094116478A TW94116478A TW200642004A TW 200642004 A TW200642004 A TW 200642004A TW 094116478 A TW094116478 A TW 094116478A TW 94116478 A TW94116478 A TW 94116478A TW 200642004 A TW200642004 A TW 200642004A
Authority
TW
Taiwan
Prior art keywords
chip
manufacturing process
packaging structure
packaged
packaging
Prior art date
Application number
TW094116478A
Other languages
Chinese (zh)
Other versions
TWI282594B (en
Inventor
wen-feng Zheng
Original Assignee
Boardtek Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boardtek Electronics Corp filed Critical Boardtek Electronics Corp
Priority to TW094116478A priority Critical patent/TWI282594B/en
Publication of TW200642004A publication Critical patent/TW200642004A/en
Application granted granted Critical
Publication of TWI282594B publication Critical patent/TWI282594B/en

Links

Classifications

    • H10W72/0198—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Light Receiving Elements (AREA)

Abstract

This invention provides a chip-packaging structure and its manufacturing process. Firstly, a carrier plate is used as a supporting device. Secondly, after the chip-packaging process finishes the packaged chip structure, the carrier plate is removed. This structure can increase the uniformity of whole packaged structure, the stability of the structure, and the reliability in the packaging process. Moreover, this invention not only broadens the application of the structure but also tremendously decreases the height of the entire packaged structure.
TW094116478A 2005-05-20 2005-05-20 Chip-packaging structure and its manufacturing process TWI282594B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094116478A TWI282594B (en) 2005-05-20 2005-05-20 Chip-packaging structure and its manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094116478A TWI282594B (en) 2005-05-20 2005-05-20 Chip-packaging structure and its manufacturing process

Publications (2)

Publication Number Publication Date
TW200642004A true TW200642004A (en) 2006-12-01
TWI282594B TWI282594B (en) 2007-06-11

Family

ID=38823784

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116478A TWI282594B (en) 2005-05-20 2005-05-20 Chip-packaging structure and its manufacturing process

Country Status (1)

Country Link
TW (1) TWI282594B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398935B (en) * 2009-10-16 2013-06-11 相互股份有限公司 Wafer carrier board and package structure and method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398935B (en) * 2009-10-16 2013-06-11 相互股份有限公司 Wafer carrier board and package structure and method thereof

Also Published As

Publication number Publication date
TWI282594B (en) 2007-06-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees