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TW200632996A - Method and structure of flip chip bonding - Google Patents

Method and structure of flip chip bonding

Info

Publication number
TW200632996A
TW200632996A TW094106105A TW94106105A TW200632996A TW 200632996 A TW200632996 A TW 200632996A TW 094106105 A TW094106105 A TW 094106105A TW 94106105 A TW94106105 A TW 94106105A TW 200632996 A TW200632996 A TW 200632996A
Authority
TW
Taiwan
Prior art keywords
bumps
substrate
chip
connecting holes
flip chip
Prior art date
Application number
TW094106105A
Other languages
Chinese (zh)
Other versions
TWI264054B (en
Inventor
Chao-Fu Weng
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94106105A priority Critical patent/TWI264054B/en
Publication of TW200632996A publication Critical patent/TW200632996A/en
Application granted granted Critical
Publication of TWI264054B publication Critical patent/TWI264054B/en

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  • Wire Bonding (AREA)

Abstract

The present invention relates to a method and structure of flip chip bonding. The method comprises: (a) providing a chip having a plurality of bumps; (b) providing a substrate having a plurality of connecting holes, wherein the shapes and positions of the connecting holes are correspondent to that of the bumps; (c) aligning the chip and the substrate so as to dispose the bumps into the connecting holes; and (d) heating the chip and the substrate so that the bumps are electrically connected to the conductive trace in the substrate. Whereby, conventional underfill is omitted so as to facilitate the manufacture process, enhance the bonding strength, and reduce total height of bonded structure.
TW94106105A 2005-03-01 2005-03-01 Method and structure of flip chip bonding TWI264054B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94106105A TWI264054B (en) 2005-03-01 2005-03-01 Method and structure of flip chip bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94106105A TWI264054B (en) 2005-03-01 2005-03-01 Method and structure of flip chip bonding

Publications (2)

Publication Number Publication Date
TW200632996A true TW200632996A (en) 2006-09-16
TWI264054B TWI264054B (en) 2006-10-11

Family

ID=37967248

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94106105A TWI264054B (en) 2005-03-01 2005-03-01 Method and structure of flip chip bonding

Country Status (1)

Country Link
TW (1) TWI264054B (en)

Also Published As

Publication number Publication date
TWI264054B (en) 2006-10-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees