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TW200628880A - Adhesive chuck device - Google Patents

Adhesive chuck device

Info

Publication number
TW200628880A
TW200628880A TW094134826A TW94134826A TW200628880A TW 200628880 A TW200628880 A TW 200628880A TW 094134826 A TW094134826 A TW 094134826A TW 94134826 A TW94134826 A TW 94134826A TW 200628880 A TW200628880 A TW 200628880A
Authority
TW
Taiwan
Prior art keywords
board
movable film
adhesive
adhesive surface
adhesive member
Prior art date
Application number
TW094134826A
Other languages
Chinese (zh)
Other versions
TWI376540B (en
Inventor
Michiya Yokota
Yoshikazu Ohtani
Mitsukuni Sakashita
Original Assignee
Shinetsu Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36227625&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200628880(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shinetsu Eng Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW200628880A publication Critical patent/TW200628880A/en
Application granted granted Critical
Publication of TWI376540B publication Critical patent/TWI376540B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Screen Printers (AREA)

Abstract

To surely mount and remove a board by a pneumatic mechanism having a simple structure. On a board side of a holding board (1), a movable film (3) which can be deformed in a direction intersecting with a board side plane (1a) in an opening part (1b) provided on the board side plane (1a), and an adhesive member (4) for holding a board (A) by adhesion by facing the board are provided. By reciprocating the movable film (3) by a pressure difference between a primary side space (5) and a secondary side space (S) of the movable film (3), an adhesive surface (4a) of the adhesive member (4) is permitted to abut to the board (A) to hold the board by adhesion, the adhesive surface and the board are forcibly separated and the board (A) is smoothly peeled from the adhesive surface (4a) of the adhesive member (4).
TW094134826A 2004-10-28 2005-10-05 Adhesive chuck device TW200628880A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004313999 2004-10-28

Publications (2)

Publication Number Publication Date
TW200628880A true TW200628880A (en) 2006-08-16
TWI376540B TWI376540B (en) 2012-11-11

Family

ID=36227625

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134826A TW200628880A (en) 2004-10-28 2005-10-05 Adhesive chuck device

Country Status (5)

Country Link
JP (1) JP3917651B2 (en)
KR (1) KR100895468B1 (en)
CN (1) CN100447622C (en)
TW (1) TW200628880A (en)
WO (1) WO2006046379A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8245751B2 (en) 2007-11-07 2012-08-21 Advanced Display Process Engineering Co., Ltd. Substrate bonding apparatus
TWI398687B (en) * 2009-10-23 2013-06-11 Au Optronics Corp Substrate bonding system and method thereof
TWI662651B (en) * 2014-07-07 2019-06-11 Ap Systems Inc. Support chuck and substrate treating apparatus

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4746003B2 (en) * 2007-05-07 2011-08-10 リンテック株式会社 Transfer device and transfer method
KR100918614B1 (en) * 2007-10-19 2009-09-25 (주)아폴로테크 Substrate Chuck
KR100942304B1 (en) * 2008-06-02 2010-02-16 주식회사 에이디피엔지니어링 Substrate chuck, Substrate bonding apparatus
KR100988897B1 (en) * 2008-08-18 2010-10-20 주식회사 탑 엔지니어링 Optic Chuck for Array Tester
KR100983605B1 (en) * 2008-09-24 2010-09-24 에이피시스템 주식회사 Substrate mounting unit and substrate bonding apparatus having same
JP5507074B2 (en) * 2008-11-18 2014-05-28 株式会社アルバック Substrate laminating method and substrate laminating apparatus
JP4954968B2 (en) * 2008-12-01 2012-06-20 アドヴァンスド・ディスプレイ・プロセス・エンジニアリング・コーポレーション・リミテッド Adhesive chuck and substrate bonding apparatus having the same
KR101152232B1 (en) * 2010-07-15 2012-06-08 에이피시스템 주식회사 Subtrate assembling apparatus and subtrate processing method using the same
KR101221034B1 (en) * 2010-10-06 2013-01-21 엘아이지에이디피 주식회사 Substrate chuck and apparatus for processing substrate using the same
EP2630210A4 (en) 2010-10-21 2017-08-30 University of Massachusetts High capacity easy release extended use adhesive devices
JP4785995B1 (en) * 2011-02-28 2011-10-05 信越エンジニアリング株式会社 Workpiece adhesive chuck device and workpiece bonding machine
JP4903906B1 (en) * 2011-04-07 2012-03-28 信越エンジニアリング株式会社 Workpiece adhesive chuck device and workpiece bonding machine
CN106313756A (en) 2012-01-19 2017-01-11 马萨诸塞大学 Releasable adhesive devices
JP5395313B1 (en) * 2012-12-25 2014-01-22 信越エンジニアリング株式会社 Actuator and adhesive chuck device
CN104981526B (en) 2013-02-06 2017-07-04 马萨诸塞大学 Load-bearing adhesive material with adjustable corners
US9182075B2 (en) 2013-03-14 2015-11-10 University Of Massachusetts Devices for application and load bearing and method of using the same
US9603419B2 (en) 2013-03-15 2017-03-28 University Of Massachusetts High capacity easy release extended use adhesive closure devices
JP5811513B2 (en) * 2014-03-27 2015-11-11 Toto株式会社 Electrostatic chuck
JP6419635B2 (en) * 2014-04-23 2018-11-07 株式会社アルバック Holding device, vacuum processing device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63197335U (en) * 1987-06-05 1988-12-19
JPH05305592A (en) * 1992-04-28 1993-11-19 Sony Corp Vacuum chuck
JPH09181156A (en) * 1995-12-25 1997-07-11 Sony Corp Vacuum chuck
KR19990048958A (en) * 1997-12-11 1999-07-05 김영환 Glass substrate adsorption device for etching chamber
JPH11333774A (en) * 1998-05-22 1999-12-07 Ricoh Co Ltd Sheet-shaped workpiece suction / transfer hand
JP2000199911A (en) * 1999-01-06 2000-07-18 Matsushita Electric Ind Co Ltd Manufacturing method and manufacturing apparatus for liquid crystal display device
JP3862065B2 (en) * 2001-11-29 2006-12-27 信越半導体株式会社 Wafer polishing head
TWI266104B (en) * 2002-03-14 2006-11-11 Sharp Kk Manufacturing method of liquid crystal display apparatus and substrate assembling apparatus
KR100685923B1 (en) * 2002-03-25 2007-02-23 엘지.필립스 엘시디 주식회사 Bonding device and manufacturing method of liquid crystal display device using the same
JP2004268155A (en) * 2003-03-05 2004-09-30 Tamagawa Machinery Co Ltd Glass substrate polishing head, polishing device using this polishing head, glass substrate polishing method and glass substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8245751B2 (en) 2007-11-07 2012-08-21 Advanced Display Process Engineering Co., Ltd. Substrate bonding apparatus
TWI465340B (en) * 2007-11-07 2014-12-21 Advanced Display Proc Eng Co Substrate bonding apparatus
TWI398687B (en) * 2009-10-23 2013-06-11 Au Optronics Corp Substrate bonding system and method thereof
TWI662651B (en) * 2014-07-07 2019-06-11 Ap Systems Inc. Support chuck and substrate treating apparatus

Also Published As

Publication number Publication date
CN1985288A (en) 2007-06-20
WO2006046379A1 (en) 2006-05-04
JP3917651B2 (en) 2007-05-23
TWI376540B (en) 2012-11-11
CN100447622C (en) 2008-12-31
KR20070069132A (en) 2007-07-02
JPWO2006046379A1 (en) 2008-08-07
KR100895468B1 (en) 2009-05-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees