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TW200629487A - Method for fabricating carrier embedded with semiconductor chip - Google Patents

Method for fabricating carrier embedded with semiconductor chip

Info

Publication number
TW200629487A
TW200629487A TW094104164A TW94104164A TW200629487A TW 200629487 A TW200629487 A TW 200629487A TW 094104164 A TW094104164 A TW 094104164A TW 94104164 A TW94104164 A TW 94104164A TW 200629487 A TW200629487 A TW 200629487A
Authority
TW
Taiwan
Prior art keywords
carrier
dielectric layer
semiconductor chip
fabricating
active surface
Prior art date
Application number
TW094104164A
Other languages
Chinese (zh)
Other versions
TWI264805B (en
Inventor
Chi-Ming Chen
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW094104164A priority Critical patent/TWI264805B/en
Publication of TW200629487A publication Critical patent/TW200629487A/en
Application granted granted Critical
Publication of TWI264805B publication Critical patent/TWI264805B/en

Links

Classifications

    • H10W70/09—
    • H10W70/099—
    • H10W72/073—
    • H10W72/874—
    • H10W72/9413—
    • H10W90/734—

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

A method for fabricating a carrier embedded with a semiconductor chip includes: providing at least one thin chip having an active surface and a non-active surface; providing a carrier having at least one cavity; forming a first dielectric layer on a bottom surface of the carrier; mounting the thin chip in the cavity of the carrier, and attaching the non-active surface of the thin chip to the first dielectric layer; forming a second dielectric layer on the carrier and the active surface of the thin chip; and planarizing a surface of the second dielectric layer to make this surface flat, such that a subsequent circuit build-up structure can be flatly formed on the surface of the second dielectric layer.
TW094104164A 2005-02-14 2005-02-14 Method for fabricating carrier embedded with semiconductor chip TWI264805B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094104164A TWI264805B (en) 2005-02-14 2005-02-14 Method for fabricating carrier embedded with semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094104164A TWI264805B (en) 2005-02-14 2005-02-14 Method for fabricating carrier embedded with semiconductor chip

Publications (2)

Publication Number Publication Date
TW200629487A true TW200629487A (en) 2006-08-16
TWI264805B TWI264805B (en) 2006-10-21

Family

ID=37969473

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094104164A TWI264805B (en) 2005-02-14 2005-02-14 Method for fabricating carrier embedded with semiconductor chip

Country Status (1)

Country Link
TW (1) TWI264805B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105023873A (en) * 2014-04-15 2015-11-04 旭德科技股份有限公司 Substrate structure and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI392071B (en) * 2008-11-04 2013-04-01 欣興電子股份有限公司 Package structure and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105023873A (en) * 2014-04-15 2015-11-04 旭德科技股份有限公司 Substrate structure and manufacturing method thereof
TWI512924B (en) * 2014-04-15 2015-12-11 旭德科技股份有限公司 Substrate structure and manufacturing method thereof
CN105023873B (en) * 2014-04-15 2018-02-02 旭德科技股份有限公司 Substrate structure and manufacturing method thereof

Also Published As

Publication number Publication date
TWI264805B (en) 2006-10-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees