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TW200606501A - Adhesive chuck device - Google Patents

Adhesive chuck device

Info

Publication number
TW200606501A
TW200606501A TW094111195A TW94111195A TW200606501A TW 200606501 A TW200606501 A TW 200606501A TW 094111195 A TW094111195 A TW 094111195A TW 94111195 A TW94111195 A TW 94111195A TW 200606501 A TW200606501 A TW 200606501A
Authority
TW
Taiwan
Prior art keywords
board
adhesive member
chuck device
adhesive
adhesive chuck
Prior art date
Application number
TW094111195A
Other languages
Chinese (zh)
Other versions
TWI364576B (en
Inventor
Yoshikazu Ohtani
Michiya Yokota
Original Assignee
Shinetsu Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=35125225&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200606501(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shinetsu Eng Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW200606501A publication Critical patent/TW200606501A/en
Application granted granted Critical
Publication of TWI364576B publication Critical patent/TWI364576B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A board is surely mounted and removed by a simple structure. On a board side of a holding plate (1), an adhesive member (3) for adhering and holding a board (A) by facing a rear plane (A1) of the board, and a deforming film (4) which can deform by protruding and receding in a direction crossing a plane (1a) on the board side are provided. An adhesive surface (3a) of the adhesive member (3) and the board (A) are abutted and adhered by the protruding and receding deformation of the deforming film (4), and the board (A) is peeled from the adhesive surface (3a) of the adhesive member (3) without difficulty by forcibly separating the both.
TW094111195A 2004-04-09 2005-04-08 Adhesive chuck device TW200606501A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004115553 2004-04-09

Publications (2)

Publication Number Publication Date
TW200606501A true TW200606501A (en) 2006-02-16
TWI364576B TWI364576B (en) 2012-05-21

Family

ID=35125225

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094111195A TW200606501A (en) 2004-04-09 2005-04-08 Adhesive chuck device

Country Status (5)

Country Link
JP (1) JP3882004B2 (en)
KR (1) KR100869088B1 (en)
CN (1) CN1777832B (en)
TW (1) TW200606501A (en)
WO (1) WO2005098522A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8245751B2 (en) 2007-11-07 2012-08-21 Advanced Display Process Engineering Co., Ltd. Substrate bonding apparatus

Families Citing this family (44)

* Cited by examiner, † Cited by third party
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US8691043B2 (en) 2005-08-30 2014-04-08 Rockwell Collins, Inc. Substrate lamination system and method
US8936057B2 (en) 2005-08-30 2015-01-20 Rockwell Collins, Inc. Substrate lamination system and method
US8603288B2 (en) 2008-01-18 2013-12-10 Rockwell Collins, Inc. Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination
JP4671817B2 (en) * 2005-09-08 2011-04-20 信越ポリマー株式会社 Parts holder
KR100898793B1 (en) * 2005-12-29 2009-05-20 엘지디스플레이 주식회사 Substrate bonding device for liquid crystal display device
KR101426572B1 (en) 2006-03-15 2014-08-05 신에츠 폴리머 가부시키가이샤 Holding jig, method of grinding semiconductor wafers
DE102006031434B4 (en) 2006-07-07 2019-11-14 Erich Thallner Handling device and handling method for wafers
JP4125776B1 (en) * 2007-01-31 2008-07-30 信越エンジニアリング株式会社 Adhesive chuck device
WO2008114337A1 (en) * 2007-02-22 2008-09-25 Shin-Etsu Engineering Co., Ltd. Vacuum bonding method and vacuum bonding device
WO2008136056A1 (en) * 2007-04-24 2008-11-13 Hitachi, Ltd. Apparatus, and process, for manufacturing of plasma display panel
JP5074125B2 (en) * 2007-08-09 2012-11-14 リンテック株式会社 Fixing jig and workpiece processing method
KR100918614B1 (en) * 2007-10-19 2009-09-25 (주)아폴로테크 Substrate Chuck
EP2243054A4 (en) * 2008-01-18 2013-09-25 Rockwell Collins Inc SUBSTRATE LAMINATION SYSTEM AND METHOD
TW201003947A (en) * 2008-03-14 2010-01-16 Dow Corning Photovoltaic cell module and method of forming same
JP4958312B2 (en) * 2008-08-11 2012-06-20 信越ポリマー株式会社 Holding jig
JP2010126342A (en) * 2008-12-01 2010-06-10 Advanced Display Process Engineering Co Ltd Substrate chuck and substrate fusion device having the same
JP2010165883A (en) * 2009-01-16 2010-07-29 Lintec Corp Carrying device for semiconductor wafer, and carrying method therefor
KR101066603B1 (en) * 2009-01-20 2011-09-22 에이피시스템 주식회사 Substrate holder unit and subtrate assembling appartus having the same
WO2010143117A2 (en) * 2009-06-08 2010-12-16 3S Swiss Solar Systems Ag Method for producing a solar panel
KR101221034B1 (en) * 2010-10-06 2013-01-21 엘아이지에이디피 주식회사 Substrate chuck and apparatus for processing substrate using the same
KR101326016B1 (en) * 2010-10-06 2013-11-07 엘아이지에이디피 주식회사 Module for detaching substrate and Apparatus using the same
JP4785995B1 (en) * 2011-02-28 2011-10-05 信越エンジニアリング株式会社 Workpiece adhesive chuck device and workpiece bonding machine
JP2012187679A (en) * 2011-03-11 2012-10-04 Mitsubishi Heavy Ind Ltd Chucking device
KR101347546B1 (en) * 2011-03-14 2014-01-03 엘아이지에이디피 주식회사 Substrate Chucking Apparatus and Thin Film Deposition Equipment with the Same
JP4903906B1 (en) * 2011-04-07 2012-03-28 信越エンジニアリング株式会社 Workpiece adhesive chuck device and workpiece bonding machine
KR101328886B1 (en) * 2011-05-07 2013-11-13 주식회사 야스 An Apparatus for attaching and detaching a substrate using a ring shape adhesive
US8647727B1 (en) 2012-06-29 2014-02-11 Rockwell Colllins, Inc. Optical assembly with adhesive layers configured for diffusion
JP5422767B1 (en) * 2013-05-09 2014-02-19 信越エンジニアリング株式会社 Bonding separation method and separation apparatus
KR101585316B1 (en) * 2014-01-29 2016-01-13 세메스 주식회사 Apparatus for ejecting a die
JP6419635B2 (en) * 2014-04-23 2018-11-07 株式会社アルバック Holding device, vacuum processing device
US9981460B1 (en) 2014-05-06 2018-05-29 Rockwell Collins, Inc. Systems and methods for substrate lamination
JP6398301B2 (en) * 2014-05-09 2018-10-03 藤倉化成株式会社 Adsorption / detachment device
CN104637843B (en) * 2015-02-02 2017-12-05 京东方科技集团股份有限公司 Sealed in unit and method for packing
CN105572925B (en) * 2016-01-04 2018-09-25 京东方科技集团股份有限公司 A kind of substrate bearing device
CN108602342B (en) * 2016-10-17 2020-06-12 信越工程株式会社 Vacuum laminating device for laminating device
CN106910700B (en) * 2017-03-09 2020-12-04 京东方科技集团股份有限公司 Transfer device and transfer method of electronic device
CN207116403U (en) * 2017-04-21 2018-03-16 厦门市三安光电科技有限公司 A kind of transposition head for microcomponent transfer
US10919237B2 (en) * 2017-05-26 2021-02-16 The Boeing Company Pick and place end effector
JP6733966B2 (en) * 2018-07-09 2020-08-05 Ａｉメカテック株式会社 Board assembly apparatus and board assembly method
US20220143838A1 (en) * 2019-02-28 2022-05-12 Nitto Denko Corporation Adherent device, transfer equipment using the same, and transfer method
KR102198180B1 (en) * 2019-05-21 2021-01-04 (주) 아이엠텍 A rubber chuck for the touch panel attachment
KR102198179B1 (en) * 2019-05-21 2021-01-04 (주) 아이엠텍 A vacuum attachment system for the substrate touch panel and a vacuum attachment method for the substrate touch panel using the system
CN115072369B (en) * 2022-06-28 2024-07-09 深圳市华星光电半导体显示技术有限公司 Conveying assembly and film forming device
WO2025121081A1 (en) * 2023-12-04 2025-06-12 株式会社クリエイティブテクノロジー Workpiece holding device

Family Cites Families (5)

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Publication number Priority date Publication date Assignee Title
JPH01142532A (en) 1987-11-27 1989-06-05 Matsushita Electric Ind Co Ltd Production of liquid crystal panel
JPH05305592A (en) 1992-04-28 1993-11-19 Sony Corp Vacuum chuck
JP3159228B2 (en) 1993-03-12 2001-04-23 ソニー株式会社 Method and apparatus for manufacturing liquid crystal display element
JPH09181156A (en) 1995-12-25 1997-07-11 Sony Corp Vacuum chuck
JP3082697B2 (en) * 1997-02-27 2000-08-28 日本電気株式会社 Anisotropic conductive film sticking method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8245751B2 (en) 2007-11-07 2012-08-21 Advanced Display Process Engineering Co., Ltd. Substrate bonding apparatus
TWI465340B (en) * 2007-11-07 2014-12-21 Advanced Display Proc Eng Co Substrate bonding apparatus

Also Published As

Publication number Publication date
CN1777832B (en) 2010-05-05
WO2005098522A1 (en) 2005-10-20
JPWO2005098522A1 (en) 2007-08-16
CN1777832A (en) 2006-05-24
JP3882004B2 (en) 2007-02-14
KR20060133942A (en) 2006-12-27
TWI364576B (en) 2012-05-21
KR100869088B1 (en) 2008-11-18

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